JP7216451B2 - Bonding machine, frame feeder and heater unit - Google Patents

Description

The present invention relates to a bonding apparatus, frame feeder and heater unit.

A so-called die bond is the operation of joining a semiconductor die to a lead frame. Also, so-called wire bonding is the operation of joining bonding wires to a semiconductor die. When performing these bonding operations, the leadframe is heated to a predetermined temperature above room temperature. When the lead frame is heated in the area where the bonding operation is performed, the lead frame stays in the area where the bonding operation is performed for the sum of the time for heating and the time for bonding.

For example, the semiconductor assembly apparatus of Patent Document 1 includes a region for preheating the lead frame and a region for wire bonding. According to this apparatus, the time for preheating and the time for wire bonding can overlap. As a result, it is possible to improve the work efficiency of the joining work.

JP-A-62-169340

2. Description of the Related Art In recent years, there has been a demand for further improvement in productivity of bonding apparatuses that perform bonding operations. SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a bonding apparatus, a frame feeder, and a heater unit that can improve productivity.

A bonding apparatus, which is one embodiment of the present invention, includes a bonding section that performs a bonding operation on a lead frame transported to a work area, a lead frame that is transported to the work area by the transport part, and transported to the work area by a heater unit. a frame feeder for preheating the lead frame before being processed. The heater unit is arranged upstream of the heating element and the work area in the conveying direction of the lead frame so as to face the back surface of the lead frame, and provides heat received from the heating element to the lead frame. and a block. The heater block is provided with a heat radiating portion having a plurality of fins formed in the depth direction from the surface of the heater block.

The bonding device performs a bonding operation using the bonding section in the working area. A heater unit that heats the lead frame before it is transported to the work area is arranged on the upstream side of the work area. Therefore, it is possible to make the area in which preheating is performed before the bonding work and the area in which the bonding work is performed different from each other. Furthermore, the heater block of the heater unit has a plurality of fins extending in the depth direction. The plurality of fins efficiently conducts heat from the heater block to the lead frame. Therefore, it is possible to shorten the time required for preheating. As a result, productivity can be improved.

The plurality of fins may be spaced apart from each other along a direction intersecting the conveying direction of the lead frame. With this configuration, the back surface of the lead frame can be protected.

The heater block may be provided with holes that are provided between the fins and penetrate in the depth direction. Heat is transferred from the heater block to the lead frame by air convection from the heater block to the lead frame. By providing this hole, air for conducting heat is preferably supplied to the fins. Therefore, heat is more efficiently transferred from the heater block to the lead frame. As a result, productivity can be further improved.

The length of the fin in the depth direction may be longer than the distance from the tip of the fin to the lead frame in the depth direction. According to this configuration, the air heated by the fins can be suitably supplied to the rear surface of the lead frame.

The bonding apparatus described above may further include a control section for controlling operations of the bonding section and the frame feeder. The control unit provides the bonding unit with a first control signal for causing the bonding unit to perform a bonding operation during the first period, and causes the heater unit to preheat the lead frame during the second period overlapping the first period. A second control signal may be provided to the frame feeder to cause it to do so. The length of the second period may be less than or equal to the length of the first period. According to this control, the preheating of the next lead frame is completed while the bonding operation is being performed. Therefore, after the bonding work is finished, it is possible to carry in the preheated lead frame in parallel with carrying out the lead frame from the working area. In other words, there is no need to provide a waiting time for the bonding work with respect to preheating. As a result, productivity can be further improved.

A frame feeder, which is another embodiment of the present invention, includes a conveying unit that conveys lead frames to a work area where bonding work is performed on the lead frames, and a first heater that preheats the lead frames before being conveyed to the work area. a unit; The first heater unit is arranged upstream of the working area in the lead frame conveying direction with respect to the first heating element and faces the back surface of the lead frame, and absorbs heat received from the first heating element. a first heater block provided to the leadframe. The first heater block is provided with a first heat radiator having a plurality of first fins formed in the depth direction from the surface of the first heater block.

A heater block of the heater unit of the frame feeder may have a plurality of fins extending in the depth direction. The plurality of fins efficiently conducts heat from the heater block to the lead frame. Therefore, it is possible to shorten the time required for preheating. As a result, productivity can be improved.

The frame feeder may further include a second heater unit that heats the lead frame transported from the work area after the bonding work is performed. The second heater unit is disposed downstream of the work area in the lead frame conveying direction and facing the back surface of the lead frame, and absorbs heat received from the second heat generating element. and a second heater block provided to the leadframe. The second heater block may be provided with a second heat radiation part having a plurality of second fins formed in the depth direction from the surface of the second heater block. According to this configuration, rapid cooling of the lead frame to which the bonding work has been performed is suppressed. Therefore, it is possible to protect the product obtained by the bonding work.

Yet another aspect of the present invention is a heater unit for preheating a lead frame before it is transported to a work area where a bonding operation is performed on the lead frame. The heater unit is arranged upstream of the heating element and the work area in the conveying direction of the lead frame so as to face the back surface of the lead frame, and provides heat received from the heating element to the lead frame. and a block. The heater block is provided with a heat radiating portion having a plurality of fins formed in the depth direction from the surface of the heater block.

A heater block of the heater unit has a plurality of fins extending in the depth direction. The plurality of fins efficiently conducts heat from the heater block to the lead frame. Therefore, it is possible to shorten the time required for preheating. As a result, productivity can be improved. Also, the plurality of fins may be spaced apart from each other along the direction intersecting the transport direction of the lead frame. Further, the heater block may be provided with holes that are provided between the fins and penetrate in the depth direction. Furthermore, the length of the fin in the depth direction may be longer than the distance from the tip of the fin to the lead frame in the depth direction.

According to the bonding apparatus, frame feeder and heater unit according to the present invention, productivity can be improved.

FIG. 1 is a perspective view showing a wire bonding apparatus of an embodiment. FIG. 2 is a diagram showing the positional relationship between the preheater, heat plate, afterheater, and lead frame. FIG. 3 is a perspective view showing a heater unit. FIG. 4 is a perspective view showing a cross section of the heater unit. FIG. 5 is a chart diagram explaining the operation of the wire bonding apparatus. FIG. 6 is a graph showing the heating performance of the heater unit of the comparative example and the heating performance of the heater unit of the example.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and overlapping descriptions are omitted.

[Wire bonding equipment]
The wire bonding apparatus 1 (bonding apparatus) shown in FIG. 1 electrically connects, for example, electrodes of a lead frame 100 and electrodes of a semiconductor element die-bonded to the lead frame 100 using thin metal wires. do. The wire bonding apparatus 1 connects wires to electrodes by applying heat, ultrasonic waves or pressure to the wires. The wire bonding apparatus 1 has a frame feeder 2, a bonding unit 3 (bonding section), and a control unit 4 (control section). These frame feeder 2 , bonding unit 3 and control unit 4 are provided on the base 6 .

In the following description, the terms conveying direction D1, facing direction D2, and depth direction D3 may be used. The transport direction D<b>1 is the direction in which the lead frame 100 is transported by the frame feeder 2 . The facing direction D2 is the direction from the main surface 11a of the preheater 11, which will be described later, toward the back surface 100a of the lead frame 100. As shown in FIG. The facing direction D2 is parallel to the moving direction of the capillaries 8 in the bonding unit 3 . Furthermore, the facing direction D2 is the depth direction of the heater block 16 . The depth direction D3 is orthogonal to each of the transport direction D1 and the facing direction D2.

The frame feeder 2 conveys a lead frame 100, which is a component to be processed. The frame feeder 2 heats the leadframe 100 to control the temperature of the leadframe 100 . Details of the frame feeder 2 will be described later. Bonding unit 3 includes a bonding tool 7 and a capillary 8 . The capillary 8 is detachably attached to the tip of the bonding tool 7 . A capillary 8 provides heat, ultrasound or pressure to the wire. A control unit 4 controls the overall operation of the wire bonding apparatus 1 including the operations of the frame feeder 2 and bonding unit 3 .

Control unit 4 provides several control signals to bonding unit 3 and frame feeder 2 . For example, the control signal includes a signal for controlling transportation of lead frames 100 in frame feeder 2 and a signal for controlling heating of lead frames 100 in frame feeder 2 . The control signals may also include signals for controlling the position of the capillary 8 relative to the leadframe 100 and signals for starting and stopping the application of heat, ultrasound or pressure.

[Frame feeder]
The frame feeder 2 has a rail 9 (conveyor), a preheater 11 (heater unit, first heater unit), a heat plate 12, and an afterheater 13 (second heater unit).

The rails 9 are a pair of members extending in the transport direction D1. The rails 9 are separated from each other in a direction orthogonal to the transport direction D1. Rails 9 remove leadframes 100 from magazines containing unprocessed leadframes 100 . The rail 9 moves the lead frame 100 along the transport direction D1. During this transport, the rails 9 hold the position of the lead frame 100 above the preheater 11, heat plate 12, and afterheater 13 for a predetermined period. Then, the rail 9 accommodates the lead frame 100 for which processing has been completed in another magazine.

A preheater 11 , a heat plate 12 and an afterheater 13 are arranged between a pair of rails 9 . The preheater 11, the heat plate 12 and the afterheater 13 are arranged in this order along the transport direction D1. A preheating area A1 is set on the preheater 11, as shown in part (a) of FIG. A bonding area A2 (work area) is set on the heat plate 12 . Furthermore, a post-heating area A3 is set on the after-heater 13 . According to this arrangement, the lead frame 100 moves through the preheating area A1, the bonding area A2, and the postheating area A3 in this order.

The preheater 11 and the afterheater 13 are separated from the back surface 100a of the lead frame 100 by a predetermined distance. A gap L1 is formed between the preheater 11 and the lead frame 100 . Similarly, a gap L1 is formed between the afterheater 13 and the lead frame 100 as well. The gap L1 is, for example, 0.5 mm or more and 3.0 mm or less, and as an example, may be 1 mm or more and 2 mm or less. The preheater 11 and the afterheater 13 are fixed to the base 6 (FIG. 1). Therefore, the distance between the preheater 11 and the lead frame 100 remains basically unchanged. Similarly, the distance between the afterheater 13 and the lead frame 100 is basically unchanged.

The distance between the heat plate 12 and the back surface 100a of the lead frame 100 is variable. Specifically, when the bonding operation is performed, the heat plate 12 contacts the rear surface 100a of the lead frame 100 (see part (a) of FIG. 2). On the other hand, when the lead frame 100 is transferred to the heat plate 12 and when the lead frame 100 is unloaded from the heat plate 12, the heat plate 12 is moved downward by the driving mechanism 10 (see (b) in FIG. 2). ) section). At this time, a gap L2 is formed between the heat plate 12 and the lead frame 100 . The gap L2 is, for example, 1 mm or more and 15 mm or less, and may be 10 mm as an example.

[Preheater]
FIG. 3 is a perspective view showing the configuration of the preheater 11 more specifically. The preheater 11 has a cartridge heater 14 (heating element, first heating element) and a heater block 16 (first heater block). The cartridge heater 14 generates heat when energized. For example, the temperature of the cartridge heater 14 may be 200° C. or higher and 400° C. or lower.

The heater block 16 transfers heat generated by the cartridge heater 14 to the lead frame 100 . Heater block 16 includes a main surface 16 a facing lead frame 100 . The width of heater block 16 in depth direction D<b>3 may be greater than the width of lead frame 100 . The heater block 16 has a heater fixing surface 17 , an upstream radiator 18 and a downstream radiator 19 . The heater fixing surface 17 is fixed to the base 6 via an adapter or the like. An upstream heat radiation portion 18 and a downstream heat radiation portion 19 are formed on the surface of the heater block 16 facing the lead frame 100 . The upstream heat radiation portion 18 and the downstream heat radiation portion 19 may be the main surface of the preheater 11 . Further, the upstream heat radiating portion 18 and the downstream heat radiating portion 19 may be the main surface of the heater block 16 . The upstream heat radiating portion 18 and the downstream heat radiating portion 19 face each other across the lead frame 100 with a gap L1 therebetween. The heat received from the heater fixing surface 17 is provided to the lead frame 100 from the upstream heat radiation portion 18 and the downstream heat radiation portion 19 .

The upstream heat radiating section 18 is provided on the upstream side in the transport direction D1. The downstream heat radiating section 19 is provided downstream in the transport direction D1. A cylindrical cartridge heater 14 is provided in the downstream heat radiating section 19 . A connecting portion 21 is provided between the upstream heat radiating portion 18 and the downstream heat radiating portion 19 . The connecting portion 21 is not provided with fins 22, which will be described later. The connecting portion 21 may be provided with, for example, a bolt hole for fixing the preheater 11 to the base 6 (see FIG. 1).

The downstream radiator 19 will be described with reference to FIG. 4 is a cross-sectional perspective view on the virtual plane K shown in FIG. 3. FIG. Since the upstream heat radiating portion 18 differs from the downstream heat radiating portion 19 only in the position where it is formed, detailed description thereof will be omitted. The downstream radiator 19 has a plurality of fins 22 (a plurality of first fins), grooves 23 and air supply holes 24 .

In the heater block 16, the main surface 16a constitutes a heat radiating portion (first heat radiating portion). The fins 22 have openings on the main surface 16a. The fins 22 increase the heat radiation area and form grooves 23 as running sections. The fins 22 extend in the facing direction D2. A tip surface 22 a of the fin 22 is part of the main surface 16 a of the heater block 16 . Therefore, the gap L1 from the preheater 11 to the lead frame 100 has the same meaning as the distance from the tip surface 22a of the fin 22 to the back surface 100a of the lead frame 100. FIG.

The plurality of fins 22 are separated from each other along a direction (depth direction D3) orthogonal to each of the facing direction D2 and the transport direction D1. Therefore, the ridgeline of the fin tip is parallel to the transport direction D1. A groove 23 is formed by this configuration. That is, grooves 23 are formed between the fins 22 . The depth L3 of the groove 23 has the same meaning as the height of the fin 22 . A depth L3 of the groove 23 is greater than the gap L1. For example, the depth L3 of the groove 23 is 5 mm or more and 30 mm or less, and is 12 mm as an example. The depth L3 of the groove 23 may be 5 times (L3=5×L1) or more and 20 times or less the gap L1, and may be defined as 10 times the gap L1, for example.

The bottom surface 23a of the groove 23 is provided with an opening 24a of the air supply hole 24. As shown in FIG. The air supply hole 24 extends along the facing direction D2. An opening 24b opposite to the air supply hole 24 is provided on the heater fixing surface 17 side. The air supply hole 24 takes in air from the opening 24 b and discharges the air to the bottom surface 23 a of the groove 23 . The air supply holes 24 supply air (see white arrows) between the fins 22 . An air supply hole 24 is provided for each groove 23 . Therefore, when the heater block 16 is viewed from above, the air supply holes 24 are provided in the heater block 16 so as to be separated from each other along the depth direction D3.

The preheater 11 generates heat in the cartridge heater 14 . The heat is transferred to heater block 16 . The heat then reaches the fins 22 . The heat reaching the fins 22 is transferred to the air present near the sides of the fins 22 . That is, the air present in the grooves 23 is heated. As the heated air becomes relatively less dense, it begins to rise. Here, in the fins 22, the heat transfer described above occurs on the side surfaces of the fins 22, and an upward flow of heated air occurs. A section in which heat is transferred from the fins 22 to the air is called a run-up section. In other words, even if the fins 22 are not provided, heat transfer from the fins 22 to the air occurs, but no run-up section is formed. By using the natural convection heating provided with the run-up section, necessary and sufficient heat energy can be provided from the preheater 11 to the lead frame 100 .

The afterheater 13 has the same configuration as the preheater 11 . That is, it has a cartridge heater 14 as a second heating element and a heater block 16 as a second heater block. The heater block 16 has an upstream heat radiating portion 18 and a downstream heat radiating portion 19 which are second heat radiating portions, and the upstream heat radiating portion 18 and the downstream heat radiating portion 19 are provided with fins 22 which are second fins. . Therefore, detailed description of the afterheater 13 is omitted.

[Operation of wire bonding equipment]
The operation of the wire bonding apparatus 1 will be described. 5A and 5B schematically show the operation of the wire bonding apparatus 1. FIG. In FIG. 5, the uppermost horizontal axis corresponds to the preheating area A1. The middle horizontal axis corresponds to the bonding area A2. The bottom horizontal axis corresponds to the post-heating area A3. Each horizontal axis indicates that time progresses from left to right. Rectangles overlapping each horizontal axis indicate that the lead frame 100 exists in each region.

Control unit 4 provides current to preheater 11 , heat plate 12 and afterheater 13 . By this operation, the preheater 11, the heat plate 12 and the afterheater 13 are each set to a predetermined temperature. For example, the set temperature of the preheater 11 is 200° C. or higher and 350° C. or lower. For example, the set temperature of the heat plate 12 is 300.degree. For example, the set temperature of the afterheater 13 is 300.degree.

The control unit 4 then provides control signals to the frame feeder 2 . As a result, control for conveying the lead frame 100 is performed. The operation of the frame feeder 2 will be described below, and each operation is performed according to the control signal that the frame feeder 2 receives from the control unit 4. FIG.

Specifically, the frame feeder 2 takes out the lead frame 100 from the magazine. The frame feeder 2 conveys the lead frame 100 taken out to the preheating area A1 (S1). Next, the frame feeder 2 holds the position of the lead frame 100 for a predetermined period (S2). During this period, the lead frame 100 receives heat from the preheater 11 . As a result, lead frame 100 is heated to a predetermined temperature.

After a predetermined period of time has elapsed, the frame feeder 2 conveys the lead frame 100 to the bonding area A2 (S3). In parallel with this transportation, the frame feeder 2 again takes out the lead frame 100 from the magazine and transports the lead frame 100 taken out to the preheating area A1 (S4). Then, the frame feeder 2 holds the position of the lead frame 100 transported to the bonding area A2 for a predetermined period (first period). Similarly, the frame feeder 2 holds the position of the lead frame 100 transported to the preheating area A1 for a predetermined period (second period). During this period the control unit 4 provides a control signal to the bonding unit 3 . In response to this control signal, the bonding unit 3 performs bonding work on the lead frame 100 (S5). Furthermore, in parallel with the bonding operation, the lead frame 100 placed in the preheating area A1 receives heat from the preheater 11, so that it is heated to a predetermined temperature (S6).

Here, the length of the period (S6) during which the lead frame 100 is placed in the preheating area A1 is the same as the length of the period required for the bonding operation (S5). That is, if the lead frame 100 reaches the preheating area A1 at the same timing as the lead frame 100 reaches the bonding area A2, the preheating (S6) and the bonding operation (S5) are completed at the same time. do.

The period during which the lead frame 100 is arranged may be the period from when the lead frame 100 stops in the preheating area A1 to when it starts to move again. The period required for the bonding operation may be the period from when the position of the lead frame 100 in the bonding area A2 stops to when it starts to move again. Also, the period required for the bonding operation may be the period from when the operation of the bonding unit 3 is started until it is stopped. That is, the period required for the bonding operation may or may not include the period from when the position of the lead frame 100 in the bonding area A2 stops to when the bonding unit 3 starts operating.

After a predetermined period of time has elapsed, the frame feeder 2 conveys the lead frame 100 on which the bonding operation has been performed to the post-heating area A3 (S7). In parallel with this transport, the frame feeder 2 transports the preheated lead frame 100 to the bonding area A2 (S8). Further, the frame feeder 2 takes out the lead frame 100 from the magazine again and conveys the lead frame 100 taken out to the preheating area A1 (S9).

Then, the frame feeder 2 holds the position of the lead frame 100 transported to the post-heating area A3 for a predetermined period. Similarly, the frame feeder 2 holds the position of the lead frame 100 transported to the bonding area A2 for a predetermined period. Furthermore, the frame feeder 2 holds the position of the lead frame 100 transported to the preheating area A1 for a predetermined period. During this period, the lead frame 100 placed in the post-heating area A3 receives heat from the after-heater 13 (S11). Also, the bonding unit 3 performs a bonding operation on the lead frame 100 (S12). Furthermore, in parallel with the bonding operation, the lead frame 100 placed in the preheating area A1 receives heat from the preheater 11, so that it is heated to a predetermined temperature (S14). After that, the frame feeder 2 stores the lead frame 100 in the magazine (S14).

[Effect]
The effects of the wire bonding apparatus 1 will be described below.

The wire bonding apparatus 1 performs preheating and bonding work in parallel. More specifically, the period required for preheating is the same as or shorter than the period required for the bonding operation. Then, immediately after the bonding operation is completed, the preheated lead frame 100 can be transported to the bonding area A2. Therefore, there is no waiting time for the bonding unit 3 except for the time for transporting the lead frame 100 . As a result, productivity is improved.

On the other hand, as an operation of the wire bonding apparatus, there may be an operation of immediately carrying a lead frame that has not reached a predetermined temperature into the bonding area after carrying out the lead frame for which the bonding operation has been completed. However, in this operation, the bonding operation cannot be started until the lead frame reaches a predetermined temperature after being brought into the bonding area. This is because the bonding unit 3 needs to accurately move the capillary 8 to the bonding position (for example, the position of the electrode pad) during the bonding operation. Here, when the temperature of the lead frame 100 arranged in the bonding area A2 rises, the lead frame 100 thermally expands, so that the positions of the electrode pads change. As a result, it becomes difficult to accurately position the capillary 8 on the electrode pad. Therefore, this operation also causes the waiting time of the bonding unit.

On the other hand, the wire bonding apparatus 1 can always provide the lead frame 100 that has reached the target temperature to the bonding area A2. In other words, the lead frame 100 transported to the bonding area A2 does not undergo thermal expansion to the extent that it affects the bonding operation. Therefore, accurate bonding work can be performed without waiting time as described above.

Moreover, the preheater 11 provided in the frame feeder 2 of the wire bonding apparatus 1 does not require a complicated mechanism such as a facility for supplying compressed air or a piping airway. Therefore, the lead frame 100 can be rapidly heated to a predetermined temperature with a simple configuration.

[Example 1 and Comparative Example 1]
The effect of the preheater 11, which is a heater unit, was confirmed by comparing it with the effect of the heater unit of the comparative example. The heater unit of the comparative example differs from the preheater 11 in that it does not have fins 22 and air supply holes 24 . Other configurations of the heater unit of the comparative example are the same as those of the preheater 11 of the embodiment. That is, according to the heater unit of the comparative example, heat transfer due to radiation between the main surface of the heater block and the back surface of the lead frame and heat transfer due to upward convection generated from the main surface of the heater block cause the heater to Heat is provided from the unit to the leadframe.

In Example 1 and Comparative Example 1, the temperature of the cartridge heater 14 was set to 350.degree. Using the timing at which the lead frame 100 was transported and stopped on the main surface 16a of the heater block 16 as a reference point, the temperature rise of the lead frame 100 was checked. 6 is a graph showing the results of Example 1 and the results of Comparative Example 1. FIG. The horizontal axis indicates time. The vertical axis indicates the temperature of the lead frame 100. FIG. Graph G6a shows the results of Example 1. Graph G6b shows the results of Comparative Example 1.

First, the results of Comparative Example 1 were confirmed. According to the graph G6b, it was first found that the temperature of the lead frame 100 was about 25° C. (see plot P1). This temperature roughly corresponds to room temperature. Next, about 40 seconds after the start of measurement, the lead frame 100 was transferred onto the heater unit (see plot P2). As a result, it was found that the temperature of the lead frame 100 rapidly increased. Then, 120 seconds after the start of measurement, the temperature of the lead frame converged to approximately 260° C. (see plot P3).

Next, the results of Example 1 were confirmed. According to the graph G6a, it was first found that the temperature of the lead frame 100 was about 25° C. (see plot P1). Next, about 40 seconds after the start of measurement, the lead frame 100 was transferred onto the heater unit (see plot P2). As a result, it was found that the temperature of the lead frame 100 rapidly increased. Then, 120 seconds after the start of measurement, the temperature of the lead frame converged to approximately 260° C. (see plot P3).

In other words, it was confirmed that there was no significant difference in the convergence temperature of the lead frame 100 regardless of the presence or absence of the fins 22 .

On the other hand, the difference appeared in the period until reaching the convergence temperature. For example, the period from the start of heating to reaching 95% of the convergence temperature (260° C.) was compared. First, in the case of the comparative example (graph G6b), it took about 48 seconds (87 seconds-39 seconds) from the start of heating to reach 95% of the convergence temperature (see plot P4). In the case of Example 1 (graph G6a), it took about 28 seconds (71 seconds-42 seconds) from the start of heating to reach 95% of the convergence temperature (see plot P5). That is, by providing the fins 22 and the air supply holes 24, 20 seconds were successfully shortened. Therefore, it was confirmed that the provision of the fins 22 and the air supply holes 24 shortened the period required for preheating.

[Modification]
Although the embodiments of the present invention have been described above, the present invention may be implemented in various forms without being limited to the above embodiments.

For example, in the above embodiments, the wire bonding apparatus 1 is illustrated as the bonding apparatus. For example, the bonding equipment may be a die bonding equipment. In this case, the bonding operation means die bonding, not wire bonding. The bonding section may include a mechanism for transferring the semiconductor chip to the lead frame 100, a mechanism for placing an adhesive on the semiconductor chip and/or the lead frame 100, and the like.

DESCRIPTION OF SYMBOLS 1... Wire bonding apparatus (bonding apparatus), 2... Frame feeder, 3... Bonding unit, 4... Control unit, 6... Base, 7... Bonding tool, 8... Capillary, 9... Rail, 10... Drive mechanism, 11... Preheater (heater unit, first heater unit), 12: heat plate, 13: after heater (heater unit, second heater unit), 14: cartridge heater (heating element, first heating element, second heating element), 16: Heater block 16a Main surface 17 Heater fixing surface 18 Upstream heat radiation part 19 Downstream heat radiation part 21 Connecting part 22 Fin 23 Groove 24 Air supply hole 100 Lead frame D1... Conveying direction, D2... Facing direction, D3... Depth direction, K... Imaginary plane, L1... Gap, L3... Depth, A1... Preheating area, A2... Bonding area, A3... Post-heating area.

Claims (11)

a bonding unit that performs a bonding operation on the lead frame transported to the work area;
a frame feeder having a transport unit that transports the lead frame to the work area and a heater unit that preheats the lead frame before being transported to the work area;
The transport section transports the lead frame while separating it from the heater unit,
The heater unit
a heating element;
A heating element disposed on the upstream side of the work area in the lead frame transport direction, facing the back surface of the lead frame and spaced apart from the lead frame, for transferring heat received from the heating element to the lead frame a heater block that provides
The heater block is provided with a heat radiating portion having a plurality of fins formed in the depth direction from the surface of the heater block ,
The bonding device , wherein the length of the fin in the depth direction is 5 times or more and 20 times or less the distance from the tip of the fin to the lead frame in the depth direction . 2. The bonding apparatus according to claim 1, wherein said plurality of fins are spaced apart from each other along a direction intersecting with the conveying direction of said lead frame. 3. The bonding apparatus according to claim 1, wherein said heater block is provided with a hole which is provided between said fins and penetrates in said depth direction. 4. The bonding apparatus according to claim 1, wherein a length of said fin in said depth direction is longer than a distance from a tip of said fin to said lead frame in said depth direction. further comprising a control unit that controls operations of the bonding unit and the frame feeder;
The control unit
providing a control signal to the bonding unit to cause the bonding unit to perform a bonding operation on the first lead frame, which is the lead frame, in a first period;
providing a control signal to the frame feeder to cause the heater unit to preheat a second lead frame different from the first lead frame in a second period overlapping the first period;
The bonding apparatus according to any one of claims 1 to 4, wherein the length of said second period is less than or equal to the length of said first period. a conveying unit that conveys the lead frame to a work area where bonding work is performed on the lead frame;
a first heater unit that preheats the lead frame before being transported to the work area;
The transport section transports the lead frame while separating it from the first heater unit,
The first heater unit is
a first heating element;
The lead is disposed on the upstream side of the work area in the conveying direction of the lead frame, faces the back surface of the lead frame and is spaced apart from the lead frame, and receives heat from the first heating element. a first heater block provided to the frame;
The first heater block is provided with a first heat radiation part having a plurality of first fins formed in a depth direction from the surface of the first heater block ,
The frame feeder , wherein the length of the fin in the depth direction is 5 times or more and 20 times or less the distance from the tip of the fin to the lead frame in the depth direction . further comprising a second heater unit that heats the lead frame transported from the work area after the bonding work is performed;
The second heater unit is
a second heating element;
A second heating element disposed downstream of the work area in the lead frame transport direction and facing the back surface of the lead frame for providing heat received from the second heating element to the lead frame. a heater block;
7. The frame feeder according to claim 6, wherein said second heater block is provided with a second heat radiation part having a plurality of second fins formed in a depth direction from the surface of said second heater block. A heater unit for preheating the lead frame before it is transported to a work area where bonding work is performed on the lead frame,
a heating element;
A heating element disposed on the upstream side of the work area in the lead frame transport direction, facing the back surface of the lead frame and spaced apart from the lead frame, for transferring heat received from the heating element to the lead frame a heater block that provides
The heater block is provided with a heat radiating portion having a plurality of fins formed in the depth direction from the surface of the heater block ,
The heater unit , wherein the length of the fin in the depth direction is 5 times or more and 20 times or less the distance from the tip of the fin to the lead frame in the depth direction . 9. The heater unit according to claim 8, wherein said plurality of fins are spaced apart from each other along a direction intersecting with the conveying direction of said lead frame. 10. The heater unit according to claim 8, wherein the heater block is provided with holes extending between the fins and penetrating in the depth direction. 11. The heater unit according to claim 8, wherein a length of said fin in said depth direction is longer than a distance from a tip of said fin to said lead frame in said depth direction.

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