JP7442974B2 - Nickel electroformed blade and manufacturing method of nickel electroformed blade - Google Patents

Description

The present invention relates to a nickel electroformed blade and a method for manufacturing a nickel electroformed blade.

Conventionally, nickel electroforming blades have been used for precision machining of electronic materials and the like. The nickel electroformed blade has a circular thin plate shape, and abrasive grains such as diamond are dispersed in the nickel plating phase. Patent Document 1 describes a method for producing a nickel alloy electroformed film and a nickel alloy electroformed film.

Japanese Patent Application Publication No. 2010-235974

Conventional nickel electroformed blades have room for improvement in terms of higher rigidity and improved machining accuracy.

In view of the above circumstances, one of the objects of the present invention is to provide a nickel electroformed blade with increased rigidity and improved machining accuracy.
Another object of the present invention is to provide a method for manufacturing a nickel electroformed blade that can stably manufacture the above-mentioned nickel electroformed blade.

One embodiment of the nickel electroformed blade of the present invention includes a disc-shaped plating phase, a cutting edge formed on the outer peripheral edge of the plating phase, and abrasive grains dispersed in the plating phase, The plating phase contains nickel and nickel boride as components of the plating phase, the boron content in the plating phase is 0.005% or more and 0.018% or less , and the plating phase has a Vickers content of 0.005% or more and 0.018% or less. Hardness is 900Hv or more .

This nickel electroformed blade contains nickel (Ni) and nickel boride (Ni _X B _Y ) as components of the plating phase. Nickel is the main component of the plating phase, and nickel boride is a metal compound such as Ni ₃ B and Ni ₂ B that is dispersed in the plating phase. In the nickel electroformed blade of the present invention, nickel crystals are refined by eutectoiding boron (B) in the plating phase. According to Hall-Petch's law for crystalline materials, yield strength increases in inverse proportion to crystal grain size. That is, the plating phase becomes amorphous due to the eutectoid of boron, the plastic deformability decreases, and the hardness relatively increases.

According to the nickel electroformed blade of the present invention, the boron content of the plating phase is 0.005% or more, and since the boron content of the plating phase is higher than that of conventional nickel electroforming blades, the hardness of the plating phase and Young's modulus can be stably increased. Specifically, the nickel electroformed blade of the present invention has a Vickers hardness of 900 Hv or more. For this reason, the blade rigidity is increased, and when performing precision machining of electronic materials etc. using a nickel electroformed blade, for example, even when deep groove machining or cutting with a narrow pitch width, the machining line may be bent or the machining groove may be Since the width is suppressed from increasing, processing accuracy can be improved.
Moreover, according to the nickel electroformed blade of the present invention, wear resistance can be improved compared to conventional nickel electroformed blades.

Further, since the boron content of the plating phase is 0.018% or less, the nickel electroformed blade can be stably manufactured. That is, if the boron content of the plating phase exceeds 0.018%, the plating phase may not be stably formed in the plating process, and the production may become unstable.

In the nickel electroformed blade, the nickel boride preferably contains Ni ₃ B.

In this case, the plating phase contains Ni ₃ B as a component. Among nickel borides, Ni ₃ B stably contributes to improving the blade rigidity, so that the processing accuracy of the nickel electroformed blade can be further improved.

In the above-mentioned nickel electroformed blade, it is preferable that the content of boron contained in the plating phase is 0.01% or more.

When the boron content of the plating phase is 0.01% or more, the Vickers hardness of the nickel electroformed blade is, for example, 950 Hv or more. Therefore, the blade rigidity is further increased, and the machining accuracy is stably improved.

Further, one embodiment of the method for manufacturing a nickel electroformed blade of the present invention includes immersing an anode and a cathode in a plating bath, and applying electricity to the anode and the cathode to form a plating phase on the surface of the cathode. a plating step, and a heating step of heat-treating the plating phase; in the plating step, the plating bath contains nickel sulfamate, a pH buffer, trimethylamine borane, and abrasive grains; The concentration of the trimethylamine borane in the plating bath is 0.05 mol/L or more and 0.2 mol/L or less, the pH buffer is boric acid, and in the heating step, the plating phase is heated at 200°C. By heat treating at the above temperature for 1 hour or more, the Vickers hardness of the plating phase becomes 900 Hv or more .

According to the method for manufacturing a nickel electroformed blade of the present invention, since the concentration of trimethylamine borane (TMAB) in the plating bath in the plating process is 0.05 mol/L or more, the nickel electroformed blade can be manufactured through this plating process. In the electroformed nickel blade, the content of boron contained in the plating phase is stably at the above-mentioned 0.005% or more. Therefore, the nickel electroformed blade manufactured by this manufacturing method has increased blade rigidity and improved processing accuracy.

For example, as described in paragraph 0027 of Patent Document 1 (Japanese Unexamined Patent Publication No. 2010-235974), when "the concentration of TMAB is 0.5 to 3.5 g/L", trimethylamine borane in the plating bath Since the concentration of is less than 0.05 mol/L at maximum, the nickel electroformed blade manufactured through this plating process has a boron content of less than 0.005% in the plating phase, and is different from the product of the present invention. is different.

Further, in the present invention, since the concentration of trimethylamine borane in the plating bath is 0.2 mol/L or less, a plating phase is stably formed in the plating process. Specifically, if the concentration of trimethylamine borane in the plating bath exceeds 0.2 mol/L, a plating phase may not be stably formed in the plating process, and production may become unstable.

Therefore, according to the method for manufacturing a nickel electroformed blade of the present invention, the nickel electroformed blade of the present invention described above can be stably manufactured.

In the method for manufacturing a nickel electroformed blade, the pH buffer is boric acid.

In this case, the boron component of trimethylamine borane is more likely to combine with nickel due to the action of boric acid, and nickel boride is more likely to be incorporated into the plating phase. Therefore, the content of boron contained in the plating phase can be stably maintained at the above-mentioned 0.005% or more.

In the method for manufacturing a nickel electroformed blade, in the heating step, the plating phase is heat-treated at a temperature of 200 ° C. or higher for 1 hour or more .

In this case, nickel boride (particularly Ni ₃ B) can be efficiently precipitated in the plating phase, and the blade rigidity can be stably increased. Note that the temperature at which the plating phase is heat-treated in the heating step is preferably 300 ° C. or lower. As a result, the Vickers hardness of the plating phase is stabilized to 900 Hv or more.

According to the nickel electroformed blade of one aspect of the present invention, rigidity is increased and processing accuracy can be improved.
Further, according to the method for manufacturing a nickel electroformed blade according to one aspect of the present invention, the above-mentioned nickel electroformed blade can be manufactured stably.

FIG. 1 is a plan view showing a nickel electroformed blade according to an embodiment of the present invention. FIG. 2 is a side sectional view (longitudinal sectional view) showing a nickel electroformed blade according to an embodiment of the present invention. FIG. 3 is a graph showing the relationship between the content of boron contained in the plating phase and Vickers hardness. FIG. 4 is a graph showing the relationship between the content of boron contained in the plating phase and wear resistance. FIG. 5 is a side sectional view showing a plating apparatus used in the plating process. FIG. 6 is a graph showing the relationship between the concentration of trimethylamine borane in the plating bath in the plating process and the boron content of the plating phase of the manufactured nickel electroformed blade.

Hereinafter, a nickel electroformed blade 10 according to an embodiment of the present invention will be described with reference to the drawings.
The nickel electroforming blade 10 of this embodiment is used for precision machining such as grooving and cutting of materials to be cut such as electronic materials. The nickel electroformed blade 10 is an electroformed blade manufactured by electrolytic plating (electroplating) in a nickel plating bath.

As shown in FIGS. 1 and 2, the nickel electroforming blade 10 includes a disc-shaped plating phase 1, a cutting edge 1A formed on the outer peripheral edge of the plating phase 1, and an abrasive grain dispersed in the plating phase 1. grain 3 (see FIG. 5). Note that the nickel electroforming blade 10 may further include a filler (not shown) dispersed in the plating phase 1.

In this embodiment, the direction in which the central axis O of the plating phase 1 extends is referred to as the axial direction, the direction perpendicular to the central axis O is referred to as the radial direction, and the direction in which the plating phase goes around the central axis O is referred to as the circumferential direction. Note that the axial direction of the plating phase 1 may also be referred to as the thickness direction.

The nickel electroforming blade 10 of this embodiment is a washer-type (flat disc-shaped) blade that is attached to the main shaft of a cutting device (not shown) via a flange.
The nickel electroforming blade 10 rotates the plating phase 1 in the circumferential direction around the central axis O by the main shaft of the cutting device, and moves it in the radial direction with respect to the material to be cut. The outer peripheral edge (cutting edge 1A) that protrudes radially outward than the flange cuts into the material to be cut, thereby precision machining the material.

The plating phase 1 has a circular annular shape with a central axis O. The thickness dimension (length in the axial direction) of the plating phase 1 is, for example, 0.01 mm or more and 0.5 mm or less.
A mounting hole 1B is formed in the radial center of the plating phase 1 (on the central axis O). The attachment hole 1B passes through the plating phase 1 in the axial direction. The attachment hole 1B has a circular hole shape centered on the central axis O.

The cutting edge 1A has an annular shape extending in the circumferential direction centering on the central axis O. The cutting edge 1A has a blade width that is approximately the same as the thickness dimension of the plating phase 1. The cutting edge 1A is formed by an outer circumferential surface of the plating phase 1 facing outward in the radial direction, and each outer circumferential portion of a pair of side surfaces 1C of the plating phase 1 facing in the axial direction.
A plurality of abrasive grains 3 are dispersed in the plating phase 1. The abrasive grains 3 are, for example, diamond abrasive grains. Note that as the abrasive grains 3, cBN abrasive grains or the like may be used instead of diamond abrasive grains.

Plating phase 1 contains nickel (Ni) and nickel boride (Ni _X B _Y ) as components. Plating phase 1 is a metal binding phase (matrix material) containing nickel as a main component. The plating phase 1 is a metal solid phase formed by plating, and since it is formed in a thin plate shape, it may also be referred to as a plating film or a plating layer. Nickel boride is dispersed in plating phase 1. Examples of nickel boride include Ni ₃ B, Ni ₂ B, and NiB. That is, the nickel boride of plating phase 1 contains Ni ₃ B.

The content of boron (B) contained in plating phase 1 is 0.005% or more and 0.018% or less. The content of boron contained in plating phase 1 is preferably 0.01% or more. Note that the boron content contained in the plating phase 1 can be measured by, for example, ICP analysis.
In FIG. 3, in the nickel electroformed blade 10 of this embodiment, the boron content of the plating phase 1 is 0.005% or more and 0.018% or less, and the Vickers hardness is 900Hv or more.

Next, a method for manufacturing the nickel electroformed blade 10 of this embodiment will be described.
The method for manufacturing the nickel electroformed blade 10 of this embodiment includes a plating process, an etching process, an inner and outer diameter machining process, and a heating process. Note that the heating step may also be referred to as an aging treatment step.

FIG. 5 shows a plating apparatus 20 used in the plating process of this embodiment.
The plating apparatus 20 includes a tank 21, a plating bath (plating solution) 22, a rotating shaft 23, a cathode 24, and an anode 25.
The tank 21 has a cylindrical shape with a bottom. Plating bath 22 is stored in tank 21 . The rotating shaft 23 is rotated around a shaft center axis extending in the vertical direction. The cathode 24 has a disk shape that extends in the horizontal direction. The cathode 24 is fixed to the lower end of the rotating shaft 23 and immersed in the plating bath 22 . The cathode 24 is a base metal that deposits the plating phase 1 on the surface 24a. The anode 25 has an annular plate shape that extends in the horizontal direction. The anode 25 is placed above the cathode 24 and facing the cathode 24 with a gap therebetween, and is immersed in the plating bath 22 .

The plating process is a process in which the anode 25 and the cathode 24 are immersed in the plating bath 22 and the anode 25 and the cathode 24 are energized to form the plating phase 1 on the surface 24a of the cathode 24.
In the plating process, the plating bath 22 includes nickel sulfamate, a pH buffer, trimethylamine borane (TMAB), and a plurality of abrasive grains 3. In this embodiment, the pH buffer is boric acid. That is, the plating bath 22 of this embodiment is a sulfamic acid bath using boric acid as a pH buffering agent. Note that the plating bath 22 may further contain a brightener, a plurality of fillers, and the like.

The concentration of trimethylamine borane in the plating bath 22 is 0.05 mol/L or more and 0.2 mol/L or less.
In the plating process, a plating phase 1 is formed on the surface 24a of the cathode 24 by rotating the rotating shaft 23 and the cathode 24 around the shaft center axis of the rotating shaft 23 and performing electrolytic plating while stirring the plating bath 22. do. The plating phase 1 is deposited on the surface 24a of the cathode 24 while taking in the abrasive grains 3. When the plating phase 1 reaches a predetermined thickness, the plating phase 1 is peeled off from the cathode 24.

In the etching step, at least the side surface 1C that was in contact with the surface 24a of the cathode 24 among the outer surfaces of the plating phase 1 peeled off from the cathode 24 is etched to cause the abrasive grains 3 to protrude on the outer surface of the plating phase 1. In other words, the etching process sharpens the abrasive grains 3 of the plating phase 1.
In the inner and outer diameter machining process, the outer and inner circumferential parts of the plating phase 1 are cut so that the outer diameter and inner diameter of the plating phase 1 have predetermined dimensions.

In the heating step, the plating phase 1 is subjected to a heat treatment (aging treatment). In the heating step, plating phase 1 is heat-treated at a temperature of 200 ° C. or higher for 1 hour or more. Note that the temperature at which the plating phase 1 is heat-treated in the heating step is preferably 300 ° C. or lower.
In this embodiment, plating phase 1 was heat-treated at a temperature of 300 ° C. for 1 hour in a muffle furnace in an air atmosphere using a carbon weight. As a result, a nickel electroformed blade 10 having a plating phase 1 with a Vickers hardness of 950 Hv or more was obtained.

The nickel electroformed blade 10 of this embodiment described above contains nickel (Ni) and nickel boride (Ni _X B _Y ) as components of the plating phase 1. Nickel is the main component of plating phase 1, and nickel boride is a metal compound such as Ni ₃ B and Ni ₂ B dispersed in plating phase 1. In the nickel electroformed blade 10 of this embodiment, boron (B) is eutectoided in the plating phase 1, so that the nickel crystals are made fine. According to Hall-Petch's law for crystalline materials, yield strength increases in inverse proportion to crystal grain size. That is, the plating phase 1 becomes amorphous due to the eutectoid of boron, the plastic deformability decreases, and the hardness relatively increases.

According to the nickel electroformed blade 10 of this embodiment, the boron content of the plating phase 1 is 0.005% or more, and the boron content of the plating phase 1 is higher than that of conventional nickel electroformed blades. The hardness and Young's modulus of Phase 1 are stably increased. Specifically, as shown in FIG. 3, the nickel electroformed blade 10 of this embodiment has a Vickers hardness of 900 Hv or more. For this reason, the blade rigidity is increased, and when performing precision machining of electronic materials etc. using the nickel electroformed blade 10, the machining line may be bent or the machining Increase in groove width is suppressed, and processing accuracy can be improved.

Figure 4 shows the relationship between the boron content of the plating phase 1 and the wear resistance of the nickel electroformed blade 10, assuming that the wear resistance of the conventional nickel electroformed blade is the standard value (1 or 100%). This is a graph showing. As shown in FIG. 4, the nickel electroformed blade 10 of this embodiment, in which the content of boron contained in the plating phase 1 is 0.005% or more and 0.018% or less, is different from the conventional nickel electroformed blade. As a result, wear resistance is increased by 30% or more.

Further, since the boron content of the plating phase 1 is 0.018% or less, the nickel electroformed blade 10 can be stably manufactured. That is, if the boron content of the plating phase 1 exceeds 0.018%, the plating phase 1 may not be stably formed in the plating process, and the production may become unstable.

Further, in this embodiment, the nickel boride of plating phase 1 contains Ni ₃ B.
That is, plating phase 1 contains Ni ₃ B as a component. Among nickel boride, Ni ₃ B stably contributes to improving the blade rigidity, so that the processing accuracy of the nickel electroformed blade 10 can be further improved.

Further, in this embodiment, when the content of boron contained in the plating phase 1 is 0.01% or more, the Vickers hardness of the nickel electroforming blade 10 is 950 Hv or more, as shown in FIG. 3. Therefore, the blade rigidity is further increased, and the machining accuracy is stably improved.

Furthermore, according to the method for manufacturing the nickel electroformed blade 10 of this embodiment, the concentration of trimethylamine borane in the plating bath 22 in the plating step is 0.05 mol/L or more, so that the nickel electroformed blade 10 manufactured through this plating step In the nickel electroformed blade 10, the content of boron contained in the plating phase 1 is stably equal to or higher than the above-mentioned 0.005%. Therefore, the nickel electroformed blade 10 manufactured by this manufacturing method has increased blade rigidity and improved processing accuracy.

For example, when "the concentration of TMAB is 0.5 to 3.5 g/L" as described in paragraph 0027 of Patent Document 1 (Japanese Unexamined Patent Publication No. 2010-235974), trimethylamine in the plating bath 22 Since the concentration of borane is less than 0.05 mol/L at maximum, the nickel electroformed blade manufactured through this plating process has a boron content of less than 0.005% in the plating phase, and the present invention It is different from.

Further, in this embodiment, since the concentration of trimethylamine borane in the plating bath 22 is 0.2 mol/L or less, the plating phase 1 is stably formed in the plating process. Specifically, if the concentration of trimethylamine borane in the plating bath 22 exceeds 0.2 mol/L, the plating phase 1 may not be stably formed in the plating process, and the production may become unstable.

Therefore, according to the method for manufacturing the nickel electroformed blade 10 of this embodiment, the nickel electroformed blade 10 of this embodiment described above can be stably manufactured.

Further, in this embodiment, the pH buffering agent of the plating bath 22 is boric acid.
In this case, the boron component of trimethylamine borane is more likely to combine with nickel due to the action of boric acid, and nickel boride is more likely to be incorporated into the plating phase 1. Therefore, the content of boron contained in the plating phase 1 can be stably maintained at the above-mentioned 0.005% or more.

FIG. 6 is a graph showing the relationship between the trimethylamine borane (TMAB) concentration in the plating bath 22 used in the plating process and the boron content of the plating phase 1 produced through this plating process. Each graph is shown for the case where boric acid is used as the pH buffer and the case where citric acid is used as the pH buffer. As shown in FIG. 6, when boric acid is used as the pH buffering agent in the plating bath 22, the boron content of the plating phase 1 is increased by about 20% compared to when citric acid is used.

Further, in this embodiment, in the heating step, plating phase 1 is heat-treated at a temperature of 200 ° C. or higher for 1 hour or more.
In this case, nickel boride (particularly Ni ₃ B) can be efficiently precipitated in the plating phase 1, and the blade rigidity can be stably increased. Note that the temperature at which the plating phase 1 is heat-treated in the heating step is preferably 300 ° C. or lower. As a result, the Vickers hardness of the plating phase 1 becomes stably 900 Hv or more.

Note that the present invention is not limited to the above-described embodiments, and the configuration can be changed, for example, as described below, without departing from the spirit of the present invention.

In the above-described embodiment, the washer-type nickel electroformed blade 10 and its manufacturing method have been described as an example, but the present invention is not limited thereto. The present invention may be applied to a hub-type nickel electroformed blade (a blade with a hub) and a manufacturing method thereof.

In addition, each structure (component) explained in the above-mentioned embodiment, modification, and notes may be combined without departing from the spirit of the present invention, and addition, omission, substitution, or other modification of the structure may be made. Changes are possible. Further, the present invention is not limited by the embodiments described above, but only by the scope of the claims.

According to the nickel electroformed blade of the present invention, rigidity is increased and processing accuracy can be improved. Further, according to the method for manufacturing a nickel electroformed blade of the present invention, the above-mentioned nickel electroformed blade can be manufactured stably. Therefore, it has industrial applicability.

1... Plating phase, 1A... Cutting edge, 3... Abrasive grain, 10... Nickel electroforming blade, 22... Plating bath, 24... Cathode, 24a... Surface, 25... Anode

Claims (4)

a disc-shaped plating phase;
a cutting edge formed on the outer peripheral edge of the plating phase;
Abrasive grains dispersed in the plating phase,
The plating phase includes nickel and nickel boride as components of the plating phase,
The content of boron contained in the plating phase is 0.005% or more and 0.018% or less,
The plating phase has a Vickers hardness of 900 Hv or more,
Nickel electroformed blade. The nickel boride includes _Ni3B ,
The nickel electroformed blade according to claim 1. The content of boron contained in the plating phase is 0.01% or more,
The nickel electroformed blade according to claim 1 or 2. a plating step of forming a plating phase on the surface of the cathode by immersing the anode and the cathode in a plating bath and applying electricity to the anode and the cathode;
a heating step of heat-treating the plating phase,
In the plating step, the plating bath includes nickel sulfamate, a pH buffer, trimethylamine borane, and abrasive grains,
The concentration of the trimethylamine borane in the plating bath is 0.05 mol/L or more and 0.2 mol/L or less,
the pH buffering agent is boric acid,
In the heating step, the plating phase is heated at a temperature of 200° C. or more for 1 hour or more, so that the plating phase has a Vickers hardness of 900 Hv or more.
Method for manufacturing nickel electroformed blades.

Images