JP7249585B2 - COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING APPARATUS - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method for thermocompression bonding a component to a substrate, and a component mounting apparatus for executing the component mounting method.

Conventionally, ACF (Anisotropic Conductive Film) tape, which is an anisotropic conductive member, is attached to the edge of the substrate as an adhesive member, and electronic components such as drive circuits (hereinafter simply referred to as There is a component mounting line that includes a component mounting apparatus that heats and mounts a component (referred to as a "component"), that is, performs temporary pressure bonding (see, for example, Patent Document 1).

JP-A-2003-77956

In order to minimize the production takt (takt time) in a component mounting line that produces display panels such as liquid crystal panels and organic EL panels, each device provided in the component mounting line operates with the standby time as short as possible.

For example, a component mounting apparatus picks up a component to be temporarily pressure-bonded to a substrate by a temporary pressure bonding head as soon as possible. Here, if there is a delay in operation due to a problem or the like in a process in which devices other than the component mounting apparatus in the component mounting line operate, the temporary pressure bonding head remains in a state of holding the picked up component.

By the way, a flexible component, which is an example of a component mounted on a display panel, absorbs moisture in the air and expands. When the flexible part is held by the temporary pressure bonding head heated to a high temperature, the moisture contained in the flexible part evaporates due to the heat from the temporary pressure bonding head, and the flexible part shrinks.

Therefore, if the time for which the temporary pressure bonding head holds the picked-up flexible component differs for each picked-up flexible component, the contraction amount of each flexible component may differ. Due to this difference in contraction amount, when the component mounting apparatus temporarily press-bonds the flexible component to the board, there is a possibility that mounting variations such as positional deviation may occur for each flexible component to be temporarily press-bonded. In particular, when so-called fine-pitch mounting, which requires precise mounting accuracy, is required for the component mounting apparatus, there is concern that such mounting variations may cause defects in the display panel.

The present invention provides a component mounting method and the like capable of suppressing mounting variations.

A component mounting method according to an aspect of the present invention is executed by a component mounting apparatus that mounts a component on a board that has undergone a predetermined process upstream of the component mounting apparatus in a component mounting line that performs a plurality of processes on the board. a carrying step of placing the substrate on a substrate stage; a receiving step of receiving a component to be mounted on the substrate by a heated head; and the substrate placed on the substrate stage. and a mounting step of mounting the component received by the head in the upstream step immediately before the component mounting apparatus, wherein the receiving step is executed after the predetermined processing is completed on the substrate.

Further, a component mounting apparatus according to an aspect of the present invention is a component mounting apparatus that mounts components on a board that has been subjected to a predetermined process upstream in a component mounting line that performs a plurality of processes on the board, the component mounting apparatus comprising: a substrate stage on which the substrate is placed, a substrate transfer device for placing the substrate on the substrate stage, a component supply unit for supplying components to be mounted on the substrate, and the components received from the component supply unit and the substrate A head attached to the substrate placed on the stage, and a control unit for controlling the operation of the head, the head having a heating mechanism, determining whether or not the predetermined processing has been completed upstream, and controlling the operation of the head so as to cause the head to receive the component from the component supply unit when it is determined that the predetermined processing has been completed; .

In addition, these comprehensive or specific aspects may be realized by a system, method, integrated circuit, computer program, or a recording medium such as a computer-readable CD-ROM. and any combination of recording media.

ADVANTAGE OF THE INVENTION According to this invention, the component mounting method etc. which can suppress mounting variation can be provided.

FIG. 1 is a schematic configuration diagram of a component mounting line including a component mounting apparatus according to an embodiment. FIG. 2 is a schematic perspective view showing the component mounting apparatus according to the embodiment. FIG. 3 is a schematic side view showing the component mounting apparatus according to the embodiment. FIG. 4 is a block diagram showing the functional configuration of the component mounting apparatus according to the embodiment. FIG. 5 is a flowchart for explaining a processing procedure of operations performed by the component mounting apparatus according to the embodiment. FIG. 6 is a side view for explaining operations performed by the component mounting apparatus according to the embodiment. FIG. 7 is a side view for explaining operations performed by the component mounting apparatus according to the embodiment.

Hereinafter, a component mounting method and the like according to the embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that each of the embodiments described below is a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement and connection of components, steps and order of steps, etc. shown in the following embodiments are examples and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in independent claims representing the highest level concept of the present invention will be described as optional constituent elements.

Each figure is a schematic diagram and is not necessarily strictly illustrated. Moreover, in each figure, the same code|symbol is attached|subjected about the same component.

In addition, in this specification and drawings, the X-axis, Y-axis, and Z-axis represent three axes of a three-dimensional orthogonal coordinate system. The X-axis and the Y-axis are orthogonal to each other and both orthogonal to the Z-axis. Further, in the following embodiments, the X-axis positive direction of the substrate transfer direction may be referred to as the upward direction, the Z-axis positive direction may be referred to as the upward direction, and the Z-axis negative direction may be referred to as the downward direction.

(Embodiment)
[overview]
First, with reference to FIG. 1, an outline of a component mounting line including a component mounting apparatus according to an embodiment will be described.

FIG. 1 is a schematic configuration diagram of a component mounting line 1 including a component mounting apparatus 100 according to an embodiment.

The component mounting line 1 is a component mounting system for producing display panels and the like, and performs a plurality of processes on substrates 200 such as display panels. Specifically, the component mounting line 1 attaches an anisotropic conductive member (ACF) 230 such as ACF to the substrate 200 on which the electrode portion 210 is formed, and heats the substrate 200 and the component 220 via the ACF 230 . It is a crimping device. Examples of the component 220 include flexible components such as TCP (Tape Carrier Package) and FPC (Flexible Printed Circuits). A component mounting apparatus 100 according to the present embodiment is one apparatus in a component mounting line 1 having a plurality of apparatuses for performing a plurality of processes on a substrate 200 such as a display panel. The component mounting line 1 is a section that performs a plurality of operations inline. The component mounting apparatus 100 mounts a component 220 on a board 200 that has been subjected to a predetermined process by a device upstream of the component mounting apparatus 100 provided in the component mounting line 1 . In the present embodiment, the component mounting apparatus 100 mounts (more specifically, temporarily crimps) an electronic component (hereinafter referred to as a component 220) having a drive circuit and the like formed on the substrate 200. FIG.

In this embodiment, the component mounting line 1 includes a board loading section 10 for loading a board 200, a bonding section 20 for bonding the ACF 230 to the board 200, and a component mounting apparatus 100 for temporarily crimping the component 220 onto the ACF 230. , a main crimping unit 40 for thermally crimping (finally crimping) the component 220 together with the ACF 230 to ensure electrical continuity between the substrate 200 and the component 220, and a board unloading unit for unloading the board 200 to which the component 220 is thermally crimped. 50 and a computer 110 (see FIG. 2) that controls the operation of each device on the component mounting line 1 .

Although the illustration of the computer 110 is omitted in FIG. 1, the computer 110 includes various devices such as the substrate loading unit 10, the bonding unit 20, the component mounting apparatus 100, the main pressure bonding unit 40, the substrate unloading unit 50, and the like. and are communicably connected by a control line or the like, and control the operation of each device, the timing of the operation, and the like.

The board loading section 10, the sticking section 20, the component mounting apparatus 100, the main pressure bonding section 40, and the board unloading section 50 are connected in this order. The component mounting line 1 is a component mounting operation in which components 220 are mounted on electrode portions 210 provided on the periphery of a rectangular substrate 200 such as a display panel substrate carried in from an upstream substrate loading section 10 where the substrate 200 is conveyed. , and the board 200 with the component 220 mounted thereon is unloaded from the board unloading section 50 . The electrode section 210 is composed of, for example, an electrode.

The board carrying-in section 10 is a device for carrying in a board 200 that has undergone a predetermined operation in an upstream facility arranged upstream of the component mounting line 1 . The substrate loading section 10 includes a plurality of stages 11 arranged in parallel in the X direction. The stage 11 holds the substrate 200 unloaded from the upstream equipment.

The sticking unit 20 is a type of adhesive tape, and is a device that sticks the ACF 230 made of an anisotropic conductive film in a tape shape to the substrate 200 . The sticking section 20 includes, for example, a plurality of stages 21 arranged in parallel in the X direction. The stage 21 holds the substrate 200 unloaded from the substrate loading section 10 . The attaching unit 20 moves the substrate 200 held by the stage 21 in a predetermined direction, and moves the substrate 200 to an attaching position where the ACF 230 is attached. Also, the attaching unit 20 attaches the ACF 230 cut to a predetermined size to the substrate 200 by the attaching tool 22 . By doing so, the attaching section 20 attaches the ACF 230 to the substrate 200 .

The component mounting apparatus 100 is a device that temporarily crimps a component 220 onto an ACF 230 attached to a substrate 200 . Specifically, the component mounting apparatus 100 picks up the component 220 placed on the component standby stage 70 (see FIG. 2), supplies the component to the component stage 90 (see FIG. 2), and mounts the component at a predetermined timing. The component 220 supplied to the stage 90 is picked up and mounted on the board 200 via the ACF 230 .

The final pressure-bonding unit 40 is a device that performs thermocompression (final pressure-bonding) of the component 220 temporarily pressure-bonded to the substrate 200 . The main crimping unit 40 includes, for example, a plurality of stages 41 arranged in parallel in the X direction. The final compression unit 40 moves the substrate 200 held by the stage 41 in a predetermined direction, and moves the substrate 200 to which the component 220 is preliminarily bonded to the component compression bonding position where the component 220 is thermally bonded. In addition, the main crimping part 40 performs thermocompression bonding by pressing the component onto the substrate 200 via the ACF 230 while heating it by using the crimping tool 42 .

The substrate unloading unit 50 is a device that unloads the substrate 200 to which the components are finally crimped by the main crimping unit 40 to the downstream equipment arranged downstream of the component mounting line 1 . The substrate 200 held on the stage 51 of the substrate unloading section 50 is unloaded to downstream equipment by a unillustrated unillustrated unloading device capable of taking out the substrate 200 from the stage 51 and unloading it downstream.

The computer 110 is a control device that controls the operation of the component mounting apparatus 100 and each device in the component mounting line 1 including the component mounting apparatus 100 . The computer 110 includes a control unit 120 that is a processing unit realized by executing software, and a storage unit 130 that stores the software.

The computer 110 may be provided independently in the component mounting apparatus 100, or may use a computer provided in the component mounting line 1. FIG.

The control unit 120 controls the operation of each device of the component mounting line 1 including the board loading unit 10, the bonding unit 20, the component mounting device 100, the main pressure bonding unit 40, and the board unloading unit 50, the timing of the operation, and the like. do. Further, the control unit 120 controls the board transfer device 60 to perform a board transfer operation of transferring the board 200 to the next process between the devices provided in the component mounting line 1 .

The control unit 120 is stored in the storage unit 130, for example, by a control program for controlling each device included in the component mounting apparatus 100 and the component mounting line 1, and a CPU (Central Processing Unit) that executes the control program. Realized.

The storage unit 130 stores component mounting information such as the size of the board 200, the type of the component 220 to be mounted on the board 200, the mounting position, the mounting direction, the operation of each device, the timing of the operation, and the timing of transferring the board 200 between the devices. It stores various data necessary for work, control programs executed by the control unit 120, and the like.

The storage unit 130 is implemented by a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), for example.

[Component mounting equipment]
Next, the component mounting apparatus 100 will be described in detail with reference to FIGS. 2 to 4. FIG.

FIG. 2 is a schematic perspective view showing component mounting apparatus 100 according to the embodiment. FIG. 3 is a schematic side view showing component mounting apparatus 100 according to the embodiment. 2, illustration of the backup stage 86 is omitted. Also, in FIG. 3, illustration of some devices such as the computer 110 and the substrate transfer device 60 is omitted. FIG. 4 is a block diagram showing the functional configuration of the component mounting apparatus 100 according to the embodiment.

2 also shows a computer 110 as a functional block for controlling each device included in the component mounting apparatus 100. As shown in FIG. The computer 110 is communicably connected to each device included in the component mounting apparatus 100 via a control line (not shown) or the like.

2 and 3 show the component standby stage moving mechanism 71, pickup head moving mechanism 73, camera moving mechanism 76, and pressure bonding head moving mechanism 81 as functional blocks.

The component mounting apparatus 100 performs a predetermined process (for example, attaching the ACF 230 to the board 200) in a device upstream of the component mounting apparatus 100 (for example, the bonding unit 20) in the component mounting line 1 that performs a plurality of processes on the board 200. A component 220 is mounted (more specifically, temporarily crimped) on the substrate 200 to which the bonding has been performed.

The component mounting method executed by component mounting apparatus 100 includes a transporting process, a receiving process, and a mounting process.

The component mounting apparatus 100 places the board 200 on the board stage 83 in the transport process.

In the receiving process, the component mounting apparatus 100 receives, that is, picks up, the component 220 to be mounted on the substrate 200 by the head (the pressure bonding head 80 ) heated by the heating mechanism 85 .

Further, the component mounting apparatus 100 executes the receiving process after the substrate 200 has undergone a predetermined process in the upstream process immediately before the transporting process. In the present embodiment, component mounting apparatus 100 attaches component 220 to component 220 by heated crimping head 80 after ACF 230 has been completely attached to substrate 200 in the step of attaching ACF 230 to substrate 200 by attaching unit 20 . Execute a receiving step that receives the

For example, the component mounting apparatus 100 performs the receiving process after a predetermined process has been completed in an upstream process immediately before the component mounting apparatus 100 and after the transfer of the board 200 from the upstream to the component mounting apparatus 100 has started. Execute. For example, after the attaching process of the ACF 230 to the substrate 200 by the attaching unit 20 is completed, the control unit 120 transfers the substrate 200 to the component mounting apparatus 100 after the attaching process by the substrate transfer device 60 is completed. After transport is initiated, a receiving step is performed in which the heated crimping head 80 receives the part 220 .

Further, for example, the component mounting apparatus 100 is placed on the substrate stage 83 after the substrate 200 transported from the upstream (for example, the bonding section 20) by the substrate transfer device 60, that is, after the transport process is completed. to execute the receiving process.

Further, in the mounting process, the component mounting apparatus 100 attaches the component 220 received by the pressure bonding head 80 to the board 200 placed on the board stage 83 . For example, in the mounting process, the control unit 120 causes the pressure bonding head 80 to temporarily pressure bond the component 220 received by the pressure bonding head 80 to the substrate 200 placed on the substrate stage 83 .

The component mounting method executed by the component mounting apparatus 100 may further include a board defect detection process, a component supply process, and a component defect detection process.

For example, in the board defect detection process, the component mounting apparatus 100 detects a defect such as a positional deviation of the board 200 placed on the board stage 83 . For example, the control unit 120 controls the substrate defect detection unit 33 to capture an image of the substrate 200 placed on the substrate stage 83, and analyzes the image generated by the image capturing to detect a defect in the substrate 200. It is determined whether or not there is In this case, for example, the control unit 120 causes the pressure bonding head 80 to perform the receiving process when no defect in the board 200 is detected in the board defect detection process.

Further, for example, in the component supply process, the component mounting apparatus 100 places the component 220 on the component stage 90 by supplying the component 220 to the component stage 90 . Further, for example, the component mounting apparatus 100 detects defects in the component 220 supplied to the component stage 90 in the component defect detection step. For example, the control unit 120 controls the component defect detection unit 34 to capture an image of the component 220 placed on the component stage 90, and analyzes the image generated by capturing the image to determine whether the component 220 is defective. It is determined whether or not there is In this case, for example, in the receiving process, the component mounting apparatus 100 causes the pressure bonding head 80 to stand by immediately above the component 220 placed on the component stage 90 after the component detection process is completed, and In the upstream process of , the component 220 placed on the component stage 90 is received by the pressure bonding head 80 after the substrate 200 has undergone predetermined processing. Specifically, for example, in the receiving process, after the component detection process is completed, the control unit 120 controls the pressure bonding head moving mechanism 81 to move the pressure bonding head 80 directly above the component 220 placed on the component stage 90 . After the ACF 230 has been completely attached to the substrate 200 in the attaching step, the component 220 placed on the component stage 90 is received by the pressure bonding head 80 .

Note that the component mounting apparatus 100 detects the completion of the bonding process of the ACF 230, or detects the start of transportation of the substrate 200, which has completed the bonding process by the substrate transfer device 60, to the component mounting apparatus 100. A detection device may be provided for Further, for example, the component mounting apparatus 100 acquires information indicating the start and completion of processing from a device upstream of the component mounting apparatus 100, such as the attaching unit 20, in order to detect the completion of the attaching process of the ACF 230. A communication interface or the like for obtaining data may be provided as an acquisition unit.

The component mounting apparatus 100 functionally includes a temporary crimping section 30 , a component supply section 31 , a detection section 32 , a substrate transfer device 60 , a control section 120 and a storage section 130 .

The component supply unit 31 supplies components 220 to be mounted (temporarily press-bonded) to the substrate 200 . More specifically, the component supply section 31 picks up one component 220 from the component standby stage 70 on which the components 220 to be mounted on the substrate 200 are placed, and places the component 220 on the component stage 90. It is a device that supplies the component 220 to the temporary crimping section 30 .

The component supply unit 31 includes, as hardware units, a component standby stage 70, a component standby stage moving mechanism 71, a pickup head 72, a pickup head moving mechanism 73, a component stage 90, and a component stage moving mechanism 91. have.

The component standby stage 70 is a stage on which components 220 are placed. For example, a plurality of components 220 may be placed on the component standby stage 70 . In this case, the plurality of components 220 are placed on the component standby stage 70, for example, in a state of being arranged on a tray in a predetermined arrangement. Moreover, the form of supplying the components 220 to the component standby stage 70 is not limited to this. For example, the carrier tape may be pulled out from a supply reel around which the carrier tape holding a plurality of components 220 is wound, and the components 220 may be punched out from the pulled-out carrier tape with a mold and supplied to the component standby stage 70. good.

The component standby stage moving mechanism 71 is a moving mechanism for moving the component 220 placed on the component standby stage 70 to a position where the pickup head 72 can pick it up. The component standby stage moving mechanism 71 is, for example, a conveyor configured to arbitrarily move the component standby stage 70 on the XY plane.

The pickup head 72 is a device for picking up the component 220 placed on the component standby stage 70 and supplying the component 220 to the component stage 90 . Specifically, the pick-up head 72 picks up the component 220 placed on the component standby stage 70 and separates the picked-up component 220 from the component stage 90 to place the picked-up component 220 on the component stage 90 . place it. The pickup head 72 has a suction nozzle capable of holding the component 220 by suction.

A method of holding the component 220 by the pickup head 72 is not particularly limited, but in the case of the present embodiment, a method of holding the component 220 by vacuum suction is adopted.

The pickup head moving mechanism 73 is a moving mechanism for moving the pickup head 72 . The pickup head moving mechanism 73 is composed of, for example, a linear motion guide and a linear motor for reciprocating the pickup head 72 in the Z-axis direction.

The component stage 90 is a stage on which the component 220 supplied by the pickup head 72 is placed.

The component stage moving mechanism 91 is a moving mechanism for moving the component stage 90 to a position where the pickup head 72 can supply the component 220 . Also, the component stage moving mechanism 91 moves the component stage 90 to a position where the camera 74 can image the component 220 placed on the component stage 90 . In the present embodiment, the component stage moving mechanism 91 moves the component stage 90 so that the component 220 placed on the component stage 90 is below the camera 74 . Further, the component stage moving mechanism 91 moves the component stage 90 to a position where the pressure bonding head 80 can receive the component 220 placed on the component stage 90, that is, can pick it up.

The component stage moving mechanism 91 is, for example, a conveyor configured to reciprocate the component stage 90 in the Y-axis direction.

The temporary pressure-bonding unit 30 is a device that picks up the component 220 supplied to the component stage 90 by the component supply unit 31 and mounts it on the board 200 (temporary pressure-bonding).

The temporary pressure-bonding unit 30 includes, as hardware units, a camera 75, a pressure-bonding head (head) 80, a pressure-bonding head moving mechanism 81, a substrate stage 83, a backup stage 86, a substrate stage moving mechanism 84, and a heating mechanism 85. and have 2 and 3, illustration of the heating mechanism 85 is omitted.

The pressure bonding head 80 receives the component 220 from the component supply section 31 and attaches it to the substrate 200 placed on the substrate stage 83 . The pressure bonding head 80 includes a suction nozzle capable of sucking and holding the component 220 placed on the component stage 90 . The pressure bonding head 80 sucks the component 220 placed on the component stage 90 with a suction nozzle, and temporarily presses it onto the substrate 200 .

The method of holding the component 220 by the crimping head 80 is not particularly limited, but in the case of this embodiment, a method of holding the component 220 by vacuum suction is adopted.

The compression head moving mechanism 81 is a movement mechanism for moving the compression head 80 . The compression head moving mechanism 81 is composed of, for example, a linear motion guide and a linear motor for reciprocating the compression head 80 in the Z-axis direction.

The substrate stage 83 is a stage on which the substrate 200 carried out from the bonding section 20 by the substrate transfer device 60 is placed. The substrate 200 is placed on the substrate stage 83 in such a state that the outer edge of the substrate 200 to which the ACF 230 is adhered protrudes from the substrate stage 83 .

The backup stage 86 is a portion of the substrate 200 to be temporarily pressure-bonded when the temporary pressure-bonding head 80 temporarily pressure-bonds the component 220 to the substrate 200, that is, the outer edge portion of the substrate 200 to which the ACF 230 is adhered. This stage is for supporting the portion of the substrate 200 protruding from the stage 83 from the back side (lower side) of the substrate 200 .

The substrate stage moving mechanism 84 is a moving mechanism that moves the substrate stage 83 to a position where the substrate 200 transferred from the bonding section 20 by the substrate transfer device 60 can be placed on the substrate stage 83 . The substrate stage moving mechanism 84 also moves the substrate 200 to a position where the pressure bonding head 80 can temporarily press the component 220 onto the ACF 230 attached to the substrate 200 .

The substrate stage moving mechanism 84 is, for example, a conveyor configured to move the substrate stage 83 arbitrarily on the XY plane and to move up and down in the Z-axis direction.

The heating mechanism 85 is a heater having a heating wire, a Peltier element, or the like for heating the crimping head. The heating mechanism 85 is built in the crimping head 80, for example. The component 220 held by the pressure bonding head 80 is heated to a predetermined temperature by the heating mechanism 85 before being temporarily pressure bonded to the substrate 200 . The pressure bonding head 80 heats the component 220 via the ACF 230 adhered to the substrate 200 while pressing the component 220 against the substrate 200 while being heated by the heating mechanism 85 . In this way, the component 220 is preliminarily crimped onto the substrate 200 while the ACF 230 is cured by heat generated from the crimping head 80 .

The detection unit 32 is a device for detecting defects such as failure and misalignment of the component 220 and the substrate 200 . The detection unit 32 functionally includes a board defect detection unit 33 and a component defect detection unit 34 .

The board defect detector 33 detects a defect such as positional deviation of the board 200 placed on the board stage 83 . The detection unit 32 includes a camera 75 as a hardware unit.

The component defect detection unit 34 detects defects such as failure of the component 220 . The component defect detection unit 34 includes cameras 74 and 75 and a camera moving mechanism 76 as hardware units.

The camera 74 is an imaging device for detecting defects in the component 220 placed on the component stage 90 . The camera 74 captures an image of the top side of the component 220 placed on the component stage 90 by capturing an image of the downward direction, for example. For example, the component mounting apparatus 100 (more specifically, the control unit 120) images the component 220 with the camera 74 and analyzes the image to determine whether the component 220 is defective. When the component mounting apparatus 100 determines that the component 220 is defective, for example, the component mounting apparatus 100 collects the component 220 from the component stage 90 and discards it. For example, when the control unit 120 determines that the component 220 is defective, it controls the component stage moving mechanism 91, the pickup head 72, and the pickup head moving mechanism 73, and transfers the component to the pickup head 72. 220 is picked up, the component 220 is collected from the component stage 90, and the component 220 is moved to a collection box (not shown) or the like installed in advance for discarding the defective component.

The camera moving mechanism 76 is a moving mechanism for moving the camera 74 to a position where the camera 74 can image the component 220 . The camera moving mechanism 76 is composed of, for example, a linear motion guide and a linear motor for reciprocating the camera 74 in the Z-axis direction.

The camera 75 is an imaging device for detecting defects in the picked-up component 220 held by the crimping head 80 . The camera 75 is provided below the backup stage 86, for example, and images the lower surface side of the component 220 held by the crimping head 80 by imaging the upper side through a window (not shown) of the backup stage 86. do. The window part is, for example, a translucent member or a through hole formed in the backup stage 86 . For example, the component mounting apparatus 100 (more specifically, the control unit 120) images the component 220 with the camera 75 and analyzes the image to determine whether the component 220 is defective. When the component mounting apparatus 100 determines that the component 220 is defective, the component mounting apparatus 100 discards the component 220, for example. For example, when the control unit 120 determines that the component 220 is defective, it controls the pressure bonding head 80 and the pressure bonding head moving mechanism 81 to set a previously installed collection box (not shown) for discarding the defective component. ) or the like.

In addition, the camera 75 detects defects such as misalignment of the substrate 200 placed on the substrate stage 83 . For example, the substrate 200 is placed on the substrate stage 83 so that the outer edge of the substrate 200 slightly protrudes from the outer edge of the substrate stage 83 in the positive Y-axis direction when viewed from above. The camera 75 captures an image of the outer edge of the substrate 200 in order to detect the position of the outer edge of the substrate 200 protruding from the outer edge of the substrate stage 83 when viewed from below. The control unit 120 analyzes an image including the board 200 captured by the camera 75 to determine whether there is a defect such as positional deviation from a predetermined position where the component 220 is temporarily crimped to the board 200. . For example, when the control unit 120 determines that the substrate 200 is defective, for example, the substrate stage moving mechanism 84 is controlled to move the substrate 200 (specifically, Specifically, the substrate stage 83) is moved.

Note that the camera moving mechanism 76 may be configured such that the camera 74 can be freely moved on the XY plane. In this case, the camera moving mechanism 76 is composed of, for example, a guide and a linear motor for moving the camera 74 within the XY plane.

Moreover, although the position of the camera 75 is fixed in this embodiment, it may be configured to be movable.

The substrate transfer device 60 is a device that transfers (delivers) the substrate 200 between adjacent devices. The substrate transfer device 60, for example, reciprocates between adjacent devices along the X-axis direction, receives the substrate 200 from the upstream device, and places the substrate 200 on the stage of the downstream device. For example, the substrate transfer apparatus 60 receives the substrate 200 to which the ACF 230 has been attached to the substrate 200 by the attaching unit 20, and places the substrate stage 83 of the component mounting apparatus 100 thereon.

The control unit 120 is a processing unit that controls each operation of the temporary crimping unit 30, the component supply unit 31, the detection unit 32, the substrate transfer device 60, etc., the timing of each operation, and the like. In the present embodiment, the control unit 120 also controls the operation of devices such as the sticking unit 20 and the main crimping unit 40 provided in the component mounting line 1 .

For example, the control unit 120 determines whether or not a predetermined process has been completed immediately upstream of the component mounting apparatus 100. If it is determined that the predetermined process has been completed, the control unit 120 supplies the component 220 to the crimping head 80 by the component supply unit. Controls the operation of the crimp head 80 to receive from 31 .

Note that the control unit 120 may control the operation of the crimping head 80 so that the crimping head 80 holds the component 220 for a predetermined time, for example. The predetermined time may be arbitrarily determined in advance and is not limited. The control unit 120 controls the operation of the crimping head 80 so that, for example, the component 220 that has passed a predetermined time after being held by the crimping head 80 is discarded without being temporarily crimped to the substrate 200 . . Note that the component mounting apparatus 100 may include a timer (not shown) such as an RTC (Real Time Clock) in order to measure time.

The storage unit 130 stores various data necessary for mounting the component 220 on the board 200, such as the operation of each device included in the component mounting apparatus 100, the timing of the operation, the timing of transferring the board 200 between the devices, and the control unit. 120 stores control programs and the like that are executed. In this embodiment, the storage unit 130 also stores a control program for the control unit 120 to control the operation of each device provided in the component mounting line 1 other than the component mounting device 100, the timing of the operation, and the like. .

The storage unit 130 is realized by a memory such as ROM and RAM, for example.

[Processing procedure]
Subsequently, a processing procedure of the component mounting apparatus 100 according to the embodiment will be described in detail with reference to FIGS. 5 to 7. FIG.

FIG. 5 is a flow chart for explaining a processing procedure of operations executed by the component mounting apparatus 100 according to the embodiment. FIG. 6 is a side view for explaining the operation performed by component mounting apparatus 100 according to the embodiment. FIG. 7 is a side view for explaining the operation performed by component mounting apparatus 100 according to the embodiment.

6 and 7, illustration of some components such as the component standby stage 70 and the substrate transfer device 60 is omitted.

As shown in FIG. 5, first, the control section 120 causes the component stage 90 to supply the component 220 to the component supply section 31 (step S101).

Next, the control unit 120 causes the detection unit 32 to detect a defect in the component 220 supplied to the component stage 90, and determines whether or not the component 220 is defective (step S102). In step S102, for example, the control unit 120 determines whether or not the component 220 is defective by analyzing an image generated by imaging the component 220 with the camera 74. FIG.

When the controller 120 determines that the component 220 is not defective (No in step S102), it positions the pressure bonding head 80 above the component 220 being supplied to the component stage 90 (step S103). In the present embodiment, in step S103, as shown in FIG. 6A, the control unit 120 causes the camera moving mechanism 76 to move the camera 74, which had been brought close to the component 220 in order to detect a defect in the component 220, upward. , and the component stage moving mechanism 91 moves the component stage 90 in the Y-axis negative direction, thereby positioning the pressure bonding head 80 above the component 220 being supplied to the component stage 90 . In addition, when the pressure contact head moving mechanism 81 is configured to be capable of moving the pressure contact head 80 in the Y-axis direction, the control unit 120 causes the pressure contact head moving mechanism 81 to move the pressure contact head 80 . may be moved above the component 220 being supplied to the component stage 90 .

Next, the control section 120 determines whether or not the predetermined process in the process of the device upstream of the component mounting device 100 has been completed (step S104). For example, in step S<b>104 , the control unit 120 determines whether or not the attaching unit 20 has completed attaching the ACF 230 to the substrate 200 . The attaching unit 20 , for example, transmits a completion signal indicating that the attaching unit 20 has completed attaching the ACF 230 to the substrate 200 to the control unit 120 . When receiving the completion signal, the control unit 120 determines that the attaching unit 20 has completed attaching the ACF 230 to the substrate 200 .

When the control unit 120 determines that the predetermined process in the process of the device upstream of the component mounting apparatus 100 is completed (Yes in step S104), the control unit 120 causes the pressure bonding head 80 to receive the component 220, that is, to pick up the component 220. (Step S105). For example, as shown in (b) of FIG. 6 , the control unit 120 causes the compression head moving mechanism 81 to move the compression head 80 downward to pick up the component 220 , thereby causing the compression head 80 to receive the component. .

In this way, the component mounting apparatus 100 causes the pressure bonding head 80 to receive the component 220 after determining that the predetermined process in the process of the upstream apparatus of the component mounting apparatus 100 has been completed.

Further, for example, after the component 220 is received by the pressure bonding head 80, the control unit 120 causes the component stage moving mechanism 91 to move the component stage 90 in the positive direction of the Y axis, as shown in FIG. The component supply unit 31 is caused to newly supply the component 220 to the component stage 90 .

Next, the control unit 120 causes the detection unit 32 to detect a defect in the component 220 received by the crimping head 80, and determines whether or not the component 220 is defective (step S106). In the present embodiment, in step S106, the controller 120 causes the pressure head moving mechanism 81 to move the pressure head 80 downward in order to detect a defect in the component 220, as shown in FIG. 6(c). to bring component 220 closer to camera 75 . Further, in step S106, for example, the control unit 120 determines whether or not the component 220 is defective by analyzing an image generated by imaging the component 220 with the camera 75. FIG.

When the controller 120 determines that the component 220 is not defective (No in step S106), the controller 120 moves the board 200 to which the ACF 230 is attached by the attaching part 20 to the component mounting apparatus 100 by moving the board 200 to the component mounting apparatus 100. It is placed on the stage 83 (step S107).

Next, the control unit 120 causes the detection unit 32 to detect a defect in the substrate 200 placed on the substrate 200, and determines whether or not the substrate 200 has a defect (step S108). For example, in step S108, as shown in (c) of FIG. 6, the control unit 120 causes the pressure-bonding head moving mechanism 81 to move the pressure-bonding head 80 upward (in the direction of arrow A1), and In order to detect a defect such as positional deviation from a predetermined position where the component 220 is temporarily pressure-bonded to the substrate 200, the substrate stage moving mechanism 84 is caused to move the substrate stage 83 in the Y-axis positive direction (the direction of the arrow A2). Then, the position of the outer edge of the substrate 200 protruding from the outer edge of the substrate stage 83 is captured by the camera 75 . The control unit 120 analyzes the image generated by the camera 75 to determine whether or not there is a defect such as displacement from the predetermined position where the component 220 is temporarily crimped to the board 200. do.

When the controller 120 determines that the substrate 200 has no defects (No in step S108), the component 220 is temporarily pressure-bonded to the substrate 200 by the pressure bonding head 80 and the pressure bonding head moving mechanism 81 (step S109). In step S109, for example, the control unit 120 first causes the substrate stage moving mechanism 84 to move the substrate stage 83 in the Z-axis negative direction (the direction of the arrow A3) as shown in (c) of FIG. As shown in (d) of 7, the lower surface of the substrate 200 is brought into contact with the backup stage. Next, as shown in (d) of FIG. 7 , the control unit 120 causes the pressure-bonding head moving mechanism 81 to move the pressure-bonding head 80 downward to temporarily pressure-bond the component 220 to the substrate 200 .

After temporarily crimping the component 220 to the substrate 200 in step S109, the control unit 120 causes the crimping head moving mechanism 81 to move the crimping head 80 upward (in the direction of the arrow A4), as shown in FIG. ) to cause the substrate stage moving mechanism 84 to move the substrate stage 83 in the Z-axis positive direction (direction of arrow A5), and to cause the substrate stage moving mechanism 84 to move the substrate stage 83 in the Y-axis negative direction (arrow A6 direction). Further, control unit 120 moves substrate 200 to substrate transfer device 60 in a process downstream of component mounting apparatus 100 (main crimping unit 40 in this embodiment), and returns the process to step S101.

Further, for example, in step S102 or step S106, when the control unit 120 determines that the component 220 is defective (Yes in step S102 or step S106), the component 220 is discarded without being temporarily pressure-bonded to the substrate 200. , the component supply unit 31 and the component stage moving mechanism 91 or the like, or the pressure bonding head 80 and the pressure bonding head moving mechanism 81 or the like are controlled.

Further, for example, in step S104, if the control unit 120 does not determine that the predetermined processing in the process of the device upstream of the component mounting apparatus 100 is completed (No in step S104), the control unit 120 causes the pressure bonding head 80 to receive the component 220. First, the pressure bonding head 80 is made to stand by above the component 220 on the component stage 90 (step S111), and the process returns to step S104. In other words, if the control unit 120 does not determine that the predetermined processing in the process of the device upstream of the component mounting apparatus 100 has been completed, the control unit 120 waits above the component 220 on the component stage 90 without causing the pressure bonding head 80 to receive the component 220 . continue (step S111).

Further, for example, when the controller 120 determines that the substrate 200 is defective in step S108 (Yes in step S108), the substrate on the substrate stage 83 is moved by the substrate stage moving mechanism 84, the substrate transfer device 60, and the like. After correcting the position of the part 200 to a predetermined position (step S112), the component 220 is temporarily pressure-bonded to the substrate 200 by the pressure bonding head 80 and the pressure bonding head moving mechanism 81 (step S109).

In addition, the start of conveyance of the board|substrate 200 from the sticking part 20 may be performed in parallel with step S105 after step S104, when Yes at step S104. That is, step S107 may be executed in parallel with step S105 after step S104 if step S104 is Yes. That is, the steps S101 and S102 and the steps S103 to S109 may be executed in parallel.

Further, step S105 may be executed after the control unit 120 makes a determination of Yes in step S104, for example, may be executed after step S107, or may be executed after the control unit 120 determines No in step S108. or after step S112.

[Effects, etc.]
As described above, the component mounting method according to the embodiment mounts the component 220 on the board 200 that has undergone predetermined processing upstream of the component mounting apparatus 100 in the component mounting line 1 that performs a plurality of processes on the board 200. It is a component mounting method executed by the component mounting apparatus 100 for mounting. The component mounting method according to the embodiment comprises a transporting step of placing the substrate 200 on the substrate stage 83, a receiving step of receiving the component 220 to be mounted on the substrate 200 with a heated head (compression bonding head 80), and a mounting step of attaching the component 220 received by the compression head 80 to the substrate 200 placed on the stage 83 . The receiving process is performed in an upstream process immediately before the component mounting apparatus 100, after the substrate 200 has undergone a predetermined process.

According to this method, even if there is a delay in unloading the board 200 due to a defect or the like in the upstream process immediately before the component mounting apparatus 100, the pressure bonding head 80 receives and holds the component 220. Therefore, heat from the crimping head 80 is less likely to affect the component 220 . Therefore, deformation of the component 220 due to heat from the crimping head 80 is less likely to occur. For example, if the predetermined process is a process that tends to cause a delay, such as a process of attaching the ACF 230 to the board 200, the board 200 is subjected to the predetermined process in an upstream process immediately before the component mounting apparatus 100. If the crimp head 80 receives and holds the part 220 before the is completed, heat is applied to the part 220 with and without delay in the linear process. time is different. Therefore, due to deformation or the like of the component 220 , unevenness in shape occurs for each component 220 , and variation in mounting of the component 220 on the substrate 200 occurs for each component 220 . Therefore, the receiving process in the component mounting method according to the present embodiment is performed in an upstream process immediately before component mounting apparatus 100, after predetermined processing is completed on board 200. FIG. By doing so, the difference in the time of heat application to the component 220 is less likely to occur between when there is a delay in the linear process of the component mounting apparatus 100 and when there is no delay. Therefore, the degree of deformation of the components 220 due to the heat from the crimping head 80 is less likely to vary among the components 220 , and variations in the mounting of the components 220 on the substrate 200 can be suppressed.

Further, for example, in the receiving process in the component mounting method according to the embodiment, a predetermined process is completed in an upstream process immediately before the component mounting apparatus 100, and the substrate 200 is not conveyed from the upstream to the component mounting apparatus 100. Executed after being started.

According to such a method, there is a delay in moving the substrate 200 to the transportation position, for example, before transportation of the substrate 200 to the component mounting apparatus 100 is started after a predetermined process is completed upstream. Even if this occurs, differences in the time during which heat is applied to components 220 for each component 220 mounted on substrate 200 are less likely to occur. As a result, differences in degree of deformation of the components 220 due to heat from the crimping head 80 are less likely to occur among the components 220 , and variations in the mounting of the components 220 on the substrate 200 can be further suppressed.

Also, for example, the receiving process in the component mounting method according to the embodiment is executed after the transporting process is completed.

According to such a method, even if a delay occurs upstream, there is no difference in the time at which heat is applied to the components 220 mounted on the substrate 200 . As a result, differences in degree of deformation of the components 220 due to heat from the crimping head 80 are less likely to occur among the components 220 , and variations in the mounting of the components 220 on the substrate 200 can be further suppressed.

Further, for example, the component mounting method according to the embodiment further includes a board defect detection process for detecting a defect in the board 200 placed on the board stage 83, and the receiving process is the board defect detection process. is not detected.

According to such a method, even if there is a delay due to alignment of the board 200 or the like due to the mounting of the component 220 on the board 200 on which a delay occurs upstream, each component 220 mounted on the board 200 can be There is no difference in the time that heat is applied to component 220 . As a result, differences in degree of deformation of the components 220 due to heat from the crimping head 80 are less likely to occur among the components 220 , and variations in the mounting of the components 220 on the substrate 200 can be further suppressed.

Further, for example, the component mounting method according to the embodiment further includes a component supply step of supplying the component 220 to the component stage 90, a component defect detection step of detecting a defect in the component 220 supplied to the component stage 90, including. In this case, in the receiving process, after the defective component detection process is completed, the pressure bonding head 80 is kept on standby just above the component 220, and in the upstream process immediately before the component mounting apparatus 100, the substrate 200 is subjected to a predetermined process. After that, the component 220 placed on the component stage 90 is received by the crimping head 80 .

According to this method, the pressure bonding head 80 stands by directly above the component 220, so that the pressure bonding head 80 can immediately receive the component 220 when the substrate 200 is completely processed. Therefore, according to such a method, the tact time for mounting the component 220 on the board 200 can be shortened.

Further, the component mounting apparatus 100 according to the present embodiment is a component mounting apparatus that mounts a component 220 on a board 200 that has been subjected to a predetermined process upstream in a component mounting line 1 that performs a plurality of processes on the board 200. . The component mounting apparatus 100 includes a substrate stage 83 on which a substrate 200 is placed, a substrate transfer device 60 that places the substrate 200 on the substrate stage 83, and a component supply unit 31 that supplies components 220 to be mounted on the substrate 200. , a pressure bonding head 80 that receives a component 220 from a component supply unit 31 and attaches it to a substrate 200 placed on a substrate stage 83; The crimping head 80 has a heating mechanism 85 . The control unit 120 determines whether or not a predetermined process has been completed immediately upstream of the component mounting apparatus 100 , and if it is determined that the predetermined process has been completed, the component 220 is supplied to the crimping head 80 from the component supply unit 31 . Control the operation of the crimp head 80 to receive.

According to such a configuration, the difference in the time during which heat is applied to component 220 is less likely to occur between when there is a delay in the process immediately before component mounting apparatus 100 and when there is no delay. Therefore, the degree of deformation of the component 220 due to the heat from the crimping head 80 is less likely to vary from component to component 220 , and variations in the mounting of the component 220 on the substrate 200 can be suppressed.

(Other embodiments)
As described above, the component mounting method and the like according to the present embodiment have been described based on the above embodiment, but the present invention is not limited to the above embodiment.

For example, in the above embodiment, all or part of the components of the computer 110 may be configured with dedicated hardware, or may be realized by executing software programs suitable for each component. good. Each component may be implemented by a program execution unit such as a CPU (Central Processing Unit) or processor reading and executing a software program recorded in a recording medium such as a HDD (Hard Disk Drive) or a semiconductor memory. good.

Also, the components of computer 110 may consist of one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

One or more electronic circuits may include, for example, a semiconductor device, an IC (Integrated Circuit), or an LSI (Large Scale Integration). An IC or LSI may be integrated on one chip or may be integrated on a plurality of chips. Although they are called ICs or LSIs here, they may be called system LSIs, VLSIs (Very Large Scale Integration), or ULSIs (Ultra Large Scale Integration) depending on the degree of integration. An FPGA (Field Programmable Gate Array) that is programmed after the LSI is manufactured can also be used for the same purpose.

In addition, it can be realized by applying various modifications to each embodiment that a person skilled in the art can think of, or by arbitrarily combining the constituent elements and functions of each embodiment without departing from the spirit of the present invention. Forms are also included in the present invention.

INDUSTRIAL APPLICABILITY The component mounting method according to the present invention can be used in a component mounting apparatus that temporarily crimps a component to a substrate, which is included in a component mounting line for producing display panels.

Reference Signs List 1 component mounting line 10 board loading section 11, 21, 41, 51 stage 20 pasting section 22 pasting tool 30 temporary pressure bonding section 31 component supply section 32 detection section 33 board failure detection section 34 component failure detection section 40 final pressure bonding section 42 Crimping tool 50 Substrate unloading unit 60 Substrate transfer device 70 Component standby stage 71 Component standby stage moving mechanism 72 Pickup head 73 Pickup head moving mechanism 74, 75 Camera 76 Camera moving mechanism 80 Crimping head (head)
81 crimping head movement mechanism 83 substrate stage 84 substrate stage movement mechanism 85 heating mechanism 86 backup stage 90 component stage 91 component stage movement mechanism 100 component mounter 110 computer 120 control section 130 storage section 200 substrate 210 electrode section 220 component 230 anisotropy Conductive member (ACF)
A1, A2, A3, A4, A5, A6 Arrows

Claims (5)

A component mounting method executed by a component mounting apparatus that mounts a component on a board that has undergone a predetermined process upstream of the component mounting apparatus in a component mounting line that performs a plurality of processes on the board, the component mounting method comprising:
a carrying step of placing the substrate on a substrate stage;
a receiving step for receiving a component for mounting on the substrate by a heated head;
a mounting step of mounting the component received by the head on the substrate placed on the substrate stage;
a substrate defect detection step of detecting a defect in the substrate placed on the substrate stage ;
The receiving step is executed when no defect in the substrate is detected in the substrate defect detecting step after the predetermined processing is completed on the substrate in the upstream step immediately before the component mounting apparatus. Ru
Component mounting method. A component mounting method executed by a component mounting apparatus that mounts a component on a board that has undergone a predetermined process upstream of the component mounting apparatus in a component mounting line that performs a plurality of processes on the board, the component mounting method comprising:
a carrying step of placing the substrate on a substrate stage;
a receiving step for receiving a component for mounting on the substrate by a heated head;
a mounting step of mounting the component received by the head on the substrate placed on the substrate stage;
a component supply step of supplying the component to a component stage;
a component defect detection step of detecting a defect in the component supplied to the component stage;
the receiving step is performed after the substrate is subjected to the predetermined processing in the upstream step immediately before the component mounting apparatus;
In the receiving step,
after the component defect detection step is completed, causing the head to stand by just above the component;
In the upstream process immediately before the component mounting apparatus, the component placed on the component stage is received by the head after the substrate is subjected to the predetermined processing.
Component mounting method. The receiving step is executed after the predetermined processing is completed in the upstream step immediately before the component mounting apparatus and after the substrate is started to be transported from the upstream to the component mounting apparatus.
The component mounting method according to claim 1 or 2 . the receiving step is performed after the transferring step is completed;
The component mounting method according to claim 1 or 2. A component mounting apparatus that mounts components on a substrate that has been subjected to a predetermined upstream process in a component mounting line that performs a plurality of processes on the board,
a substrate stage on which the substrate is placed;
a substrate transfer device for placing the substrate on the substrate stage;
a component supply unit that supplies components to be mounted on the substrate;
a head that receives the component from the component supply unit and attaches it to the substrate placed on the substrate stage;
a control unit that controls the operation of the head;
with
The head has a heating mechanism,
The control unit
It is determined whether or not the predetermined processing is completed in the upstream immediately before the component mounting apparatus, and when it is determined that the predetermined processing is completed, the head is caused to receive the component from the component supply unit. controlling the movement of the head to
Component mounting equipment.

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