JP7300842B2 - Cleaning method of the object to be cleaned - Google Patents

Description

The present invention relates to a method for cleaning an object to be cleaned.

Cutting equipment that cuts package substrates called CSP (Chip Size Package) substrates and QFN (Quad Flat Non-leaded Package) substrates is subject to cutting waste, including offcuts, and cutting water that is supplied during cutting. A scrap processing device for processing is provided. This offcut processing apparatus is equipped with groove-shaped receiving and conveying members on both sides of a chuck table that supports a package substrate during cutting, and a cleaning nozzle (offcut nozzle) for flowing washing water to the bottom of the receiving and conveying member. is provided. Scattered cutting waste and cutting water are received by a receiving and conveying member, washed away by washing water, and flowed down to the end (downstream side of processing feed), and the endless belt and slope-shaped guide plate, which are scrap material conveying means, are used. It is collected by dropping it into a storage container through a hole (see, for example, Patent Literature 1).

JP 2015-5544 A

In order to reliably wash away cutting waste and cutting water, it is required to supply cleaning water (cleaning liquid) with a strong momentum to a wide area of the bottom portion of the receiving and conveying member. Conventional washing nozzles have restrictions on the injection direction, and in order to widen the injection range of washing water, it is necessary to arrange a large number of washing nozzles side by side or to provide a mechanism to change the injection direction of the washing nozzles. there were. In addition, it is necessary to install a powerful pump or the like in order to forcefully jet the washing water. Such a configuration causes an increase in cost and an increase in maintenance burden due to an increase in the number of parts and a complicated mechanism.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for cleaning an object to be cleaned, which has a simple structure and is capable of vigorously ejecting a cleaning liquid.

In order to solve the above-described problems and achieve the object, the present invention supplies a cleaning liquid to a cleaning nozzle when a cutting operation for cutting a workpiece of a cutting device is started, and cleans the workpiece. a washing liquid supplying step of reducing the frictional resistance of the mill ends by causing water to remain around the mill ends produced by cutting; and a cleaning liquid jetting step of jetting the cleaning liquid onto the scrap material, wherein the cleaning liquid jetting step is intermittently performed at timing when a predetermined amount of the cleaning liquid accumulates in the cleaning nozzle.

Further, in the present invention, the cleaning nozzle is fixed to a water case having an opening inside which a chuck table holding the workpiece is arranged.
Further, in the present invention, the cleaning nozzle includes a cutting waste guide plate adjacent to a water case having an opening for arranging a chuck table holding the workpiece inside, and a cutting waste guide plate at the lower end of the cutting waste guide plate. It is fixed to the upper end portion of the cutting waste guide plate of the end material processing device comprising a continuous cutting waste collecting box.

According to the present invention, since air is intermittently supplied to the position where water is pushed out at the timing when water accumulates in the washing nozzle, water can be vigorously supplied, and scraps can be removed, for example.

FIG. 1 is a perspective view showing a part of a cutting device equipped with a cleaning nozzle according to this embodiment. FIG. 2 is a side view of a portion of the cutting device viewed from the downstream side in the feed direction. FIG. 3 is a schematic diagram showing the configuration of the cleaning unit.

A form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in configuration can be made without departing from the gist of the present invention.

A cleaning nozzle according to this embodiment will be described with reference to the drawings. FIG. 1 is a perspective view showing a part of a cutting device equipped with a cleaning nozzle according to this embodiment. FIG. 2 is a side view of a portion of the cutting device viewed from the downstream side in the feed direction.

The cutting apparatus 10 shown in FIG. 1 has a function of processing offcuts and chips (objects to be cleaned) produced by cutting a package substrate and cutting water supplied during cutting. Since the configuration of the cutting device 10 other than the portions related to the treatment of scraps, chips, and cutting water is well known, the illustration thereof will be partially omitted for a brief description.

The cutting apparatus 10 cuts a package substrate 100 such as a CSP substrate or a QFN substrate shown in FIG. 1 as a workpiece. On the surface of the package substrate 100, a plurality of regions partitioned by cutting lines 102 provided in a grid pattern are formed, and a device 103 is formed in each region. Two device portions 104 each having a plurality of devices 103 formed thereon are formed on the package substrate 100 , and redundant connecting members 105 are formed outside the device portions 104 . This surplus connecting member 105 is cut off in advance before dividing the device section 104 into the individual devices 103 to generate offcuts.

The cutting device 10 has a first chuck table 11 and a second chuck table 12, and while moving the chuck tables 11 and 12 in the X-axis direction (processing feed direction), jigs 11A of the chuck tables 11 and 12 are moved. , 11B is cut. In the X-axis direction, the direction in which the chuck tables 11 and 12 move during cutting is the downstream side, and the opposite direction is the upstream side. A processing feed means (not shown) for moving the first chuck table 11 and the second chuck table 12 in the X-axis direction is composed of a ball screw mechanism or the like having a ball screw rotated by a motor. Each chuck table 11, 12 is rotatably supported about an axis directed in the Z-axis direction (vertical direction). The jigs 11A and 11B are fixed to the upper surfaces of the chuck tables 11 and 12, respectively, and have a plurality of suction ports corresponding to the individual devices 103 on the package substrate 100. FIG.

A first cutting means (not shown) and a second cutting means (not shown) are provided in the vicinity of the first chuck table 11 and the second chuck table 12 . Each cutting means comprises a cutting blade (not shown) mounted on a spindle rotatable about an axis oriented in the Y direction (index feed direction) perpendicular to the X direction. It is movable in the Z-axis direction (vertical direction).

By rotating the cutting blade of the first cutting means to cut into the package substrate 100 on the jig 11A of the first chuck table 11, the first chuck table 11 is moved downstream in the X-axis direction. The package substrate 100 on the jig 11A can be cut along predetermined cutting lines 102 . Similarly, while rotating the cutting blade of the second cutting means to cut into the package substrate 100 on the jig 12A of the second chuck table 12, the second chuck table 12 is moved downstream in the X-axis direction. Thus, the package substrate 100 on the jig 12A can be cut along a predetermined cutting line 102. FIG.

When the package substrate 100 on the jig 11A of the first chuck table 11 is completely cut along one planned cutting line 102, the cutting blade is lifted upward to move the first chuck table 11 upstream in the X-axis direction. At the same time, the first cutting means are moved (indexed) in the Y-axis direction. Then, cutting along the next scheduled cutting line 102 is executed. After completion of cutting along the plurality of planned cutting lines 102 arranged in the Y-axis direction, the first chuck table 11 is rotated by 90 degrees, and the same procedure as described above is performed for another plurality of planned cutting lines 102 arranged in the Y-axis direction. do the cutting. In this manner, the package substrate 100 can be cut along the grid-like cutting lines 102 . Similarly, the package substrate 100 on the second chuck table 12 can also be cut along the grid-shaped planned cutting lines 102 .

A cutting water injection nozzle (not shown) for injecting cutting water sent from a cutting water supply source (not shown) is provided in the vicinity of each of the first cutting means and the second cutting means. When the package substrate 100 is cut by each cutting means, cutting water is supplied around the cutting blade from the cutting water injection nozzle. The cutting water cools the cut portion and washes away the chips generated during cutting.

The first chuck table 11 and the second chuck table 12 are arranged in an opening formed on a water case (also called a receiving conveying member) 13 . The opening is surrounded by a bottom portion 15 forming the upper surface of the water case 13 and a pair of side walls 16 and 17 and an end wall 18 projecting upward from the bottom portion 15 . The side wall 16 and the side wall 17 are walls separated in the Y-axis direction and extending in the X-axis direction. The end wall 18 is a wall portion located on the upstream side in the X-axis direction and extending in the Y-axis direction. A first moving plate 19 that moves in the X-axis direction together with the first chuck table 11 and a second moving plate 20 that moves in the X-axis direction together with the second chuck table 12 are provided in the opening. A bellows cover 21 is provided on the upstream side of the first moving plate 19 in the X-axis direction, and a bellows cover 22 is provided on the upstream side of the second moving plate 20 in the X-axis direction.

A processing feed means for moving the first chuck table 11 and the second chuck table 12 in the X-axis direction is covered by the water case 13, the first moving plate 19, the second moving plate 20, the bellows cover 21, the bellows cover 22, and the like. It is placed in a waterproof space (not shown).

Further, in the opening, a first cover 23 and a second cover 24 are provided on the downstream side of the first moving plate 19 and the second moving plate 20 in the X-axis direction for discharging offcuts, chips, and cutting water. It is The first cover 23 includes a pair of inclined surfaces 25 gradually lowered toward the center in the Y-axis direction, and a pair of inclined surfaces 25 located between the pair of inclined surfaces 25 in the Y-axis direction and gradually lowered from the upstream side to the downstream side. and a central sloping surface 26 . Similarly to the first cover 23, the second cover 24 has a pair of inclined surfaces 27 that gradually lower toward the center in the Y-axis direction, and a pair of inclined surfaces 27 positioned upstream in the Y-axis direction between the pair of inclined surfaces 27. It has a central inclined surface 28 that gradually lowers from the side to the downstream side.

A standing wall portion 29 protruding upward is provided on the peripheral edge of the first moving plate 19 , and a standing wall portion 30 protruding upward is provided on the peripheral edge of the second moving plate 20 . The vertical wall portion 29 has an opening communicating with the central inclined surface 26 side of the first cover 23 , and the vertical wall portion 30 has an opening communicating with the central inclined surface 28 side of the second cover 24 . When cutting the package substrate 100 on the first chuck table 11 , cutting water containing scraps and chips flows from above the first moving plate 19 onto the first cover 23 . When cutting the package substrate 100 on the second chuck table 12 , cutting water containing scraps and chips flows from above the second moving plate 20 onto the second cover 24 .

As shown in FIG. 2, inside each of the first cover 23 and the second cover 24, there are sliding portions 23A that are slidable with respect to rails 31 and 32 laid on the bottom portion 15 of the water case 13. 24A is formed. The first cover 23 and the second cover 24 are guided by rails 31 and 32 and sliding portions 23A and 24A so as to be movable in the X-axis direction. As shown in FIG. 1, the upstream end of the first cover 23 is connected to the first moving plate 19, and the first cover 23 moves in the X-axis direction together with the first chuck table 11 and the first moving plate 19. . The upstream end of the second cover 24 is connected to the second moving plate 20, and the second cover 24 moves in the X-axis direction together with the second chuck table 12 and the second moving plate 20. As shown in FIG. The downstream ends of the first cover 23 and the second cover 24 are free ends that are not fixed to the water case 13 or the like.

When the package substrate 100 is cut on the first chuck table 11 or the second chuck table 12, excess connecting members 105 of the package substrate 100 are generated as offcuts. This type of offcuts is much larger in size and weight (eg, several centimeters in size) than fine shavings (eg, several micrometers in size) generated by cutting general silicon wafers and the like. Therefore, the cutting device 10 is provided with a scrap processing device 50 for reliably discharging the scrap. The offcut processing device 50 will be described below.

The 1st cover 23 and the 2nd cover 24 are respectively provided with an inclined surface 25, a central inclined surface 26, and a central inclined surface 26 to remove scraps (cutting chips) and cutting water flowing from the first moving plate 19 and the second moving plate 20 on the upstream side. It is guided downstream through the slanted surface 27 and the central slanted surface 28 and flows out from the free end. Furthermore, brushes may be provided at the free ends of the first cover 23 and the second cover 24 . The brush can sweep off the scraps and chips that have fallen to the bottom 15 to the downstream side.

As shown in FIG. 2, the scrap processing device 50 is provided with a cutting waste guide plate 51 adjacent to the water case 13 downstream of the free ends of the first cover 23 and the second cover 24 in the X-axis direction. ing. The chip guide plate 51 is a slope portion that changes its height in the Z-axis direction as it progresses in the Y-axis direction, and is inclined so as to gradually decrease from the first cover 23 side to the second cover 24 side. A vertically movable cutting waste collection box 52 is provided at a position continuous with the lower end of the cutting waste guide plate 51 , and the cutting waste collection box 52 is mounted inside a box mounting portion 53 . The cutting waste collecting box 52 has a mesh portion 52A formed at least in a mesh shape at the bottom, and can collect scraps and relatively large cutting wastes that are caught without passing through the mesh portion 52A. Cutting water that has passed through the mesh portion 52A of the cutting waste collection box 52 is discharged to the outside.

End materials (cutting chips) generated by cutting and cutting water supplied during cutting are received by the standing wall portion 29 and the standing wall portion 30, guided by the first cover 23 and the second cover 24, and sent to the downstream side in the X-axis direction. , and flows out from the free ends of the first cover 23 and the second cover 24 toward the chip guide plate 51 . However, scraps (cutting waste) and cutting water not only flow downstream through the first cover 23 and the second cover 24, but also are scattered around by the cutting blades rotating at high speed. The side areas of the chuck tables 11 and 12 and the covers 23 and 24 also fall onto the bottom portion 15 . For this reason, the offcut processing apparatus 50 jets cleaning water (cleaning liquid) toward the offcuts (objects to be cleaned) scattered in the side regions of the chuck tables 11 and 12 and the covers 23 and 24. A cleaning unit 40 is provided for flushing the scraps downstream. In this embodiment, the first lateral region 15A between the first chuck table 11 and the first cover 23 and the side wall 16, the first chuck table 11 and the first cover 23 and the second chuck table 12 and the second cover 24 and a third lateral region 15C between the second chuck table 12 and the second cover 24 and the side wall 17, respectively. Also, the cleaning unit 40 may be provided at the upper end portion of the cutting waste guide plate 51 . The cleaning unit 40 pushes away the end material (object to be cleaned) on the cutting waste guide plate 51 toward the cutting waste collection box 52 .

Next, the washing unit will be explained. FIG. 3 is a schematic diagram showing the configuration of the cleaning unit. As shown in FIG. 3, the cleaning unit 40 includes a unit main body 41, a pair of cleaning nozzles 42 extending from the unit main body 41 toward the scrap material 106, and a control unit ( control means) 60. This control unit 60 controls the operation of a plurality (four units) of cleaning units 40, and the control unit of the cutting device 10 may also be used.

The unit main body 41 includes a cleaning water supply path (cleaning liquid supply path) 43 communicating with a cleaning water supply source (cleaning liquid supply source) 200, and a cleaning water valve (cleaning liquid valve) 44 provided in the middle of the cleaning water supply path 43. , an air supply path 45 communicating with an air supply source 201, an air valve 46 provided in the middle of the air supply path 45, and a mixer 47 connected to the cleaning water supply path 43 and the air supply path 45. A washing nozzle 42 is connected to the mixer 47 . Therefore, the cleaning water supply path 43 communicates the cleaning water supply source 200 and the cleaning nozzle 42 via the mixer 47 , and the air supply path 45 communicates the air supply source 201 via the mixer 47 with the cleaning nozzle 42 . It communicates with the nozzle 42 .

The cleaning nozzle 42 is formed of a tubular member such as metal, and ejects cleaning water from a tip portion 42A. The cleaning nozzle 42 is fixed to the bottom portion 15 of the water case 13 or the cutting waste guide plate 51, respectively, toward the downstream side in the X-axis direction or the Y-axis direction. It is flattened by being crushed in the Z-axis direction (vertical direction). As a result, the cleaning water can be jetted over a wide range from the tip portion 42A, and for example, the cleaning water can reliably hit the scraps 106 scattered in the first lateral region 15A. In addition, the cleaning nozzle 42 may be formed by a pipe such as a flexible resin tube.

The cleaning water supply source 200 supplies cleaning water (for example, pure water), and the air supply source 201 supplies compressed air. The cleaning water supply path 43 and the air supply path 45 are formed by, for example, flexible resin tube piping. The cleansing water valve 44 opens and closes so as to block the flow of cleansing water in the cleansing water supply path 43 . The air valve 46 opens and closes so as to block the flow of air (compressed air) in the air supply path 45 . The control unit 60 controls opening and closing operations of the washing water valve 44 and the air valve 46 . The mixer 47 joins the cleaning water and air and guides them to the cleaning nozzle 42 . In this embodiment, pure water (cleaning water) is used as the cleaning liquid, but the cleaning liquid is not limited to this, and may contain a substance for increasing the cleaning power or may be a different type of liquid.

Next, a method for cleaning (washing away) the scraps 106 by the cleaning unit 40 will be described. First, when the cutting operation of the cutting device 10 is started, the control unit 60 opens the cleaning water valve 44 to supply cleaning water to the cleaning nozzle 42 (cleaning liquid supplying step). In this embodiment, the cleaning water valve 44 is controlled to be open at all times during the cleaning operation (washing operation). As a result, the cleaning water supplied into the cleaning nozzle 42 accumulates, and excess cleaning water flows out from the tip portion 42A. The washed water that flows out wets the bottom portion 15 (the first side area 15A, etc.) of the water case 13 or the cutting waste guide plate 51, or causes the water to stay around the scraps 106, so that the scraps 106 Reduce frictional resistance.

Subsequently, the control unit 60 opens the air valve 46 to supply air to the cleaning nozzle 42, thereby ejecting the cleaning water accumulated in the cleaning nozzle 42 (cleaning liquid ejection step). The air valve 46 is intermittently controlled to alternately close and open during cleaning operations. Specifically, after being closed for a predetermined closing time (for example, 4 seconds), it is opened for a predetermined opening time (for example, 0.4 seconds) that is shorter than the closing time. This closing time is the time until a predetermined amount of cleaning water (for example, the amount of cleaning water that fills the cleaning nozzle 42) is accumulated in the cleaning nozzle 42 . Moreover, it is also possible to wait until the water stays around the offcuts 106 . By momentarily opening the air valve 46 , the cleaning water 70 in the cleaning nozzle 42 is jetted toward the mill ends 106 by the pressure of the air.

Here, as in the two-fluid nozzle, if the cleansing water and air are completely mixed, the cleansing water is not sufficiently washed away because it becomes misty. On the other hand, in the present invention, by intermittently opening and closing the air valve 46 with a short opening time, as shown in FIG. 3, particles of washing water 70 are continuously sprayed. Since the particles of the washing water 70 have a greater weight than those in the form of a mist, the particles of the washing water 70 can be vigorously ejected, and when they hit the offcuts 106, the offcuts 106 are pushed downstream. can be swept away. Further, it is more effective to inject the cleaning water while the cleaning water is accumulated around the offcuts 106 .

Thus, the cleaning unit 40 of the present embodiment includes the cleaning water supply path 43 communicating the cleaning water supply source 200 and the cleaning nozzle 42, the air supply path 45 communicating the air supply source 201 and the cleaning nozzle 42, Since the air valve 46 that opens and closes the air supply path 45 and the control unit 60 that intermittently opens and closes the air valve 46 are provided, the cleaning water 70 can be vigorously jetted from the cleaning nozzle 42 toward the scrap material 106 . Material 106 can be swept downstream.

Further, according to the cleaning method of the object to be cleaned of the present application, the cleaning liquid supply step of supplying the cleaning liquid to the cleaning nozzle 42 and the cleaning liquid injection step of supplying air to the cleaning nozzle 42 and injecting the cleaning water accumulated in the cleaning nozzle 42 are performed. Since the cleaning liquid spraying step is performed intermittently at the timing when a predetermined amount of cleaning water accumulates in the cleaning nozzle 42, the cleaning water 70 is easily and vigorously jetted from the cleaning nozzle 42 toward the scrap material 106. , and the offcuts 106 can be washed downstream.

In addition, this invention is not limited to the said embodiment. That is, various modifications can be made without departing from the gist of the present invention. For example, in the above embodiment, the cleaning unit 40 has two cleaning nozzles 42, but the number of cleaning nozzles 42 included in the cleaning unit 40 is not limited to this. It can be changed as appropriate according to conditions such as the range of washing away. For example, when cleaning a narrower range than in this embodiment, only one cleaning nozzle may be provided. Conversely, when cleaning a wider range than in this embodiment, three or more cleaning nozzles may be provided. The nozzles may be arranged side by side.

Further, in the present embodiment, the tip portion 42A of the cleaning nozzle 42 is crushed in the Z-axis direction (vertical direction) to have a flat shape.

Also, in the present embodiment, an example of the closing time and opening time of the air valve 46 has been described, but the closing time and opening time are not limited to this time. It can be changed as appropriate depending on the weight and size.

REFERENCE SIGNS LIST 10 cutting device 11 first chuck table 12 second chuck table 13 water case 15 bottom 15A first side area 15B intermediate area 15C third side area 19 first moving plate 20 second moving plate 40 cleaning unit 42 cleaning nozzle 42A Tip 43 Washing water supply path 44 Washing water valve 45 Air supply path 46 Air valve 47 Mixer 50 End material processing device 51 Chip guide plate 52 Cutting waste collection box 60 Control unit 70 Washing water 100 Package substrate 105 Surplus connecting member 106 End material 200 cleaning water supply 201 air supply

Claims (3)

When the cutting operation of cutting the workpiece of the cutting device is started, a cleaning liquid is supplied to the cleaning nozzle to cause water to accumulate around the scraps generated by cutting the workpiece, a cleaning liquid supplying step for reducing the frictional resistance of the mill ends ;
a cleaning liquid jetting step of supplying air to the cleaning nozzle and jetting the cleaning liquid accumulated in the cleaning nozzle to the end material ;
The cleaning liquid injection step includes:
A method of cleaning an object to be cleaned, characterized by intermittently cleaning the cleaning liquid at a timing when a predetermined amount of cleaning liquid accumulates in the cleaning nozzle. 2. The method for cleaning an object to be cleaned according to claim 1, wherein said cleaning nozzle is fixed to a water case having an opening formed therein for arranging a chuck table holding said object to be processed. The cleaning nozzle includes a cutting waste guide plate adjacent to a water case having an opening for arranging a chuck table holding the workpiece inside, and a cutting waste collection box continuing to the lower end of the cutting waste guide plate. 2. The method for cleaning an object to be cleaned according to claim 1, wherein said cutting waste guide plate is fixed to an upper end portion of said cutting waste guide plate of a scrap material processing apparatus comprising:

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