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JP7587167B2 - Method for manufacturing electrolyte membrane supported reduction electrode - Google Patents
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JP7587167B2 - Method for manufacturing electrolyte membrane supported reduction electrode - Google Patents

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JP7587167B2
JP7587167B2 JP2022566519A JP2022566519A JP7587167B2 JP 7587167 B2 JP7587167 B2 JP 7587167B2 JP 2022566519 A JP2022566519 A JP 2022566519A JP 2022566519 A JP2022566519 A JP 2022566519A JP 7587167 B2 JP7587167 B2 JP 7587167B2
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electrolyte membrane
reduction
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carbon dioxide
reduction electrode
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紗弓 里
裕也 渦巻
晃洋 鴻野
武志 小松
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04Electrodes; Manufacture thereof not otherwise provided for characterised by the material

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Description

本発明は、電解質膜支持型還元電極の製造方法に関する。 The present invention relates to a method for manufacturing an electrolyte membrane-supported reduction electrode.

従来、地球温暖化の防止やエネルギーの安定供給という観点から、二酸化炭素を還元する技術が注目されている。二酸化炭素を還元する還元装置としては、太陽光等の光エネルギーを印加して二酸化炭素を還元する人工光合成技術を利用した還元装置、外部から電気エネルギーを印加して二酸化炭素を還元する電解分解装置がある(非特許文献1~3参照)。 Conventionally, from the viewpoint of preventing global warming and ensuring a stable supply of energy, technology for reducing carbon dioxide has been attracting attention. Examples of devices for reducing carbon dioxide include devices that use artificial photosynthesis technology to reduce carbon dioxide by applying light energy such as sunlight, and electrolytic decomposition devices that reduce carbon dioxide by applying electrical energy from the outside (see Non-Patent Documents 1 to 3).

非特許文献1の図2には、光照射による二酸化炭素の還元装置が図示されている。左側の酸化槽と右側の還元槽との間に電解質膜を配置し、酸化槽と還元槽とをそれぞれ水溶液で満たす。酸化槽内に窒化ガリウム(GaN)の酸化電極を入れ、還元槽内に銅(Cu)の還元電極を入れて、酸化電極と還元電極とを導線で接続する。そして、酸化槽内の水溶液にヘリウム(He)を流入し、還元槽内の水溶液に二酸化炭素(CO)を流入する。 Figure 2 of Non-Patent Document 1 illustrates an apparatus for reducing carbon dioxide by light irradiation. An electrolyte membrane is placed between an oxidation tank on the left side and a reduction tank on the right side, and the oxidation tank and reduction tank are each filled with an aqueous solution. A gallium nitride (GaN) oxidation electrode is placed in the oxidation tank, and a copper (Cu) reduction electrode is placed in the reduction tank, and the oxidation electrode and reduction electrode are connected by a conductor. Helium (He) is then introduced into the aqueous solution in the oxidation tank, and carbon dioxide (CO 2 ) is introduced into the aqueous solution in the reduction tank.

このとき、酸化電極に光を照射すると、酸化電極では電子・正孔対の生成および分離が生じ、水(HO)の酸化反応により酸素(O)およびプロトン(H)が生成する。そして、プロトンは電解質膜を介して還元槽へ移動し、酸化電極で発生した電子(e)は導線を介して還元電極へ移動する。その後、還元電極ではプロトンと電子との結合により水素(H)が生成し、プロトンと電子と二酸化炭素とにより二酸化炭素の還元反応が引き起こされる。この二酸化炭素の還元反応により、エネルギー資源として活用される一酸化炭素、ギ酸、メタンなどが生成する。 When the oxidation electrode is irradiated with light, electron-hole pairs are generated and separated at the oxidation electrode, and oxygen (O 2 ) and protons (H + ) are generated by the oxidation reaction of water (H 2 O). The protons then move to the reduction tank via the electrolyte membrane, and the electrons (e - ) generated at the oxidation electrode move to the reduction electrode via the conductor. After that, hydrogen (H 2 ) is generated at the reduction electrode by the combination of the protons and electrons, and a reduction reaction of carbon dioxide is caused by the protons, electrons, and carbon dioxide. This reduction reaction of carbon dioxide generates carbon monoxide, formic acid, methane, and other energy resources.

Satoshi Yotsuhashi、外6名、“CO2 Conversion with Light and Water by GaN Photoelectrode”、Japanese Journal of Applied Physics 51、2012年、p.02BP07-1-p.02BP07-3Satoshi Yotsuhashi and 6 others, “CO2 Conversion with Light and Water by GaN Photoelectrode”, Japanese Journal of Applied Physics 51, 2012, p.02BP07-1-p.02BP07-3 Yoshio Hori、外2名、“Formation of Hydrocarbons in the Electrochemical Reduction of Carbone Dioxide at a Copper Electrode in Aqueous Solution”、Journal of the Chemical Society 85(8)、1989年、p.2309-p.2326Yoshio Hori and others, “Formation of Hydrocarbons in the Electrochemical Reduction of Carbone Dioxide at a Copper Electrode in Aqueous Solution”, Journal of the Chemical Society 85(8), 1989, p.2309-p.2326 Qingxin Jia、外2名、”Direct Gas-phase CO2 Reduction for Solar Methane Generation Using a Gas Diffusion Electrode with a BiVO4:Mo and a Cu-In-Se Photoanode”、Chemistry Letter、47、2018年1月13日、p.436- p.439Qingxin Jia and 2 others, “Direct Gas-phase CO2 Reduction for Solar Methane Generation Using a Gas Diffusion Electrode with a BiVO4:Mo and a Cu-In-Se Photoanode”, Chemistry Letter, 47, January 13, 2018, p.436- p.439

還元電極への二酸化炭素の供給量を増大させるため、還元槽を気相の二酸化炭素で満たす二酸化炭素の気相還元装置がある。この気相還元装置では、プロトンが気相の二酸化炭素中を移動できないことを踏まえ、電解質膜に対して還元電極が直接形成される。 To increase the amount of carbon dioxide supplied to the reduction electrode, there is a gas-phase carbon dioxide reduction device that fills the reduction tank with gas-phase carbon dioxide. In this gas-phase reduction device, the reduction electrode is formed directly on the electrolyte membrane, based on the fact that protons cannot move through gas-phase carbon dioxide.

その形成方法には、金属イオンを含む金属塩溶液と金属イオンを還元する還元剤溶液とを用いた無電解めっき法がある。従来の無電解めっき法では、電解質膜の片面とその反対面とに金属塩溶液と還元剤溶液とをそれぞれ同時に注入する。還元剤溶液の還元剤が電解質膜を透過して金属塩溶液と接触することで、金属塩溶液内の金属イオンが還元され、電解質膜の片面に金属が析出される。One method for forming such a membrane is electroless plating, which uses a metal salt solution containing metal ions and a reducing agent solution that reduces the metal ions. In conventional electroless plating, a metal salt solution and a reducing agent solution are simultaneously injected onto one side and the other side of an electrolyte membrane. The reducing agent in the reducing agent solution permeates the electrolyte membrane and comes into contact with the metal salt solution, reducing the metal ions in the metal salt solution and depositing metal on one side of the electrolyte membrane.

しかし、金属塩溶液と還元剤溶液とを同時に注入するため、還元剤溶液の還元剤が電解質膜を透過して金属塩溶液に接触する前のタイミングで、金属塩溶液が少量ではあるが電解質膜の内部に浸透してしまう。これにより、還元剤溶液と金属塩溶液とが電解質膜の内部で接触し、還元電極が電解質膜内にめり込むように形成されてしまう。また、電解質膜の内部に形成された還元電極には二酸化炭素を供給できず、電解質膜は膜内に水分を含んでいるため、電解質膜内の水分が電解質膜内の溶存酸素と反応して還元電極が酸化してしまう。その結果、還元電極では、式(1)および式(2)に示すように、酸化した還元電極自身の還元反応が優先して進行する。これにより、二酸化炭素の還元反応が抑制され、二酸化炭素の還元反応の効率が低下してしまう。However, because the metal salt solution and the reducing agent solution are injected simultaneously, a small amount of the metal salt solution penetrates into the electrolyte membrane before the reducing agent in the reducing agent solution penetrates the electrolyte membrane and comes into contact with the metal salt solution. As a result, the reducing agent solution and the metal salt solution come into contact inside the electrolyte membrane, and the reduction electrode is formed so as to sink into the electrolyte membrane. In addition, carbon dioxide cannot be supplied to the reduction electrode formed inside the electrolyte membrane, and since the electrolyte membrane contains moisture within the membrane, the moisture within the electrolyte membrane reacts with the dissolved oxygen within the electrolyte membrane, causing the reduction electrode to oxidize. As a result, in the reduction electrode, the reduction reaction of the oxidized reduction electrode itself proceeds preferentially, as shown in formulas (1) and (2). This suppresses the reduction reaction of carbon dioxide, and the efficiency of the reduction reaction of carbon dioxide is reduced.

CuO+2H+2e→2Cu+HO ・・・(1)
CuO+2H+2e→Cu+HO ・・・(2)
また、二酸化炭素の気相還元装置では、一般に、太陽光の昇降サイクルやメンテナンスサイクルによって、光エネルギーまたは電気エネルギーのON,OFFを繰り返す運転が実施される。このような運転を行う場合、電解質膜の内部に形成された還元電極がエネルギーOFFの状態で酸化し、再びONにすると酸化した還元電極の還元反応が優先して進行するので、二酸化炭素の還元反応の効率が低下してしまう。
Cu 2 O + 2H + +2e - → 2Cu + H 2 O ... (1)
CuO+2H + +2e - →Cu+H 2 O...(2)
In addition, in a gas-phase carbon dioxide reduction device, operation is generally performed in which light energy or electric energy is repeatedly turned on and off depending on the rising and falling cycle of sunlight and the maintenance cycle. When the energy is turned off, the reduction electrode formed inside the electrode is oxidized, and when the electrode is turned on again, the reduction reaction of the oxidized reduction electrode proceeds preferentially, resulting in a decrease in the efficiency of the reduction reaction of carbon dioxide.

本発明は、上記事情に鑑みてなされたものであり、本発明の目的は、二酸化炭素の気相還元装置を構成する電解質膜支持型還元電極において、電解質膜の内部に還元電極が形成されることを抑制可能であり、二酸化炭素の還元反応の効率を改善可能な技術を提供することである。The present invention has been made in consideration of the above circumstances, and the object of the present invention is to provide a technology that can suppress the formation of a reduction electrode inside an electrolyte membrane in an electrolyte membrane-supported reduction electrode that constitutes a gas-phase carbon dioxide reduction device, and can improve the efficiency of the carbon dioxide reduction reaction.

本発明の一態様の電解質膜支持型還元電極の製造方法は、酸化電極を含む酸化槽と空の内部に二酸化炭素が供給される還元槽との間に配置される電解質膜支持型還元電極の製造方法において、電解質膜の片面の反対面を還元剤溶液に浸漬する第1の工程と、前記電解質膜の片面を金属イオンを含む金属塩溶液に浸漬する第2の工程と、を行う。In one embodiment of the present invention, a method for manufacturing an electrolyte membrane-supported reduction electrode, which is disposed between an oxidation cell containing an oxidation electrode and a reduction cell into whose interior carbon dioxide is supplied, includes a first step of immersing one side of an electrolyte membrane opposite to the other side in a reducing agent solution, and a second step of immersing one side of the electrolyte membrane in a metal salt solution containing metal ions.

本発明によれば、二酸化炭素の気相還元装置を構成する電解質膜支持型還元電極において、電解質膜の内部に還元電極が形成されることを抑制可能であり、二酸化炭素の還元反応の効率を向上可能な技術を提供できる。 According to the present invention, in an electrolyte membrane-supported reduction electrode constituting a gas-phase carbon dioxide reduction device, it is possible to prevent a reduction electrode from being formed inside the electrolyte membrane, thereby providing a technology that can improve the efficiency of the carbon dioxide reduction reaction.

図1は、電解質膜支持型還元電極の製造工程を示す図である。FIG. 1 is a diagram showing a manufacturing process of an electrolyte membrane supported reduction electrode. 図2は、無電解めっき法の反応系を示す図である。FIG. 2 is a diagram showing the reaction system of the electroless plating method. 図3は、電解質膜に対する還元電極の形成イメージを示す図である。FIG. 3 is a diagram showing an image of the formation of a reduction electrode on an electrolyte membrane. 図4は、実施例1に係る二酸化炭素の気相還元装置の構成例を示す図である。FIG. 4 is a diagram illustrating a configuration example of the gas phase reduction device for carbon dioxide according to the first embodiment. 図5は、二酸化炭素の気相還元装置の運転例を示す図である。FIG. 5 is a diagram showing an example of operation of the gas phase reduction device for carbon dioxide. 図6は、実施例6に係る二酸化炭素の気相還元装置の構成例を示す図である。FIG. 6 is a diagram showing a configuration example of a gas phase reduction device for carbon dioxide according to a sixth embodiment.

以下、図面を参照して本発明の実施例を説明する。本発明は、後述の実施例に限定されるものではなく、本発明の趣旨を逸脱しない範囲内において変更を加えることが可能である。Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The present invention is not limited to the embodiment described below, and modifications can be made without departing from the spirit of the present invention.

[発明の概要]
本発明は、金属塩溶液と還元剤溶液とを用いた無電解めっき法により、電解質膜に対して還元電極が直接形成された電解質膜支持型還元電極を製造する製造方法に関する発明である。本発明では、電解質膜に対して無電解めっき処理を施す前に、電解質膜の片面の反対面を還元剤溶液に浸漬することを特徴とする。
Summary of the Invention
The present invention relates to a method for manufacturing an electrolyte membrane supported reduction electrode in which a reduction electrode is formed directly on an electrolyte membrane by electroless plating using a metal salt solution and a reducing agent solution. The present invention is characterized in that, before electroless plating is performed on the electrolyte membrane, one side of the electrolyte membrane is immersed in a reducing agent solution.

これにより、無電解めっき処理前に電解質膜の片面(還元電極の形成面)まで還元剤溶液が拡散・浸透するので、電解質膜の片面に金属塩溶液を注入した際に当該片面の直上から還元電極を形成可能となる。つまり、還元電極作製時および還元反応停止時における電解質膜内部の還元電極の形成を抑制できるので、還元電極の酸化を抑制でき、二酸化炭素の還元反応の効率を向上できる。As a result, the reducing agent solution diffuses and penetrates to one side of the electrolyte membrane (the surface where the reduction electrode is formed) before the electroless plating process, so that when the metal salt solution is injected onto one side of the electrolyte membrane, the reduction electrode can be formed from directly above that side. In other words, the formation of the reduction electrode inside the electrolyte membrane during the production of the reduction electrode and when the reduction reaction is stopped can be suppressed, so oxidation of the reduction electrode can be suppressed and the efficiency of the carbon dioxide reduction reaction can be improved.

[実施例1]
[電解質膜支持型還元電極の製造方法]
図1は、電解質膜支持型還元電極の製造工程を示す図である。電解質膜には、デュポン社製のナフィオン(商標登録)を用いる。金属塩溶液および還元剤溶液には、表1に示すように調整される各溶液を用いる。例えば、還元剤溶液には、極性化合物である水素化ホウ素ナトリウム(NaBH)を還元剤の主成分とする溶液を用いる。
[Example 1]
[Method of manufacturing an electrolyte membrane supported reduction electrode]
1 is a diagram showing the manufacturing process of an electrolyte membrane supported reduction electrode. Nafion (registered trademark) manufactured by DuPont is used as the electrolyte membrane. The metal salt solution and the reducing agent solution are prepared as shown in Table 1. For example, the reducing agent solution is a solution containing sodium borohydride (NaBH 4 ), a polar compound, as the main reducing agent component.

Figure 0007587167000001
Figure 0007587167000001

まず、電解質膜と還元電極との密着性を向上させるため、工程1では、電解質膜の片面に研磨紙を擦り付けて当該片面を粗化する(S1)。次に、電解質膜のプロトン移動度を向上させるため、工程2では、電解質膜を沸騰硝酸に60分間浸漬し(S2)、工程3では、電解質膜を沸騰純水に60分間浸漬する(S3)。その後、図2に示すように、電解質膜1を、第1の槽11と第2の槽12との間に配置する。このとき、電解質膜1の粗化面を第1の槽11側に向けて配置する。First, in order to improve the adhesion between the electrolyte membrane and the reduction electrode, in step 1, one side of the electrolyte membrane is roughened by rubbing abrasive paper against the one side (S1). Next, in order to improve the proton mobility of the electrolyte membrane, in step 2, the electrolyte membrane is immersed in boiling nitric acid for 60 minutes (S2), and in step 3, the electrolyte membrane is immersed in boiling pure water for 60 minutes (S3). Then, as shown in FIG. 2, the electrolyte membrane 1 is placed between the first tank 11 and the second tank 12. At this time, the roughened surface of the electrolyte membrane 1 is placed facing the first tank 11.

次に、工程4(第1の工程)では、第2の槽12を還元剤溶液22で満たして1分間放置し、電解質膜1の反対面(粗化面の反対面)を還元剤溶液22に浸漬する(S4)。次に、工程5(第2の工程)では、第1の槽11を金属イオンを含む金属塩溶液21で満たして30分間放置し、電解質膜1の粗化面を金属塩溶液21に浸漬する(S5)。Next, in step 4 (first step), the second tank 12 is filled with the reducing agent solution 22 and left for 1 minute, and the opposite surface of the electrolyte membrane 1 (opposite the roughened surface) is immersed in the reducing agent solution 22 (S4). Next, in step 5 (second step), the first tank 11 is filled with a metal salt solution 21 containing metal ions and left for 30 minutes, and the roughened surface of the electrolyte membrane 1 is immersed in the metal salt solution 21 (S5).

工程5は、電解質膜1を隔てて金属塩溶液21と還元剤溶液22とを接触するように配置して無電解めっき処理する工程である。つまり、工程5は、電解質膜1の反対面を還元剤溶液22に浸漬し、電解質膜の粗化面を金属塩溶液21に浸漬する無電解めっき処理により、電解質膜1の粗化面に還元電極用の金属を析出させる工程である。Step 5 is a step of performing electroless plating by arranging the metal salt solution 21 and the reducing agent solution 22 so that they are in contact with each other across the electrolyte membrane 1. In other words, step 5 is a step of depositing a metal for a reduction electrode on the roughened surface of the electrolyte membrane 1 by electroless plating in which the opposite surface of the electrolyte membrane 1 is immersed in the reducing agent solution 22 and the roughened surface of the electrolyte membrane is immersed in the metal salt solution 21.

工程4において、還元剤溶液22の主成分である水素化ホウ素ナトリウムは、極性化合物であるから、電解質膜1の内部を拡散・透過する。その後、工程5において、金属塩溶液21と電解質膜1との界面において、酸化還元反応(BH +4OH→BO +2HO+2H+4e、Cu2++2e→Cu)が起きて銅が析出する。これにより、図3の拡大図(a)に示すように、電解質膜1の当初表面上に還元電極2が直上形成された電解質膜支持型還元電極30が得られる。発明者は、還元電極2が電解質膜1の内部にめり込むことなく、電解質膜1の直上から還元電極2が形成されていることを確認した。 In step 4, sodium borohydride, which is the main component of the reducing agent solution 22, is a polar compound and therefore diffuses and permeates the inside of the electrolyte membrane 1. Thereafter, in step 5, an oxidation-reduction reaction (BH 4 - +4OH - →BO 2 - +2H 2 O+2H 2 +4e - , Cu 2+ +2e - →Cu) occurs at the interface between the metal salt solution 21 and the electrolyte membrane 1, and copper is precipitated. As a result, an electrolyte membrane-supported reduction electrode 30 is obtained in which the reduction electrode 2 is formed directly on the initial surface of the electrolyte membrane 1, as shown in the enlarged view (a) of FIG. 3. The inventors confirmed that the reduction electrode 2 is formed directly on the electrolyte membrane 1 without being embedded in the electrolyte membrane 1.

電解質膜1は、例えば、カチオンまたはアニオンを伝導する固体高分子膜、炭素-フッ素からなる骨格を持つ電解質膜であるナフィオンやフォアブルー、アクイヴィオン(商標登録)を用いてもよい。また、金属塩溶液21および還元剤溶液22を他の薬品に変更することで、Ni、Pt、Au、Ag、Pd、Sn、Pdなど任意の種類の金属を形成してもよいし、当該金属に対して酸化反応や置換反応の処理を行うことにより金属錯体を形成してもよい。The electrolyte membrane 1 may be, for example, a solid polymer membrane that conducts cations or anions, or an electrolyte membrane having a carbon-fluorine skeleton, such as Nafion, Forblue, or Aquivion (registered trademark). By changing the metal salt solution 21 and the reducing agent solution 22 to other chemicals, any type of metal, such as Ni, Pt, Au, Ag, Pd, Sn, or Pd, may be formed, or a metal complex may be formed by subjecting the metal to an oxidation reaction or substitution reaction.

[二酸化炭素の気相還元装置の構成]
図4は、実施例1に係る二酸化炭素の気相還元装置100の構成例を示す図である。当該気相還元装置100は、酸化電極への光照射により還元電極で二酸化炭素の還元反応を起こす還元装置(人工光合成装置)である。以下、単に気相還元装置100という。
[Configuration of the carbon dioxide gas phase reduction device]
4 is a diagram showing a configuration example of a carbon dioxide gas-phase reduction device 100 according to Example 1. The gas-phase reduction device 100 is a reduction device (artificial photosynthesis device) that causes a carbon dioxide reduction reaction at a reduction electrode by irradiating an oxidation electrode with light. Hereinafter, it will be simply referred to as the gas-phase reduction device 100.

気相還元装置100は、図4に示すように、一筐体の内部空間を二分することで形成された酸化槽41と還元槽44とを備える。酸化槽41は水溶液43で満たされ、水溶液43には半導体または金属錯体からなる酸化電極42が挿入される。酸化槽41に隣接する還元槽44には、その空の内部に二酸化炭素の気体または二酸化炭素を含む気体が満たされる。As shown in Figure 4, the gas-phase reduction device 100 comprises an oxidation tank 41 and a reduction tank 44 formed by dividing the internal space of a single housing in two. The oxidation tank 41 is filled with an aqueous solution 43 into which an oxidation electrode 42 made of a semiconductor or metal complex is inserted. The empty interior of the reduction tank 44 adjacent to the oxidation tank 41 is filled with carbon dioxide gas or a gas containing carbon dioxide.

酸化電極42は、例えば、窒化物半導体、酸化チタン、アモルファスシリコン、ルテニウム錯体、レニウム錯体のような光活性やレドックス活性を示す化合物である。水溶液43は、例えば、炭酸水素カリウム水溶液、炭酸水素ナトリウム水溶液、塩化カリウム水溶液、塩化ナトリウム水溶液、水酸化ナトリウム水溶液、水酸化カリウム水溶液、水酸化ルビジウム水溶液、水酸化セシウム水溶液である。The oxidation electrode 42 is a compound that exhibits photoactivity or redox activity, such as a nitride semiconductor, titanium oxide, amorphous silicon, a ruthenium complex, or a rhenium complex. The aqueous solution 43 is, for example, an aqueous solution of potassium bicarbonate, an aqueous solution of sodium bicarbonate, an aqueous solution of potassium chloride, an aqueous solution of sodium chloride, an aqueous solution of sodium hydroxide, an aqueous solution of potassium hydroxide, an aqueous solution of rubidium hydroxide, or an aqueous solution of cesium hydroxide.

上記製造方法で製造した電解質膜支持型還元電極30は、酸化槽41と還元槽44との間に配置される。酸化槽41側には電解質膜1が配置され、還元槽44側には還元電極2が配置される。酸化電極42と還元電極2とは、導線45で接続される。The electrolyte membrane-supported reduction electrode 30 manufactured by the above manufacturing method is placed between the oxidation tank 41 and the reduction tank 44. The electrolyte membrane 1 is placed on the oxidation tank 41 side, and the reduction electrode 2 is placed on the reduction tank 44 side. The oxidation electrode 42 and the reduction electrode 2 are connected by a conductor 45.

酸化槽41には、酸化槽41内の水溶液43にヘリウムを流入するため、チューブ46が挿入される。還元槽44には、還元槽44内に二酸化炭素を流入するため、還元槽44の底部に気体入力口47が形成される。さらに、気相還元装置100を運転するため、光源48が酸化電極42に対して対向配置される。光源48は、例えば、キセノンランプ、擬似太陽光源、ハロゲンランプ、水銀ランプ、太陽光、または、これらの組み合わせである。A tube 46 is inserted into the oxidation tank 41 to allow helium to flow into the aqueous solution 43 in the oxidation tank 41. A gas inlet 47 is formed at the bottom of the reduction tank 44 to allow carbon dioxide to flow into the reduction tank 44. Furthermore, a light source 48 is disposed opposite the oxidation electrode 42 to operate the gas-phase reduction device 100. The light source 48 is, for example, a xenon lamp, a pseudo-sun light source, a halogen lamp, a mercury lamp, sunlight, or a combination of these.

[電気化学測定およびガス・液体生成量測定]
電気化学測定およびガス・液体生成量測定を説明する。
[Electrochemical measurements and gas/liquid production measurements]
Electrochemical measurements and gas and liquid production measurements are explained.

酸化槽41を水溶液43で満たす。酸化電極42には、サファイア基板上にn型半導体である窒化ガリウム(GaN)の薄膜と、窒化アルミニウムガリウム(AlGaN)の薄膜とを、その順にエピタキシャル成長させ、その上にニッケル(Ni)を真空蒸着して熱処理を行うことで、酸化ニッケル(NiO)の助触媒薄膜を形成した基板を用いた。そして、その酸化電極42を、水溶液43に浸水するように酸化槽41内に設置した。水溶液43は、1.0mol/Lの水酸化カリウム水溶液とした。光源48には、300Wの高圧キセノンランプ(波長450nm以上をカット、照度6.6mW/cm)を用い、酸化電極42の半導体光電極の酸化助触媒が形成されている面(NiOの形成面)が照射面となるように固定した。酸化電極42の光照射面積を2.5cmとした。 The oxidation tank 41 is filled with the aqueous solution 43. For the oxidation electrode 42, a substrate was used in which a thin film of gallium nitride (GaN) and a thin film of aluminum gallium nitride (AlGaN) were epitaxially grown in that order on a sapphire substrate, and nickel (Ni) was vacuum-deposited thereon and heat-treated to form a nickel oxide (NiO) promoter thin film. The oxidation electrode 42 was then placed in the oxidation tank 41 so as to be immersed in the aqueous solution 43. The aqueous solution 43 was a 1.0 mol/L aqueous potassium hydroxide solution. For the light source 48, a 300W high-pressure xenon lamp (cutting wavelengths of 450 nm or more, illuminance 6.6 mW/cm 2 ) was used, and the surface of the semiconductor photoelectrode of the oxidation electrode 42 on which the oxidation promoter was formed (the surface on which NiO was formed) was fixed as the irradiated surface. The light irradiation area of the oxidation electrode 42 was set to 2.5 cm 2 .

酸化槽41に対してチューブ46からヘリウムを、還元槽44に対して気体入力口47から二酸化炭素を、それぞれ流量5ml/minかつ圧力0.18MPaで流し入れた。この系では、電解質膜支持型還元電極30内の[電解質膜-銅(還元電極)-気相の二酸化炭素]からなる三相界面において、二酸化炭素の還元反応を進行させることができる。Helium was fed into the oxidation tank 41 through the tube 46, and carbon dioxide was fed into the reduction tank 44 through the gas inlet 47, each at a flow rate of 5 ml/min and a pressure of 0.18 MPa. In this system, the reduction reaction of carbon dioxide can be carried out at the three-phase interface consisting of [electrolyte membrane - copper (reduction electrode) - gas-phase carbon dioxide] in the electrolyte membrane supported reduction electrode 30.

酸化槽41と還元槽44とをヘリウムと二酸化炭素とでそれぞれ十分に置換した後、光源48を用いて酸化電極42に均一に光を300分間照射した。酸化電極42への光照射により、酸化電極42と還元電極2との間に電子が流れる。光照射時の酸化電極42と還元電極2との間の電流値を、電気化学測定装置(Solartron社製、1287型ポテンショガルバノスタット)で測定した。また、光照射中の任意の時間に、酸化槽41内および還元槽44内のガスおよび液体を採取し、ガスクロマトグラフおよび液体クロマトグラフ、ガスクロマトグラフ質量分析計で反応生成物を分析した。その結果、酸化槽41内では、酸素が生成され、還元槽44内では、水素、一酸化炭素、ギ酸、メタン、メタノール、エタノール、エチレンが生成されていることを確認した。After the oxidation tank 41 and the reduction tank 44 were fully replaced with helium and carbon dioxide, respectively, the oxidation electrode 42 was uniformly irradiated with light for 300 minutes using the light source 48. When the oxidation electrode 42 was irradiated with light, electrons flowed between the oxidation electrode 42 and the reduction electrode 2. The current value between the oxidation electrode 42 and the reduction electrode 2 during light irradiation was measured with an electrochemical measurement device (Solartron, 1287 type potentiogalvanostat). In addition, gas and liquid in the oxidation tank 41 and the reduction tank 44 were collected at any time during light irradiation, and the reaction products were analyzed with a gas chromatograph, a liquid chromatograph, and a gas chromatograph mass spectrometer. As a result, it was confirmed that oxygen was generated in the oxidation tank 41, and hydrogen, carbon monoxide, formic acid, methane, methanol, ethanol, and ethylene were generated in the reduction tank 44.

[実施例2]
実施例2では、電解質膜支持型還元電極30の製造方法の工程4において、電解質膜1の還元剤溶液22への浸漬時間を10分間にした。それ以外の条件は実施例1と同様である。
[Example 2]
In Example 2, the electrolyte membrane 1 was immersed in the reducing agent solution 22 for 10 minutes in step 4 of the method for producing the electrolyte membrane supported reduction electrode 30. The other conditions were the same as those in Example 1.

[実施例3]
実施例3では、電解質膜支持型還元電極30の製造方法の工程4において、電解質膜1の還元剤溶液22への浸漬時間を30分間にした。それ以外の条件は実施例1と同様である。
[Example 3]
In Example 3, the electrolyte membrane 1 was immersed in the reducing agent solution 22 for 30 minutes in step 4 of the method for producing the electrolyte membrane supported reduction electrode 30. The other conditions were the same as those in Example 1.

[実施例4]
実施例4では、電解質膜支持型還元電極30の製造方法の工程4において、電解質膜1の還元剤溶液22への浸漬時間を60分間にした。それ以外の条件は実施例1と同様である。
[Example 4]
In Example 4, the electrolyte membrane 1 was immersed in the reducing agent solution 22 for 60 minutes in step 4 of the method for producing the electrolyte membrane supported reduction electrode 30. The other conditions were the same as those in Example 1.

[実施例5]
実施例5では、図5に示すように、酸化電極42への光照射を60分間行い(ON)、30分間停止する(OFF)、という運転を繰り返し行い、酸化電極42への総光照射時間が300分間になったときに測定を停止した。それ以外の条件は実施例3と同様である。
[Example 5]
5, the oxidation electrode 42 was irradiated with light for 60 minutes (ON) and then stopped for 30 minutes (OFF), and the measurement was stopped when the total irradiation time of the oxidation electrode 42 with light reached 300 minutes. The other conditions were the same as those of Example 3.

[実施例6]
[電解質膜支持型還元電極の製造方法]
電解質膜支持型還元電極30は、実施例1と同様の手順で製造する。
[Example 6]
[Method of manufacturing an electrolyte membrane supported reduction electrode]
The electrolyte membrane supported reduction electrode 30 is manufactured in the same manner as in the first embodiment.

[二酸化炭素の気相還元装置の構成]
図6は、実施例6に係る二酸化炭素の気相還元装置100の構成を示す図である。当該二酸化炭素の気相還元装置100は、気相の二酸化炭素の電解還元反応の装置(電解還元反応装置)である。以下、単に気相還元装置100という。
[Configuration of the carbon dioxide gas phase reduction device]
6 is a diagram showing the configuration of a gas-phase carbon dioxide reduction apparatus 100 according to Example 6. The gas-phase carbon dioxide reduction apparatus 100 is an apparatus for electrolytic reduction reaction of gas-phase carbon dioxide (electrolytic reduction reaction apparatus). Hereinafter, it will be simply referred to as the gas-phase reduction apparatus 100.

気相還元装置100は、図6に示すように、一筐体の内部空間を二分することで形成された酸化槽41と還元槽44とを備える。酸化槽41は水溶液43で満たされ、水溶液43には半導体または金属錯体からなる酸化電極42が挿入される。酸化槽41に隣接する還元槽44には、その空の内部に二酸化炭素の気体または二酸化炭素を含む気体が満たされる。酸化電極42は、例えば、白金、金、銀、銅、インジウム、ニッケルである。水溶液43の具体例は、実施例1と同様である。 As shown in Figure 6, the gas-phase reduction device 100 includes an oxidation tank 41 and a reduction tank 44 formed by dividing the internal space of a single housing in two. The oxidation tank 41 is filled with an aqueous solution 43, into which an oxidation electrode 42 made of a semiconductor or a metal complex is inserted. The empty interior of the reduction tank 44 adjacent to the oxidation tank 41 is filled with carbon dioxide gas or a gas containing carbon dioxide. The oxidation electrode 42 is, for example, platinum, gold, silver, copper, indium, or nickel. A specific example of the aqueous solution 43 is the same as in Example 1.

上記製造方法で製造した電解質膜支持型還元電極30は、酸化槽41と還元槽44との間に配置される。酸化槽41側には電解質膜1が配置され、還元槽44側には還元電極2が配置される。酸化電極42と還元電極2とは、導線45で接続される。The electrolyte membrane-supported reduction electrode 30 manufactured by the above manufacturing method is placed between the oxidation tank 41 and the reduction tank 44. The electrolyte membrane 1 is placed on the oxidation tank 41 side, and the reduction electrode 2 is placed on the reduction tank 44 side. The oxidation electrode 42 and the reduction electrode 2 are connected by a conductor 45.

酸化槽41には、酸化槽41内の水溶液43にヘリウムを流入するため、チューブ46が挿入される。還元槽44には、還元槽44内に二酸化炭素を流入するため、還元槽44の底部に気体入力口47が形成される。さらに、気相還元装置100を運転するため、電源49が導線45に接続される。A tube 46 is inserted into the oxidation tank 41 to allow helium to flow into the aqueous solution 43 in the oxidation tank 41. A gas inlet 47 is formed at the bottom of the reduction tank 44 to allow carbon dioxide to flow into the reduction tank 44. Furthermore, a power source 49 is connected to the conductor 45 to operate the gas-phase reduction device 100.

[電気化学測定およびガス・液体生成量測定]
電気化学測定およびガス・液体生成量測定を説明する。
[Electrochemical measurements and gas/liquid production measurements]
Electrochemical measurements and gas and liquid production measurements are explained.

酸化槽41を水溶液43で満たす。酸化電極42には、白金(ニラコ社製)を用いた。酸化電極42の表面積の約0.55cmが水溶液43に浸水するように酸化槽41内に設置した。水溶液43は、1.0mol/Lの水酸化カリウム水溶液とした。 The oxidation tank 41 is filled with an aqueous solution 43. Platinum (manufactured by Nilaco Corporation) is used for the oxidation electrode 42. The oxidation electrode 42 is placed in the oxidation tank 41 so that about 0.55 cm2 of its surface area is submerged in the aqueous solution 43. The aqueous solution 43 is a 1.0 mol/L aqueous potassium hydroxide solution.

酸化槽41に対してチューブ46からヘリウムを、還元槽44に対して気体入力口47から二酸化炭素を、それぞれ流量5ml/minかつ圧力0.18MPaで流し入れた。この系では、電解質膜支持型還元電極30内の[電解質膜-銅(還元電極)-気相の二酸化炭素]からなる三相界面において、二酸化炭素の還元反応を進行させることができる。二酸化炭素が直接供給される還元電極2の面積は、約6.25cmである。 Helium was fed into the oxidation vessel 41 through a tube 46, and carbon dioxide was fed into the reduction vessel 44 through a gas inlet 47, each at a flow rate of 5 ml/min and a pressure of 0.18 MPa. In this system, the reduction reaction of carbon dioxide can proceed at a three-phase interface consisting of [electrolyte membrane-copper (reduction electrode)-gas-phase carbon dioxide] in the electrolyte membrane supported reduction electrode 30. The area of the reduction electrode 2 to which carbon dioxide is directly supplied is approximately 6.25 cm2 .

酸化槽41と還元槽44とをヘリウムと二酸化炭素とでそれぞれ十分に置換した後、酸化電極42と還元電極2との間を電源49を介して導線45でつなぎ、電圧2.0Vを印加して300分間電子を流した。電圧2.0Vを印加した時の酸化電極42と還元電極2との間の電流値を、電気化学測定装置で測定した。また、電圧印加中の任意の時間に、酸化槽41内および還元槽44内のガスおよび液体を採取し、ガスクロマトグラフおよび液体クロマトグラフ、ガスクロマトグラフ質量分析計にて反応生成物を分析した。その結果、酸化槽41内では、酸素が生成され、還元槽44内では、水素、一酸化炭素、ギ酸、メタン、メタノール、エタノール、エチレンが生成されていることを確認した。After the oxidation tank 41 and reduction tank 44 were fully replaced with helium and carbon dioxide, respectively, the oxidation electrode 42 and reduction electrode 2 were connected with a conductor 45 via a power source 49, and a voltage of 2.0 V was applied to allow electrons to flow for 300 minutes. The current value between the oxidation electrode 42 and reduction electrode 2 when a voltage of 2.0 V was applied was measured with an electrochemical measurement device. In addition, gas and liquid in the oxidation tank 41 and reduction tank 44 were sampled at any time during the voltage application, and the reaction products were analyzed with a gas chromatograph, a liquid chromatograph, and a gas chromatograph mass spectrometer. As a result, it was confirmed that oxygen was generated in the oxidation tank 41, and hydrogen, carbon monoxide, formic acid, methane, methanol, ethanol, and ethylene were generated in the reduction tank 44.

[実施例7]
実施例7では、電解質膜支持型還元電極30の製造方法の工程4において、電解質膜1の還元剤溶液22への浸漬時間を10分間にした。それ以外の条件は実施例6と同様である。
[Example 7]
In Example 7, the electrolyte membrane 1 was immersed in the reducing agent solution 22 for 10 minutes in step 4 of the method for producing the electrolyte membrane supported reduction electrode 30. The other conditions were the same as those in Example 6.

[実施例8]
実施例8では、電解質膜支持型還元電極30の製造方法の工程4において、電解質膜1の還元剤溶液22への浸漬時間を30分間にした。それ以外の条件は実施例6と同様である。
[Example 8]
In Example 8, the electrolyte membrane 1 was immersed in the reducing agent solution 22 for 30 minutes in step 4 of the method for producing the electrolyte membrane supported reduction electrode 30. The other conditions were the same as those in Example 6.

[実施例9]
実施例9では、電解質膜支持型還元電極30の製造方法の工程4において、電解質膜1の還元剤溶液22への浸漬時間を60分間にした。それ以外の条件は実施例6と同様である。
[Example 9]
In Example 9, the electrolyte membrane 1 was immersed in the reducing agent solution 22 for 60 minutes in step 4 of the method for producing the electrolyte membrane supported reduction electrode 30. The other conditions were the same as those in Example 6.

[実施例10]
実施例10では、図5に示したように、電源49による電圧印加を60分間行い(ON)、30分間停止する(OFF)、という運転を繰り返し行い、総電圧印加時間が300分間になったときに測定を停止した。それ以外の条件は実施例8と同様である。
[Example 10]
In Example 10, as shown in Fig. 5, the voltage application by the power source 49 was repeated for 60 minutes (ON) and for 30 minutes (OFF), and the measurement was stopped when the total voltage application time reached 300 minutes. The other conditions were the same as those in Example 8.

[比較対象例1]
[電解質膜支持型還元電極の製造方法]
実施例1に記載の工程1~工程5のうち、工程4(電解質膜1の還元剤溶液22への浸漬)を行うことなく、金属塩溶液21と還元剤溶液22とを第1の槽11と第2の槽12とにそれぞれ同時に注入した。それ以外の製造方法は実施例1と同様である。製造後の電解質膜支持型還元電極30の断面を観察すると、図3の拡大図(b)に示すように、電解質膜1の粗化面から300nmの深さまで還元電極2が電解質膜1の内部にめり込むように形成されていた。
[Comparative Example 1]
[Method of manufacturing an electrolyte membrane supported reduction electrode]
Of steps 1 to 5 described in Example 1, step 4 (immersion of the electrolyte membrane 1 in the reducing agent solution 22) was not performed, and the metal salt solution 21 and the reducing agent solution 22 were simultaneously injected into the first tank 11 and the second tank 12, respectively. The rest of the manufacturing method was the same as in Example 1. When a cross section of the electrolyte membrane supported reduction electrode 30 after manufacture was observed, as shown in the enlarged view (b) of FIG. 3, the reduction electrode 2 was formed so as to be embedded into the electrolyte membrane 1 to a depth of 300 nm from the roughened surface of the electrolyte membrane 1.

[二酸化炭素の気相還元装置の構成]
光照射による二酸化炭素の気相還元装置であり、実施例1と同様である。
[Configuration of the carbon dioxide gas phase reduction device]
This is an apparatus for reducing carbon dioxide gas phase by light irradiation, and is the same as that in the first embodiment.

[電気化学測定およびガス・液体生成量測定]
実施例1と同様である。
[Electrochemical measurements and gas/liquid production measurements]
This is the same as in Example 1.

[比較対象例2]
[電解質膜支持型還元電極の製造方法]
比較対象例1と同様である。
[Comparative Example 2]
[Method of manufacturing an electrolyte membrane supported reduction electrode]
The same as Comparative Example 1.

[二酸化炭素の気相還元装置の構成]
光照射による二酸化炭素の気相還元装置であり、実施例1と同様である。
[Configuration of the carbon dioxide gas phase reduction device]
This is an apparatus for reducing carbon dioxide gas phase by light irradiation, and is the same as that in the first embodiment.

[電気化学測定およびガス・液体生成量測定]
図5に示したように、酸化電極42への光照射を60分間行い(ON)、30分間停止する(OFF)、という運転を繰り返し行い、酸化電極42への総光照射時間が300分間になったときに測定を停止した。それ以外の条件は実施例1と同様である。
[Electrochemical measurements and gas/liquid production measurements]
5, the oxidation electrode 42 was irradiated with light for 60 minutes (ON) and then stopped for 30 minutes (OFF), and the measurement was stopped when the total light irradiation time of the oxidation electrode 42 reached 300 minutes. The other conditions were the same as those in Example 1.

[比較対象例3]
[電解質膜支持型還元電極の製造方法]
比較対象例1と同様である。
[Comparative Example 3]
[Method of manufacturing an electrolyte membrane supported reduction electrode]
The same as Comparative Example 1.

[二酸化炭素の気相還元装置の構成]
電圧印加による二酸化炭素の気相還元装置であり、実施例6と同様である。
[Configuration of the carbon dioxide gas phase reduction device]
This is a gas phase reduction device for carbon dioxide by applying a voltage, and is similar to that of Example 6.

[電気化学測定およびガス・液体生成量測定]
実施例6と同様である。
[Electrochemical measurements and gas/liquid production measurements]
Same as Example 6.

[比較対象例4]
[電解質膜支持型還元電極の製造方法]
比較対象例1と同様である。
[Comparative Example 4]
[Method of manufacturing an electrolyte membrane supported reduction electrode]
The same as Comparative Example 1.

[二酸化炭素の気相還元装置の構成]
電圧印加による二酸化炭素の気相還元装置であり、実施例6と同様である。
[Configuration of the carbon dioxide gas phase reduction device]
This is a gas phase reduction device for carbon dioxide by applying a voltage, and is similar to that of Example 6.

[電気化学測定およびガス・液体生成量測定]
図5に示したように、電源49による電圧印加を60分間行い(ON)、30分間停止する(OFF)、という運転を繰り返し行い、総電圧印加時間が300分間になったときに測定を停止した。それ以外の条件は実施例6と同様である。
[Electrochemical measurements and gas/liquid production measurements]
5, the voltage application by the power source 49 was repeated for 60 minutes (ON) and 30 minutes (OFF), and the measurement was stopped when the total voltage application time reached 300 minutes. The other conditions were the same as in Example 6.

[二酸化炭素の還元反応の実験結果]
実施例1~4、6~9および比較対象例1、3による二酸化炭素還元のファラデー効率を表2に示す。表2は、300分間連続で光照射または電圧印加した場合の二酸化炭素還元のファラデー効率(積算値)である。
[Experimental results of carbon dioxide reduction reaction]
Table 2 shows the faradaic efficiency of carbon dioxide reduction in Examples 1 to 4, 6 to 9 and Comparative Examples 1 and 3. Table 2 shows the faradaic efficiency (integrated value) of carbon dioxide reduction when light irradiation or voltage application was performed continuously for 300 minutes.

Figure 0007587167000002
Figure 0007587167000002

また、実施例5、10および比較対象例2、4による二酸化炭素還元のファラデー効率を表3に示す。表3は、光照射または電圧印加を60分間ON、30分間OFFする運転を繰り返した場合における、300分後の二酸化炭素還元のファラデー効率(積算値)である。Table 3 shows the Faraday efficiency of carbon dioxide reduction in Examples 5 and 10 and Comparative Examples 2 and 4. Table 3 shows the Faraday efficiency (integrated value) of carbon dioxide reduction after 300 minutes when light irradiation or voltage application was repeatedly turned on for 60 minutes and off for 30 minutes.

Figure 0007587167000003
Figure 0007587167000003

二酸化炭素還元のファラデー効率とは、式(3)に示すように、光照射または電圧印加により電極間に流れた電子数に対して、二酸化炭素の還元反応に使われた電子数の割合を示す値である。The Faraday efficiency of carbon dioxide reduction is a value that indicates the ratio of the number of electrons used in the carbon dioxide reduction reaction to the number of electrons that flow between the electrodes due to light irradiation or voltage application, as shown in equation (3).

二酸化炭素還元のファラデー効率=(二酸化炭素の還元反応の電子数)/(酸化電極-還元電極間の電子数) ・・・(3)
式(3)の「二酸化炭素の還元反応の電子数」は、二酸化炭素の還元生成物の積算生成量の測定値を、その生成反応に必要な電子数に換算することで求めることができる。還元反応生成物の濃度をA[ppm]、キャリアガスの流量をB[L/sec]、還元反応に必要な電子数をZ[mol]、ファラデー定数をF[C/mol]、気体のモル体をVm[L/mol]、光照射時間または電圧印加時間をT[sec]としたとき、式(4)を用いて算出した。
Faraday efficiency of carbon dioxide reduction=(number of electrons in the carbon dioxide reduction reaction)/(number of electrons between the oxidation electrode and the reduction electrode) (3)
The "number of electrons in the reduction reaction of carbon dioxide" in formula (3) can be calculated by converting the measured cumulative amount of the reduction product of carbon dioxide into the number of electrons required for the production reaction. It was calculated using formula (4) when the concentration of the reduction reaction product is A [ppm], the flow rate of the carrier gas is B [L/sec], the number of electrons required for the reduction reaction is Z [mol], the Faraday constant is F [C/mol], the molar mass of the gas is Vm [L/mol], and the light irradiation time or voltage application time is T [sec].

二酸化炭素の還元反応の電子値[C]=(A×B×Z×F×T×10-6)/Vm ・・・(4)
表2より、実施例1~4および実施例6~9では、比較対象例1および比較対象例3とそれぞれ比較して、二酸化炭素還元のファラデー効率が向上したことを確認した。これは、各実施例1~4、6~9において、電解質膜の内部に還元電極がめり込まず、電解質膜の直上から還元電極が形成できていたことが要因と考えられる。
Electron value for the reduction reaction of carbon dioxide [C] = (A x B x Z x F x T x 10 -6 ) / Vm (4)
From Table 2, it was confirmed that the faradaic efficiency of carbon dioxide reduction was improved in Examples 1 to 4 and Examples 6 to 9 compared with Comparative Example 1 and Comparative Example 3. This is believed to be because in each of Examples 1 to 4 and 6 to 9, the reduction electrode was not embedded in the electrolyte membrane, and the reduction electrode was able to be formed directly above the electrolyte membrane.

各実施例1~10では、比較対象例1~4と異なり、無電解めっき処理前に、工程4として電解質膜を還元剤溶液に浸漬させた。これにより、無電解めっき処理前に電解質膜の粗化面まで還元剤溶液が拡散・浸透したため、第1の槽に金属塩溶液を注入した際に電解質膜の粗化面の直上から還元電極が形成される。In each of Examples 1 to 10, unlike Comparative Examples 1 to 4, the electrolyte membrane was immersed in a reducing agent solution in step 4 before the electroless plating process. As a result, the reducing agent solution diffused and penetrated up to the roughened surface of the electrolyte membrane before the electroless plating process, and a reduction electrode was formed directly above the roughened surface of the electrolyte membrane when the metal salt solution was injected into the first tank.

一方、比較対象例1~4では、工程4を行うことなく、第1の槽と第2の槽とに金属塩溶液と還元剤溶液とをそれぞれ同時に注入した。この場合、金属塩溶液も少量だけ電解質膜の内部に浸透する。それゆえ、還元剤溶液が電解質膜の粗化面まで浸透する前に、金属塩溶液が電解質膜の内部で接触し、還元電極が電解質膜内にめり込むように形成される。また、比較対象例1~4の場合、電解質膜の内部に形成された還元電極の部分には二酸化炭素が供給できないことに加えて、電解質膜は膜内に水を含んでいることから、電解質膜内の水分が電解質膜内の溶存酸素と反応して還元電極が酸化される。その結果、酸化した電極自身の還元反応が優先して進行し、二酸化炭素還元反応が抑制されてしまう。On the other hand, in Comparative Examples 1 to 4, the metal salt solution and the reducing agent solution were simultaneously injected into the first tank and the second tank, respectively, without performing step 4. In this case, only a small amount of the metal salt solution also penetrates into the electrolyte membrane. Therefore, before the reducing agent solution penetrates the roughened surface of the electrolyte membrane, the metal salt solution comes into contact with the inside of the electrolyte membrane, and the reduction electrode is formed so as to be embedded in the electrolyte membrane. In addition, in the case of Comparative Examples 1 to 4, carbon dioxide cannot be supplied to the part of the reduction electrode formed inside the electrolyte membrane, and since the electrolyte membrane contains water within the membrane, the moisture within the electrolyte membrane reacts with the dissolved oxygen within the electrolyte membrane to oxidize the reduction electrode. As a result, the reduction reaction of the oxidized electrode itself proceeds preferentially, and the carbon dioxide reduction reaction is suppressed.

以上より、実施例1~10で工程4を実施することにより、電解質膜への還元電極のめり込みが抑制され、二酸化炭素の還元反応の効率が向上した。 From the above, by performing step 4 in Examples 1 to 10, the sinking of the reduction electrode into the electrolyte membrane was suppressed, and the efficiency of the carbon dioxide reduction reaction was improved.

また、実施例1~4および実施例6~9の各二酸化炭素還元のファラデー効率を比較すると、工程4での電解質膜の還元剤溶液への浸漬時間が30分以上である実施例3、4および実施例8、9の方が、30分未満である実施例1、2および実施例6、7よりも高い。浸漬時間に対する電解質膜にめり込む還元電極の深さを分析すると、実施例1と実施例6、実施例2と実施例7、実施例3と実施例8、実施例4と実施例9のそれぞれについて、250nm、150nm、20nm、20nmであった。この結果から、浸漬時間が30分未満の範囲では、めり込む還元電極の深さが深くなる傾向が得られ、浸漬時間が30分以上では、深さ20nmで飽和値となり、二酸化炭素還元のファラデー効率がより向上することが想定される。したがって、電解質膜は、予め還元剤溶液に30分以上浸漬させることが望ましい。 In addition, when comparing the Faraday efficiency of carbon dioxide reduction in Examples 1 to 4 and Examples 6 to 9, Examples 3, 4 and Examples 8, 9, in which the electrolyte membrane is immersed in the reducing agent solution for 30 minutes or more in step 4, are higher than Examples 1, 2 and Examples 6, 7, in which the electrolyte membrane is immersed in the reducing agent solution for less than 30 minutes. When the depth of the reduction electrode embedded in the electrolyte membrane versus the immersion time is analyzed, it is 250 nm, 150 nm, 20 nm, and 20 nm for Examples 1 and 6, Examples 2 and 7, Examples 3 and 8, and Examples 4 and 9, respectively. From these results, it is possible to obtain a tendency for the depth of the reduction electrode to be deeper when the immersion time is less than 30 minutes, and when the immersion time is 30 minutes or more, the saturation value is reached at a depth of 20 nm, and it is assumed that the Faraday efficiency of carbon dioxide reduction is further improved. Therefore, it is desirable to immerse the electrolyte membrane in the reducing agent solution in advance for 30 minutes or more.

また、表3より、実施例5、10では、比較対象例2、4とそれぞれ比較して、二酸化炭素還元のファラデー効率が向上した。実施例5、10については、表2に示す300分間連続運転させた実施例3、8とそれぞれほぼ同程度のファラデー効率が得られた。比較対象例2、4のファラデー効率が低いのは、二酸化炭素の気相還元装置のON、OFFを繰り返す際に、OFFと共に還元電極が酸化され、再びONにすると酸化された電極の還元反応が優先して進行することから、二酸化炭素の還元反応の効率が低下してしまうことが要因と考えられる。 Also, from Table 3, in Examples 5 and 10, the faradaic efficiency of carbon dioxide reduction was improved compared to Comparative Examples 2 and 4, respectively. For Examples 5 and 10, the faradaic efficiency was approximately the same as that of Examples 3 and 8, which were operated continuously for 300 minutes, as shown in Table 2. The reason why the faradaic efficiency of Comparative Examples 2 and 4 is low is thought to be that when the gas phase carbon dioxide reduction device is repeatedly turned on and off, the reduction electrode is oxidized when it is turned off, and when it is turned on again, the reduction reaction of the oxidized electrode proceeds preferentially, resulting in a decrease in the efficiency of the carbon dioxide reduction reaction.

以上より、実施例5、10では、工程4を行うことにより、電解質膜への還元電極のめり込みを抑制でき、OFFの状態で還元電極が酸化されるのを抑制できることから、二酸化炭素の還元反応の効率が向上した。 From the above, in Examples 5 and 10, by performing step 4, it was possible to suppress the sinking of the reduction electrode into the electrolyte membrane and to suppress the oxidation of the reduction electrode in the OFF state, thereby improving the efficiency of the carbon dioxide reduction reaction.

[発明の効果]
本発明によれば、無電解めっき法による二酸化炭素の気相還元用の電解質膜支持型還元電極の製造において、無電解めっき処理を行う前に電解質膜を還元剤溶液に浸漬するので、還元電極作製時および還元反応停止時における電解質膜内部の還元電極の形成を抑制できる。その結果、還元電極の酸化を抑制でき、二酸化炭素の還元反応の効率を向上できる。
[Effects of the Invention]
According to the present invention, in the manufacture of an electrolyte membrane-supported reduction electrode for gas-phase reduction of carbon dioxide by electroless plating, the electrolyte membrane is immersed in a reducing agent solution before electroless plating, so that the formation of a reduction electrode inside the electrolyte membrane during the preparation of the reduction electrode and when the reduction reaction is stopped can be suppressed. As a result, oxidation of the reduction electrode can be suppressed, and the efficiency of the reduction reaction of carbon dioxide can be improved.

1:電解質膜
2:還元電極
11:第1の槽
12:第2の槽
21:金属塩溶液
22:還元剤溶液
30:電解質膜支持型還元電極
41:酸化槽
42:酸化電極
43:水溶液
44:還元槽
45:導線
46:チューブ
47:気体入力口
48:光源
49:電源
1: Electrolyte membrane 2: Reduction electrode 11: First tank 12: Second tank 21: Metal salt solution 22: Reducing agent solution 30: Electrolyte membrane supported reduction electrode 41: Oxidation tank 42: Oxidation electrode 43: Aqueous solution 44: Reduction tank 45: Conductor 46: Tube 47: Gas inlet 48: Light source 49: Power source

Claims (5)

酸化電極を含む酸化槽と空の内部に二酸化炭素が供給される還元槽との間に配置される電解質膜支持型還元電極の製造方法において、
電解質膜の片面の反対面を還元剤溶液に浸漬する第1の工程と、
前記第1の工程の後、前記電解質膜の片面を金属イオンを含む金属塩溶液に浸漬する第2の工程と、
を行う電解質膜支持型還元電極の製造方法。
A method for producing an electrolyte membrane supported reduction electrode disposed between an oxidation chamber including an oxidation electrode and a reduction chamber into which carbon dioxide is supplied, comprising the steps of:
A first step of immersing a surface opposite to one surface of an electrolyte membrane in a reducing agent solution;
a second step of immersing one surface of the electrolyte membrane in a metal salt solution containing metal ions after the first step ;
The present invention relates to a method for producing an electrolyte membrane-supported reduction electrode.
前記第1の工程および前記第2の工程を行う前に、
前記電解質膜の片面を粗化する工程と、
前記電解質膜を沸騰硝酸に浸漬する工程と、
前記電解質膜を沸騰純水に浸漬する工程と、
を行う請求項1に記載の電解質膜支持型還元電極の製造方法。
Before carrying out the first step and the second step,
Roughening one surface of the electrolyte membrane;
immersing the electrolyte membrane in boiling nitric acid;
immersing the electrolyte membrane in boiling pure water;
2. The method for producing an electrolyte membrane supported reduction electrode according to claim 1, further comprising the steps of:
前記第2の工程は、
前記電解質膜の反対面を前記還元剤溶液に浸漬し、前記電解質膜の片面を前記金属塩溶液に浸漬する無電解めっき処理により、前記電解質膜の片面に還元電極用の金属を析出させる工程である請求項1または2に記載の電解質膜支持型還元電極の製造方法。
The second step includes:
3. The method for producing an electrolyte membrane supported reduction electrode according to claim 1 or 2, wherein the method comprises the steps of: immersing an opposite surface of the electrolyte membrane in the reducing agent solution; and immersing one surface of the electrolyte membrane in the metal salt solution by electroless plating to deposit a metal for a reduction electrode on one surface of the electrolyte membrane.
前記還元剤溶液に含まれる還元剤は、
極性化合物である請求項1ないし3のいずれかに記載の電解質膜支持型還元電極の製造方法。
The reducing agent contained in the reducing agent solution is
4. The method for producing an electrolyte membrane supported reduction electrode according to claim 1, wherein the compound is a polar compound.
前記電解質膜は、
カチオンまたはアニオンを伝導する固体高分子膜である請求項1ないし4のいずれかに記載の電解質膜支持型還元電極の製造方法。
The electrolyte membrane is
5. The method for producing an electrolyte membrane-supported reduction electrode according to claim 1, wherein the electrolyte membrane is a solid polymer membrane that conducts cations or anions.
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Citations (3)

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JP2004197215A (en) 2002-08-23 2004-07-15 Eamex Co Method of forming electrode by plating, stacked body, and device using the stacked body
JP2008223118A (en) 2007-03-15 2008-09-25 Mitsubishi Electric Corp Solid polymer electrolyte membrane, method for producing the same, and electrolysis element
WO2020121556A1 (en) 2018-12-10 2020-06-18 日本電信電話株式会社 Carbon dioxide gas-phase reduction device and carbon dioxide gas-phase reduction method

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