JP7460875B2 - Dicing device and cutter setting method - Google Patents

Description

The present invention relates to a dicing device and a cutter setting method.

A wafer on which multiple semiconductor elements having electronic devices are formed is cut or grooved (hereinafter referred to as dicing) by a dicing machine. The dicing machine is equipped with a thin, disk-shaped blade rotated at high speed by a spindle and a table that holds the wafer by suction, and processes the wafer by bringing the cutting edge of the outer periphery of the rapidly rotating blade into contact with the wafer. The table and blade are moved relatively by the X, Y, Z, and θ axis movement mechanisms equipped in the dicing machine. This allows the dicing machine to perform dicing processes on the wafer in various shapes.

In a dicing machine, it is important that the amount of the wafer that is left uncut by the blade matches a preset value. Conventionally, in order to match the amount of the wafer that is left uncut to the set value, a process that positions the Z-axis position (also called the Z-axis coordinate) of the blade's rotation axis with high precision, that is, a process called cutter setting, is periodically performed. In this cutter set, the amount of wear on the blade's cutting edge is measured, and the Z-axis position of the blade's rotation axis is corrected based on the amount of wear on the cutting edge, thereby matching the amount of the wafer that is left uncut to the set value.

A contact-type cutter setting device is known as a device for measuring the amount of wear on the cutting edge of a blade (see, for example, Patent Document 1). With this contact-type cutter setting device, the blade is lowered in the Z-axis direction toward the table, and contact of the cutting edge of the blade with the table is detected by electrical conduction, and the amount of wear is measured based on the Z-axis position of the rotation axis of the blade at this time. With a contact-type cutter setting device, the cutting edge of the blade is directly contacted with the table, so the amount of wear on the cutting edge of the blade can be directly measured.

JP 2003-211350 A

By the way, when dicing a wafer with a resin molded surface, a saw-tooth type blade (hereinafter referred to as a "saw blade") may be used instead of a normal dicing blade.

For saw blades, when setting the cutter, the amount of wear on the cutting edge is measured by bringing the saw blade into contact with a table in a rotating state. At that time, if the table is made of a viscous material such as stainless steel, a part of the cutting pieces scraped by the saw blade when setting the cutter adheres to the cutting edge of the saw blade and remains as burrs. occurs. This burr is difficult to separate from the cutting edge even during the dicing process performed after the cutter is set, and therefore, when the cutter is set next time, it comes into contact with the table before the cutting edge. In other words, when setting the cutter of a saw blade, the amount of wear on the cutting edge may be measured based on the Z-axis position when the burr contacts the table, resulting in a problem of increased measurement error.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a dicing device and a cutter setting method that can reduce errors in measuring the amount of wear on the cutting edge of a saw blade.

In order to achieve the object of the present invention, the dicing device of the present invention includes a work table that holds a workpiece, a saw blade that processes the workpiece, a spindle that can rotate the saw blade, and a spindle and a work table. A dicing device that relatively moves a spindle and a work table, and performs cutter setting that measures the amount of wear on the saw blade by bringing the cutting edge of the saw blade into contact with the work table. The spindle is configured to be rotatable in the forward and reverse directions, and by controlling the direction of rotation of the spindle, the saw blade is rotated in the forward direction when processing a workpiece, and the saw blade is rotated in the forward direction when setting the cutter. A blade rotation control means for rotating the saw blade in the reverse direction, and a measuring means for measuring the amount of wear on the saw blade by detecting that the cutting edge of the saw blade rotating in the reverse direction comes into contact with the work table. .

In order to achieve the object of the present invention, the cutter setting method of the present invention is a cutter setting method for measuring the amount of wear on the cutting edge by contacting the cutting edge of a saw blade with a work table that holds a workpiece, and includes a blade rotation switching step of switching the rotation direction of the saw blade from the forward direction, which is the rotation direction when processing the workpiece, to a reverse direction, which is the opposite direction to the forward direction, a moving step of moving the saw blade rotating in the reverse direction and the work table in directions that bring them closer together, and a measuring step of measuring the amount of wear on the cutting edge by detecting that the cutting edge of the saw blade rotating in the reverse direction has come into contact with the work table.

According to the present invention, it is possible to reduce measurement errors in the amount of wear on the cutting edge of a saw blade.

FIG. 1 is a perspective view of a dicing device to which the present invention is applied. FIG. 2 is a perspective view showing a structure of a processing unit of the dicing device shown in FIG. Top view of the table Front view showing an example of a saw blade A conceptual diagram explaining the configuration and operation of a cutter setting device. Plan view showing cutter set position An enlarged view of the main parts showing the state of the cutting edge when the saw blade is rotated in the reverse direction and the cutter is set. An enlarged view of the main parts showing the state of the saw blade when the cutter is set with the saw blade rotated in the forward direction. A graph showing the total wear amount of the cutting edge when the saw blade is rotated in the reverse direction and the cutter is set. A graph showing the total wear amount of the cutting edge when the saw blade is rotated in the forward direction and the cutter is set. Schematic side view of a burr removal device Schematic cross-sectional view of a burr removal device Graph showing the total wear amount of the cutting edge when the cutter is set using the burr removing device of FIG. 11 . Graph showing the total amount of wear on the cutting edge when performing cutter set using the burr removal device shown in Figure 12

Below, an embodiment of the dicing device and cutter setting method according to the present invention will be described in detail with reference to the attached drawings.

Figure 1 is an overall perspective view of a dicing device 10 to which the cutter setting method of the present invention is applied.

The dicing device 10 includes a load port 12 that transfers cassettes containing multiple disk-shaped wafers (workpieces) W between external devices, a transport device 16 that has suction pads 14 and transports the wafers W to each part of the device, a work table 18 that holds the wafers W by suction, a processing section 20 that dices the wafers W, and a spinner 22 that cleans and dries the wafers W after dicing. The operation of each part of the dicing device 10 is controlled by a controller 24.

The processing section 20 is provided with a camera 26. This camera 26 is used as a device for capturing an image of the surface of the wafer W and aligning the wafer W by a known pattern matching method.

Inside the processing section 20, there are provided a pair of saw blades 28, 28 arranged opposite to each other, and spindles 30, 30 with a built-in high frequency motor that rotate the saw blades 28, 28.

FIG. 2 is a perspective view showing the structure of the processing section 20.

As shown in FIG. 2, the processing section 20 includes an X-table 32. The X-table 32 is guided by X-guides 36, 36 provided on an X-base 34, and is driven in the X-direction indicated by the arrow X-X by an X-movement mechanism section 40 having a linear motor 38. In addition, a rotary table 42 that rotates in the θ-direction is fixed to the upper surface of the X-table 32, and the work table 18 is provided on this rotary table 42. Therefore, the work table 18 is moved in the X-direction by the X-table 32, and rotated in the θ-direction by the rotary table 42.

Further, the processing section 20 includes a Y base 44 configured in a gate shape so as to straddle the X base 34 . A pair of Y tables 46, 46 are provided on the wall surface of the Y base 44. The pair of Y tables 46, 46 are guided by Y guides 48, 48 fixed to the wall surface of the Y base 44, and are moved by a Y moving mechanism section 50 consisting of a stepping motor and a ball screw (not shown). driven in the direction.

Z tables 52, 52 are provided in the Y tables 46, 46, respectively. The Z tables 52, 52 are guided by a Z guide (not shown) provided on the Y table 46, and are driven in the Z direction indicated by the arrow Z-Z by a Z moving mechanism 54 consisting of a stepping motor and a ball screw (not shown). Ru. Spindles 30, 30 are fixed to the Z tables 52, 52 in a facing state, and saw blades 28, 28 attached to the tips of the spindles 30, 30 are arranged facing each other. The saw blade 28 is rotated by a spindle 30 at a high speed of 6000 rpm to 80000 rpm. Further, the spindle 30 is configured to be rotatable in a forward rotation direction and a reverse rotation direction.

With the above-described configuration of the processing section 20, the saw blades 28, 28 are index-fed in the Y direction by the Y-moving mechanism section 50, cut-fed in the Z-direction by the Z-moving mechanism section 54, and the work table 18 is moved in the X direction. It is cut and fed in the X direction by the moving mechanism section 40, and rotated in the .theta. direction by a .theta. rotation mechanism section (not shown). These operations are controlled by controller 24 (see FIG. 1). Note that the X movement mechanism section 40, Y movement mechanism section 50, Z movement mechanism section 54 described in the embodiment, and the θ rotation mechanism section (not shown) constitute the relative movement means of the present invention.

The controller 24 controls the cutting feed amount in the Z direction by the Z movement mechanism 54 based on the wear amount of the cutting edge 29 (see FIG. 4) of the saw blade 28 measured by a cutter set section 60 (see FIG. 5), which will be described later. The cutting amount or the uncut amount of the wafer W is controlled to match the set value.

Figure 3 is a plan view of the work table 18. The work table 18 has a suction portion 56 that is circular in plan view and that holds the wafer W by suction, and a main body 58 that is ring-shaped in plan view and is disposed outside the suction portion 56 to support the suction portion 56.

The suction portion 56 is configured in a circular shape centered on the central axis 18A of the work table 18. The suction portion 56 is also configured from a porous material and is connected to a vacuum source (not shown) via a vacuum path. By driving the vacuum source, air in the vacuum path is sucked in, and the wafer W is thereby vacuum-sucked and held on the surface of the suction portion 56.

The main body 58 is made of stainless steel, and the surface of the main body 58 is positioned on the same plane as the surface of the suction part 56. This main body 58 is the contacted part that comes into contact with the cutting edge 29A of the saw blade 28 (see FIG. 4). In other words, when the cutter is set, the cutting edge 29A of the saw blade 28 comes into contact with the surface of this main body 58.

FIG. 4 is a front view showing an example of the saw blade 28, and in order to emphasize the features of the saw blade 28, the cutting edge 29A is exaggerated.

The saw blade 28 has a plurality of cutting edges 29A, 29A, . A relief surface 29D is formed on the other surface. In the rotation direction of the saw blade 28, the rotation direction indicated by arrow A is the rotation direction when dicing the wafer W. Hereinafter, the rotation direction indicated by arrow A will be referred to as a "normal rotation direction", and the rotation direction indicated by arrow B, which is the opposite direction, will be referred to as a "reverse rotation direction". In addition, in defining the "normal rotation direction", the rotation direction in which the rake face 29B faces can also be referred to as the "normal rotation direction".

Next, the operation of the dicing device 10 shown in Figure 1 will be described.

In the dicing device 10, first, a cassette containing multiple wafers W is placed on the load port 12 by a transport device (not shown) or manually. The wafers W are removed one by one from the placed cassette by the transport device 16, and placed on the surface of the work table 18 by the transport device 16. The back surface of the wafer W is then vacuum-adsorbed and held on the surface of the suction portion 56 of the work table 18. In this way, the wafer W is held on the work table 18.

The surface of the wafer W held on the work table 18 is imaged by the camera 26 in FIG. 1, and then the attitude of the work table 18 is adjusted by the The position of the cut line formed on the surface of the wafer W and the position of the saw blade 28 are aligned.

When the alignment is completed and the dicing process is started, the spindle 30 starts rotating in the normal rotation direction, the saw blade 28 rotates at high speed in the normal rotation direction, and cutting is performed from a nozzle (not shown) to the processing point. liquid is supplied. In this state, the wafer W is cut and fed together with the work table 18 in the X direction, and the spindle 30 is lowered to a predetermined height in the Z direction to perform dicing. The above is the general operation of the dicing device 10.

Figure 5 is a conceptual diagram illustrating the configuration and operation of the cutter set unit 60. The configuration of the cutter set unit 60 will be explained below, but configurations that overlap with the configuration of the dicing device 10 described above will also be explained repeatedly.

The cutter set unit 60 shown in FIG. 5 is composed of a work table 18, a controller 24, a saw blade 28, and a spindle 30.

The controller 24 includes a CPU (Central Processing Unit) 62, a memory 64, an input/output interface 68, a cutter set circuit section 70, a Z movement mechanism section 54, an X movement mechanism section 40, a Y movement mechanism section 50, and the like. The controller 24 implements the functions of each part of the controller 24 by expanding various programs such as control programs stored in the memory 64 and having the CPU 62 execute the expanded programs. Executes calculation processing and control processing. Further, the cutter set circuit section 70 is provided with a contact detection circuit section 72 that detects when the cutting edge 29A of the saw blade 28 comes into contact with the main body 58 of the work table 18.

When setting the cutter, the contact detection circuit section 72 applies a positive potential from the DC power supply 73 to the rear end of the spindle 30 via a conductive brush (not shown), and the saw blade 28 is at a positive potential. Further, a negative potential is applied to the main body 58 of the work table 18 that comes into contact with the saw blade 28, and the main body 58 has a negative potential. Thereby, when the cutting edge 29A of the saw blade 28 comes into contact with the main body 58, the saw blade 28 and the main body 58 are electrically connected. The contact detection circuit section 72 detects that the cutting blade 29A has contacted the main body 58 through the electrical continuity, and the controller 24 calculates the amount of wear based on the Z-axis position of the rotation axis of the saw blade 28 at this time. Measure. In the embodiment, the controller 24 constitutes the measuring means of the present invention.

FIG. 6 is a plan view of the main body 58 of the work table 18 showing an example of the cutter set position. The main body 58 is a region that comes into contact with the cutting edge 29A of the saw blade 28 over the entire circumference, and contact scratches 58A, 58A, . . . are formed at the positions where the cutting edge 29A comes into contact.

Next, a cutter setting method by the cutter setting section 60 will be described with reference to FIG.

First, the work table 18 is rotated by the θ rotation mechanism (not shown), and the work table 18 is moved by the X movement mechanism 40 to position the main body 58 of the work table 18 below the saw blade 28. This position is the first cutter set position. Next, the saw blade 28 is rotated at a predetermined rotation speed by the spindle 30 and lowered at a predetermined speed by the Z movement mechanism 54, and the Z-axis position of the rotation axis of the saw blade 28 when the cutting edge 29A contacts the main body 58 is acquired and stored. After that, the saw blade 28 is raised by the Z movement mechanism 54 and retreated from the main body 58. This completes the first cutter set. Note that the rotation direction of the saw blade 28 during the first cutter set may be the forward direction indicated by the arrow A in FIG. 4 or the reverse direction indicated by the arrow B, but in the embodiment, it is performed in the forward direction. After this, the dicing device 10 performs the dicing process of the wafer W described above.

When performing the second cutter set, first, the θ rotation mechanism (not shown) rotates the work table 18, and the X movement mechanism 40 rotates the work table 18, as in the first cutter set. is moved to position the main body 58 of the work table 18 so that the surface of the main body 58 free of contact scratches 58A (see FIG. 6) is located below the saw blade 28. This position becomes the second cutter set position.

Next, the controller 24 controls the rotational direction of the spindle 30 to rotate the saw blade 28 in the reverse direction at a predetermined rotational speed (for example, 30,000 rpm) (blade rotation switching step), and the Z moving mechanism section 54 (moving step) at a speed of (for example, 0.5 mm/sec). Then, the controller 24 measures the amount of wear based on the Z-axis position of the rotation axis of the saw blade 28 when the cutting edge 29A contacts the main body 58 (measurement step). Thereafter, the saw blade 28 is raised by the Z moving mechanism section 54 and retracted from the main body 58. This completes the second cutter setting operation. The same procedure will be followed for the third and subsequent cutter sets. Further, in the embodiment, the controller 24 constitutes the blade rotation control means of the present invention.

In this way, in the cutter setting method of the embodiment, when setting the cutter for the second or subsequent times, the rotation direction of the saw blade 28 is switched to the reverse direction to set the cutter. Below, the advantages of rotating the saw blade 28 in the reverse direction when setting the cutter for the second or subsequent times will be explained.

FIG. 7 is an enlarged view of a main part showing the state of the saw blade 28 when the cutter is set by rotating the saw blade 28 in the reverse direction. FIG. 8 is a comparative example of FIG. 7, that is, an enlarged view of the main part showing the state of the saw blade 28 when the saw blade 28 is rotated in the forward rotation direction and the cutter is set.

As shown in FIG. 8, when the saw blade 28 is rotated in the forward direction to perform the cutter set, the burr (cutting chip of the main body 58) 80 attached to the rake face 29B of the cutting edge 29A during the first cutter set is pressed against the rake face 29B by the main body 58 as shown by arrow C when it comes into contact with the main body 58. As a result, the burr 80 remains attached to the rake face 29B, resulting in a measurement error of the length of the burr 80. In addition, since a new burr 80 may adhere to the burr 80 attached previously each time the cutter set is performed multiple times, there is also the problem that the measurement error of the wear amount of the cutting edge 29 increases each time the cutter set is performed.

In contrast, as shown in FIG. 7, when the saw blade 28 is rotated in the reverse direction to perform the cutter set, the burr 80 attached to the rake face 29B during the first cutter set is gradually pushed by the body 58 each time the cutter set is repeated from the second time onwards, and bends toward the valley 29C between the cutting edge 29A and the cutting edge 29A adjacent to the cutting edge 29A downstream in the rotation direction. In other words, when the cutter set is performed multiple times, the burr 80 attached to each cutting edge 29A is completely bent as described above, so that all cutting edges 29A come into stable contact with the body 58. As a result, when the saw blade 28 is rotated in the reverse direction to perform the cutter set, the measurement error of the cutting edge wear amount of the saw blade 28 can be reduced.

Therefore, according to the cutter setting method of the embodiment, a blade rotation switching step of switching the rotation direction of the saw blade 28 to the reverse direction, a moving step of moving the saw blade 28 rotating in the reverse direction toward the main body 58, and a measuring step of measuring the amount of wear of the cutting edge 29 by detecting that the cutting edge 29 of the saw blade 28 rotating in the reverse direction has come into contact with the main body 58, thereby reducing measurement errors in the amount of wear of the cutting edge of the saw blade 28. In addition, when setting the cutter for the second or subsequent times, burrs can be prevented from adhering to the rake face 29B.

FIG. 9 is a graph showing the total wear amount of the saw blade 28 obtained when the saw blade 28 was rotated in the reverse direction and the cutter was set a plurality of times. FIG. 10 is a comparative example of FIG. 9, that is, a graph showing the total wear amount of the saw blade 28 obtained when the saw blade 28 was rotated in the normal rotation direction and the cutter set was performed multiple times. It is. The horizontal axis of the graphs in FIGS. 9 and 10 shows the number of cutter sets, and the vertical axis shows the total wear amount (mm). Note that the total amount of wear is an integrated value of the amount of wear obtained for each cutter set, and refers to the cumulative amount of wear from the time when the saw blade 28 is attached to the spindle 30.

Further, the test conditions in FIG. 9 were that the rotational speed of the saw blade 28 was set to 30,000 rpm, and the downward movement speed of the saw blade 28 was set to 0.5 mm/sec. Then, the saw blade 28 is repeatedly moved up and down with respect to the main body 58, and the contact of the cutting blade 29A with the main body 58 is repeated multiple times, and the amount of wear measured at that time is within 1 μm three times in a row, and When it was determined that the amount of wear was greater than the previous measurement of the cutter set, the average value of the three measurements was taken as the amount of wear. It goes without saying that each time the cutting blade 29A contacts the main body 58, the position of the main body 58 relative to the saw blade 28 is changed so that the surface of the main body 58 without any contact scratches 58A (see FIG. 6) is cut. The blade 29A was set so as to be in contact with each other.

According to the graph in FIG. 10, when the cutter is set in the normal rotation direction, the total wear amount fluctuates toward a negative value, which indicates that the diameter of the cutting edge 29 of the saw blade 28 is increasing. can be confirmed. This is because the burr 80 (see FIG. 8) attached to the cutting edge 29A of the saw blade 28 comes into contact with the main body 58, and the apparent diameter of the saw blade 28 becomes larger. Therefore, when the saw blade 28 is rotated in the normal rotation direction and the cutter is set, the measurement error of the amount of wear on the cutting edge of the saw blade 28 increases.

In contrast, according to the graph in Figure 9, when the cutter set is performed with rotation in the reverse direction, the total wear amount increases to the positive side for each cutter set, and it can be confirmed that the diameter of the cutting edge 29 of the saw blade 28 becomes smaller. This is because the burr 80 attached to the cutting edge 29A is bent as shown in Figure 7 by the rotation of the saw blade 28 in the reverse direction, and the cutting edge 29A comes into contact with the main body 58. Therefore, when the cutter set is performed by rotating the saw blade 28 in the reverse direction, the measurement error of the wear amount of the cutting edge of the saw blade 28 can be reduced.

Next, a burr removing device for removing burrs 80 attached to the cutting edge 29A of the saw blade 28 will be described.

FIG. 11 is a schematic side view of the burr removal device 90 of the embodiment. FIG. 12 is a schematic side view of a burr removal device 100, which is a comparative example of the burr removal device 90 shown in FIG.

The burr removal device 100 shown in FIG. 12 includes a nozzle 104 that sprays cutting water 102, and a spindle 30 that rotates the saw blade 28 in the normal rotation direction. Moreover, the nozzle 104 is arranged at a position facing the flank 29D of the cutting blade 29A. Therefore, according to the burr removal apparatus 100 of FIG. 12, the cutting water 102 injected from the nozzle 104 is injected toward the flank surface 92D of the cutting blade 29A.

According to the burr removal device 100 shown in FIG. 12, the relative speed of the cutting water 102 to the burr 80 adhering to the rake face 92B is the injection speed from the nozzle 104 minus the rotation speed of the saw blade 28 in the forward direction, and the cutting water 102 collides with the burr 80 at this speed. In other words, the rotation speed of the saw blade 28 cannot be effectively used as a force for removing the burr 80, so the burr 80 cannot be removed efficiently.

On the other hand, the burr removing device 90 of the embodiment shown in FIG. It is arranged at a position facing the rake face 29B of the cutting blade 29A.

According to the burr removal device 90 of the embodiment shown in FIG. The speed is the sum of the rotation speed in the normal rotation direction, and the cutting water 92 collides with the burr 80 at this speed. In other words, since the rotational speed of the saw blade 28 can be effectively used as a force for removing the burr 80, the burr 80 can be removed efficiently.

Therefore, according to the embodiment of the burr removal device 90, the saw blade 28 is rotated in the forward direction by the spindle 30, and cutting water 92 is sprayed toward the rake face 29B from a nozzle 94 arranged at a position opposite the rake face 29B, so that the burrs 80 can be effectively removed.

In this way, the burr removal device 90 of the embodiment can effectively remove the burrs 80 attached to the cutting edge 29A of the saw blade 28, thereby reducing measurement errors in the amount of wear on the cutting edge 29 when the cutter is set.

The burr removal process by the burr removal device 90 may be performed for each cutter set, or may be performed based on the wear amount of the saw blade 28 measured at the time of cutter set. Moreover, it may be carried out during the dicing process of the wafer W, or may be carried out during the return movement of the work table 18 in the X-axis direction between the dicing processes. Alternatively, it may be carried out immediately before setting the cutter. If carried out immediately before setting the cutter, the direction of rotation of the saw blade 28 at the time of setting the cutter is not limited to the reverse direction, but may be the normal direction.

The graph in Figure 13 shows the change in the total wear of the saw blade 28 when the burr removal process is performed using the burr removal device 90 shown in Figure 11. The graph in Figure 14 shows the change in the total wear of the saw blade 28 when the burr removal process is performed using the burr removal device 100 shown in Figure 12. The horizontal axis of the graphs in Figures 13 and 14 shows the number of cutter sets, and the vertical axis shows the total wear (mm). In addition, in both of the burr removal processes shown in Figures 13 and 14, 1.5 liters of cutting water was sprayed per minute for 30 seconds.

According to the graph in Figure 14, the total wear amount of the cutter set carried out the second time (-0.014 mm) varied greatly compared to the total wear amount of the cutter set carried out the first time (0 mm). It is shown. This is because a burr 80 having a length of about 0.014 mm in the outer diameter direction from the cutting edge 29A is attached to the cutting edge 29A. Furthermore, based on the total amount of wear of the cutter sets carried out several times thereafter, it can be seen that the burr 80 having a length of about 0.008 mm remains attached to the cutting edge 29A. Based on the total wear amount of the cutter set after 68 to 70 cycles, it can be seen that a burr 80 having a length of about 0.02 mm was attached to the cutting edge 29A. Therefore, before performing the 71st cutter set, a burr removal process was performed using the burr removal device 100 shown in FIG. 12, and the burr 80 having a length of about 0.02 mm could be removed. However, based on the total amount of wear of the cutter set after the 72nd cut, the burr 80 having a length of 0.007 mm remained attached, and the burr 80 could not be effectively removed.

On the other hand, according to the graph of FIG. 13, based on the total wear amount of the cutter set performed from the second to the 25th time, it is found that the burr 80 having a length of about 0.002 mm remains attached to the cutting edge 29A. Based on the total wear amount of the cutter set performed from the 26th time, it is found that the burr 80 having a length of about 0.005 mm has adhered to the cutting edge 29A. Based on the total wear amount of the cutter set performed from the 29th to the 37th time, it is found that the burr 80 having a length of about 0.002 mm remains attached to the cutting edge 29A. Based on the total wear amount of the cutter set performed from the 38th to the 45th time, it is found that the burr 80 having a length of about 0.005 mm to 0.006 mm has adhered to the cutting edge 29A. Based on the total wear amount of the cutter set performed from the 46th to the 49th time, it is found that the burr 80 having a length of about 0.004 mm to 0.006 mm has adhered to the cutting edge 29A. Therefore, by using the burr removal device 90 shown in FIG. 11 to remove the burrs before the 50th cutter set, it was confirmed that the burrs 80 having a length of approximately 0.005 mm could be removed and the total wear amount returned to nearly 0 mm. Therefore, by using the burr removal device 90 shown in FIG. 11, the burrs 80 could be effectively removed.

W... Wafer, 10... Dicing device, 12... Load port, 14... Suction pad, 16... Transfer device, 18... Work table, 20... Processing section, 22... Spinner, 24... Controller, 26... Camera, 28... Saw blade Blade, 29... Cutting edge, 29A... Cutting edge, 29B... Rake face, 30... Spindle, 32... X table, 34... X base, 36... X guide, 38... Linear motor, 40... Table, 44...Y base, 46...Y table, 48...Y guide, 50...Y moving mechanism section, 52...Z table, 54...Z moving mechanism section, 56... suction section, 58... main body, 60... cutter set section , 62... CPU, 64... Memory, 68... Input/output interface, 70... Cutter set circuit section, 72... Contact detection circuit section

Claims (4)

a work table that holds the work;
a sawtooth blade having at least one cutting edge;
a spindle capable of rotating the saw blade;
Blade rotation control means for rotating the saw blade in a forward rotation direction in which the blade portion of the cutting blade to which burrs are attached faces, and rotating the saw blade blade in a reverse rotation direction that is opposite to the forward rotation direction;
comprising a measuring means for measuring the amount of wear on the cutting edge by detecting that the cutting edge of the saw blade comes into contact with the work table,
The blade rotation control means rotates the saw blade in the normal rotation direction when processing the workpiece with the saw blade, and rotates the saw blade in the normal rotation direction when the measuring means measures the wear amount of the cutting edge. A dicing device that rotates the dicing device in the reverse direction. The dicing apparatus according to claim 1, further comprising: a nozzle that is disposed at a position facing the blade portion of the saw blade rotating in the normal rotation direction and injects cutting water toward the blade portion. . A work table that holds a workpiece, a saw blade having at least one cutting edge, a spindle capable of rotating the saw blade, and detecting that the cutting edge of the saw blade has contacted the work table. A cutter setting method applied to a dicing device comprising: a measuring means for measuring the amount of wear on the cutting edge;
When processing the workpiece with the saw blade, rotate the saw blade in a forward rotation direction in which the blade portion of the cutting blade to which burrs are attached faces,
A cutter setting method, wherein the saw blade is rotated in a reverse direction that is opposite to the normal rotation direction when measuring the wear amount of the cutting edge by the measurement means. The cutter setting method according to claim 3 , further comprising the step of removing burrs from the cutting edge of the saw blade by jetting cutting water toward the cutting edge of the saw blade rotating in the forward direction.

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