JP7526385B2 - Vehicle lighting device and vehicle lamp - Google Patents

Description

Embodiments of the present invention relate to a vehicle lighting device and a vehicle lamp.

2. Description of the Related Art From the standpoint of energy saving and life extension, vehicle lighting devices equipped with light emitting diodes have become increasingly popular instead of vehicle lighting devices equipped with filaments.
For example, a vehicle lighting device includes a socket, a light-emitting module provided at one end of the socket, and a plurality of power supply terminals electrically connected to the light-emitting module. The light-emitting module includes, for example, a substrate having a wiring pattern, and a light-emitting diode (LED) provided on the substrate and electrically connected to the wiring pattern. Each of the plurality of power supply terminals is soldered to a connection pad provided on the wiring pattern.

In recent years, there has been a demand for smaller light-emitting modules, and therefore smaller vehicle lighting devices. To this end, a light-emitting module has been proposed that includes a chip-shaped light-emitting diode, a frame that surrounds the chip-shaped light-emitting diode, a sealing portion that is provided inside the frame and covers the chip-shaped light-emitting diode, and an optical element provided on the sealing portion. In such a light-emitting module, the sealing portion is formed by filling the inside of the frame with a translucent resin. The optical element is placed on the resin that has been filled inside the frame.

Here, when the optical element is placed on the resin, gas such as air may become trapped between the optical element and the resin. If the resin hardens while gas is trapped inside, a layer containing gas or voids (air bubbles) may occur between the sealing portion and the optical element, or inside the sealing portion. If a layer containing gas or voids are present, the light emitted from the light-emitting diode may be reflected at the interface with the layer containing gas or voids, reducing the light extraction efficiency.

Therefore, when an optical element is placed on the resin filled inside the frame, the resin is made to overflow outside the frame. In this way, the gas trapped between the optical element and the resin can be discharged together with the resin, preventing the formation of layers or voids containing gas. In this case, if a large amount of resin overflows outside the frame, it becomes easier to discharge the gas.

However, because the resin that spills out of the frame has a certain degree of fluidity, there is a risk that the spilled resin will flow over the board and adhere to, for example, the connection pads provided on the wiring pattern. Because the power supply terminals are soldered to the connection pads, if the resin adheres to the connection pads, it will be difficult to solder the power supply terminals to the connection pads.
Therefore, there has been a demand for the development of a technology that can prevent the flowable resin from spreading to unintended areas on a substrate.

JP 2016-195099 A

The problem that the present invention aims to solve is to provide a vehicle lighting device and a vehicle lamp that can prevent a flowable resin from spreading to unintended areas on a substrate.

A vehicle lighting device according to an embodiment comprises a socket; a substrate provided on one end of the socket; at least one light-emitting element provided on the substrate; a frame provided on the substrate and surrounding the light-emitting element; a sealing portion provided inside the frame and including a resin; an optical element provided on the sealing portion; and a trap that is concave, opens onto the outer surface of the frame, does not open onto the end surface of the frame opposite the substrate , and holds at least a portion of the resin that has spilled outside the frame.

According to an embodiment of the present invention, it is possible to provide a vehicle lighting device and a vehicle lamp that can prevent a flowable resin from spreading to unintended areas on a substrate.

1 is a schematic perspective view illustrating a vehicle lighting device according to an embodiment of the present invention; 2 is a cross-sectional view of the vehicle lighting device shown in FIG. 1 taken along line AA. FIG. 2 is a schematic cross-sectional view of a light-emitting module. 1 is a schematic cross-sectional view of a light-emitting module according to a comparative example. 6A to 6F are schematic cross-sectional views illustrating traps according to other embodiments. 11A to 11C are schematic cross-sectional views illustrating a trap according to another embodiment. 1 is a schematic partial cross-sectional view illustrating a vehicle lamp.

Below, an embodiment will be illustrated with reference to the drawings. Note that in each drawing, similar components are given the same reference numerals and detailed explanations are omitted as appropriate.

(Vehicle lighting device)
The vehicle lighting device 1 according to the present embodiment can be installed in, for example, an automobile or a railroad car. Examples of the vehicle lighting device 1 installed in an automobile include a front combination light (for example, a combination of a daylight running lamp (DRL), a position lamp, a turn signal lamp, etc.) and a rear combination light (for example, a combination of a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, etc.). However, the uses of the vehicle lighting device 1 are not limited to these.

FIG. 1 is a schematic perspective view illustrating a vehicle lighting device 1 according to the present embodiment.
FIG. 2 is a cross-sectional view of the vehicle lighting device 1 taken along line AA in FIG.
FIG. 3 is a schematic cross-sectional view of the light-emitting module 20.
As shown in FIGS. 1 and 2 , a vehicle lighting device 1 may be provided with, for example, a socket 10, a light emitting module 20, a power supply unit 30, and a heat transfer unit 40.

The socket 10 has, for example, a mounting portion 11, a bayonet 12, a flange 13, heat dissipation fins 14, and a connector holder 15.
The mounting portion 11 is provided on the surface of the flange 13 opposite to the side on which the heat dissipation fins 14 are provided. The outer shape of the mounting portion 11 may be columnar. The outer shape of the mounting portion 11 is, for example, cylindrical. The mounting portion 11 has a recess 11a that opens to the end face opposite to the flange 13 side.

The bayonet 12 is provided on the outer surface of the mounting portion 11. The bayonet 12 protrudes toward the outside of the vehicle lighting device 1. The bayonet 12 faces the flange 13. A plurality of bayonets 12 are provided. The bayonets 12 can be used when mounting the vehicle lighting device 1 to the housing 101 of the vehicle lamp 100. The bayonet 12 can be used for a twist lock.

The flange 13 has a plate shape. The flange 13 has, for example, a disk shape. The outer surface of the flange 13 is located further outward from the vehicle lighting device 1 than the outer surface of the bayonet 12.

The heat dissipation fin 14 is provided on the flange 13 on the side opposite the mounting portion 11. At least one heat dissipation fin 14 can be provided. The socket 10 illustrated in Figures 1 and 2 is provided with multiple heat dissipation fins. The multiple heat dissipation fins 14 can be arranged in a predetermined direction. The heat dissipation fin 14 can be plate-shaped.

The connector holder 15 can be provided on the side of the flange 13 opposite the mounting portion 11. The connector holder 15 can be provided alongside the heat dissipation fins 14. The connector holder 15 can be provided near the periphery of the flange 13. The connector holder 15 is cylindrical, and a connector 105 having a seal member 105a inside can be inserted into it.

The socket 10 has the function of holding the light-emitting module 20 and the power supply unit 30, and the function of transferring heat generated in the light-emitting module 20 to the outside. Therefore, it is preferable that the socket 10 is formed from a material with high thermal conductivity. For example, the socket 10 can be formed from a metal such as an aluminum alloy.

In recent years, it is also desirable for the socket 10 to be lightweight and capable of efficiently dissipating heat generated in the light-emitting module 20. For this reason, it is preferable for the socket 10 to be formed from a highly thermally conductive resin. The highly thermally conductive resin includes, for example, a resin and a filler using an inorganic material. The highly thermally conductive resin can be, for example, a resin such as PET (Polyethylene terephthalate) or nylon mixed with a filler using carbon or aluminum oxide.

If the socket 10 contains a highly thermally conductive resin and has the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 molded as a single unit, the heat generated in the light-emitting module 20 can be efficiently dissipated. The weight of the socket 10 can also be reduced. In this case, the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 can be molded as a single unit using a method such as injection molding. The socket 10 and the power supply portion 30 can also be molded as a single unit using a method such as insert molding.

The power supply unit 30 has a plurality of power supply terminals 31 and a holding unit 32 .
The power supply terminals 31 may be rod-shaped. The power supply terminals 31 may be arranged in a predetermined direction. One end of each of the power supply terminals 31 protrudes from the bottom surface 11a1 of the recess 11a. One end of each of the power supply terminals 31 is soldered to each of the connection pads (lands) 21a1 described later. The other end of each of the power supply terminals 31 is exposed inside the hole of the connector holder 15. The connector 105 is fitted into the power supply terminals 31 exposed inside the hole of the connector holder 15. The power supply terminals 31 may be formed of a metal such as a copper alloy. The shape, arrangement, material, number, etc. of the power supply terminals 31 are not limited to those exemplified, and may be changed as appropriate.

As described above, it is preferable that the socket 10 is made of a material with high thermal conductivity. However, materials with high thermal conductivity may have electrical conductivity. For example, metals such as aluminum alloys and highly thermally conductive resins containing fillers made of carbon have electrical conductivity. Therefore, the holding portion 32 is provided to insulate the multiple power supply terminals 31 from the socket 10, which has electrical conductivity. The holding portion 32 also has the function of holding the multiple power supply terminals 31. Note that, when the socket 10 is made of a highly thermally conductive resin having insulating properties (for example, a highly thermally conductive resin containing a filler made of aluminum oxide), the holding portion 32 can be omitted. In this case, the socket 10 holds the multiple power supply terminals 31. The holding portion 32 can be made of a resin having insulating properties. The holding portion 32 can be, for example, pressed into a hole 10a provided in the socket 10 or adhered to the inner wall of the hole 10a.

The heat transfer unit 40 is provided, for example, between the substrate 21 and the bottom surface 11a1 of the recess 11a. The heat transfer unit 40 can be bonded, for example, to the bottom surface 11a1 of the recess 11a. The adhesive that bonds the heat transfer unit 40 to the bottom surface 11a1 of the recess 11a is preferably an adhesive with high thermal conductivity. For example, the adhesive can be an adhesive mixed with a filler using an inorganic material. The inorganic material is preferably a material with high thermal conductivity (for example, ceramics such as aluminum oxide or aluminum nitride). The thermal conductivity of the adhesive can be, for example, 0.5 W/(m·K) or more and 10 W/(m·K) or less.

The heat transfer section 40 can also be embedded in the bottom surface 11a1 of the recess 11a by insert molding. The heat transfer section 40 can also be attached to the bottom surface 11a1 of the recess 11a via a layer of thermally conductive grease (heat dissipating grease). There are no particular limitations on the type of thermally conductive grease, but it can be, for example, modified silicone mixed with a filler using a material with high thermal conductivity (for example, ceramics such as aluminum oxide or aluminum nitride). The thermal conductivity of the thermally conductive grease can be, for example, 1 W/(m·K) or more and 5 W/(m·K) or less.

The heat transfer section 40 is provided to facilitate the transfer of heat generated in the light-emitting module 20 to the socket 10. For this reason, the heat transfer section 40 is preferably formed from a material with high thermal conductivity. The heat transfer section 40 has a plate shape, and can be formed from a metal such as aluminum, an aluminum alloy, copper, or a copper alloy.
If the amount of heat generated in the light-emitting module 20 is small, the heat transfer section 40 may be omitted.

As shown in FIGS. 2 and 3 , the light emitting module 20 includes, for example, a substrate 21 , a light emitting element 22 , a frame portion 23 , a sealing portion 24 , an element 25 , an optical element 26 , and a trap 27 .
The substrate 21 is provided on one end of the socket 10. The substrate 21 can be bonded, for example, onto the heat transfer portion 40. In this case, the adhesive used is preferably an adhesive with high thermal conductivity. The adhesive can be, for example, the same as the adhesive used to bond the heat transfer portion 40 and the bottom surface 11a1 of the recess 11a described above.

The substrate 21 has a plate shape. The planar shape of the substrate 21 can be, for example, a rectangle. The substrate 21 can be formed from, for example, an inorganic material such as ceramics (for example, aluminum oxide or aluminum nitride), or an organic material such as paper phenol or glass epoxy. The substrate 21 may also be a metal plate with its surface covered with an insulating material. When the light-emitting element 22 generates a large amount of heat, it is preferable to form the substrate 21 using a material with high thermal conductivity from the viewpoint of heat dissipation. Examples of materials with high thermal conductivity include, for example, ceramics such as aluminum oxide or aluminum nitride, highly thermally conductive resin, and a metal plate with its surface covered with an insulating material. The substrate 21 may have a single-layer structure or a multi-layer structure.

In addition, a wiring pattern 21a is provided on the surface of the substrate 21 (see FIG. 1). The wiring pattern 21a can be formed from, for example, a material mainly composed of silver or a material mainly composed of copper. The wiring pattern 21a is provided with a plurality of connection pads 21a1 for soldering the power supply terminal 31 and a plurality of mounting pads 21a2 for mounting the light emitting element 22 and the element 25.
In addition, a covering portion may be provided to cover the wiring pattern 21a, a film resistor to be described later, etc. The covering portion may include, for example, a glass material.

The light-emitting element 22 is provided on the substrate 21 on the side opposite to the bottom surface 11a1 side of the recess 11a. The light-emitting element 22 is provided on the substrate 21. The light-emitting element 22 is electrically connected to the wiring pattern 21a. For example, the light-emitting element 22 is mounted on the mounting pad 21a2. At least one light-emitting element 22 can be provided. When a plurality of light-emitting elements 22 are provided, the plurality of light-emitting elements 22 can be connected in series with each other.
The light emitting element 22 may be, for example, a light emitting diode, an organic light emitting diode, a laser diode, or the like.

The light-emitting element 22 can be a chip-shaped light-emitting element. The chip-shaped light-emitting element 22 can be mounted on the mounting pad 21a2 by COB (Chip On Board). In this way, many light-emitting elements 22 can be provided in a small area. Therefore, the light-emitting module 20 can be made smaller, and the vehicle lighting device 1 can be made smaller. The chip-shaped light-emitting element 22 can be, for example, an upper electrode type light-emitting element, an upper and lower electrode type light-emitting element, or a flip-chip type light-emitting element. The light-emitting element 22 illustrated in Figures 1 to 3 is an upper and lower electrode type light-emitting element. The electrode of the upper electrode type light-emitting element or the upper electrode of the upper and lower electrode type light-emitting element can be electrically connected to the mounting pad 21a2 by the wiring 21b. In this case, the wiring 21b can be connected by, for example, a wire bonding method. The flip-chip type light-emitting element 22 can be directly mounted on the mounting pad 21a2. The number, size, arrangement, etc. of the light-emitting elements 22 are not limited to those illustrated, and can be appropriately changed depending on the size and use of the vehicle lighting device 1.

The frame portion 23 is provided on the substrate 21 on the side opposite the bottom surface 11a1 of the recess 11a. The frame portion 23 is frame-shaped and is adhered to the substrate 21. The frame portion 23 surrounds the light-emitting element 22. The frame portion 23 can be formed from a resin. The resin can be, for example, a thermoplastic resin such as PBT (polybutylene terephthalate), PC (polycarbonate), PET, nylon, PP (polypropylene), PE (polyethylene), or PS (polystyrene).

The frame 23 can have the function of defining the formation range of the sealing portion 24 and the function of a reflector. Therefore, in order to improve the reflectivity, the frame 23 can contain titanium oxide particles or a white resin. The inner surface of the frame 23 can also be an inclined surface. For example, the inner surface of the frame 23 can be inclined in a direction away from the central axis of the frame 23 as it moves away from the substrate 21.

The sealing portion 24 can be provided inside the frame portion 23. The sealing portion 24 can be provided so as to cover the area surrounded by the frame portion 23. The sealing portion 24 can be provided so as to cover the light-emitting element 22. The sealing portion 24 can include a resin having translucency. The sealing portion 24 can be formed, for example, by filling the inside of the frame portion 23 with resin. The filling of the resin can be performed, for example, using a dispenser. The resin to be filled can be, for example, a silicone resin. In this case, if the viscosity of the resin to be filled is too low, it is difficult to suppress the spread of the resin that has overflowed outside the frame portion 23. If the viscosity of the resin to be filled is too high, it is difficult to discharge the air caught inside the resin. Therefore, it is preferable that the viscosity of the resin to be filled is, for example, 1000 mPa·s or more and 7500 mPa·s or less.

The sealing portion 24 may also contain a phosphor. The phosphor may be, for example, a YAG phosphor (yttrium aluminum garnet phosphor). However, the type of phosphor may be changed as appropriate to obtain a desired emission color depending on the application of the vehicle lighting device 1.

The element 25 can be a passive element or an active element used to configure a light-emitting circuit having the light-emitting element 22. As shown in FIG. 1, the element 25 can be provided, for example, on the periphery of the frame portion 23 and electrically connected to the wiring pattern 21a (mounting pad 21a2). At least one element 25 can be provided.

The element 25 may be, for example, a resistor 25a and a control element 25b.
However, the type of element 25 is not limited to the exemplified ones, and can be changed as appropriate depending on the configuration of the light-emitting circuit having the light-emitting element 22. For example, in addition to the above-mentioned ones, the element 25 may be a capacitor, a pull-down resistor, a positive characteristic thermistor, a negative characteristic thermistor, an inductor, a surge absorber, a varistor, a transistor such as a FET or a bipolar transistor, an integrated circuit, a computing element, and the like.

The resistor 25a is provided on the substrate 21 on the side opposite the bottom surface 11a1 of the recess 11a. The resistor 25a is provided on the substrate 21. The resistor 25a is electrically connected to the wiring pattern 21a. For example, the resistor 25a is mounted on the mounting pad 21a2. The resistor 25a can be, for example, a surface mount resistor, a resistor with leads (metal oxide film resistor), or a film resistor formed using a screen printing method or the like. The resistor 25a illustrated in FIG. 1 is a film resistor.

The material of the film resistor can be, for example, ruthenium oxide (RuO ₂ ). The film resistor can be formed, for example, by using a screen printing method and a baking method. If the resistor 25a is a film resistor, the contact area between the resistor 25a and the substrate 21 can be increased, so that heat dissipation can be improved. In addition, a plurality of resistors 25a can be formed at once. Therefore, productivity can be improved. In addition, the variation in resistance value among the plurality of resistors 25a can be suppressed.

Here, since there is variation in the forward voltage characteristics of the light-emitting element 22, if the applied voltage between the anode terminal and the ground terminal is constant, variation occurs in the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light irradiated from the light-emitting element 22. Therefore, in order to keep the brightness of the light irradiated from the light-emitting element 22 within a predetermined range, the value of the current flowing through the light-emitting element 22 is set within a predetermined range by the resistor 25a connected in series to the light-emitting element 22. In this case, the resistance value of the resistor 25a is changed to keep the value of the current flowing through the light-emitting element 22 within the predetermined range.

If the resistor 25a is a surface mount resistor or a resistor with leads, a resistor 25a having an appropriate resistance value can be selected according to the forward voltage characteristics of the light emitting element 22. If the resistor 25a is a film resistor, the resistance value can be increased by removing a portion of the resistor 25a. For example, by irradiating a film resistor with laser light, a portion of the film resistor can be easily removed. Note that the number and size of the resistors 25a are not limited to those exemplified, and can be changed as appropriate according to the number and specifications of the light emitting elements 22.

The control element 25b is provided on the substrate 21 on the side opposite the bottom surface 11a1 of the recess 11a. The control element 25b is provided on the substrate 21. For example, the control element 25b is mounted on the mounting pad 21a2. The control element 25b can be provided, for example, to prevent a reverse voltage from being applied to the light-emitting element 22 and to prevent pulse noise from the reverse direction from being applied to the light-emitting element 22. The control element 25b can be, for example, a diode. The control element 25b can be, for example, a surface-mounted diode or a diode with leads. The control element 25b illustrated in FIG. 1 is a surface-mounted diode.

The optical element 26 can be formed from a light-transmitting material. The optical element 26 can be formed from, for example, a light-transmitting resin such as a silicone resin, glass, or the like. The optical element 26 can be formed, for example, by a molding method.

As shown in Figs. 2 and 3, the optical element 26 is provided on the sealing portion 24. The optical element 26 can be adhered to at least one of the end face 24a of the sealing portion 24 opposite the substrate 21 side and the end face 23a of the frame portion 23 opposite the substrate 21 side. For example, the optical element 26 can be adhered to at least one of the end face 24a of the sealing portion 24 and the end face 23a of the frame portion 23 by hardening the resin filled inside the frame portion 23.

The optical element 26, for example, diffuses and focuses the light emitted from the light-emitting element 22. The optical element 26 illustrated in Figs. 2 and 3 is a convex lens. The optical element 26, which is a convex lens, focuses the light so that a predetermined light distribution characteristic is obtained. Note that the optical element 26 is not limited to a convex lens, and may be, for example, a concave lens.

FIG. 4 is a schematic cross-sectional view of a light-emitting module 120 according to a comparative example.
In order to avoid complication, FIG. 4 illustrates only the substrate 21, the light emitting element 22, the frame portion 123, the sealing portion 24, and the optical element 26.

The light emitting module 20 described above is provided with a frame portion 23, but as shown in FIG. 4, a light emitting module 120 according to the comparative example is provided with a frame portion 123.
The optical element 26 is provided on the sealing portion 24. For example, the inside of the frame portion 123 is filled with resin, and the optical element 26 is placed on the filled resin. The filled resin is cured to form the sealing portion 24, and the optical element 26 is bonded to at least one of the end surface 24a of the sealing portion 24 and the end surface 123a of the frame portion 123.

Here, when the optical element 26 is placed on the resin, gas such as air may be trapped between the optical element 26 and the resin. If the resin hardens while gas is trapped inside, a layer containing gas or voids (air bubbles) may occur between the sealing portion 24 and the optical element 26 or inside the sealing portion 24. If a layer containing gas or voids are present, the light emitted from the light emitting element 22 may be reflected at the interface of the layer containing gas or void, which may reduce the light extraction efficiency.

In this case, if the resin is allowed to overflow outside the frame 123 when the optical element 26 is placed on the resin, the gas trapped between the optical element 26 and the resin can be discharged together with the resin. In order to prevent the occurrence of layers containing gas or voids, it is preferable to increase the amount of resin that overflows outside the frame 123.

However, because the resin that spills out of the frame 123 has a certain degree of fluidity, the spilled resin may flow over the substrate 21 and, for example, adhere to the connection pad 21a1 provided on the wiring pattern 21a. Because the power supply terminal 31 is soldered to the connection pad 21a1, if the resin adheres to the connection pad 21a1, it becomes difficult to solder the power supply terminal 31 to the connection pad 21a1.

In recent years, there has been a demand for smaller light-emitting modules, and therefore smaller vehicle lighting devices 1. This shortens the distance between frame 123 and connection pad 21a1, making it easier for resin to adhere to connection pad 21a1. In this case, if the amount of resin spilling out of frame 123 is reduced, it becomes more difficult for resin to adhere to connection pad 21a1, but it becomes more difficult to prevent the generation of layers containing gas, voids, etc.

Therefore, the light-emitting module of this embodiment is provided with a trap on at least one of the outer surface of the frame and near the periphery of the optical element, which holds at least a portion of the resin that has spilled outside the frame.
3, the trap 27 can be concave and open on the outer surface 23b of the frame 23. In this case, the trap 27 can also be further opened on the end face 23a of the frame 23. The trap 27 can have, for example, a ring-shaped configuration along the outer surface 23b of the frame 23. Also, a plurality of traps 27 can be provided along the outer surface 23b of the frame 23. In this case, trap 27 having a ring-shaped configuration makes it easier to hold the spilled resin.

If trap 27 is provided, at least a portion of the resin that spills outside frame 23 can be retained, thereby reducing at least the amount of resin that reaches substrate 21. Therefore, even if the amount of resin that spills outside frame 23 is increased to suppress the generation of layers containing gas or voids, the resin is less likely to reach connection pad 21a1. In other words, if trap 27 is provided, it is possible to prevent the flowable resin from spreading to unintended areas on substrate 21.

5A to 5F are schematic cross-sectional views illustrating traps 27a to 27f according to other embodiments.
5A, the trap 27a opens to the outer surface 23b of the frame 23 and the end surface 23a of the frame 23. A jaw 27a1 is provided on the trap 27a facing the outer surface 23b of the frame 23. The provision of the jaw 27a1 makes it possible to prevent the resin that has flowed into the trap 27a from flowing out to the outer surface 23b of the frame 23.

As shown in FIG. 5B, the trap 27b opens to the outer surface 23b of the frame 23 and the end surface 23a of the frame 23. The trap 27b is inclined with respect to the end surface 23a of the frame 23. For example, the trap 27b can be inclined in a direction away from the central axis of the frame 23 as it approaches the end surface 23a of the frame 23. In this way, it is possible to prevent the resin that has flowed into the inside of the trap 27b from flowing out to the outer surface 23b of the frame 23. In addition, since the resin that has overflowed to the outside of the frame 23 flows along the outer surface 23b of the frame 23 toward the substrate 21, if the inner wall of the trap 27b on the end surface 23a side is inclined, it becomes easier to flow the resin into the inside of the trap 27b.

Also, as shown in Figs. 5(c) to (f), the traps 27c to 27f may open to the outer surface 23b of the frame 23, but not to the end surface 23a of the frame 23. That is, the traps only need to open to at least the outer surface 23b of the frame 23. The resin that overflows outside the frame 23 flows along the outer surface 23b of the frame 23 toward the substrate 21, so if the traps open to the outer surface 23b of the frame 23, the resin can flow into the inside of the traps. However, if the traps open to the outer surface 23b and the end surface 23a of the frame 23, it is easier to flow the resin into the traps. On the other hand, if the traps do not open to the end surface 23a of the frame 23, the area of the end surface 23a can be increased, and the bonding strength between the frame 23 and the sealing portion 24 can be increased.

In addition, although the cross-sectional shape of the trap is exemplified as a rectangle, the cross-sectional shape of the trap can be changed as appropriate. For example, as shown in FIG. 5(d), the cross-sectional shape of trap 27d may be a triangle. Since the resin that spills out of frame 23 flows toward substrate 21 along outer surface 23b of frame 23, if the inner wall on the end surface 23a side of trap 27d is inclined, it becomes easier to flow resin into trap 27d.

For example, as shown in FIG. 5(f), the cross-sectional shape of trap 27f may be a portion of a circle or an ellipse. Also, as shown in FIG. 5(f), multiple traps may be provided along the central axis of frame 23. Also, it is possible to provide traps that open to outer surface 23b of frame 23 and end surface 23a of frame 23, and traps that open to outer surface 23b of frame 23 but do not open to end surface 23a of frame 23.

FIG. 6 is a schematic cross-sectional view illustrating a trap 127 according to another embodiment.
6, the optical element 26a has, for example, an optical portion 26a1, a flange portion 26a2, and a convex portion 26a3. The optical portion 26a1, the flange portion 26a2, and the convex portion 26a3 can be integrally formed.

The optical portion 26a1 is provided on the sealing portion 24. The light emitted from the light emitting element 22 is incident on the optical portion 26a1. The optical portion 26a1 illustrated in Fig. 6 may be a convex lens.
The flange 26a2 has, for example, an annular shape. The flange 26a2 is provided so as to surround the periphery of the optical portion 26a1. An outer surface 26a2a of the flange 26a2 is located outside the frame portion 23.

The protrusion 26a3 is provided near the periphery of the flange portion 26a2 and protrudes toward the substrate 21.
A gap is provided between the inner surface 26a3a of the protrusion 26a3 and the outer surface 23b of the frame 23. If a gap is provided between the inner surface 26a3a of the protrusion 26a3 and the outer surface 23b of the frame 23, the resin that has overflowed to the outside of the frame 23 can be held by capillary force. Therefore, this gap can be used as a trap 127. That is, the trap 127 is provided between the inner surface 26a3a of the protrusion 26a3 and the outer surface 23b of the frame 23. In this case, if the gap dimension S is increased, the capillary force is reduced, so the amount of resin that can be held is reduced. If the gap dimension S is reduced, the volume of the portion that holds the resin is reduced, so the amount of resin that can be held is reduced. According to the knowledge obtained by the present inventor, it is preferable that the gap dimension S is 0.1 mm or more and 0.5 mm or less.

If trap 127 is provided, at least a portion of the resin spilling out of frame 23 can be held, thereby reducing at least the amount of resin that reaches substrate 21. Therefore, even if the amount of resin spilling out of frame 23 is increased to suppress the generation of layers containing gas, voids, and the like, the resin is less likely to reach connection pad 21a1. In other words, if trap 127 is provided, it is possible to prevent flowable resin from spreading to unintended areas on substrate 21.
Also, the trap 127 and the traps provided in the frame portion 23 (for example, the traps 27, 27a to 27f) may be provided.

(Vehicle lighting fixtures)
Next, the vehicle lamp 100 will be illustrated.
In the following, as an example, a case where the vehicular lamp 100 is a front combination light provided on an automobile will be described. However, the vehicular lamp 100 is not limited to a front combination light provided on an automobile. The vehicular lamp 100 may be any vehicular lamp provided on an automobile, a railroad car, or the like.

FIG. 7 is a schematic partial cross-sectional view illustrating the vehicle lamp 100. As shown in FIG.
As shown in FIG. 7, the vehicle lamp 100 includes, for example, the vehicle lighting device 1, a housing 101, a cover 102, an optical element unit 103, a seal member 104, and a connector 105.

The vehicle lighting device 1 is attached to the housing 101. The housing 101 holds the mounting portion 11. The housing 101 is box-shaped with one end open. The housing 101 can be made of, for example, a light-opaque resin. The bottom surface of the housing 101 is provided with a mounting hole 101a into which the portion of the mounting portion 11 with the bayonet 12 is inserted. The periphery of the mounting hole 101a is provided with a recess into which the bayonet 12 provided on the mounting portion 11 is inserted. Note that although the case in which the mounting hole 101a is directly provided on the housing 101 has been exemplified, a mounting member having the mounting hole 101a may be provided on the housing 101.

When attaching the vehicle lighting device 1 to the vehicle lamp 100, the part of the mounting part 11 on which the bayonet 12 is provided is inserted into the mounting hole 101a, and the vehicle lighting device 1 is rotated. Then, the bayonet 12 is held in place by the fitting provided on the periphery of the mounting hole 101a. This type of attachment method is called a twist lock.

The cover 102 is provided to cover the opening of the housing 101. The cover 102 can be formed from a translucent resin or the like. The cover 102 can also have a function such as a lens.

Light emitted from the vehicle lighting device 1 is incident on the optical element unit 103. The optical element unit 103 reflects, diffuses, guides, and collects the light emitted from the vehicle lighting device 1, and forms a predetermined light distribution pattern. For example, the optical element unit 103 illustrated in FIG. 7 is a reflector. In this case, the optical element unit 103 reflects the light emitted from the vehicle lighting device 1 so that a predetermined light distribution pattern is formed.

The seal member 104 is provided between the flange 13 and the housing 101. The seal member 104 may be annular. The seal member 104 may be made of an elastic material such as rubber or silicone resin.

The connector 105 is fitted to the ends of the multiple power supply terminals 31 exposed inside the connector holder 15. The connector 105 is electrically connected to a power source, etc. The connector 105 is also provided with a ring-shaped seal member 105a. When the connector 105 is inserted into the connector holder 15, the seal member 105a seals the inside of the connector holder 15 to make it watertight.

Although several embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the gist of the invention. These embodiments and their variations are included within the scope and gist of the invention, as well as within the scope of the invention and its equivalents described in the claims. Furthermore, the above-mentioned embodiments can be implemented in combination with each other.

1 Vehicle lighting device, 10 Socket, 20 Light emitting module, 21 Substrate, 21a1 Connection pad, 22 Light emitting element, 23 Frame portion, 23a End face, 23b Outer surface, 24 Sealing portion, 26 Optical element, 26a Optical element, 26a1 Optical portion, 26a2 Flange portion, 26a2a Outer surface, 26a3 Convex portion, 26a3a Inner surface, 27 Trap, 27a to 27f Trap, 31 Power supply terminal, 100 Vehicle lamp, 101 Housing, 127 Trap

Claims (5)

A socket;
A substrate provided on one end side of the socket;
At least one light emitting element disposed on the substrate;
a frame portion provided on the substrate and surrounding the light emitting element;
a sealing portion including a resin and provided inside the frame portion;
an optical element disposed on the encapsulation portion;
a trap having a concave shape, opening to an outer surface of the frame portion and not opening to an end surface of the frame portion opposite to the substrate side , the trap holding at least a part of the resin that has spilled out of the frame portion;
A vehicle lighting device comprising: The vehicle lighting device according to claim 1, wherein the inner wall of the trap opposite the substrate is inclined toward the substrate as it approaches the center of the frame. The vehicle lighting device according to claim 1 or 2, wherein the inner wall of the trap on the side facing the substrate is inclined toward the substrate as it approaches the center of the frame. The vehicle lighting device according to any one of claims 1 to 3, wherein a plurality of the traps are provided along the central axis of the frame. A vehicle lighting device according to any one of claims 1 to 4;
A housing in which the vehicle lighting device is mounted;
A vehicle lamp equipped with:

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