JP7209939B2 - Dicing device and cutter setting method - Google Patents

Description

The present invention relates to a dicing device and a cutter setting method.

A wafer on which a plurality of semiconductor elements having electronic devices are formed is subjected to cutting or grooving (hereinafter referred to as dicing) by a dicing machine. The dicing apparatus includes a thin disk-shaped blade that is rotated at high speed by a spindle and a table that holds the wafer by suction, and processes the wafer by bringing the cutting edge of the outer peripheral edge of the blade that rotates at high speed into contact with the wafer. The table and the blade are moved relative to each other by movement mechanisms for the X, Y, Z, and θ axes provided in the dicing machine. As a result, the dicing apparatus can dicing the wafer into various shapes.

In a dicing machine, it is important to match the amount of wafer left uncut by the blade with a preset value. Therefore, conventionally, in order to match the uncut amount of the wafer to a set value, the Z-axis position (also referred to as Z-axis coordinate) of the rotating shaft of the blade is positioned with high accuracy, which is called cutter setting. process is performed on a regular basis. In this cutter set, the amount of wear of the cutting edge of the blade is measured, and the Z-axis position of the rotating shaft of the blade is corrected based on the amount of wear of the cutting edge, thereby matching the uncut amount of the wafer to the set value. .

A contact type cutter set device is known as a device for measuring the amount of wear of the cutting edge of a blade (see, for example, Patent Document 1). According to this contact type cutter setting device, the blade is lowered toward the table in the Z-axis direction, and the contact of the cutting edge of the blade with the table is detected by electrical conduction. Measure the amount of wear based on the position. According to the contact type cutter setting device, since the cutting edge of the blade is brought into direct contact with the table, it is possible to directly measure the wear amount of the cutting edge of the blade.

Japanese Patent Application Laid-Open No. 2003-211350

By the way, when dicing a wafer having resin molded on its surface, a saw blade type blade (hereinafter referred to as a "saw blade") may be used instead of a normal dicing blade. be.

As for the saw blade, when the cutter is set, the wear amount of the cutting edge is measured by bringing the saw blade into contact with the table while rotating. At that time, if the table is made of a viscous material such as stainless steel, a part of the cutting pieces cut by the saw blade when the cutter is set adheres to the cutting edge of the saw blade and remains as burrs. occurs. This burr is difficult to peel off from the cutting edge even during dicing processing performed after the cutter is set, and therefore contacts the table before the cutting edge when the cutter is set next time. That is, when the saw blade is set on the cutter, the amount of wear of the cutting edge may be measured based on the Z-axis position when the burr comes into contact with the table.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a dicing apparatus and a cutter setting method capable of reducing the measurement error of the cutting edge wear amount of a saw blade.

In order to achieve the object of the present invention, the dicing apparatus of the present invention comprises a work table for holding a work, a saw blade for processing the work, a spindle capable of rotating the saw blade, a spindle, and a work table. and relative movement means for relatively moving the spindle and the work table, and relatively moving the spindle and the work table to bring the cutting edge of the saw blade into contact with the work table, thereby performing cutter setting for measuring the amount of wear of the cutting edge. The spindle is rotatable in forward and reverse directions. By controlling the rotational direction of the spindle, the saw blade is rotated in the forward direction when machining a workpiece, and the saw blade is rotated in the normal direction when the cutter is set. A blade rotation control means for rotating the blade in the reverse direction, and a measurement means for measuring the wear amount of the cutting edge by detecting contact of the cutting edge of the saw blade rotating in the reverse direction with the work table. .

In order to achieve the object of the present invention, the cutter setting method of the present invention is a cutter setting method that measures the amount of wear of the cutting edge by bringing the cutting edge of the saw blade into contact with a work table that holds a work, wherein the cutting edge of the saw blade The blade rotation switching step of switching the rotation direction of from the forward rotation direction, which is the rotation direction when processing the work, to the reverse rotation direction, which is the opposite direction to the forward rotation direction, and the saw blade rotating in the reverse direction A moving process in which the work table is moved relatively closer to the work table, and a measurement process in which the amount of wear of the cutting edge is measured by detecting that the cutting edge of the saw blade rotating in the reverse direction comes into contact with the work table. And prepare.

ADVANTAGE OF THE INVENTION According to this invention, the measurement error of the cutting-edge wear amount of a saw blade can be reduced.

A perspective view of a dicing machine to which the present invention is applied FIG. 2 is a perspective view showing the structure of a working portion of the dicing apparatus shown in FIG. 1; top view of table Front view showing an example of a saw blade Conceptual diagram explaining the configuration and operation of the cutter set device Top view showing the cutter setting position Enlarged view of the main part showing the state of the cutting edge when the saw blade is rotated in the reverse direction and the cutter is set. Enlarged view of the main part showing the state of the cutting edge when the saw blade is rotated in the normal direction and the cutter is set. A graph showing the total amount of wear on the cutting edge when the saw blade is rotated in the reverse direction and the cutter is set. A graph showing the total amount of wear on the cutting edge when the saw blade is rotated in the normal direction and the cutter is set. Schematic side view of deburring device Schematic cross-sectional view of deburring device Graph showing the total amount of blade edge wear when the cutter is set using the burr removing device of FIG. Graph showing the total amount of wear on the cutting edge when the cutter is set using the burr removing device of FIG.

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a dicing apparatus and a cutter setting method according to the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 is an overall perspective view of a dicing apparatus 10 to which the cutter setting method of the present invention is applied.

The dicing apparatus 10 has a load port 12 for transferring a cassette containing a plurality of disk-shaped wafers (workpieces) W to and from an external apparatus, and a suction pad 14, and conveys the wafers W to various parts of the apparatus. It includes a carrier device 16, a work table 18 that holds the wafer W by suction, a processing unit 20 that dices the wafer W, and a spinner 22 that cleans and dries the wafer W after dicing. A controller 24 controls the operation of each part of the dicing apparatus 10 .

A camera 26 is provided in the processing unit 20 . This camera 26 is used as a device for imaging the surface of the wafer W and aligning the wafer W by a known pattern matching method.

Inside the processing unit 20, a pair of saw blades 28, 28 facing each other and spindles 30, 30 with built-in high-frequency motors for rotating the saw blades 28, 28 are provided.

FIG. 2 is a perspective view showing the structure of the processing section 20. As shown in FIG.

As shown in FIG. 2 , the processing section 20 has an X table 32 . The X table 32 is guided by X guides 36, 36 provided on the X base 34, and driven in the X direction indicated by arrows XX by an X movement mechanism 40 having a linear motor 38. As shown in FIG. A rotary table 42 that rotates in the .theta. Therefore, the work table 18 is moved in the X direction by the X table 32 and rotated in the θ direction by the rotary table 42 .

The processing unit 20 also includes a Y base 44 configured in a gate shape so as to straddle the X base 34 . A pair of Y tables 46 , 46 are provided on the wall surface of the Y base 44 . A pair of Y tables 46, 46 are guided by Y guides 48, 48 fixed to the wall surface of the Y base 44, and are moved by a Y movement mechanism 50 consisting of a stepping motor and a ball screw (not shown) as indicated by arrows YY. direction is driven.

The Y tables 46, 46 are provided with Z tables 52, 52, respectively. The Z tables 52, 52 are guided by a Z guide (not shown) provided on the Y table 46, and driven in the Z direction indicated by arrows ZZ by a Z movement mechanism 54 comprising a stepping motor and a ball screw (not shown). be. Spindles 30, 30 are fixed to the Z tables 52, 52 so as to face each other, and saw blades 28, 28 attached to the tips of the spindles 30, 30 are arranged to face each other. The saw blade 28 is rotated at a high speed of 6000 rpm to 80000 rpm by the spindle 30 . Further, the spindle 30 is configured to be rotatable in forward and reverse directions.

With the above-described configuration of the processing unit 20, the saw blades 28, 28 are index-fed in the Y-direction by the Y-moving mechanism 50 and fed in the Z-direction by the Z-moving mechanism 54, and the work table 18 is moved in the X direction. It is fed in the X-direction by the moving mechanism 40 and rotated in the θ-direction by the θ-rotation mechanism (not shown). These operations are controlled by controller 24 (see FIG. 1). The X movement mechanism 40, the Y movement mechanism 50, the Z movement mechanism 54, and the .theta. rotation mechanism (not shown) described in the embodiments constitute the relative movement means of the present invention.

The controller 24 adjusts the cutting feed amount in the Z direction by the Z movement mechanism 54 based on the amount of wear of the cutting edge 29 (see FIG. 4) of the saw blade 28 measured by the cutter setting unit 60 (see FIG. 5) described later. control to match the cut amount or uncut amount of the wafer W to the set value.

3 is a plan view of the worktable 18. FIG. The work table 18 includes a planarly-viewed circular suction portion 56 that suction-holds the wafer W, and a planarly-viewed ring-shaped main body 58 that is arranged outside the suction portion 56 and supports the suction portion 56 .

The adsorption portion 56 is configured in a circular shape centered on the central axis 18A of the work table 18 . The adsorption section 56 is made of a porous member and is connected to a vacuum source (not shown) via a vacuum path. By driving the vacuum source, the air in the vacuum path is sucked, whereby the wafer W is vacuum-sucked and held on the surface of the suction section 56 .

The main body 58 is made of stainless steel, and the surface of the main body 58 is positioned flush with the surface of the adsorption portion 56 . The main body 58 is a contacted portion with which the cutting edge 29A (see FIG. 4) of the saw blade 28 contacts. 29A is contacted.

FIG. 4 is a front view of one example of the saw blade 28, with the cutting edge 29A exaggerated to emphasize the features of the saw blade 28. FIG.

The saw blade 28 has a plurality of cutting edges 29A, 29A, . A flank 29D is formed on the other side. Among the rotation directions of the saw blade 28, the rotation direction indicated by the arrow A is the rotation direction when the wafer W is diced. Hereinafter, the direction of rotation indicated by arrow A will be referred to as the "forward rotation direction", and the opposite direction of rotation indicated by the arrow B will be referred to as the "reverse rotation direction". In defining the "forward rotation direction", the rotation direction in which the rake face 29B faces can also be referred to as the "forward rotation direction".

Next, operation of the dicing apparatus 10 shown in FIG. 1 will be described.

In the dicing apparatus 10, first, a cassette containing a plurality of wafers W is placed on the load port 12 by a transfer device (not shown) or manually. Wafers W are taken out one by one from the placed cassette by the carrier device 16 and placed on the surface of the work table 18 by the carrier device 16 . Thereafter, the back surface of the wafer W is vacuum-sucked and held on the surface of the suction section 56 of the work table 18 . Thereby, the wafer W is held on the work table 18 .

The surface of the wafer W held on the work table 18 is imaged by the camera 26 shown in FIG. The position of the cut line formed on the surface of the wafer W and the position of the saw blade 28 are aligned.

When the alignment is completed and the dicing process is started, the spindle 30 starts rotating in the normal direction, the saw blade 28 rotates in the normal direction at high speed, and a nozzle (not shown) cuts to the processing point. Liquid is supplied. In this state, the wafer W is cut and fed in the X direction together with the work table 18, and the spindle 30 is lowered to a predetermined height in the Z direction for dicing. The general operation of the dicing apparatus 10 has been described above.

FIG. 5 is a conceptual diagram illustrating the configuration and operation of the cutter set section 60. As shown in FIG. The configuration of the cutter setting section 60 will be described below, and the configuration that overlaps with the configuration of the dicing apparatus 10 described above will also be described repeatedly.

The cutter set section 60 shown in FIG. 5 is composed of the work table 18, the controller 24, the saw blade 28, the spindle 30, and the like.

The controller 24 includes a CPU (Central Processing Unit) 62, a memory 64, an input/output interface 68, a cutter set circuit section 70, a Z movement mechanism section 54, an X movement mechanism section 40, a Y movement mechanism section 50, and the like. The controller 24 expands various programs such as a control program stored in the memory 64 and causes the CPU 62 to execute the expanded programs, thereby realizing the functions of the respective units of the controller 24 . calculation processing and control processing. Further, the cutter set circuit section 70 is provided with a contact detection circuit section 72 for detecting that the cutting edge 29A of the saw blade 28 has come into contact with the main body 58 of the work table 18. As shown in FIG.

When the cutter is set, the contact detection circuit 72 applies a positive potential from the DC power supply 73 to the rear end of the spindle 30 via a conductive brush (not shown), and the saw blade 28 is at a positive potential. A negative potential is applied to the main body 58 of the work table 18 that contacts the saw blade 28, and the main body 58 is at a negative potential. Thus, when the cutting edge 29A of the saw blade 28 contacts the main body 58, the saw blade 28 and the main body 58 are electrically connected. The contact detection circuit unit 72 detects that the cutting blade 29A has come into contact with the main body 58 by the above electrical conduction, and the controller 24 detects the amount of wear based on the Z-axis position of the rotating shaft of the saw blade 28 at this time. to measure In the embodiment, the controller 24 constitutes the measuring means of the invention.

FIG. 6 is a plan view of the main body 58 of the work table 18 showing one example of the cutter set position. The main body 58 has a region with which the cutting edge 29A of the saw blade 28 contacts over the entire circumference, and contact scratches 58A, 58A, . . .

Next, a cutter setting method by the cutter setting section 60 will be described with reference to FIG.

First, the work table 18 is rotated by the θ rotation mechanism (not shown) and moved by the X movement mechanism 40 to position the main body 58 of the work table 18 below the saw blade 28 . This position is the first cutter set position. Next, the saw blade 28 is rotated at a predetermined rotational speed by the spindle 30 and lowered at a predetermined speed by the Z movement mechanism 54, and the rotation of the saw blade 28 when the cutting edge 29A contacts the main body 58 Get and store the Z-axis position of the axis. After that, the saw blade 28 is raised by the Z movement mechanism 54 and retracted from the main body 58 . This completes the first cutter setting. The rotating direction of the saw blade 28 when the cutter is set for the first time may be the forward rotating direction indicated by the arrow A in FIG. 4 or the reverse rotating direction indicated by the arrow B. shall be performed in the opposite direction. After that, the dicing apparatus 10 performs the dicing process of the wafer W described above.

When performing the second cutter setting, first, the work table 18 is rotated by the θ rotation mechanism (not shown) and the work table 18 is moved by the X movement mechanism 40 in the same manner as the first cutter setting. to position the main body 58 of the work table 18 so that the surface of the main body 58 free of contact scratches 58A (see FIG. 6) is positioned below the saw blade 28. This position is the second cutter set position.

Next, the controller 24 controls the rotation direction of the spindle 30 to rotate the saw blade 28 in the reverse direction (blade rotation switching step) at a predetermined rotation speed (for example, 30000 rpm), (for example, 0.5 mm/sec) (moving step). Then, the controller 24 measures the amount of wear based on the Z-axis position of the rotating shaft of the saw blade 28 when the cutting edge 29A contacts the main body 58 (measurement step). After that, the saw blade 28 is raised by the Z movement mechanism 54 and retracted from the main body 58 . This completes the second cutter setting operation. The same procedure is followed for the third and subsequent cutter sets. Further, in the embodiment, the controller 24 constitutes blade rotation control means of the present invention.

As described above, in the cutter setting method of the embodiment, the rotating direction of the saw blade 28 is switched to the reverse direction when the cutter is set for the second and subsequent times, and the cutter is set. Advantages of rotating the saw blade 28 in the reverse direction when setting the cutter for the second time and thereafter will be described below.

FIG. 7 is an enlarged view of a main portion showing the state of the saw blade 28 when the saw blade 28 is rotated in the reverse direction to set the cutter. FIG. 8 is a comparative example of FIG. 7, that is, an enlarged view of the main part showing the state of the saw blade 28 when the saw blade 28 is rotated in the forward rotation direction to set the cutter.

As shown in FIG. 8, when the saw blade 28 is rotated in the normal direction to set the cutter, burrs (cutting pieces of the main body 58) 80 attached to the rake face 29B of the cutting edge 29A during the first cutter setting. contacts the main body 58, the main body 58 relatively receives a force that presses against the rake face 29B, as indicated by arrow C. As a result, the burr 80 is kept attached to the rake face 29B, and a measurement error corresponding to the length of the burr 80 is generated. Moreover, every time the cutter is set a plurality of times, a new burr 80 may adhere to the previously adhered burr 80, so the measurement error of the wear amount of the cutting edge 29 increases each time the cutter is set. There is also

On the other hand, as shown in FIG. 7, when the saw blade 28 is rotated in the reverse direction and the cutter is set, the burr 80 attached to the rake face 29B during the first cutter setting is removed after the second cutter setting. Every time it is repeated, it is gradually pushed by the main body 58 and bent toward the valley portion 29C between the cutting edge 29A and the cutting edge 29A adjacent to the cutting edge 29A on the downstream side in the rotational direction. That is, when the cutter setting is performed a plurality of times, the burrs 80 adhering to each cutting edge 29A are completely bent as described above, so that all the cutting edges 29A are stably brought into contact with the main body 58. FIG. As a result, when the saw blade 28 is rotated in the reverse direction to set the cutter, the measurement error of the cutting edge wear amount of the saw blade 28 can be reduced.

Therefore, according to the cutter setting method of the embodiment, the blade rotation switching step of switching the rotation direction of the saw blade 28 to the reverse direction, and the movement of moving the saw blade 28 rotating in the reverse direction toward the main body 58 and a measuring step of measuring the amount of wear of the cutting edge 29 by detecting that the cutting edge 29 of the saw blade 28 rotating in the reverse direction has come into contact with the main body 58. 28 can reduce the measurement error of the wear amount of the cutting edge. In addition, when the cutter is set for the second and subsequent times, it is possible to prevent burrs from adhering to the rake face 29B.

FIG. 9 is a graph showing the total wear amount of the saw blade 28 obtained when the saw blade 28 was rotated in the reverse direction and the cutter set was performed multiple times. FIG. 10 is a comparative example of FIG. 9, that is, a graph showing the total amount of wear of the saw blade 28 obtained when the saw blade 28 was rotated in the normal rotation direction and the cutter set was performed multiple times. is. In the graphs of FIGS. 9 and 10, the horizontal axis indicates the number of times the cutter is set, and the vertical axis indicates the total amount of wear (mm). The total wear amount is an integrated value of the wear amount obtained for each cutter set, and refers to the accumulated wear amount from the time when the saw blade 28 was attached to the spindle 30 .

9, the rotation speed of the saw blade 28 was set to 30000 rpm, and the downward movement speed of the saw blade 28 was set to 0.5 mm/sec. Then, the saw blade 28 is repeatedly moved up and down with respect to the main body 58, and the contact of the cutting blade 29A with the main body 58 is repeated a plurality of times, and the wear amount measured at that time is within 1 μm for three consecutive times, and When measuring that the amount of wear increased from the measured value of the previous cutter set, the average value of the three measured values was obtained as the amount of wear. Of course, each time the cutting blade 29A contacts the main body 58 repeatedly, the position of the main body 58 with respect to the saw blade 28 is changed so that the surface of the main body 58 without contact scratches 58A (see FIG. 6) is cut. The blade 29A was set to contact.

According to the graph of FIG. 10, when the cutter is set by rotating in the normal direction, the total wear amount fluctuates to the negative value side, so the diameter of the cutting edge 29 of the saw blade 28 increases. can be confirmed. This is because the burr 80 (see FIG. 8) adhering to the cutting edge 29A of the saw blade 28 contacts the main body 58 and the apparent diameter of the saw blade 28 increases. Therefore, when the saw blade 28 is rotated in the normal direction to set the cutter, the measurement error of the cutting edge wear amount of the saw blade 28 increases.

On the other hand, according to the graph of FIG. 9, when the cutter is set by rotating in the reverse direction, the total wear amount increases to the positive value side for each cutter set, so the cutting edge 29 of the saw blade 28 It can be seen that the diameter is smaller. The reason for this is that the burr 80 adhering to the cutting edge 29A is bent as shown in FIG. Therefore, when the saw blade 28 is rotated in the reverse direction to set the cutter, the measurement error of the cutting edge wear amount of the saw blade 28 can be reduced.

Next, a burr removing device for removing burrs 80 adhering to the cutting edge 29A of the saw blade 28 will be described.

FIG. 11 is a schematic side view of the burr removing device 90 of the embodiment. FIG. 12 is a schematic side view of a burr removing device 100 which is a comparative example of the burr removing device 90 shown in FIG.

A burr removing device 100 shown in FIG. 12 includes a nozzle 104 for injecting cutting water 102 and a spindle 30 for rotating a saw blade 28 in the normal direction. Further, the nozzle 104 is arranged at a position facing the flank 29D of the cutting edge 29A. Therefore, according to the burr removing device 100 of FIG. 12, the cutting water 102 jetted from the nozzle 104 is jetted toward the flank 92D of the cutting edge 29A.

According to the burr removing device 100 shown in FIG. 12, the relative velocity of the cutting water 102 with respect to the burr 80 adhering to the rake face 92B changes from the jetting speed jetted from the nozzle 104 to the rotational speed of the saw blade 28 in the forward rotation direction. The cutting water 102 collides with the burr 80 at this speed. In other words, since the rotational speed of the saw blade 28 cannot be effectively used as a force for removing the burr 80, the burr 80 cannot be removed efficiently.

On the other hand, the burr removing device 90 of the embodiment shown in FIG. It is arranged at a position facing the rake face 29B of the cutting edge 29A.

According to the burr removing device 90 of the embodiment shown in FIG. The cutting water 92 collides with the burr 80 at this speed. That is, the rotational speed of the saw blade 28 can be effectively used as a force for removing the burr 80, so the burr 80 can be removed efficiently.

Therefore, according to the burr removing device 90 of the embodiment, the saw blade 28 is rotated in the normal direction by the spindle 30, and the cutting water 92 is discharged from the nozzle 94 arranged at the position facing the rake face 29B. , the burr 80 can be effectively removed.

As described above, according to the burr removing device 90 of the embodiment, the burr 80 adhering to the cutting edge 29A of the saw blade 28 can be effectively removed. can be reduced.

The deburring process by the deburring device 90 may be performed for each cutter set, or may be performed based on the wear amount of the saw blade 28 measured when the cutter is set. Further, it may be performed during the dicing process of the wafer W, or during the return movement of the work table 18 in the X-axis direction between dicing processes. Moreover, you may implement just before a cutter set. If performed immediately before setting the cutter, the direction of rotation of the saw blade 28 at the time of setting the cutter is not limited to the reverse direction, and may be the normal direction.

The graph of FIG. 13 shows changes in the total wear amount of the saw blade 28 when the deburring process is performed using the deburring device 90 shown in FIG. The graph of FIG. 14 shows changes in the total wear amount of the saw blade 28 when the deburring process is performed using the deburring device 100 shown in FIG. In the graphs of FIGS. 13 and 14, the horizontal axis indicates the number of times the cutter is set, and the vertical axis indicates the total amount of wear (mm). Also, in the burr removing process shown in FIGS. 13 and 14, cutting water was jetted at 1.5 liters per minute for 30 seconds.

According to the graph of FIG. 14, the total amount of wear of the cutter set (-0.014 mm) that was performed the second time varied greatly from the total amount of wear (0 mm) of the cutter set that was performed the first time. It is shown. This is because a burr 80 having a length of about 0.014 mm is attached to the cutting edge 29A in the radial direction from the cutting edge 29A. Further, based on the total amount of wear of multiple cutter sets performed thereafter, it can be seen that a burr 80 having a length of about 0.008 mm remains adhered to the cutting edge 29A. Based on the total amount of wear of the cutter set 68 to 70 times, it can be seen that a burr 80 having a length of about 0.02 mm adhered to the cutting edge 29A. Therefore, when the burr removing process was performed using the burr removing apparatus 100 shown in FIG. 12 before the 71st cutter setting, the burr 80 having a length of about 0.02 mm could be removed. However, based on the total amount of wear of the cutter set after the 72nd time, the burr 80 having a length of 0.007 mm remained attached, and the burr 80 could not be removed effectively.

On the other hand, according to the graph of FIG. 13, based on the total amount of wear of the cutter set performed from the 2nd to the 25th times, the burr 80 having a length of about 0.002 mm remained attached to the cutting edge 29A. I know there is. Based on the total amount of wear of the cutter set performed for the 26th time, it can be seen that a burr 80 having a length of about 0.005 mm adhered to the cutting edge 29A. Based on the total amount of wear of the cutter set performed from the 29th to the 37th times, it can be seen that the burr 80 having a length of about 0.002 mm remains attached to the cutting edge 29A. Based on the total amount of wear of the cutter set performed 38th to 45th times, it can be seen that a burr 80 having a length of about 0.005mm to 0.006mm was attached to the cutting edge 29A. Based on the total amount of wear of the cutter set carried out from the 46th to the 49th, it can be seen that a burr 80 having a length of about 0.004mm to 0.006mm adhered to the cutting edge 29A. Therefore, if burrs are removed using the burr removing device 90 shown in FIG. It was confirmed that the amount of wear returned to near 0 mm. Therefore, the burr 80 could be effectively removed by using the burr removing device 90 shown in FIG.

DESCRIPTION OF SYMBOLS W... Wafer, 10... Dicing device, 12... Load port, 14... Suction pad, 16... Conveyor, 18... Work table, 20... Processing unit, 22... Spinner, 24... Controller, 26... Camera, 28... Saw blade Blade 29 Cutting edge 29A Cutting edge 29B Rake face 30 Spindle 32 X table 34 X base 36 X guide 38 Linear motor 40 X movement mechanism 42 Rotation Table 44 Y base 46 Y table 48 Y guide 50 Y movement mechanism 52 Z table 54 Z movement mechanism 56 Adsorption unit 58 Main body 60 Cutter set unit , 62 ... CPU, 64 ... memory, 68 ... input/output interface, 70 ... cutter set circuit section, 72 ... contact detection circuit section

Claims (4)

a work table for holding a workpiece;
a saw blade having at least one cutting edge with a rake face ;
a spindle capable of rotating the saw blade;
relative movement means for relatively moving the spindle and the work table;
with
A dicing device that performs cutter setting for measuring the amount of wear of the cutting edge by relatively moving the spindle and the work table to bring the cutting edge of the saw blade into contact with the work table,
The spindle is configured to be rotatable in a forward rotation direction, which is a rotation direction in which the rake face faces, and a reverse rotation direction, which is a direction opposite to the forward rotation direction,
By controlling the rotation direction of the spindle, the saw blade is rotated in the forward rotation direction when processing the workpiece, and the saw blade is rotated in the reverse rotation direction when the cutter is set. means and
A dicing apparatus comprising measuring means for measuring the wear amount of the cutting edge by detecting that the cutting edge of the saw blade rotating in the reverse direction comes into contact with the work table. 2. The dicing apparatus according to claim 1, further comprising a nozzle disposed at a position facing the rake face of the saw blade rotating in the normal direction and ejecting cutting water toward the rake face. . A cutter setting method for measuring the amount of wear of a saw blade having at least one cutting edge with a rake face by bringing the cutting edge of a saw blade into contact with a work table that holds a workpiece,
A blade rotation switching step of switching the rotation direction of the saw blade blade from the forward rotation direction, which is the rotation direction in which the rake face faces , to the reverse rotation direction, which is the opposite direction to the forward rotation direction;
a moving step of moving the saw blade rotating in the reverse direction and the work table in a direction toward each other;
a measuring step of measuring the wear amount of the cutting edge by detecting that the cutting edge of the saw blade rotating in the reverse direction comes into contact with the work table;
and a cutter setting method. and a burr removing step of removing burrs adhering to the rake face by injecting cutting water toward the rake face of the saw blade rotating in the normal direction. Described cutter setting method.

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