JP6582677B2 - Substrate device and optical device manufacturing method - Google Patents

Description

The present invention relates to a method for manufacturing a board device and an optical device.

  In Patent Document 1, a plurality of long substrates are arranged in the short direction, and adjacent substrates are connected by a plurality of first connecting portions in the longitudinal direction, and the length per unit length is viewed from the short direction. A step of preparing a group of substrates having a first portion having a long connecting portion and a second portion having a short length, a step of mounting components on the surface of the substrate serving as the first portion, and a light emitting element on the back surface of the substrate A method for manufacturing a light emitting substrate is disclosed that includes a step and a step of cutting a plurality of connecting portions.

Japanese Patent Laying-Open No. 2015-066673

  A plurality of large-sized substrates, each of which serves as a reference for mounting an element, is prepared on a portion of the planar substrate that serves as a plurality of unit substrates, and the plurality of unit substrates on which the elements are mounted are defined on the large-sized substrate. There is known a method of manufacturing a collective substrate in which a plurality of connecting pieces for connecting the unit substrates between the plurality of grooves and the plurality of grooves are formed by a tool. If an element is mounted on the unit board of the collective board manufactured by this method with reference to the mark, the mounting position of the element with respect to the outer shape of the unit board may be shifted.

In the present invention, the position where the element is mounted is within a range determined from the end of the unit substrate as compared with the case where the element is mounted based on a hole or a recess formed by a tool different from the tool for forming a plurality of grooves . An object of the present invention is to provide a method for manufacturing a plurality of substrate devices .

The substrate device manufacturing method according to claim 1, wherein a plurality of grooves defining the outer shape of the plurality of unit substrates on which the elements are mounted are formed on the positioned large substrate by a tool, and the elements are formed on the plurality of unit substrates. A step of preparing a collective substrate in which holes or recesses to be mounted are formed by the tool, and the element is mounted on a plurality of unit substrates based on the holes or recesses of the collective substrate. Separating the plurality of unit substrates from each other.
In the method for manufacturing a collective substrate according to the first aspect, a plurality of grooves that define the outer shape of a plurality of unit substrates on which elements are mounted are formed on a positioned large substrate by a tool, and holes or recesses are formed by the tool. Process.

According to a second aspect of the present invention, there is provided a substrate device manufacturing method in which a first mark serving as a reference for mounting the element is attached to a portion of the planar substrate on which the element is mounted, and a second mark different from the first mark. After positioning the large substrate with the mark, a plurality of grooves defining the outer shape of the plurality of unit substrates are formed in the large substrate with a tool, and a hole or a recess is formed in the second mark on the large substrate with the tool. Preparing a collective substrate having a shape formed thereon, measuring a deviation amount of the second mark with respect to the holes or the recesses of the collective substrate, and determining a position shifted by the deviation amount with respect to a plurality of the first marks. Mounting the element on the plurality of unit substrates and separating the plurality of unit substrates from the collective substrate.
The method for manufacturing a collective substrate according to the second aspect is the method for manufacturing the collective substrate according to the first aspect, wherein, prior to this step, the element is mounted as a reference for mounting a plurality of unit substrates on the flat substrate. The large substrate having a first mark and a second mark different from the first mark is prepared, and in the step, the tool forms the hole or the recess in the second mark on the large substrate.

According to a third aspect of the present invention, there is provided a method for manufacturing a substrate device, comprising: positioning a large substrate with a mark serving as a reference for mounting the element on a portion serving as a plurality of unit substrates on the planar substrate; Preparing a collective substrate in which a hole or a recess is formed in the mark on the large-sized substrate with the tool while forming a plurality of grooves defining the outer shape of the plurality of unit substrates with a tool; The amount of deviation of the mark with respect to the hole or the concave portion is measured, the element is mounted on the plurality of unit substrates with reference to the positions displaced by the amount of deviation with respect to the plurality of marks, Separating the unit substrate.
A method for manufacturing a collective substrate according to a third aspect is the method for manufacturing a collective substrate according to the first aspect, wherein the large substrate in which a plurality of unit substrates in a flat substrate are marked before the step. In the step, the hole or the recess is formed in the mark on the large substrate by the tool.

According to a fourth aspect of the present invention, there is provided a substrate device manufacturing method, comprising: using the aggregate substrate manufactured by the method according to the first aspect ; and mounting the element on a plurality of the unit substrates based on the holes or the recesses. A plurality of the unit substrates are separated from the aggregate substrate.

According to a fifth aspect of the present invention, there is provided a method of manufacturing the substrate apparatus, wherein the collective substrate manufactured by the method according to the second aspect is used to measure a deviation amount of the second mark with respect to the hole or the concave portion. The element is mounted on the plurality of unit substrates with reference to the position shifted by the amount of deviation relative to the mark, and the plurality of unit substrates are separated from the collective substrate.

The substrate device manufacturing method according to the sixth aspect uses the aggregate substrate manufactured by the method according to the third aspect to measure the amount of deviation of the mark with respect to the hole or the recess, and with respect to a plurality of the marks. The element is mounted on the plurality of unit substrates with the position shifted by the amount of displacement as a reference, and the plurality of unit substrates are separated from the collective substrate.

The method of manufacturing an optical device according to claim 4, wherein the unit substrate is long, the element is a light emitting element or a light receiving element, and is manufactured by the method according to claim 1. The substrate device is used, the end surface of the substrate device in the short direction is brought into contact with the housing, the substrate device is positioned in the housing, and the housing and the optical component are opposed to each other. An optical device manufacturing method, comprising: positioning an optical component on a body; and fixing the substrate device and the optical component to the housing.
Method of manufacturing an optical device according to a seventh aspect, the unit substrate is an elongated, the element is a light emitting element, a substrate device manufactured by the method according to any one aspect of the fourth to sixth aspect The substrate device is placed in contact with the casing by bringing the end surface of the substrate device in the short direction into contact with the casing, and the optical element is optically mounted on the casing so that the element and the optical component face each other. The component is positioned, and the substrate device and the optical component are fixed to the casing.

In the method for manufacturing a collective substrate according to the first aspect , the positional relationship between the holes or recesses and the outer shapes of the plurality of unit substrates is clearer than when the holes or recesses are formed using a tool different from the tool that forms the plurality of grooves. An aggregate substrate can be manufactured.

The method of manufacturing the collective substrate of the second aspect is that the positions of the second mark and the outer shapes of the plurality of unit substrates are different from the case of forming a hole or a recess in the second mark with a tool different from the tool that forms the plurality of grooves. A collective substrate with a clear relationship can be manufactured.

In the method of manufacturing the collective substrate of the third aspect , the positional relationship between the marks and the outer shapes of the plurality of unit substrates is clear as compared with the case where holes or recesses are formed in the marks using a tool different from the tool that forms the plurality of grooves. An aggregate substrate can be manufactured.

The manufacturing method of the substrate device according to claim 1 and the fourth aspect is a position where the element is mounted as compared with the case where the element is mounted on the basis of a hole or a recess formed by a tool different from the tool for forming the plurality of grooves. It is possible to manufacture a plurality of substrate devices that are within a predetermined range from the end of the unit substrate.

Method of manufacturing a substrate according to claim 2 and the fifth aspect, as compared with the case of mounting the device to the unit substrate a first indicia as a reference, the range which the position is determined from the edge of the unit substrate element is mounted A plurality of substrate devices can be manufactured.

In the method of manufacturing the substrate device according to the third and sixth aspects, the position where the element is mounted is within a range determined from the end of the unit board, as compared with the case where the element is mounted on the unit board based on the mark. A plurality of substrate devices can be manufactured.

The method for manufacturing an optical device according to claim 4 and the seventh embodiment, as compared with the case of forming a hole or recess in the tool and different tools for forming a plurality of grooves and a plurality of connecting pieces, deviation of the optical axis is within the acceptable range It is possible to manufacture an optical device.

It is a fragmentary perspective view of the exposure apparatus manufactured by the manufacturing method of the exposure apparatus of embodiment. It is sectional drawing in the longitudinal direction of the exposure apparatus of embodiment. It is a top view of the plane board used when manufacturing the collective board of an embodiment. It is a top view of the large sized board | substrate used when manufacturing the aggregate substrate of embodiment. It is a perspective view of the end mill of the router used when forming a plurality of slots, a plurality of connecting pieces, and a hole in the 2nd process of an embodiment. It is a top view of the collective substrate of an embodiment. It is a figure which shows the state which formed the hole in the 2nd mark attached | subjected to the large sized board | substrate of embodiment, Comprising: It is a schematic diagram which shows the state in which the center of a 2nd mark and the center of a hole correspond. It is a figure which shows the state which formed the hole in the 2nd mark attached | subjected to the large sized board | substrate of embodiment, Comprising: It is a schematic diagram which shows the state which the center of the 2nd mark and the center of the hole have shifted | deviated. It is a top view in the state where the light emitting element was mounted in the collective substrate of an embodiment.

≪Overview≫
Hereinafter, modes (embodiments) for carrying out the invention will be described. First, the exposure apparatus 10 manufactured by the exposure apparatus manufacturing method of the embodiment will be described. Next, a method for manufacturing the exposure apparatus 10 according to the embodiment will be described. Next, the operation of the embodiment will be described. Since the manufacturing method of the exposure apparatus 10 of the embodiment includes the manufacturing method of the collective substrate 90 and the light emitting substrate 20 of the embodiment, the manufacturing method of the collective substrate 90 and the light emitting substrate 20 of the embodiment is the same as that of the embodiment. This will be described in the description of the manufacturing method of the exposure apparatus 10.

≪Exposure equipment≫
The exposure apparatus 10 has a function of forming a latent image by irradiating the photosensitive drum PD constituting the image forming apparatus (not shown) with the light LB (see FIG. 2). As illustrated in FIGS. 1 and 2, the exposure apparatus 10 includes a light emitting substrate 20, a lens array 30, and a housing 40. Here, the exposure apparatus 10 is an example of an optical apparatus. The light emitting substrate 20 is an example of a substrate device. The lens array 30 is an example of an optical component. It should be noted that the following description of the components of the exposure apparatus 10 is for each component in the state that constitutes the exposure apparatus 10 unless otherwise specified.

<Light emitting substrate>
The light emitting substrate 20 has a function of irradiating light LB in accordance with image data sent from a control unit (not shown) of the image forming apparatus. Here, the light emitting substrate 20 is an example of a substrate device. The light emitting substrate 20 includes a long substrate 50, a plurality of LED arrays 62, and a driver 64 (see FIGS. 1 and 2). Here, the LED array 62 is an example of an element and a light emitting element. The long substrate 50 is an example of a unit substrate.

  On one surface (front surface 52) of the long substrate 50, a long terminal 56 extending in the longitudinal direction is formed from one end side to the other end side in the longitudinal direction. A plurality of LED arrays 62 are mounted on the long terminals 56 in a staggered manner along the longitudinal direction of the long terminals 56. Further, a pair of rectangular marks 58 (hereinafter referred to as first marks 58) between the end of one end in the longitudinal direction on the surface 52 and the end of the long terminal 56 adjacent to the end. Is formed. On the other hand, a terminal (not shown) for mounting the driver 64 is formed on the other side (back surface 54) of the long substrate 50. The driver 64 is mounted on the terminal.

<Lens array>
The lens array 30 has a function of refracting the light LB irradiated by the plurality of LED arrays 62 and forming an image of the refracted light LB on the photosensitive drum PD. The lens array 30 is long. As shown in FIG. 2, the lens array 30 is disposed between the light emitting substrate 20 and the photosensitive drum PD when attached to the image forming apparatus.

<Case>
The housing 40 has a function of fixing the light emitting substrate 20 and the lens array 30 so that the light emitting substrate 20 and the lens array 30 face each other. The housing 40 is long. Further, as shown in FIG. 2, the casing 40 penetrates in the height direction (a direction intersecting the longitudinal direction and the short direction of the casing 40) and has a long penetration along the longitudinal direction. A hole 42 is formed.

  The housing 40 positions the lens array 30 in the housing 40 by bringing both end surfaces of the lens array 30 in the short-side direction into contact with the upper facing surface in the short-side direction in the through hole 42, and the lens array in the housing 40. 30 is fixed. In addition, the housing 40 is configured such that the light emitting substrate 20 is attached to the housing 40 by bringing both end surfaces in the short direction of the long substrate 50 constituting the light emitting substrate 20 into contact with the opposed surfaces in the lower short direction of the through holes 42. The light emitting substrate 20 is fixed to the housing 40 by positioning.

  The above is the description of the configuration of the exposure apparatus 10.

<< Manufacturing method of exposure apparatus >>
Next, a method for manufacturing the exposure apparatus 10 will be described with reference to the drawings. The manufacturing method of the exposure apparatus 10 includes a first process, a second process, a third process, a fourth process, a fifth process, and a sixth process, which will be described later. Moreover, each said process is performed in order of these description. Hereinafter, each of the above steps will be briefly described, and then the configurations of the planar substrate 70 (see FIG. 3), the large substrate 80 (see FIG. 4), and the collective substrate (see FIG. 6) used in each step will be described. Next, each of the above steps will be described in detail. In the following description, an arrow X in the figure indicates the length direction of each substrate (a flat substrate 70, a large substrate 80, a collective substrate 90, and a substrate 100 described later), an arrow Y indicates a width direction of each substrate, and an arrow Z indicates The thickness direction of each substrate.

<Simple explanation of each process>
The first step is a step of preparing a large substrate 80 (see FIG. 4) by patterning the flat substrate 70 (see FIG. 3). The second step is a step of preparing the collective substrate 90 (see FIG. 6) by forming a plurality of grooves 92 and 94 and holes 96 in the large substrate 80 prepared in the first step. Here, the hole 96 is an example of a hole. Further, the grooves 92 and 94 and the hole 96 of the present embodiment penetrate the collective substrate 90. The third step is a step of measuring a deviation amount of a second mark 86 (described later) with respect to the hole 96 using the collective substrate 90 prepared in the second step (see FIGS. 7 and 8). In the fourth step, the plurality of LED arrays 62 are mounted on the collective substrate 90 (the long substrate 50 constituting the substrate) on the basis of the position shifted by the shift amount measured in the third step with respect to the first mark 58. 100 is a step of preparing 100 (see FIG. 9). The fifth step is a step of cutting a plurality of connecting pieces 93 and 95 to be described later on the substrate 100 prepared in the fourth step. The sixth step is a step of fixing the light emitting substrate 20 manufactured through the steps up to the fifth step and the lens array 30 to the housing 40 (see FIGS. 1 and 2).

<Configuration of flat substrate, large substrate and collective substrate>
[Plane substrate]
The flat substrate 70 is a substrate whose entire surfaces are covered with copper foil (see FIG. 3). However, positioning holes (round holes 72, long holes 74) are formed in the flat substrate 70.

[Large substrate]
In the large substrate 80, a pattern such as a long terminal 56, a terminal for mounting the driver 64, a first mark 58, a second mark 86, and the like constituting each long substrate 50 is formed on the flat substrate 70 ( The substrate is in a state of being patterned (see FIG. 4). However, the large substrate 80 is not formed with the grooves 92 and 94 (see FIG. 4).

[Aggregate substrate]
The collective substrate 90 is a substrate in which a plurality of grooves 92 and 94 and holes 96 are formed in a large substrate 80 (see FIG. 6). The collective substrate 90 includes a plurality of long substrates 50, a pair of discarded substrates 98 and 99, and a plurality of connecting pieces 93 and 95. The uncut portions where the plurality of grooves 92 and 94 are formed in the large substrate 80 become the plurality of connecting pieces 93 and 95.

  The plurality of long substrates 50 are arranged along the short direction of each long substrate 50 (the width direction of the collective substrate 90). In addition, the pair of discarded substrates 98 is arranged outside the long substrates 50 at both ends in the short direction of each long substrate 50 among the plurality of long substrates 50 (at both ends in the width direction of the collective substrate 90). Yes. Further, the pair of discarded substrates 99 are arranged outside the long substrates 50 at both ends in the longitudinal direction of the respective long substrates 50 among the plurality of long substrates 50 (at both ends in the length direction of the collective substrate 90). Yes.

  A plurality of grooves 92 are formed between adjacent long substrates 50 and between each discarded substrate 98 and the long substrate 50 adjacent to the discarded substrate 98. From another viewpoint, the adjacent long substrates 50, each discarded substrate 98, and the elongated substrate 50 adjacent to the discarded substrate 98 are connected by a plurality of connecting pieces 93. Further, a groove 94 is formed between each discarded substrate 99 and the long substrate 50 adjacent to the discarded substrate 99. In addition, connecting pieces 95 are formed between the adjacent grooves 94. The plurality of grooves 92 and 94 are grooves that define the outer shape of the plurality of long substrates 50.

<Detailed description of each process>
[First step]
As described above, the first step is a step of preparing the large substrate 80 (see FIG. 4). Specifically, in the first step, a pair of first marks 58 is attached to each part (for example, 10 parts) to be a plurality of long substrates 50 in the flat substrate 70 and a part different from the part to which the first mark 58 is attached. This is a step of preparing a large substrate 80 with the second mark 86 attached (one part as an example). Here, the technical meaning of the first mark 58 will be described in the description of the fourth step. Further, the second mark 86 is a portion where the hole 96 is formed in the second step, and is formed on the discarded substrate 98 (see FIG. 6). As an example, the second mark 86 is a solid pattern with a circular outer shape. In the first step, the flat substrate 70 is made a large substrate by performing photosensitivity, resist removal, etching, and the like on the flat substrate 70 laminated with a dry film (not shown) using a pattern forming apparatus (not shown). 80. At this time, the flat substrate 70 is positioned in the pattern forming apparatus by the round hole 72 and the long hole 74. When the large substrate 80 is prepared, the first step is finished.

[Second step]
As described above, the second step is a step of preparing the collective substrate 90 (see FIG. 6). Specifically, in the second step, the large substrate 80 manufactured in the first step is positioned in a router (not shown) which is an example of a machine tool with positioning holes (round holes 72, long holes 74). In this step, the holes 96 are formed by the end mill EM (see FIG. 5) while the plurality of grooves 92 and 94 are formed by the end mill EM. Note that a plurality of connecting pieces 93 and 95 are formed on the large-sized substrate 80 as the plurality of grooves 92 and 94 are formed. Here, the end mill EM is an example of a tool. The hole 96 is used in the fourth step to determine a reference (a position where the deviation amount measured in the third step from the first mark 58 is corrected) when mounting the plurality of LED arrays 62. It is.

  First, in the second step, a plurality of grooves 92 and 94 are formed by the end mill EM on the large-sized substrate 80 positioned on the router by positioning holes (round holes 72 and long holes 74).

  Next, in the second step, a plurality of grooves 92 and 94 are formed, and the holes 96 are formed in the large substrate 80 that is still positioned in the router by the positioning holes (round holes 72 and long holes 74) by the end mill EM. It is formed. In this case, the hole 96 is formed around a point that is the center of the second mark 86 based on the position information of the XY plane coordinates with respect to the round hole 72 of the second mark 86 formed in the first step. The hole 96 of the embodiment is, for example, a round hole having a smaller diameter than the second mark 86.

  As described above, when the plurality of grooves 92 and 94 and the holes 96 are formed by the end mill EM in a state where the large substrate 80 is positioned on the router, the collective substrate 90 is prepared, and the second step is completed. In other words, when the first step and the second step are performed in this order and finished, the collective substrate 90 is manufactured.

<Third step>
As described above, the third step is a step of measuring the shift amount of the second mark 86 with respect to the hole 96 using the collective substrate 90 prepared in the second step (see FIGS. 7 and 8). Specifically, in the third step, an image IM including a hole 96 and a second mark 86 using the collective substrate 90 positioned by positioning holes (round holes 72, long holes 74) in an imaging device (not shown). Is imaged.

  For example, in the image IM including the hole 96 and the second mark 86 imaged by the imaging device, when the center OA of the hole 96 coincides with the center OB of the second mark 86 as shown in FIG. The amount of deviation of the second mark 86 with respect to is 0 (the amount of deviation 0 means that the amount of deviation ΔX in the length direction of the aggregate substrate 90 is 0 and the amount of deviation ΔY in the width direction is 0). The On the other hand, for example, as shown in FIG. 8, when the center OA of the hole 96 and the center OB of the second mark 86 are misaligned, the amount of misalignment is −ΔX1 in the length direction and ΔY1 in the width direction. The

  The imaging device is actually formed from the second mark 86 of the captured image IM at a position where the length and width of the second mark 86 are maximum values in the length direction and width direction of the collective substrate 90, respectively. The center OB of the second mark 86 is recognized. Further, the imaging device recognizes, as the center OA of the hole 96, the position where the distance between the inner walls of the hole 96 in the length direction and the width direction of the collective substrate 90 is the maximum value from the hole 96 of the captured image IM. It is like that. The imaging apparatus measures the amount of deviation between the center OA and the center OB in the XY plane coordinates. The amount of deviation can be measured in this way because the diameter of the hole 96 is smaller than the diameter of the second mark 86. When the amount of displacement of the second mark 86 with respect to the hole 96 is measured, the third step ends.

<4th process>
In the fourth step, as described above, using the collective substrate 90 prepared in the second step, the long terminals 56 of the plural long substrates 50 constituting the collective substrate 90 are provided with a plurality of LEDs along the longitudinal direction thereof. In this step, the array 62 is arranged and a plurality of LED arrays 62 are mounted on each long substrate 50 (see FIG. 9). Specifically, in the fourth step, the first mark 58 of each long substrate 50 is formed by using the collective substrate 90 positioned by the positioning holes (round holes 72, long holes 74) on the mounting device (not shown). On the other hand, a plurality of LED arrays 62 are mounted on each long substrate 50 with reference to the position shifted by the amount of shift measured in the third step. For example, when the amount of deviation measured in the third step is as shown in FIG. 8, that is, when the amount of deviation is −ΔX1 in the length direction and ΔY1 in the width direction, a plurality of LED arrays are provided for each long terminal 56. The reference for mounting 62 is a position shifted by -ΔX in the length direction and by ΔY in the width direction with respect to the first mark 58.

  When a plurality of LED arrays 62 are mounted on each long substrate 50 constituting the collective substrate 90, as shown in FIG. 9, a plurality of light emitting substrates 20, a pair of discarded substrates 98, and a pair of discarded substrates 99, A substrate (hereinafter referred to as a substrate 100) in a state of being connected by a plurality of connecting pieces 93 and 95 is prepared, and the fourth step is completed.

<5th process>
As described above, the fifth step is a step of cutting the plurality of connection pieces 93 and 95 in the substrate 100 prepared in the fourth step. That is, the fifth step is a step of spreading the substrate 100 (the collective substrate 90) to the plurality of light emitting substrates 20 (the long substrates 50). Specifically, in the fifth step, a plurality of grooves 92 along the length direction of the substrate 100 are used by using the substrate 100 positioned by positioning holes (round holes 72, long holes 74) in a cutter device (not shown). A plurality of connecting pieces 93 are cut along the line. Further, in the fifth step, using the substrate 100 positioned by positioning holes (round holes 72, long holes 74) in a cutter device (not shown), along the plurality of grooves 94 along the width direction of the substrate 100. Thus, the plurality of connecting pieces 95 are cut.

  When all the connecting pieces 93 and 95 are cut by the fifth step, a plurality of light emitting substrates 20 (10 in the embodiment as an example), two discarded substrates 98, and two discarded substrates 99 are separated. Thus, ten light emitting substrates 20 are manufactured, and the fifth step is completed. In other words, when the first step, the second step, the third step, the fourth step, and the fifth step are performed in the order of description, the light emitting substrate 20 is manufactured.

<6th process>
As described above, the sixth step is a step of fixing the light emitting substrate 20 manufactured through the steps up to the fifth step and the lens array 30 to the housing 40 (see FIGS. 1 and 2).

  Specifically, the sixth step is performed using a fixing jig (not shown) for fixing the light emitting substrate 20 and the lens array 30 to the housing 40. Specifically, in the sixth step, an operator applies an adhesive (not shown) to a plurality of locations on the upper peripheral edge of the upper through hole 42 of the casing 40. Next, the operator brings both end surfaces of the lens array 30 in the short direction into contact with the upper facing surface of the through hole 42 in the short direction, and positions the lens array 30 on the housing 40. The lens array 30 is fixed to 40 (see FIGS. 1 and 2). In addition, the worker applies an adhesive (not shown) to a plurality of locations on the back surface of the long substrate 50. Next, the operator brings both end surfaces in the short direction of the long substrate 50 constituting the light emitting substrate 20 into contact with the opposed surfaces in the lower short direction of the through holes 42 (the light emitting substrate 20 is attached to the casing 40). And the light emitting substrate 20 is fixed to the housing 40 (see FIGS. 1 and 2). When the sixth step is completed, the exposure apparatus 10 is manufactured (see FIGS. 1 and 2).

  The above is the description of the manufacturing method of the exposure apparatus 10.

≪Action≫
Next, the operation of the embodiment will be described in comparison with a comparative embodiment described below. In the description of the comparative form, when using a component or the like equivalent to that used in the embodiment, the name of the component or the like is used as it is even if it is not shown.

  In the case of the comparative form, the second mark 86 is not formed in the step of preparing a large substrate. In the case of the comparative embodiment, the hole 96 is not formed in the process of manufacturing the aggregate substrate from the large substrate. In the case of the comparative example, after the collective substrate is manufactured, a plurality of LED arrays 62 are arranged with the first mark 58 as a reference using the mounting apparatus. The manufacturing method of the exposure apparatus of the comparative form is the same as that of the embodiment except for the above points.

  In the case of the comparative form, there is a possibility that the distance from the end surface in the short direction of each long substrate 50 constituting the collective substrate to the first mark 58 may vary. The variation occurs because the first mark 58 and the like are patterned on the flat substrate 70 by a pattern forming device to manufacture a large substrate, and then a plurality of grooves 92 and 94 are formed on the large substrate by a router. This is due to the tolerance of mounting of large substrates. Further, in the case of the comparative embodiment, there is no one for grasping the variation in the distance from the end surface in the short direction to the first mark 58 in each of the long substrates 50 constituting the collective substrate.

  In the case of the comparative embodiment, the LED array 62 is mounted on each long substrate 50 with the first mark 58 as a reference to manufacture the light emitting substrate 20, and then the lateral end face of the light emitting substrate 20 is attached to the housing 40. The light emitting substrate 20 is positioned and fixed to the housing 40 in contact with the opposing surface of the through hole 42. As a result, in the case of the exposure apparatus 10 manufactured according to the comparative embodiment, there is a possibility that the optical axis is shifted due to a variation in the distance from the end surface in the short direction of the long substrate 50 to the first mark 58.

  Further, in the case of the embodiment, as in the case of the comparative form, for the same reason as in the case of the comparative form, the distance from the end surface in the short direction of each long substrate 50 constituting the aggregate substrate to the first mark 58 is set. There is a risk of variations. However, in the case of the embodiment, the second mark 86 is formed on the large substrate 80 in the first step, and the plurality of grooves 92 and 94 are formed by the end mill EM with the large substrate 80 positioned on the router in the second step. Meanwhile, the hole 96 is formed by the end mill EM. Then, by measuring the amount of deviation between the second mark 86 and the hole 96 in the third step, indirectly grasping the amount of deviation of the first mark 58 from the end of the long substrate 50 in the short direction. Can do.

  Therefore, according to the manufacturing method of the collective substrate 90 of the embodiment, the second mark is compared with the case where the hole 96 is formed with a tool different from the tool that forms the plurality of grooves 92 and 94 and the plurality of connecting pieces 93 and 95. It is possible to manufacture a collective substrate in which the positional relationship between 86 and the outer shape of the plurality of long substrates 50 is clear.

  Further, in the case of the embodiment, after the first step, the second step, and the third step, each length in the fourth step is set based on the position shifted by the amount of deviation measured in the third step with respect to the first mark 58. A plurality of LED arrays 62 are mounted on the scale substrate 50.

  Therefore, according to the manufacturing method of the light emitting substrate 20 of the embodiment, the position where the plurality of LED arrays 62 are mounted is longer than the case where the elements are mounted on the unit substrate with the first mark 58 as a reference. A plurality of light emitting substrates 20 that are within a predetermined range from the edge (outer shape) can be manufactured. Here, the defined range means a range in which the deviation of the optical axis is within an allowable range in a state where the light emitting substrate 20 constitutes the exposure apparatus 10. Accordingly, according to the manufacturing method of the exposure apparatus 10 of the embodiment, compared with the case where the hole 96 is formed with a tool different from the tool that forms the plurality of grooves 92, 94 and the plurality of connecting pieces 93, 95, the light It is possible to manufacture the exposure apparatus 10 in which the axis deviation is within an allowable range.

  In the case of the embodiment, in the first step, the second mark 86 is formed in a portion corresponding to the discarded substrate 99 (see FIGS. 4 and 6). For this reason, the light emitting substrate 20 (long substrate 50) manufactured by the method of the embodiment does not have the second mark 86 used for correction of misalignment in the manufacture of the light emitting substrate 20 (in the light emitting substrate 20 as a product, the technology). There is no second mark 86 that has no meaning). Therefore, according to the manufacturing method of the light emitting substrate 20 of the embodiment, the light emitting substrate 20 in which the space of the long substrate 50 can be effectively used can be manufactured. Further, according to the method for manufacturing the light emitting substrate 20 of the embodiment, the light emitting substrate 20 can be reduced in size because it is not necessary to form the second mark 86 on the long substrate 50.

  As described above, the present invention has been described in detail for specific embodiments, but the technical scope of the present invention is not limited to the above-described embodiments. For example, the following forms are also included in the technical scope of the present invention.

  The exposure apparatus 10 of the embodiment has been described as an example of an optical apparatus. However, for example, when a plurality of light emitting elements (LED array 62) constituting the light emitting substrate 20 of the exposure apparatus 10 are changed to light receiving elements, an image reading apparatus of a contact image sensor is obtained. In this case, the light receiving element is an example of an optical element. The image reading apparatus is an example of an optical apparatus.

  Further, in the embodiment, it has been described that the holes 96 are formed in the collective substrate 90 in the second step. However, if the amount of deviation of the second mark 86 can be measured in the third step, a recess may be formed instead of the hole 96.

  In the embodiment, it has been described that the second mark 86 is formed in a portion corresponding to the discarded substrate 98 when the collective substrate 90 is configured in the first step. However, as long as the second mark 86 is formed on the surface when the large substrate 80 is used as the collective substrate 90, the second mark 86 may not be formed in a portion corresponding to the discarded substrate 98. For example, it may be formed in a portion corresponding to the discarded substrate 99. Further, it may be formed in a portion corresponding to the long substrate 50. Further, it may be formed in a portion corresponding to each long substrate 50.

  Further, in the embodiment, the shift amount of the second mark 86 with respect to the hole 96 is measured, and the plurality of LED arrays 62 are mounted on the basis of the position shifted with respect to the first mark 58 by the shift amount. However, in the first step, a large substrate 80 on which the first mark 58 and the second mark 86 are not formed is prepared, and the plurality of grooves 92 and 94 are formed in a state where the large substrate 80 is positioned on the router in the second step. The aggregate substrate may be manufactured by forming the holes 96 with the end mill EM while forming with the end mill EM. According to this method of manufacturing a collective substrate, the hole 96 and the plurality of holes are compared with the case where the hole 96 is formed with a tool different from the tool that forms the plurality of grooves 92 and 94 (and the plurality of connecting pieces 93 and 95). A collective substrate having a clear positional relationship with the outer shape of the long substrate 50 can be manufactured. Further, in this case, when mounting a plurality of LED arrays 62 on each long substrate 50 constituting the collective substrate, the hole 96 is used as a mounting reference. Therefore, it is effective in that it is not necessary to measure the amount of deviation of the second mark 86 with respect to the hole 96 as in the embodiment, and to perform reference correction in mounting the LED array 62. In addition, according to the manufacturing method of the light emission board | substrate 20 (exposure apparatus 10) using the aggregate substrate manufactured by this method, it can be said that there exists an effect similar to embodiment.

  Further, in the embodiment, the shift amount of the second mark 86 with respect to the hole 96 is measured, and the plurality of LED arrays 62 are mounted on the basis of the position shifted by the shift amount with respect to the first mark 58. However, a large substrate 80 on which the second mark 86 is not formed in the first step is prepared, and a plurality of grooves 92 and 94 are formed by the end mill EM in a state where the large substrate 80 is positioned on the router in the second step. On the other hand, the collective substrate may be manufactured by forming the holes 96 in the first mark 58 (the first mark 58 in this case is an example of the mark) by the end mill EM. According to this method of manufacturing a collective substrate, the hole 96 and the plurality of holes are compared with the case where the hole 96 is formed with a tool different from the tool that forms the plurality of grooves 92 and 94 (and the plurality of connecting pieces 93 and 95). A collective substrate having a clear positional relationship with the outer shape of the long substrate 50 can be manufactured. Accordingly, it can be said that according to the manufacturing method of the light emitting substrate 20 (exposure apparatus 10) using the aggregate substrate manufactured by this method, the same effects as those of the embodiment can be obtained.

DESCRIPTION OF SYMBOLS 10 Exposure apparatus 20 Light emission board | substrate (an example of a board | substrate apparatus)
30 Lens array (an example of an optical component)
40 Case 50 Long substrate (an example of unit substrate)
58 1st mark, 62 mark LED array (an example of an element and an optical element)
70 flat substrate 80 large substrate 86 second mark 90 collective substrate 92 groove 93 connecting piece 94 groove 95 connecting piece 96 hole EM end mill (an example of a tool)

Claims (4)

While forming a plurality of grooves for defining the outer shape of the plurality of unit substrates on which the elements are mounted on the positioned large substrate, a tool is provided with a hole or a recess serving as a reference for mounting the elements on the plurality of unit substrates. preparing a collective substrate formed by,
Mounting the element on the plurality of unit substrates based on the holes or the recesses of the assembly substrate, and separating the plurality of unit substrates from the assembly substrate;
Manufacturing method of substrate device having Element in the flat plane substrate is positioned a large-board marked with second indicia different from the first mark with subjecting the first indicia which is a plurality of reference of Unit substrate and sites the element mounting consisting implemented Thereafter, a plurality of grooves defining the outer shapes of the plurality of unit substrates are formed on the large substrate with a tool, and an aggregate substrate is prepared in which holes or recesses are formed in the second marks on the large substrate with the tool. Process,
The amount of deviation of the second mark with respect to the hole or the concave portion of the collective substrate is measured, and the element is mounted on the plurality of unit boards with reference to the position shifted by the amount of deviation with respect to the plurality of first marks. Separating the plurality of unit substrates from the aggregate substrate;
Manufacturing method of substrate device having After positioning the large-board marked as a plurality of reference of Unit substrate become sites the element implementation elements are mounted on a flat surface substrate, a large-sized substrate, the outer shape of the plurality of the unit substrate Preparing a collective substrate in which a hole or a recess is formed in the mark on the large substrate with the tool while forming a plurality of grooves defining
The amount of deviation of the mark with respect to the hole or the recess of the collective substrate is measured, and the element is mounted on the plurality of unit substrates on the basis of positions displaced by the amount of deviation with respect to the plural marks, Separating the plurality of unit substrates from the substrate;
Manufacturing method of substrate device having The unit substrate is long,
The element is a light emitting element or a light receiving element ,
A substrate device manufactured by the method according to any one of claims 1 to 3 , wherein an end surface in a short direction of the substrate device is brought into contact with a housing, and the substrate device is brought into contact with the housing. Position and
Positioning the optical component in the housing so that the element and the optical component face each other;
Fixing the substrate device and the optical component to the housing;
Manufacturing method of optical device.

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