JP7634818B2 - Wear amount measuring device and wear amount measuring method - Google Patents

Description

The present invention relates to a dicing device and a cutter setting method.

A wafer on which multiple semiconductor elements having electronic devices are formed is cut or grooved (hereinafter referred to as dicing) by a dicing machine. The dicing machine is equipped with a thin, disk-shaped blade rotated at high speed by a spindle and a table that holds the wafer by suction, and processes the wafer by bringing the cutting edge of the outer periphery of the rapidly rotating blade into contact with the wafer. The table and blade are moved relatively by the X, Y, Z, and θ axis movement mechanisms equipped in the dicing machine. This allows the dicing machine to perform dicing processes on the wafer in various shapes.

In a dicing machine, it is important that the amount of the wafer that is left uncut by the blade matches a preset value. Conventionally, in order to match the amount of the wafer that is left uncut to the set value, a process that positions the Z-axis position (also called the Z-axis coordinate) of the blade's rotation axis with high precision, that is, a process called cutter setting, is periodically performed. In this cutter set, the amount of wear on the blade's cutting edge is measured, and the Z-axis position of the blade's rotation axis is corrected based on the amount of wear on the cutting edge, thereby matching the amount of the wafer that is left uncut to the set value.

A contact-type cutter setting device is known as a device for measuring the amount of wear on the cutting edge of a blade (see, for example, Patent Document 1). With this contact-type cutter setting device, the blade is lowered in the Z-axis direction toward the table, and contact of the cutting edge of the blade with the table is detected by electrical conduction, and the amount of wear is measured based on the Z-axis position of the rotation axis of the blade at this time. With a contact-type cutter setting device, the cutting edge of the blade is directly contacted with the table, so the amount of wear on the cutting edge of the blade can be directly measured.

JP 2003-211350 A

By the way, when dicing a wafer with a resin molded surface, a saw-tooth type blade (hereinafter referred to as a "saw blade") may be used instead of a normal dicing blade.

When setting the saw blade, the amount of wear on the cutting edge is measured by contacting the rotating saw blade with the table. If the table is made of a viscous material such as stainless steel, some of the cutting chips removed by the saw blade when setting the cutter will adhere to the cutting edge of the saw blade and remain as burrs. These burrs are difficult to remove from the cutting edge even during dicing processing performed after setting the cutter, so the next time the cutter is set, it will come into contact with the table before the cutting edge. In other words, when setting the saw blade, the amount of wear on the cutting edge may be measured based on the Z-axis position when the burr comes into contact with the table, resulting in a problem of large measurement errors.

The present invention was made in consideration of these circumstances, and aims to provide a dicing device and cutter setting method that can reduce measurement errors in the amount of wear on the cutting edge of a saw blade.

In order to achieve the object of the present invention, the dicing device of the present invention is a dicing device that includes a work table that holds a workpiece, a saw blade that processes the workpiece, a spindle that can rotate the saw blade, and a relative movement means that moves the spindle and the worktable relative to each other, and performs cutter setting to measure the amount of wear on the cutting edge by moving the spindle and the worktable relative to each other and bringing the cutting edge of the saw blade into contact with the worktable. The spindle is configured to be rotatable in both forward and reverse directions, and includes a blade rotation control means that controls the rotation direction of the spindle to rotate the saw blade in the forward direction when processing the workpiece and rotate the saw blade in the reverse direction when setting the cutter, and a measurement means that measures the amount of wear on the cutting edge by detecting that the cutting edge of the saw blade rotating in the reverse direction has come into contact with the worktable.

In order to achieve the object of the present invention, the cutter setting method of the present invention is a cutter setting method for measuring the amount of wear on the cutting edge by contacting the cutting edge of a saw blade with a work table that holds a workpiece, and includes a blade rotation switching step of switching the rotation direction of the saw blade from the forward direction, which is the rotation direction when processing the workpiece, to a reverse direction, which is the opposite direction to the forward direction, a moving step of moving the saw blade rotating in the reverse direction and the work table in directions that bring them closer together, and a measuring step of measuring the amount of wear on the cutting edge by detecting that the cutting edge of the saw blade rotating in the reverse direction has come into contact with the work table.

The present invention can reduce measurement errors in the amount of wear on the cutting edge of a saw blade.

FIG. 1 is a perspective view of a dicing device to which the present invention is applied. FIG. 2 is a perspective view showing a structure of a processing unit of the dicing device shown in FIG. Table top view A front view showing an example of a saw blade A conceptual diagram explaining the configuration and operation of a cutter setting device. Plan view showing cutter setting position An enlarged view of the main part showing the cutting edge state when the saw blade is rotated in the reverse direction and the cutter is set. An enlarged view of the main part showing the cutting edge state when the saw blade is rotated in the forward direction and the cutter is set. A graph showing the total wear amount of the cutting edge when the saw blade is rotated in the reverse direction and the cutter is set. A graph showing the total wear amount of the cutting edge when the saw blade is rotated in the forward direction and the cutter is set. Schematic side view of a burr removal device Schematic cross-sectional view of the burr removal device Graph showing the total wear amount of the cutting edge when the cutter is set using the burr removing device of FIG. 11 . Graph showing the total wear amount of the cutting edge when the cutter is set using the burr removing device of FIG. 12

Below, an embodiment of the dicing device and cutter setting method according to the present invention will be described in detail with reference to the attached drawings.

Figure 1 is an overall perspective view of a dicing device 10 to which the cutter setting method of the present invention is applied.

The dicing device 10 includes a load port 12 that transfers cassettes containing multiple disk-shaped wafers (workpieces) W between external devices, a transport device 16 that has suction pads 14 and transports the wafers W to each part of the device, a work table 18 that holds the wafers W by suction, a processing section 20 that dices the wafers W, and a spinner 22 that cleans and dries the wafers W after dicing. The operation of each part of the dicing device 10 is controlled by a controller 24.

The processing section 20 is provided with a camera 26. This camera 26 is used as a device for capturing an image of the surface of the wafer W and aligning the wafer W by a known pattern matching method.

Inside the processing section 20, there are a pair of saw blades 28, 28 arranged opposite each other, and spindles 30, 30 with built-in high-frequency motors that rotate the saw blades 28, 28.

Figure 2 is a perspective view showing the structure of the processing section 20.

As shown in FIG. 2, the processing section 20 includes an X-table 32. The X-table 32 is guided by X-guides 36, 36 provided on an X-base 34, and is driven in the X-direction indicated by the arrow X-X by an X-movement mechanism section 40 having a linear motor 38. In addition, a rotary table 42 that rotates in the θ-direction is fixed to the upper surface of the X-table 32, and the work table 18 is provided on this rotary table 42. Therefore, the work table 18 is moved in the X-direction by the X-table 32, and rotated in the θ-direction by the rotary table 42.

The processing unit 20 also includes a Y base 44 that is configured in a gate shape so as to straddle the X base 34. A pair of Y tables 46, 46 are provided on the wall surface of the Y base 44. The pair of Y tables 46, 46 are guided by Y guides 48, 48 fixed to the wall surface of the Y base 44, and are driven in the Y direction indicated by the arrow Y-Y by a Y movement mechanism unit 50 consisting of a stepping motor and a ball screw (not shown).

The Y tables 46, 46 are provided with Z tables 52, 52, respectively. The Z tables 52, 52 are guided by Z guides (not shown) provided on the Y table 46, and are driven in the Z direction indicated by the arrow Z-Z by a Z movement mechanism 54 consisting of a stepping motor and a ball screw (not shown). Spindles 30, 30 are fixed facing each other on the Z tables 52, 52, and saw blades 28, 28 attached to the tips of the spindles 30, 30 are arranged facing each other. The saw blades 28 are rotated at high speeds of 6,000 rpm to 80,000 rpm by the spindle 30. The spindle 30 is also configured to be rotatable in both forward and reverse directions.

With the above-mentioned configuration of the processing unit 20, the saw blades 28, 28 are indexed in the Y direction by the Y movement mechanism 50 and are cut in the Z direction by the Z movement mechanism 54, and the work table 18 is cut in the X direction by the X movement mechanism 40 and rotated in the θ direction by a θ rotation mechanism (not shown). These operations are controlled by the controller 24 (see FIG. 1). The X movement mechanism 40, Y movement mechanism 50, Z movement mechanism 54, and θ rotation mechanism (not shown) described in the embodiment constitute the relative movement means of the present invention.

The controller 24 controls the amount of cutting feed in the Z direction by the Z movement mechanism 54 based on the amount of wear of the cutting edge 29 (see FIG. 4) of the saw blade 28 measured by the cutter set unit 60 (see FIG. 5) described below, and matches the amount of cutting or uncut portion of the wafer W to a set value.

Figure 3 is a plan view of the work table 18. The work table 18 has a suction portion 56 that is circular in plan view and that holds the wafer W by suction, and a main body 58 that is ring-shaped in plan view and is disposed outside the suction portion 56 to support the suction portion 56.

The suction portion 56 is configured in a circular shape centered on the central axis 18A of the work table 18. The suction portion 56 is also configured from a porous material and is connected to a vacuum source (not shown) via a vacuum path. By driving the vacuum source, air in the vacuum path is sucked in, and the wafer W is thereby vacuum-sucked and held on the surface of the suction portion 56.

The main body 58 is made of stainless steel, and the surface of the main body 58 is positioned on the same plane as the surface of the suction part 56. This main body 58 is the contacted part that comes into contact with the cutting edge 29A of the saw blade 28 (see FIG. 4). In other words, when the cutter is set, the cutting edge 29A of the saw blade 28 comes into contact with the surface of this main body 58.

Figure 4 is a front view showing an example of a saw blade 28, with the cutting edge 29A exaggerated to highlight the characteristics of the saw blade 28.

The saw blade 28 has a number of cutting edges 29A, 29A... arranged at a predetermined interval that make up the cutting edge 29 at the outer periphery, with a rake face 29B inclined at a predetermined angle formed on one side of the cutting edge 29A, and a clearance face 29D formed on the other side. In the rotation direction of the saw blade 28, the rotation direction indicated by the arrow A is the rotation direction when dicing the wafer W. Hereinafter, the rotation direction indicated by the arrow A will be referred to as the "normal direction", and the opposite rotation direction indicated by the arrow B will be referred to as the "reverse direction". In defining the "normal direction", the rotation direction in which the rake face 29B faces can also be referred to as the "normal direction".

Next, the operation of the dicing device 10 shown in Figure 1 will be described.

In the dicing device 10, first, a cassette containing multiple wafers W is placed on the load port 12 by a transport device (not shown) or manually. The wafers W are removed one by one from the placed cassette by the transport device 16, and placed on the surface of the work table 18 by the transport device 16. The back surface of the wafer W is then held by vacuum suction to the surface of the suction portion 56 of the work table 18. In this way, the wafer W is held on the work table 18.

The surface of the wafer W held on the work table 18 is imaged by the camera 26 in FIG. 1, and then the position of the work table 18 is adjusted by the X-axis movement mechanism 40 and the θ-axis rotation mechanism (not shown) to align the position of the cut line formed on the surface of the wafer W with the position of the saw blade 28.

Once alignment is complete and dicing begins, the spindle 30 starts rotating in the normal direction, the saw blade 28 rotates in the normal direction at high speed, and cutting fluid is supplied to the processing point from a nozzle (not shown). In this state, the wafer W is cut and fed in the X direction together with the work table 18, and the spindle 30 is lowered in the Z direction to a predetermined height, and dicing is performed. This is the general function of the dicing device 10.

Figure 5 is a conceptual diagram illustrating the configuration and operation of the cutter set unit 60. Below, the configuration of the cutter set unit 60 will be explained, but configurations that overlap with the configuration of the dicing device 10 described above will also be explained repeatedly.

The cutter set unit 60 shown in FIG. 5 is composed of a work table 18, a controller 24, a saw blade 28, and a spindle 30.

The controller 24 includes a CPU (Central Processing Unit) 62, memory 64, an input/output interface 68, a cutter set circuit section 70, a Z movement mechanism section 54, an X movement mechanism section 40, and a Y movement mechanism section 50. The controller 24 deploys various programs, such as a control program, stored in the memory 64, and executes the deployed programs using the CPU 62, thereby realizing the functions of each section of the controller 24 and executing various arithmetic processing and control processing via the input/output interface 68. The cutter set circuit section 70 also includes a contact detection circuit section 72 that detects when the cutting edge 29A of the saw blade 28 comes into contact with the main body 58 of the work table 18.

When the cutter is set, the contact detection circuit unit 72 applies a positive potential from the DC power source 73 to the rear end of the spindle 30 via a conductive brush (not shown), so that the saw blade 28 is at a positive potential. A negative potential is also applied to the body 58 of the work table 18 that contacts the saw blade 28, so that the body 58 is at a negative potential. As a result, when the cutting edge 29A of the saw blade 28 contacts the body 58, electrical conduction is established between the saw blade 28 and the body 58. The contact detection circuit unit 72 detects that the cutting edge 29A has contacted the body 58 due to the electrical conduction, and the controller 24 measures the amount of wear based on the Z-axis position of the rotation axis of the saw blade 28 at this time. In the embodiment, the controller 24 constitutes the measuring means of the present invention.

Figure 6 is a plan view of the body 58 of the work table 18, showing an example of the cutter set position. The body 58 is the area that comes into contact with the cutting edge 29A of the saw blade 28 all around, and contact scratches 58A, 58A... are formed at the positions where the cutting edge 29A comes into contact.

Next, the cutter setting method using the cutter setting unit 60 will be described with reference to FIG. 5.

First, the work table 18 is rotated by the θ rotation mechanism (not shown), and the work table 18 is moved by the X movement mechanism 40 to position the main body 58 of the work table 18 below the saw blade 28. This position becomes the first cutter set position. Next, the saw blade 28 is rotated at a predetermined rotation speed by the spindle 30 and lowered at a predetermined speed by the Z movement mechanism 54, and the Z-axis position of the rotation axis of the saw blade 28 when the cutting edge 29A contacts the main body 58 is acquired and stored. After that, the saw blade 28 is raised by the Z movement mechanism 54 and retreated from the main body 58. This completes the first cutter set. Note that the rotation direction of the saw blade 28 during the first cutter set may be the forward direction indicated by the arrow A in FIG. 4 or the reverse direction indicated by the arrow B, but in the embodiment, it is performed in the forward direction. After this, the dicing device 10 performs the dicing process of the wafer W described above.

When performing the second cutter set, similar to the first cutter set, first, the work table 18 is rotated by the θ rotation mechanism (not shown) and moved by the X movement mechanism 40, and the main body 58 of the work table 18 is positioned so that the surface of the main body 58 without contact scratches 58A (see FIG. 6) is located below the saw blade 28. This position becomes the second cutter set position.

Next, the controller 24 controls the rotation direction of the spindle 30, rotates the saw blade 28 in the reverse direction at a predetermined rotation speed (e.g., 30,000 rpm) (blade rotation switching process), and lowers the saw blade 28 at a predetermined speed (e.g., 0.5 mm/sec) (movement process) using the Z movement mechanism 54. The controller 24 then measures the amount of wear (measurement process) based on the Z-axis position of the rotation axis of the saw blade 28 when the cutting edge 29A contacts the main body 58. Thereafter, the saw blade 28 is raised by the Z movement mechanism 54 and retreated from the main body 58. This completes the second cutter set operation. The third and subsequent cutter sets are performed in the same procedure. In the embodiment, the controller 24 constitutes the blade rotation control means of the present invention.

In this way, in the cutter setting method of the embodiment, the rotation direction of the saw blade 28 is switched to the reverse direction when setting the cutter for the second or subsequent times, and the cutter is set. Below, the advantages of rotating the saw blade 28 in the reverse direction when setting the cutter for the second or subsequent times will be explained.

Figure 7 is an enlarged view of the main part of the saw blade 28 when the saw blade 28 is rotated in the reverse direction to set the cutter. Figure 8 is a comparative example of Figure 7, that is, an enlarged view of the main part of the saw blade 28 when the saw blade 28 is rotated in the forward direction to set the cutter.

As shown in FIG. 8, when the saw blade 28 is rotated in the forward direction to perform the cutter set, the burr (cutting chip of the main body 58) 80 attached to the rake face 29B of the cutting edge 29A during the first cutter set is pressed against the rake face 29B by the main body 58 as shown by arrow C when it comes into contact with the main body 58. As a result, the burr 80 remains attached to the rake face 29B, resulting in a measurement error of the length of the burr 80. In addition, each time the cutter set is performed multiple times, a new burr 80 may adhere to the burr 80 that was previously attached, so there is also the problem that the measurement error of the wear amount of the cutting edge 29 increases each time the cutter set is performed.

In contrast, as shown in FIG. 7, when the saw blade 28 is rotated in the reverse direction to perform the cutter set, the burr 80 attached to the rake face 29B during the first cutter set is gradually pushed by the body 58 each time the cutter set is repeated from the second time onwards, and bends toward the valley 29C between the cutting edge 29A and the cutting edge 29A adjacent to the cutting edge 29A downstream in the rotation direction. In other words, when the cutter set is performed multiple times, the burr 80 attached to each cutting edge 29A is completely bent as described above, so that all cutting edges 29A come into stable contact with the body 58. As a result, when the saw blade 28 is rotated in the reverse direction to perform the cutter set, the measurement error of the cutting edge wear amount of the saw blade 28 can be reduced.

Therefore, according to the cutter setting method of the embodiment, a blade rotation switching step of switching the rotation direction of the saw blade 28 to the reverse direction, a moving step of moving the saw blade 28 rotating in the reverse direction toward the main body 58, and a measuring step of measuring the amount of wear of the cutting edge 29 by detecting that the cutting edge 29 of the saw blade 28 rotating in the reverse direction has come into contact with the main body 58, thereby reducing measurement errors in the amount of wear of the cutting edge of the saw blade 28. In addition, when setting the cutter for the second or subsequent times, burrs can be prevented from adhering to the rake face 29B.

Figure 9 is a graph showing the total wear of the saw blade 28 obtained when the saw blade 28 is rotated in the reverse direction and cutter sets are performed multiple times. Figure 10 is a comparative example of Figure 9, that is, a graph showing the total wear of the saw blade 28 obtained when the saw blade 28 is rotated in the forward direction and cutter sets are performed multiple times. The horizontal axis of the graphs in Figures 9 and 10 shows the number of cutter sets, and the vertical axis shows the total wear (mm). The total wear is the cumulative value of the wear obtained for each cutter set, and refers to the accumulated wear from the time the saw blade 28 was attached to the spindle 30.

The test conditions in FIG. 9 were as follows: the rotational speed of the saw blade 28 was set to 30,000 rpm, and the downward movement speed of the saw blade 28 was set to 0.5 mm/sec. The saw blade 28 was repeatedly raised and lowered relative to the body 58, and the cutting edge 29A was repeatedly brought into contact with the body 58 multiple times. When the wear amount measured at that time was within 1 μm for three consecutive times and was greater than the wear amount measured for the previous cutter set, the average of the three measured values was obtained as the wear amount. Of course, the position of the body 58 relative to the saw blade 28 was changed each time the cutting edge 29A was repeatedly brought into contact with the body 58, and the cutting edge 29A was set to come into contact with the surface of the body 58 that had no contact scratches 58A (see FIG. 6).

According to the graph in Figure 10, when the cutter is set by rotating in the forward direction, the total wear amount fluctuates to the negative side, and it can be confirmed that the diameter of the cutting edge 29 of the saw blade 28 increases. This is because the burrs 80 (see Figure 8) attached to the cutting edge 29A of the saw blade 28 come into contact with the main body 58, increasing the apparent diameter of the saw blade 28. Therefore, when the cutter is set by rotating the saw blade 28 in the forward direction, the measurement error in the wear amount of the cutting edge of the saw blade 28 increases.

In contrast, according to the graph in Figure 9, when the cutter set is performed with rotation in the reverse direction, the total wear amount increases to the positive side for each cutter set, and it can be confirmed that the diameter of the cutting edge 29 of the saw blade 28 becomes smaller. This is because the burr 80 attached to the cutting edge 29A is bent as shown in Figure 7 by the rotation of the saw blade 28 in the reverse direction, and the cutting edge 29A comes into contact with the main body 58. Therefore, when the cutter set is performed by rotating the saw blade 28 in the reverse direction, the measurement error of the wear amount of the cutting edge of the saw blade 28 can be reduced.

Next, we will explain the burr removal device for removing the burrs 80 attached to the cutting edge 29A of the saw blade 28.

Figure 11 is a schematic side view of a burr removal device 90 according to an embodiment. Figure 12 is a schematic side view of a burr removal device 100, which is a comparative example of the burr removal device 90 shown in Figure 11.

The burr removal device 100 shown in FIG. 12 includes a nozzle 104 that sprays cutting water 102, and a spindle 30 that rotates the saw blade 28 in the forward direction. The nozzle 104 is disposed in a position facing the clearance 29D of the cutting edge 29A. Therefore, according to the burr removal device 100 in FIG. 12, the cutting water 102 sprayed from the nozzle 104 is sprayed toward the clearance 92D of the cutting edge 29A.

According to the burr removal device 100 shown in FIG. 12, the relative speed of the cutting water 102 to the burr 80 adhering to the rake face 92B is the injection speed from the nozzle 104 minus the rotation speed of the saw blade 28 in the forward direction, and the cutting water 102 collides with the burr 80 at this speed. In other words, the rotation speed of the saw blade 28 cannot be effectively used as a force for removing the burr 80, so the burr 80 cannot be removed efficiently.

In contrast, the burr removal device 90 of the embodiment shown in FIG. 11 includes a nozzle 94 that sprays cutting water 92 and a spindle 30 that rotates the saw blade 28 in the forward direction, and the nozzle 94 is positioned opposite the rake face 29B of the cutting edge 29A.

According to the embodiment of the burr removal device 90 shown in FIG. 11, the relative speed of the cutting water 92 to the burr 80 adhering to the rake face 29B is the sum of the ejection speed of the cutting water 92 ejected from the nozzle 94 and the rotation speed of the saw blade 28 in the forward direction, and the cutting water 92 collides with the burr 80 at this speed. In other words, the rotation speed of the saw blade 28 can be effectively used as a force for removing the burr 80, so the burr 80 can be removed efficiently.

Therefore, according to the embodiment of the burr removal device 90, the saw blade 28 is rotated in the forward direction by the spindle 30, and cutting water 92 is sprayed toward the rake face 29B from a nozzle 94 arranged at a position opposite the rake face 29B, so that the burrs 80 can be effectively removed.

In this way, the burr removal device 90 of the embodiment can effectively remove the burrs 80 attached to the cutting edge 29A of the saw blade 28, thereby reducing measurement errors in the amount of wear on the cutting edge 29 when the cutter is set.

The burr removal process by the burr removal device 90 may be performed for each cutter set, or may be performed based on the amount of wear of the saw blade 28 measured when the cutter is set. It may also be performed during the dicing process of the wafer W, or during the return movement of the work table 18 in the X-axis direction performed between dicing processes. It may also be performed immediately before the cutter is set. If it is performed immediately before the cutter is set, the rotation direction of the saw blade 28 when the cutter is set is not limited to the reverse direction and may be the forward direction.

The graph in Figure 13 shows the change in the total wear of the saw blade 28 when the burr removal process is performed using the burr removal device 90 shown in Figure 11. The graph in Figure 14 shows the change in the total wear of the saw blade 28 when the burr removal process is performed using the burr removal device 100 shown in Figure 12. The horizontal axis of the graphs in Figures 13 and 14 shows the number of cutter sets, and the vertical axis shows the total wear (mm). In addition, in both of the burr removal processes shown in Figures 13 and 14, 1.5 liters of cutting water was sprayed per minute for 30 seconds.

The graph in Figure 14 shows that the total wear amount of the second cutter set (-0.014 mm) fluctuated significantly from the total wear amount of the first cutter set (0 mm). This is because burrs 80 having a length of about 0.014 mm in the outer diameter direction from cutting edge 29A were attached to cutting edge 29A. Furthermore, based on the total wear amount of the subsequent cutter sets, it can be seen that burrs 80 having a length of about 0.008 mm remained attached to cutting edge 29A. And based on the total wear amount of the 68th to 70th cutter sets, it can be seen that burrs 80 having a length of about 0.02 mm were attached to cutting edge 29A. Therefore, when the burr removal process was performed using the burr removal device 100 shown in FIG. 12 before the 71st cutter set, the burr 80 having a length of about 0.02 mm could be removed, but based on the total wear amount of the cutter set from the 72nd cutter set onwards, the burr 80 having a length of 0.007 mm remained attached, and the burr 80 could not be effectively removed.

On the other hand, according to the graph of FIG. 13, based on the total wear amount of the cutter set performed from the 2nd to the 25th time, it can be seen that the burr 80 having a length of about 0.002 mm remains attached to the cutting edge 29A. Based on the total wear amount of the cutter set performed from the 26th time, it can be seen that the burr 80 having a length of about 0.005 mm has adhered to the cutting edge 29A. Based on the total wear amount of the cutter set performed from the 29th to the 37th time, it can be seen that the burr 80 having a length of about 0.002 mm remains attached to the cutting edge 29A. Based on the total wear amount of the cutter set performed from the 38th to the 45th time, it can be seen that the burr 80 having a length of about 0.005 mm to 0.006 mm has adhered to the cutting edge 29A. Based on the total wear amount of the cutter sets performed from the 46th to 49th times, it can be seen that burrs 80 having a length of about 0.004 mm to 0.006 mm had adhered to the cutting edge 29A. Therefore, it was confirmed that by removing the burrs using the burr removal device 90 shown in FIG. 11 before performing the 50th cutter set, the burrs 80 having a length of about 0.005 mm could be removed, and the total wear amount returned to nearly 0 mm. Therefore, by using the burr removal device 90 shown in FIG. 11, the burrs 80 could be effectively removed.

W...wafer, 10...dicing device, 12...load port, 14...suction pad, 16...transport device, 18...work table, 20...processing unit, 22...spinner, 24...controller, 26...camera, 28...saw blade, 29...cutting edge, 29A...cutting edge, 29B...scooping surface, 30...spindle, 32...X table, 34...X base, 36...X guide, 38...linear motor, 40...X movement mechanism, 42...rotary table, 44...Y base, 46...Y table, 48...Y guide, 50...Y movement mechanism, 52...Z table, 54...Z movement mechanism, 56...suction unit, 58...main body, 60...cutter set unit, 62...CPU, 64...memory, 68...input/output interface, 70...cutter set circuit, 72...contact detection circuit

Claims (2)

a rotating means for rotating a saw blade having at least one cutting edge in a direction opposite to a direction in which a cutting portion of the cutting edge faces;
a measuring means for measuring an amount of wear of the cutting edge of the saw blade by detecting that the cutting edge of the saw blade rotating in the opposite direction has come into contact with a contacted portion;
A wear amount measuring device comprising: a rotating step of rotating a saw blade having at least one cutting edge in a direction opposite to a direction in which a cutting portion of the cutting edge faces;
a wear amount measuring step of measuring the wear amount of the cutting edge by detecting that the cutting edge of the saw blade rotating in the opposite direction has come into contact with a contacted portion;
A wear amount measuring method comprising:

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