JP7555015B2 - Component crimping device - Google Patents

Description

The present invention relates to a component crimping device and a component crimping method for crimping components onto a substrate.

Conventionally, there is a component bonding device that applies anisotropic conductive film (ACF) as an adhesive member to the end of a substrate, and then presses electronic components such as drive circuits onto the portion of the substrate where the ACF is applied (see, for example, Patent Document 1).

The component mounting device disclosed in Patent Document 1, which is an example of a component bonding device, supports the edge of the board with a lower support (a so-called backup stage) when bonding a component to the board. In addition, in order to recognize the position of the board, the component mounting device disclosed in Patent Document 1 captures an image of the alignment mark on the board from below through a cutout (through-hole) provided in the lower support, and aligns the component when bonding it based on the position of the alignment mark.

JP 2014-045057 A

In the case of a component bonding device that bonds components to multiple types of boards with different sizes and arrangements of alignment marks, depending on the size and arrangement of the alignment marks, the imaging unit may not be able to capture an image of the alignment mark through the above-mentioned through-hole depending on the type of board. Therefore, if the size (opening width) of the through-hole is increased to accommodate multiple alignment marks, the edge of the board (especially the corner when viewed from above) may not be supported by the lower support part. In this case, when the component is bonded to the board, the edge of the board is not properly supported by the lower support part, so the component may not be bonded in the appropriate position, which may result in mounting variations.

The present invention provides a component crimping device that can suppress mounting variations.

A component crimping device according to one aspect of the present invention includes a support section having a support surface that supports a substrate having an alignment mark from the underside of the substrate and a through-hole that penetrates the support surface, an imaging section that images the alignment mark of the substrate supported by the support surface through the through-hole, and a crimping tool that crimps a component onto a crimping target portion of the substrate based on the position of the alignment mark imaged by the imaging section, and the support section is configured to be able to change the opening width of the through-hole.

The component crimping method according to one aspect of the present invention includes a determination step of determining the type of a substrate having an alignment mark, an adjustment step of adjusting the opening width of a through-hole in a lower support part having a support surface that supports the substrate from the underside of the substrate and a through-hole that penetrates the support surface, based on the type determined in the determination step, a support step of supporting the substrate on the support surface, an imaging step of imaging the alignment mark of the substrate supported on the support surface through the through-hole, and a crimping step of crimping a component to a crimping target portion of the substrate based on the position of the alignment mark imaged in the imaging step.

These comprehensive or specific aspects may be realized as a system, method, integrated circuit, computer program, or computer-readable recording medium such as a CD-ROM, or may be realized as any combination of a system, method, integrated circuit, computer program, and recording medium.

The present invention provides a component crimping device that can suppress mounting variations.

FIG. 1 is a schematic configuration diagram of a component mounting line including a component crimping device according to an embodiment. FIG. 2 is a schematic side view showing the component crimping device according to the embodiment. FIG. 3A is a schematic top view illustrating an example of a lower support portion according to an embodiment. FIG. 3B is a schematic top view illustrating another example of the lower support portion according to the embodiment. FIG. 4 is a diagram for explaining the opening width and pitch. FIG. 5 is a schematic exploded perspective view showing a first support member according to the embodiment. FIG. 6 is a schematic perspective view showing a first support member and a second support member according to the embodiment. FIG. 7 is a flowchart showing a processing procedure of the component crimping device according to the embodiment.

The following describes in detail the component crimping device and the like according to the embodiments of the present invention with reference to the drawings. Note that each of the embodiments described below shows a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, the arrangement and connection of the components, steps and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims that show the highest concept of the present invention are described as optional components.

The figures are schematic diagrams and are not necessarily precise illustrations. In each figure, the same components are given the same reference numerals.

In addition, in this specification and the drawings, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional Cartesian coordinate system. The X-axis and Y-axis are mutually orthogonal, and are both orthogonal to the Z-axis. In addition, in the following embodiments, the positive direction of the Z-axis may be described as upward, and the negative direction of the Z-axis may be described as downward.

Also, the alignment marks shown in Figures 3A, 3B, and 6, which will be described below, are hatched for the purpose of explanation, although they do not represent cross sections.

(Embodiment)
[Component mounting line]
First, a component mounting line including a component crimping device according to an embodiment will be described.

Figure 1 is a schematic diagram of a component mounting line 1 including a component crimping device 100 according to an embodiment.

The component mounting line 1 is a component mounting system for producing display panels and the like, and performs multiple processes on a substrate 300 such as a display panel. Specifically, the component mounting line 1 is a system that attaches an anisotropic conductive member, ACF 330, to the substrate 300 on which an electrode section 310 is formed, and thermocompresses the substrate 300 and a component 340 via the ACF 330. The electrode section 310 is, for example, composed of an electrode.

Component 340 is, for example, an electronic component in which a drive circuit and the like are formed, and examples of such components include flexible components such as TCP (Tape Carrier Package) and FPC (Flexible Printed Circuits).

The component bonding device 100 according to this embodiment is one of the devices in a component mounting line 1 that includes multiple devices that perform multiple processes on a substrate 300 such as a display panel. Specifically, the component bonding device 100 is a device that places (more specifically, temporarily bonds) a component 340 on the substrate 300 via an ACF 330.

The component mounting line 1 includes a board loading section 10, a bonding section 20, a component crimping device 100, a main crimping section 40, a board unloading section 50, a board transport device 60, and a computer 150 (see Figure 2).

In FIG. 1, the computer 150 is not shown. The computer 150 is communicatively connected to each device, such as the board loading section 10, the bonding section 20, the component crimping device 100, the main crimping section 40, the board unloading section 50, and the board transport device 60, via control lines or the like, and controls the operation of each device and the timing of the operation.

The board loading section 10 is a device into which boards 300 that have completed a predetermined operation in an upstream facility located upstream of the component mounting line 1 are loaded. The board loading section 10 includes a stage 11.

Stage 11 is a stage on which the substrate 300 transported from the upstream equipment is placed and which holds the substrate 300.

The adhesion unit 20 is a device that adheres the ACF 330 to the electrode portion 310 of the substrate 300. The ACF 330 is a type of adhesive tape, and is a tape-like member made of anisotropic conductive film. The adhesion unit 20 includes a stage 21 and an adhesion tool 22.

The stage 21 is a movable stage on which the substrate 300 removed from the substrate loading section 10 is placed and which holds the placed substrate 300.

The adhesion tool 22 is a device that adheres the ACF 330 to the substrate 300 held on the stage 21. For example, the adhesion unit 20 moves the stage 21 holding the substrate 300 to an adhesion position where the ACF 330 is adhered. Also, for example, the adhesion unit 20 adheres the ACF 330 cut to a predetermined size to the substrate 300 using the adhesion tool 22. The adhesion tool 22 includes, for example, a supply unit that supplies the ACF 330, a cutting unit that cuts the ACF 330 to the predetermined size, and an adhesion head that adheres the ACF 330 to the substrate 300.

The component bonding apparatus 100 is an apparatus that places (temporarily bonds) a component 340 on a substrate 300 via an ACF 330. Specifically, the component bonding apparatus 100 picks up a component 340 placed on a component stage 120 (see FIG. 2), aligns a bonding head 131 (see FIG. 2) based on the position of an alignment mark 320 on the substrate 300, and places the component 340 on the substrate 300 via the ACF 330. Details of the component bonding apparatus 100 will be described later.

The final bonding unit 40 is a device that performs thermocompression bonding (final bonding) of the component 340 that has been temporarily bonded to the substrate 300. Specifically, the final bonding unit 40 performs thermocompression bonding (final bonding) of the component 340 together with the ACF 330 to ensure electrical continuity between the substrate 300 (more specifically, the electrode unit 310) and the component 340. The final bonding unit 40 includes, for example, a stage 41 and a bonding tool 42.

The stage 41 is a movable stage on which the substrate 300 removed from the component crimping device 100 is placed and which holds the placed substrate 300.

The bonding tool 42 is a device that performs thermocompression bonding (main bonding) of the component 340 that has been temporarily bonded to the substrate 300 held on the stage 41. For example, the main bonding unit 40 moves the stage 41 holding the substrate 300 to a main bonding position where the component 340 is attached. Also, for example, the main bonding unit 40 uses the bonding tool 42 to heat and press the component against the substrate 300 via the ACF 330 to perform thermocompression bonding. The bonding tool 42 includes, for example, a bonding head and a heating unit such as a heater that heats the bonding head.

The board unloading section 50 is a device for unloading the board 300 to which the components 340 have been fully compressed by the full compression bonding section 40 to downstream equipment located downstream of the component mounting line 1. The board unloading section 50 includes a stage 51.

The stage 51 is a stage on which the substrate 300 removed from the main pressure bonding section 40 is placed and which holds the placed substrate 300. The substrate 300 held on the stage 51 is removed from the stage 51 by, for example, the substrate transport device 60 and is carried out to downstream equipment on the component mounting line 1.

In the component mounting line 1, the board loading section 10, the bonding section 20, the component crimping device 100, the main crimping section 40, and the board unloading section 50 are connected in this order. The board transport device 60 transports the board 300 that has been processed in each device to the next process. The board transport device 60 includes, for example, a suction nozzle that suctions and holds the board 300, and a motor and guide that move the suction nozzle.

The computer 150 is a control device that controls the operation of each device in the component mounting line 1, including the component crimping device 100. Specifically, the computer 150 is communicatively connected to each device, such as the attachment unit 20, the component crimping device 100, the main crimping unit 40, and the board transport device 60, provided in the component mounting line 1, via a control line (not shown) or the like, and controls the operation of each device and the timing of the operation. For example, the computer 150 controls the attachment unit 20, the component crimping device 100, and the main crimping unit 40 to cause each device to perform the above-mentioned predetermined operations such as attachment, temporary crimping, and main crimping on the board 300, and controls the board transport device 60 to perform a board transport operation that transports the board 300 to the next process between each device provided in the component mounting line 1. The computer 150 transports the board 300 from the upstream side to the downstream side in synchronization with each device provided in the component mounting line 1.

The computer 150 is realized by, for example, a communication interface for communicating with the bonding unit 20, the component crimping device 100, the main crimping unit 40, and the substrate transport device 60, etc., a non-volatile memory in which a program is stored, a volatile memory which is a temporary storage area for executing the program, an input/output port for sending and receiving signals, a processor for executing the program, etc.

[Component crimping device]
Next, the component crimping device 100 will be described in detail.

Figure 2 is a schematic side view showing the component crimping device 100 according to an embodiment. Note that in Figure 2, the computer 150 and the crimping head moving mechanism 132 are shown as functional blocks. The computer 150 is communicatively connected to each device of the component crimping device 100 via a control line or the like (not shown).

The component crimping device 100 is a device that crimps a component 340 to a crimping target portion of a substrate 300 having an alignment mark 320. In this embodiment, the component crimping device 100 pre-cracks the component 340 to a position where the ACF 330 is attached, which is the crimping target portion of the substrate 300 where the ACF 330 is attached by an attachment unit 20 located upstream of the component crimping device 100.

The component crimping device 100 includes a stage 110, a stage moving unit 111, a component stage 120, a crimping tool 130, an imaging unit 140, a computer 150, and a support unit 200.

The stage 110 is a stage on which the substrate 300 is placed. For example, the substrate 300 to which the ACF 330 is attached is transported and placed on the stage 110 by the substrate transport device 60 and placed on the stage 21 of the attachment unit 20. The substrate 300 is placed on the stage 110 with the outer edge of the substrate 300 to which the ACF 330 is attached extending beyond the stage 110 when viewed from above.

The stage moving unit 111 is a driving device that moves the stage 110. The stage moving unit 111 is configured to be able to move the stage 110 in, for example, the X-axis direction, the Y-axis direction, and the Z-axis direction. For example, the stage moving unit 111 moves the stage 110 to a position where the substrate 300 transported from the bonding unit 20 by the substrate transport device 60 can be placed on the stage 110. Also, for example, the stage moving unit 111 moves the substrate 300 to a position where the bonding head 131 can temporarily bond the component 340 to the ACF 330 attached to the substrate 300.

The stage moving unit 111 is, for example, a conveyor that is configured to be able to move the stage 110 arbitrarily in the XY plane and to be able to move up and down in the Z-axis direction.

The component stage 120 is the stage on which the component 340 to be pressure-bonded to the substrate 300 is mounted.

The bonding tool 130 is a device that picks up the component 340 placed on the component stage 120 and bonds it to the substrate 300. Specifically, the component 340 is bonded to the bonding target portion of the substrate 300 based on the position of the alignment mark 320 captured by the imaging unit 140.

The crimping tool 130 includes, for example, a crimping head 131 and a crimping head moving mechanism 132.

The bonding head 131 is a head that picks up the component 340 placed on the component stage 120 and presses the picked-up component 340 onto the substrate 300 via the ACF 330 attached to the substrate 300. The bonding head 131 picks up the component 340, for example, by vacuum suction.

The bonding head 131 also has a heater such as an electric heating wire or a Peltier element, and the heater heats the component 340 held by the bonding head 131 to a predetermined temperature before the component 340 is pre-bonded to the substrate 300. While being heated by the heater, the bonding head 131 presses the component 340 against the substrate 300 while heating the component 340 via the ACF 330 attached to the substrate 300. In this way, the component 340 is pre-bonded to the substrate 300 while the ACF 330 is hardened by the heat generated by the bonding head 131.

The bonding head 131 is realized, for example, by a heating unit such as the heater described above and a suction nozzle capable of suctioning and holding the component 340.

The method of holding the component 340 by the crimping head 131 does not have to be vacuum suction and is not particularly limited.

The bonding head moving mechanism 132 is a device for moving the bonding head 131. For example, the bonding head moving mechanism 132 moves the bonding head 131 to a position where the component 340 placed on the component stage 120 can be picked up. Next, after the bonding head 131 picks up the component 340, the bonding head moving mechanism 132 moves the bonding head 131 based on the position of the alignment mark 320 on the substrate 300, and compresses the component 340 to the bonding target portion of the substrate 300. The position of the alignment mark 320 is recognized by the imaging unit 140 capturing an image of the substrate 300.

The crimping head moving mechanism 132 is realized, for example, by a guide and a motor.

The imaging unit 140 is a camera for identifying the position of the alignment mark 320 on the substrate 300. The imaging unit 140 generates an image including the alignment mark 320 on the substrate 300, for example, by capturing an image of the substrate 300 from the lower side of the substrate 300. For example, the computer 150 identifies the position of the alignment mark 320 by performing image analysis on the image generated by the imaging unit 140, and causes the crimping tool 130 to crimp the component 340 to the crimping target portion of the component 340 on the substrate 300 based on the identified position of the alignment mark 320.

The computer 150 is a device for controlling each device included in the component crimping device 100. Specifically, the computer 150 is communicatively connected to the stage moving unit 111, the crimping tool 130, and the imaging unit 140 via control lines (not shown) and the like, and controls the operation of each device.

The computer 150 may be provided by the component crimping device 100 alone, or may use a computer provided by the component mounting line 1. In this embodiment, the computer 150 also controls devices other than the component crimping device 100 provided by the component mounting line 1. The computer 150 includes a control unit 151 and a memory unit 152.

The control unit 151 is a processing unit that controls the operation of the stage movement unit 111, the crimping tool 130, and the imaging unit 140.

For example, the control unit 151 determines whether the bonding process of the ACF 330 to the substrate 300 is completed in the bonding unit 20, and when it is determined that the process is completed, the control unit 151 controls the substrate transport device 60 to transport the substrate 300 placed on the stage 21 to the stage 110. The control unit 151 also controls the operation of the bonding head 131 and the bonding head moving mechanism 132 so that the bonding head 131 picks up the component 340 from the component stage 120. The control unit 151 also moves the stage moving unit 111 to make the lower support unit 200 support the end of the substrate 300, and makes the imaging unit 140 capture the alignment mark 320 of the substrate 300. The control unit 151 also performs image analysis on the image including the alignment mark 320 generated by the imaging unit 140 to identify the position of the alignment mark 320. In addition, the control unit 151 controls the bonding head moving mechanism 132 based on the position of the identified alignment mark 320 to move the bonding head 131, causing the bonding head 131 to bond the component 340 to the substrate 300.

The control unit 151 is realized, for example, by a control program stored in the memory unit 152 for controlling the component crimping device 100 and each device of the component mounting line 1, and a CPU (Central Processing Unit) that executes the control program.

The memory unit 152 is a storage device that stores various data necessary for the component crimping operation, such as the size of the substrate 300, the type of component 340 to be mounted on the substrate 300, the mounting position, the mounting direction, the operation of each device, the timing of the operation, the timing of transporting the substrate 300 between each device, and the control program executed by the control unit 151.

The storage unit 152 is realized by a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory).

The lower support unit 200 is a so-called backup stage that supports the substrate 300 having the alignment mark 320 from the underside of the substrate 300. Specifically, the lower support unit 200 supports the component crimping portion, which is the portion of the substrate 300 that is crimped when the crimping head 131 crimps the component 340 onto the substrate 300, from the back side (lower side) of the substrate 300, that is, the outer edge of the substrate 300 to which the ACF 330 is attached and that protrudes from the stage 110 when viewed from above.

[Lower support part]
Next, the configuration of the lower support part 200 will be described in detail.

Figure 3A is a schematic top view showing an example of the support part 200 according to the embodiment. In Figure 3A, the substrate 300 is shown with a dashed line, and components that overlap the substrate 300 in a top view and are located below the substrate 300 are shown with a solid line.

The lower support portion 200 has a main body portion 210, a screw 211, a first support member 220, a second support member 230, a through portion 240, a gap portion 250, and support surfaces 260 to 263.

The main body 210 is a support for supporting the first support member 220 and the second support member 230. The first support member 220 and the second support member 230 are each slidably supported on the main body 210 by screws 211. In this embodiment, the first support member 220 and the second support member 230 are each slidable in the X-axis direction.

The first support member 220 and the second support member 230 are each slidably mounted on the main body 210 and support the substrate 300 from the underside of the substrate 300. The first support member 220 and the second support member 230 are arranged side by side in the sliding direction (the X-axis direction in this embodiment). The first support member 220 and the second support member 230 are also arranged apart by a gap 250. In this embodiment, the first support member 220 and the second support member 230 are structured to be symmetrical about the Y-axis when viewed from above.

The through-hole 240 is a through-hole for imaging the alignment mark 320 of the substrate 300 from below. In this embodiment, the through-hole 240 is provided in both the first support member 220 and the second support member 230. Specifically, the through-hole 240 is provided in the lower support part 200 so as to penetrate the support surfaces 260 to 263 described below. The imaging unit 140 images the alignment mark 320 of the substrate 300 supported by the support surfaces 260 to 263 through the through-hole 240.

The through-holes 240 include a first through-hole 241 and a second through-hole 242 that each penetrate the support surface and are spaced apart from each other. Specifically, for example, the first support member 220 has the first through-hole 241, and the second support member 230 has the second through-hole 242. More specifically, the first through-hole 241 is provided in the first support member 220 so as to penetrate between the support surfaces 260 and 261. The second through-hole 242 is provided in the second support member 230 so as to penetrate between the support surfaces 262 and 263.

The gap portion 250 is a portion that is formed by the first support member 220 and the second support member 230 and is located between the first support member 220 and the second support member 230.

As shown in FIG. 3A, for example, an alignment mark 320 is provided near a corner of a rectangular substrate 300 when viewed from above. The through-hole 240 is disposed at a position overlapping the alignment mark 320 when viewed from above. The imaging unit 140 is disposed at a position overlapping the alignment mark 320 and the through-hole 240 when viewed from above. This allows the imaging unit 140 to image the alignment mark 320 through (passing) the through-hole 240.

Figure 3B is a schematic top view showing another example of the lower support part 200 according to the embodiment.

Here, it is assumed that the component 340 is pressure-bonded to the substrate 301, which is different from the substrate 300. For example, it is assumed that the substrate 301 is different in size from the substrate 300, and the alignment mark 320 is provided at a different position from the substrate 300. In this case, if the through-hole 240 is located at the position shown in FIG. 3A, the imaging unit 140 cannot image the alignment mark 320 through the through-hole 240. Therefore, for example, the worker can change the opening width of the through-hole 240 and the pitch (width of the gap 250) of the first support member 220 and the second support member 230 by sliding the first support member 220 and the second support member 230, so that the alignment mark 320 can be imaged by the imaging unit 140 through the through-hole 240. In other words, the lower support unit 200 is configured to be able to change the opening widths W1 and W2 of the through-hole 240, which will be described later. Specifically, the lower support portion 200 is configured to be able to change the opening widths W1, W2 of the first through portion 241 and the second through portion 242. More specifically, the lower support portion 200 is configured to be able to change the opening width W1 of the first through portion 241 and the opening width W2 of the second through portion 242 independently. Furthermore, the lower support portion 200 is configured to be able to change, for example, the interval (pitch W3) between the first through portion 241 and the second through portion 242.

Figure 4 is a schematic top view of the lower support portion 200 to explain the opening widths W1, W2, and pitch W3.

As shown in FIG. 4, the first support member 220 has a first support 221 and a second support 222 configured to be slidable relative to the first support 221. The second support 222 is configured to be slidable relative to the first support 221, which makes it possible to change the opening width of the lower support 200. Specifically, the second support 222 is configured to be slidable relative to the first support 221, which makes it possible to change the opening width W1 of the first penetration portion 241 included in the penetration portion 240.

The first support 221 is placed on the upper surface of the main body 210 and is configured to be slidable relative to the main body 210. The second support 222 is placed on the upper surface of the first support 221 and is configured to be slidable relative to the first support 221.

The screw 211 supports the first support 221 and the second support 222 on the main body 210 so that they can slide. Specifically, the first support 221 and the second support 222 each have a through hole 290 at a position where they at least partially overlap when viewed from above. The through hole 290 extends in the direction in which the first support 221 and the second support 222 slide (the X-axis direction in this embodiment). The screw 211 is disposed in the through hole 290. This allows the first support 221 and the second support 222 to slide independently of each other.

Figure 5 is a schematic exploded perspective view showing the first support member 220 according to the embodiment.

For example, the through hole 290 has a first through hole 291 and a second through hole 292.

The first through hole 291 is a through hole provided in the first support 221.

The second through hole 292 is a through hole provided in the second support 222.

The first through hole 291 and the second through hole 292 are arranged in positions where they at least partially overlap when viewed from above. Furthermore, the screw 211 is arranged in the first through hole 291 and the second through hole 292. This allows the first support 221 and the second support 222 to slide independently of each other.

Referring again to FIG. 4, the first penetration portion 241 is provided between the first support 221 and the second support 222 when viewed from above. In other words, the first penetration portion 241 is a space portion between the first support 221 and the second support 222, which is formed by the first support 221 and the second support 222. Therefore, the opening width W1 of the first penetration portion 241 can be changed by sliding the first support 221 and the second support 222.

Similarly, the second support member 230 has a first support 231 and a second support 232 configured to be slidable relative to the first support 231. The second support 232 is configured to be slidable relative to the first support 231, so that the opening width of the lower support 200 can be changed. Specifically, the second support 232 is configured to be slidable relative to the first support 231, so that the opening width W2 of the second penetration portion 242 included in the penetration portion 240 can be changed.

The first support 231 is placed on the upper surface of the main body 210. The second support 232 is placed on the upper surface of the first support 231. The screw 211 supports the first support 231 and the second support 232 to the main body 210 so that they can slide. Specifically, the first support 231 and the second support 232 each have a through hole 290 at a position where they at least partially overlap when viewed from above. The through hole 290 extends in the direction in which the first support 231 and the second support 232 slide (in the present embodiment, the X-axis direction). The screw 211 is disposed in the through hole 290, and as a result, the first support 231 and the second support 232 can slide independently of each other.

The second through-hole 242 is provided between the first support 231 and the second support 232 when viewed from above. In other words, the second through-hole 242 is a space between the first support 231 and the second support 232, which is formed by the first support 231 and the second support 232. Therefore, the opening width W2 of the second through-hole 242 can be changed by sliding the first support 231 and the second support 232.

In addition, the first support member 220 and the second support member 230 are slidable, so that the pitch W3 can be changed.

This allows the lower support portion 200 to have appropriate opening widths W1, W2, and pitch W3 regardless of the position, shape, etc. of the alignment mark 320.

Figure 6 is a schematic perspective view showing the first support member 220 and the second support member 230 according to the embodiment.

The lower support portion 200 has support surfaces 260-263 that support the substrate 300 having the alignment mark 320 from the underside of the substrate 300.

For example, the first support 221 and the second support 222 each have a support surface 260, 261 that supports the substrate 300. Specifically, the first support 221 has a support surface 260, and the second support 222 has a support surface 261.

The first support 221 has a first protrusion 270 that protrudes upward. The upper surface of the first protrusion 270 forms the support surface 260.

The second support 222 also has a second protruding portion 280 that protrudes upward. The upper surface of the second protruding portion 280 serves as the support surface 261.

In addition, support surface 260 and support surface 261 are flush with each other.

Similarly, the first support 231 and the second support 232 each have a support surface 262, 263 that supports the substrate 300.

Specifically, the first support 231 has a first protruding portion 271 that protrudes upward. The upper surface of the first protruding portion 271 serves as the support surface 262.

In addition, the second support 232 has a second protruding portion 281 that protrudes upward. The upper surface of the second protruding portion 281 serves as the support surface 263.

The first protrusion 270 and the second protrusion 280 are arranged side by side in the direction in which the first support 221 and the second support 222 slide. The support surface 262 and the support surface 263 are flush with each other. More specifically, the support surface 260, the support surface 261, the support surface 262, and the support surface 263 are flush with each other.

[Processing Procedure]
Next, a process procedure of the component crimping device 100 according to the embodiment will be described in detail.

Figure 7 is a flowchart showing the processing steps of the component crimping device 100 according to the embodiment.

First, the type of substrate 300 having the alignment mark 320 is determined (step S101). The type here means the type of substrate 300 that is predetermined for each position of the alignment mark 320.

Next, the pitch W3 is adjusted according to the determined type of the substrate 300 (step S102). Specifically, the pitch W3 of the gap 250 in the lower support portion 200 is adjusted based on the type of the substrate 300 determined in step S101.

Next, the opening widths W1 and W2 are adjusted according to the type of the substrate 300 determined (step S103). Specifically, the opening widths W1 and W2 of the penetration portion 240 in the lower support portion 200 are adjusted based on the type of the substrate 300 determined in step S101.

The order in which steps S102 and S103 are performed may be reversed, and is not particularly limited.

Steps S101 to S103 may be performed by an operator or by the control unit 151. For example, the component crimping device 100 may include an identification unit for identifying the type of the substrate 300, and an adjustment unit for adjusting the opening widths W1, W2, and pitch W3 based on the identification result by the identification unit. For example, the identification unit is a camera that generates an image by capturing an image of the substrate 300. For example, the adjustment unit is a motor that slides the first support member 220 and the second support member 230. For example, the control unit 151 may cause the identification unit to capture an image of the substrate 300 placed on the stage 110 and generate an image, analyze the generated image to identify the type of the substrate 300, and have the adjustment unit adjust the opening widths W1, W2, and pitch W3 based on the identified type.

Next, the control unit 151 starts the process of pressing the component 340 onto the substrate 300.

Specifically, the substrate 300 loaded into the substrate loading section 10 is transported to the attachment section 20 by controlling the substrate transport device 60, and the attachment section 20 is controlled to attach the ACF 330 to the electrode section 310 of the substrate 300 (step S104).

Next, the control unit 151 controls the substrate transport device 60 to transport the substrate 300 with the ACF 330 attached to it to the component crimping device 100, and supports the substrate 300 from its underside on the support surfaces 260-263 of the support unit 200 (step S105).

Next, the control unit 151 causes the imaging unit 140 to capture an image of the alignment mark 320 of the substrate 300 supported by the support unit 200 through the through-hole 240 (step S106).

Next, the control unit 151 presses the component 340 onto the crimping target portion based on the position of the alignment mark 320 captured by the imaging unit 140 (step S107). Specifically, the control unit 151 identifies the position of the alignment mark 320 by performing image analysis on the image captured by the imaging unit 140, and controls the crimping tool 130 based on the identified position of the alignment mark 320 to crimp the component 340 onto the crimping target portion on the substrate 300. In this embodiment, the crimping target portion is the position on the substrate 300 where the ACF 330 is affixed.

Next, the control unit 151 controls the substrate transport device 60 to transport the substrate 300 with the component 340 bonded thereto to the full bonding unit 40, and performs full bonding between the component 340 bonded to the substrate 300 and the substrate 300 (step S108).

[Effects, etc.]
As described above, the component crimping device 100 according to the embodiment includes a lower support unit 200 having support surfaces 260-263 that support a substrate 300 having an alignment mark 320 from the lower surface side of the substrate 300, and a through-hole 240 that penetrates the support surfaces 260-263, an imaging unit 140 that images the alignment mark 320 of the substrate 300 supported by the support surfaces 260-263 through the through-hole 240, and a crimping tool 130 that crimps the component 340 to a crimping target portion of the substrate 300 based on the position of the alignment mark 320 imaged by the imaging unit 140. The lower support unit 200 is configured to be able to change the opening widths W1 and W2 of the through-hole 240.

By adjusting the opening widths W1 and W2, even in the case of the component bonding device 100 bonding components 340 to multiple types of substrates 300 having different sizes of alignment marks 320, it is possible to prevent the end of the substrate 300 (particularly the corners when viewed from above) from being unsupported by the lower support portion 200. Therefore, the component bonding device 100 can prevent mounting variations in which the bonding position of the component 340 deviates from the desired position.

For example, the through-hole 240 includes a first through-hole 241 and a second through-hole 242 that each penetrate the support surface and are spaced apart from each other. In this embodiment, the first through-hole 241 is provided to penetrate the support surface 260 and the support surface 261. In this embodiment, the second through-hole 242 is provided to penetrate the support surface 262 and the support surface 263. In this case, for example, the lower support portion 200 is configured to be able to change the opening widths W1 and W2 of the first through-hole 241 and the second through-hole 242. Specifically, the lower support portion 200 is configured to be able to change the opening width W1 of the first through-hole 241 and the opening width W2 of the second through-hole 242 independently.

In many cases, the substrate 300 has multiple alignment marks 320, for example, at two corners of the edge that is supported by the support part 200 when viewed from above. Therefore, with this configuration, even in a substrate having multiple alignment marks 320, each of the multiple alignment marks 320 can be imaged by the imaging part 140 from below the substrate 300 through the through part 240.

For example, the lower support portion 200 is configured to be able to change the distance (pitch W3) between the first through portion 241 and the second through portion 242.

This allows the support portion 200 to support the substrate 300 in a more appropriate position.

For example, the lower support portion 200 includes a main body portion 210, and a first support member 220 and a second support member 230 that are slidably provided on the main body portion 210. For example, the first support member 220 has a first penetration portion 241, and the second support member 230 has a second penetration portion 242.

This allows the opening widths W1, W2 and pitch W3 to be easily adjusted by sliding the first support member 220 and the second support member 230 separately.

For example, the first support member 220 has a first support 221 and a second support 222 that is configured to be slidable relative to the first support 221, thereby making it possible to change the opening width of the through-hole 240 of the lower support 200 (more specifically, the opening width W1 of the first through-hole 241 included in the through-hole 240). For example, the first support 221 and the second support 222 have support surfaces 260 and 261, respectively. Specifically, the first support 221 has the support surface 260, and the second support 222 has the support surface 261. For example, the first through-hole 241 is provided between the first support 221 and the second support 222.

This allows the opening width W1 to be easily adjusted by sliding the first support 221 and the second support 222.

For example, the component crimping device 100 further includes a screw 211 that slidably supports the first support 221 and the second support 222 on the main body 210. For example, the first support 221 is placed on the upper surface of the main body 210, and the second support 222 is placed on the upper surface of the first support 221. For example, the first support 221 and the second support 222 each have a through hole 290 at a position where they at least partially overlap when viewed from above. For example, the through hole 290 extends in the direction in which the first support 221 and the second support 222 slide, and the screw 211 is disposed in the through hole 290.

This allows the first support 221 and the second support 222 to slide in a simple configuration.

For example, the first support 221 has a first protruding portion 270 that protrudes upward, and the second support 222 has a second protruding portion 280 that protrudes upward. For example, the first protruding portion 270 and the second protruding portion 280 are arranged side by side in the direction in which the first support 221 and the second support 222 slide. For example, the upper surface (support surface 260) of the first protruding portion 270 and the upper surface (support surface 261) of the second protruding portion are support surfaces that support the substrate 300, and are flush with each other.

This allows a configuration to be realized in which the substrate 300 can be appropriately supported and the opening width W1 can be easily adjusted, even if the first support 221 and the second support 222 are separate members.

In addition, the component bonding method according to the embodiment includes a determination step (step S101) of determining the type of substrate 300 having alignment mark 320, and an adjustment step (step S102) of adjusting the opening widths W1 and W2 of through-portion 240 in under-receiving portion 200 having support surfaces 260 to 263 that support substrate 300 from the underside of substrate 300 and through-portion 240 that penetrates through support surfaces 260 to 263, based on the type of substrate 300 determined in the determination step. 03), a supporting step (step S105) of supporting the substrate 300 on the supporting surfaces 260 to 263, an imaging step (step S106) of imaging the alignment mark 320 of the substrate 300 supported on the supporting surfaces 260 to 263 through the through-hole 240, and a crimping step (step S107) of crimping the component 340 to the crimping target portion of the substrate 300 based on the position of the alignment mark 320 imaged in the imaging step.

This provides the same effect as the component crimping device 100.

(Other embodiments)
Although the component crimping device and the like according to the present embodiment have been described above based on the above embodiment, the present invention is not limited to the above embodiment.

For example, the substrate 300 is light-transmitting and has an alignment mark 320 on its upper surface. This allows the alignment mark 320 to be imaged even if the imaging unit 140 captures an image from below the substrate 300. Of course, the substrate 300 may have the alignment mark 320 on its lower surface. In this case, the substrate 300 may or may not be light-transmitting.

Also, for example, in the above embodiment, all or some of the components of computer 150 may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a HDD (Hard Disk Drive) or a semiconductor memory.

Furthermore, the components of computer 150 may be composed of one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

The one or more electronic circuits may include, for example, a semiconductor device, an integrated circuit (IC), or a large scale integration (LSI). The IC or LSI may be integrated into one chip or into multiple chips. Here, we refer to it as an IC or an LSI, but depending on the degree of integration, it may be called a system LSI, a very large scale integration (VLSI), or an ultra large scale integration (ULSI). Also, a field programmable gate array (FPGA) that is programmed after the LSI is manufactured can be used for the same purpose.

In addition, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art may conceive, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope of the spirit of the present invention.

The present invention can be used in component bonding devices that temporarily bond components to substrates, such as those found on component mounting lines that produce display panels.

REFERENCE SIGNS LIST 1 Component mounting line 10 Substrate loading section 11, 21, 41, 51, 110 Stage 20 Bonding section 22 Bonding tool 40 Main bonding section 42, 130 Bonding tool 50 Substrate unloading section 60 Substrate transport device 100 Component bonding device 111 Stage moving section 120 Component stage 131 Bonding head 132 Bonding head moving mechanism 140 Imaging section 150 Computer 151 Control section 152 Memory section 200 Under-support section 210 Main body section 211 Screw 220 First support member 221, 231 First support 222, 232 Second support 230 Second support member 240 Penetration section 241 First penetration section 242 Second penetration section 250 Gap section 260, 261, 262, 263 Support surface 270, 271 First protrusion 280, 281 Second protrusion 290 Through hole 291 First through hole 292 Second through hole 300, 301 Substrate 310 Electrode portion 320 Alignment mark 330 ACF
340 Part W1, W2 Opening width W3 Pitch

Claims (5)

a lower support portion having a support surface that supports a substrate having an alignment mark from a lower surface side of the substrate and a through portion that penetrates the support surface;
an imaging unit that images the alignment mark of the substrate supported by the support surface through the through-hole;
a bonding tool that bond a component to a bonding target portion of the substrate based on the position of the alignment mark imaged by the imaging unit,
The through-holes include a first through-hole and a second through-hole, each of which passes through the support surface and is spaced apart from each other;
The lower support portion includes a main body portion, and a first support member and a second support member slidably provided on the main body portion,
The first support member has the first penetrating portion,
The second support member has the second penetrating portion,
The lower receiving portion is configured to be able to change the opening widths of the first through portion and the second through portion.
Component crimping device. The lower receiving portion is configured to be able to change the interval between the first through portion and the second through portion.
The component crimping device according to claim 1 . The first support member has a first support and a second support configured to be slidable relative to the first support, thereby making the opening width changeable,
the first support and the second support each have a support surface;
The first penetrating portion is provided between the first support and the second support.
3. The component crimping device according to claim 1 or 2 . a screw for slidably supporting the first support and the second support on a main body portion,
The first support is placed on an upper surface of the main body,
the second support is placed on an upper surface of the first support,
the first support and the second support are each provided with a through hole at a position where they at least partially overlap when viewed from above,
the through hole extends in a direction in which the first support and the second support slide,
The screw is disposed in the through hole.
The component crimping device according to claim 3 . The first support has a first protruding portion that protrudes upward,
The second support has a second protruding portion that protrudes upward,
the first protrusion and the second protrusion are arranged side by side in a direction in which the first support and the second support slide,
The upper surface of the first protrusion and the upper surface of the second protrusion are the support surface and are flush with each other.
5. The component crimping device according to claim 3 or 4 .

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