JP7645486B2 - Component mounting device and component mounting method - Google Patents

Description

This disclosure relates to a component mounting device and a component mounting method.

In semiconductor and other circuit board manufacturing factories, multiple mounting board production lines are installed, and multiple component mounting devices are arranged on each mounting board production line. Each component mounting device mounts electronic components and other components at the position on the circuit board where cream solder has been printed. In recent years, in order to increase the productivity of circuit board manufacturing factories, there has been a demand for improving the operating efficiency of these component mounting devices as well.

A conventional component placement device is known in which a nozzle is mounted on a moving head, and an electronic component held by the nozzle is illuminated by an illumination unit and then captured by a component recognition camera to perform image recognition of the electronic component (see, for example, Patent Document 1).

JP 2001-94299 A

It is assumed that the lighting unit disclosed in Patent Document 1 is used to capture and recognize a component picked up by a nozzle mounted on a moving head while moving (scanning) above a component recognition camera. In this case, multiple images need to be acquired in order to recognize each of the different states or postures of the component. Furthermore, in order to acquire multiple images, the component needs to be moved above the component recognition camera at least twice. As a result, it takes time to recognize the component.

In addition, in order to recognize different states or postures of a part using multiple captured images, different pixel brightness values are required for the multiple images. Therefore, a wide range of pixel brightness values (dynamic range) is required across the multiple images.

The present disclosure provides a component mounting device and a component mounting method that can improve the accuracy of image-based component recognition by ensuring a wide dynamic range for multiple images, shorten the time required for component recognition, and improve component mounting efficiency.

One aspect of the present disclosure is a component mounting device comprising: an illumination unit that illuminates a component held by a head, and an imaging unit that images the component from below in an imaging range including the entire component ; an imaging control unit that controls imaging by the imaging unit and illumination conditions including information about brightness of illumination by the illumination unit at the time of imaging; an imaging control unit that recognizes the component from an image captured by the imaging unit; and a component mounting unit that mounts the component on a board with the head based on a recognition result by the component recognition unit, wherein the imaging control unit acquires a first image including the entire component by turning on the illumination unit under a first illumination condition and having the imaging unit capture an image at a first time point when the component is moving above the imaging unit, and acquires a second image including the entire component by turning on the illumination unit under a second illumination condition different from the first illumination condition and having the imaging unit capture an image at a second time point when the component is moving above the imaging unit, and the component recognition unit recognizes the component based on the first image and the second image.

One aspect of the present disclosure is a component mounting method comprising the steps of controlling lighting conditions including information about brightness of lighting when an image is captured by an illumination unit that illuminates a component held by a head, and controlling imaging by an imaging unit that captures an image of the component held by the head from below in an imaging range including the entire component , recognizing the component from the image captured by the imaging unit, and mounting the component on a board with the head based on a result of the component recognition, wherein the step of controlling imaging includes the steps of: at a first timing when the component is moving above the imaging unit, turning on the illumination unit under a first lighting condition and causing the imaging unit to capture an image, thereby obtaining a first image including the entire component , and at a second timing when the component is moving above the imaging unit, turning on the illumination unit under a second lighting condition different from the first lighting condition and causing the imaging unit to capture an image, thereby obtaining a second image including the entire component, and the step of recognizing the component includes the step of recognizing the component based on the first image and the second image.

According to the present disclosure, by ensuring a wide dynamic range for multiple images, it is possible to improve the accuracy of image-based component recognition, shorten the time required for component recognition, and improve component mounting efficiency.

FIG. 2 is a top view illustrating a mechanical configuration of the component mounting device according to the first embodiment; FIG. 2 is a side view illustrating a mechanical configuration of the component mounting apparatus shown in FIG. FIG. 3 is a perspective view illustrating the operation of the moving head shown in FIG. FIG. 3 is a side view illustrating a mechanical configuration of the component recognition camera shown in FIG. FIG. 5 is a perspective view illustrating a mechanical configuration of the lighting unit shown in FIG. FIG. 2 is a block diagram illustrating a functional configuration of a control unit of the component mounting device shown in FIG. FIG. 2 is a schematic diagram illustrating an example of an arrangement of nozzles for mounting components and imaging timings under various lighting conditions when imaging components mounted on the nozzles; Graph showing an example of workpiece reflectance and image brightness for each portion of a part when the part is illuminated and imaged with an illumination value of 50. Graph showing an example of workpiece reflectance and image brightness for each portion of a part when the part is illuminated and imaged with an illumination value of 150. A table showing specific examples of lighting conditions for a part that is imaged multiple times. FIG. 1 is an image diagram illustrating an example of an image of a component captured under illumination conditions for alignment; FIG. 1 is an image diagram illustrating an example of an image of a part captured under lighting conditions for character recognition. 1 is a flowchart illustrating an example of an operation of a component mounting device.

Below, the embodiments will be described in detail with reference to the drawings as appropriate. However, more detailed explanations than necessary may be omitted. For example, detailed explanations of already well-known matters or duplicate explanations of substantially identical configurations may be omitted. This is to avoid the following explanation becoming unnecessarily redundant and to facilitate understanding by those skilled in the art. Note that the attached drawings and the following explanation are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

For example, the term "part" or "device" in the embodiments is not limited to a physical configuration that is mechanically realized by hardware, but also includes configurations whose functions are realized by software such as a program. Furthermore, the functions of one configuration may be realized by two or more physical configurations, or the functions of two or more configurations may be realized by, for example, one physical configuration.

<Mechanical configuration of the component mounting device>
First, the mechanical configuration of the component mounting device 1 will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a top view illustrating the mechanical configuration of the component mounting device 1 according to the first embodiment. Fig. 2 is a side view illustrating the mechanical configuration of the component mounting device 1 shown in Fig. 1. In Fig. 1 and Fig. 2, the front side of the component mounting device 1 (the lower side in the plane of Fig. 1 and the left side in the plane of Fig. 2) is also referred to as the front side, and the back side of the component mounting device 1 (the upper side in the plane of Fig. 1 and the right side in the plane of Fig. 2) is also referred to as the rear side.

One or more component mounting devices 1 are arranged in a mounting board manufacturing line for mounting various components P to a board W, and mount the components P in a predetermined position and orientation on the board W transported from upstream of the mounting board manufacturing line.

As shown in Figures 1 and 2, the component mounting device 1 is mainly configured to include a main body mechanism 10 (an example of a component mounting unit) that mounts components P (e.g., electronic components such as ICs (integrated circuits), transistors, and capacitors, lead components, chip components, or BGA (ball grid array) components) on a board W by the operation of each component mechanism, and a control unit 40 that controls the operation of the main body mechanism 10. The main body mechanism 10 has a mounting machine main body 11 composed of a base 12 and the like, and a head unit 23 that is movable relative to the mounting machine main body 11. The control unit 40 is stored inside the base 12 (see below) of the component mounting device 1, and controls various mechanisms such as the mounting machine main body 11 and the head unit 23.

A board transport mechanism 13 is disposed in the center of the base 12 of the mounting machine main body 11 along the X direction (the transport direction of the board W) shown in FIG. 1. The board transport mechanism 13 has a pair of conveyor sections 14 extending along the X direction, and transports the board W placed on the pair of conveyor sections 14, positions it at a predetermined mounting position, and holds it.

A pair of component supply mechanisms 15 are disposed facing each other on both the front and rear sides of the board transport mechanism 13 (top and bottom sides in the plane of FIG. 1, left and right sides in the plane of FIG. 2). Each of the pair of component supply mechanisms 15 has a feeder base 16 in which a slot 17 is provided, and multiple tape feeders 18 are attached in parallel to the slots 17 as part feeders.

The component mounting device 1 further includes a feeder cart 19. The feeder cart 19 includes a carriage section 20 with multiple wheels disposed on its underside, and multiple reel stock sections (not shown) disposed on the upper side of the carriage section 20. A reel 21 is housed in each of the multiple reel stock sections. A carrier tape 22 containing a component P is pulled out from each of the reels 21, and the component P is supplied to the tape feeder 18 of the component supply mechanism 15. As a result, the tape feeder 18 of the component supply mechanism 15 pitch-feeds the carrier tape 22 in the tape feed direction, thereby supplying the component P to a removal position where removal (pickup) is performed by a moving head 26 of the head unit 23 described below.

The head unit 23 is disposed above the base 12 and is configured to be movable between a mounting position and a removal position where the component supply mechanism 15 and the substrate W are disposed. Specifically, the head unit 23 is capable of linear movement along the X and Y directions by an X-axis table mechanism 25 and a Y-axis table mechanism 24 that are disposed orthogonal to each other on a plane substantially parallel to the surface of the substrate W.

On the upper surface of the base 12, a Y-axis table mechanism 24 is disposed along the Y direction. A pair of front and rear X-axis table mechanisms 25 are disposed along the X direction, and are attached to each of the Y-axis table mechanisms 24 so as to be slidable along the Y direction. A moving head 26 is attached to the tip of each of the pair of front and rear X-axis table mechanisms 25 so as to be slidable along the X direction. That is, in the first embodiment, the moving head 26 is mounted on the head unit 23, and the moving head 26 is provided so as to be movable independently of each other by the X-axis table mechanism 25 and the Y-axis table mechanism 24. As a result, the moving head 26 is arbitrarily positioned on a plane approximately parallel to the surface of the substrate W, that is, on the horizontal plane (XY plane). Both the X-axis table mechanism 25 and the Y-axis table mechanism 24 are configured with linear guide drive mechanisms.

Between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13, a component recognition camera 28 (an example of an imaging unit) is disposed. The component holding nozzle 27 (see below), which is attached to the moving head 26 while taking out and holding the component P from the component supply mechanism 15, moves and passes above the component recognition camera 28. At this time, the component recognition camera 28 takes images of the component P adsorbed and held by the component holding nozzle 27 as it passes by, multiple times at a predetermined timing and under predetermined lighting conditions (see below). In other words, the component recognition camera 28 takes images of the component P held by the component holding nozzle 27, and while the control unit 40 is changing the lighting conditions multiple times while the component P is moving above it, it takes continuous images at a timing corresponding to each of the lighting conditions (see below). By integrating each of these imaging results and performing recognition processing, the identification and position detection of the component P are performed with high accuracy.

In addition, a nozzle holder 38 and a waste box 37 are further disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. The nozzle holder 38 stores multiple types of component holding nozzles 27 of the moving head 26 corresponding to the components P to be held. By having the moving head 26 access the nozzle holder 38 and performing a predetermined nozzle replacement operation, a component holding nozzle 27 (described below) suitable for the object to be held is attached to the moving head 26. The waste box 37 is formed in a box shape and has an internal space, in which components P determined to be defective as a result of recognition of the image captured by the component recognition camera 28 are discarded.

<Configuration and operation of moving head>
Next, the configuration and operation of the moving head 26 will be described with reference to Fig. 3. Fig. 3 is a perspective view illustrating the operation of the moving head 26 shown in Fig. 2.

The moving head 26 is a multiple head having multiple moving heads 26, and multiple component holding nozzles 27 are arranged side by side at the bottom end of each moving head 26 (see FIG. 7). For example, the moving head 26 is provided with multiple component holding nozzles 27 (e.g., eight nozzles) in multiple rows (e.g., two rows). In addition, a reflector (an example of a first reflector) (not shown) is fixed to the moving head 26 to reflect illumination light emitted from the transmitted illumination unit 34 (see below). The reflector is positioned above the held component P.

Each of the component holding nozzles 27 uses air pressure, for example, to vacuum-suck and hold the component P from the tape feeder 18 of the component supply mechanism 15, and moves up and down individually. The moving head 26 also has a Z-axis lifting mechanism (not shown) that individually lifts and lowers each of the component holding nozzles 27, and a θ-axis rotation mechanism (not shown) that individually rotates each of the component holding nozzles 27 around the nozzle axis. The Y-axis table mechanism 24 and the X-axis table mechanism 25 are driven to position the moving head 26 arbitrarily in the horizontal plane (XY plane). This movement causes the moving head 26 to suck up and pick up the component P by the component holding nozzle 27 from the pick-up position of the tape feeder 18 of the component supply mechanism 15.

A board recognition camera 36 (see FIG. 1) is fixed to the moving head 26. The board recognition camera 36 is disposed on the underside of the X-axis table mechanism 25 and moves integrally with the moving head 26. As the moving head 26 moves, the board recognition camera 36 passes above the board W positioned by the board transport mechanism 13 and images the board W. The image capture result (image capture information) is similarly processed for recognition, thereby detecting the position and orientation of the board W.

As a result of detecting the position of the board W, the moving head 26 uses its component holding nozzles 27 to place components P at their respective mounting points (e.g., the mounting positions and mounting orientations at which the components P should be placed on the board W) in accordance with instructions from the control unit 40. This mounting of components P at one time is carried out until all of the components P that have been sucked and held by each of the component holding nozzles 27 of the moving head 26 have been placed on the board W. In this way, the components P are held and moved by the component holding nozzles 27 of the moving head 26 between the removal position and the mounting operation position, and are finally placed on the board W.

The component mounting device 1 repeatedly performs a series of operations, using the component holding nozzle 27 of the moving head 26 to pick up and mount multiple components P, then move back to the pick-up position, until mounting is completed at all of the multiple mounting points on the board W. By repeating this operation, multiple components P are sequentially mounted on each of the boards W that are transported in sequence, and after mounting, the boards W on which all of the components P have been mounted are transported to a downstream process. In this way, the mounting machine main body 11 and the head unit 23 operate in coordination, and this coordinated operation is executed according to instructions from the control unit 40.

In addition, in the first embodiment, a series of work units consisting of the forward movement from the removal of component P at the removal position to the mounting work position of component P, and the subsequent return movement to the removal position, is also referred to as a "one turn" work unit. The forward movement from the removal position to the mounting work position in one turn is hereinafter also referred to simply as "forward movement in one turn."

<Configuration of the parts recognition camera>
Next, the configuration of the component recognition camera 28 will be described with reference to Figures 4 and 5. Figure 4 is a side view illustrating the mechanical configuration of the component recognition camera 28 shown in Figure 2. Figure 5 is a perspective view illustrating the mechanical configuration of the lighting unit 31 shown in Figure 4. For ease of explanation, Figure 4 also illustrates the moving head 26 that moves above the component recognition camera 28 and on its optical axis, and also illustrates a schematic diagram of the internal structure of the lighting unit of the component recognition camera 28, as described below.

As shown in FIG. 4, the part recognition camera 28 has an image sensor section 29 and an illumination unit section 31. During just one turn of the part recognition camera 28 (i.e., a single forward movement), the illumination unit section 31 is turned on multiple times for the part P held by the moving head 26, and the image sensor section 29 captures images continuously from below in accordance with each of these timings.

The part recognition camera 28 can capture images according to a scan imaging method, and has an ROI (Region Of Interest) function using an area sensor. With the ROI function, the part recognition camera 28 can set the ROI range of the imaging sensor unit 29 to multiple locations (e.g., two locations) and capture images by switching between these multiple locations continuously.

The imaging sensor unit 29 has a generally cylindrical housing 30 and an imaging element (not shown) built into the housing 30. The imaging element is, for example, a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The imaging sensor unit 29 has a shutter function and is configured to be able to capture an image by exposing it to light at a predetermined timing in accordance with a command from an imaging processing unit 47 (see below) of the control unit 40. The imaging sensor unit 29 transmits the results (imaging information) captured by the imaging element to the control unit 40.

The component recognition camera 28 also has a center camera 29A and a side camera 29B as the imaging sensor unit 29. The center camera 29A is arranged so that its optical axis is aligned along the vertical direction (Z direction), and is capable of capturing an image of the component P moving above the component recognition camera 28. The side cameras 29B are arranged on both sides of the center camera 29A in the horizontal direction, and are arranged so that their optical axes are inclined relative to the vertical direction (Z direction), and are capable of capturing an image of the component P moving above the component recognition camera 28.

The lighting unit section 31 has a box-shaped housing 32, and is arranged in a stacked and connected state on top of the housing 30 of the imaging sensor section 29. The lighting unit section 31 has a plurality of reflective lighting sections 33, a plurality of transmitted lighting sections 34, a plurality of side lighting sections 35, and a coaxial lighting section 39, each of which is arranged inside the housing 32. By appropriately using the plurality of reflective lighting sections 33, the plurality of transmitted lighting sections 34, the plurality of side lighting sections 35, and the coaxial lighting section 39, the component mounting device 1 lights the moving component P under a plurality of lighting conditions and images the component P.

Each of the multiple reflective lighting sections 33 is arranged approximately parallel to the bottom wall 32p (i.e., the XY plane, horizontal plane) of the housing 32 of the lighting unit section 31, and its irradiation direction is set along the optical axis of the center camera 29A. When the reflective lighting section 33 is turned on, its illumination light is irradiated in an approximately vertical direction (approximately the Z direction). A transparent glass G is arranged in the horizontal direction between the reflective lighting section 33 and the component holding nozzle 27 that holds the component P to be illuminated. Reflective lighting is also called oblique lighting.

The component P held by the component holding nozzle 27 is illuminated by the reflective illumination unit 33 at time t1 when the component P moves above the component recognition camera 28, and the underside of the component P is illuminated through the transparent glass G. At the same time as this timing t1, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

Each of the multiple transmitted illumination units 34 is disposed at an angle to the bottom wall 32p and side wall 32q (i.e., the Z direction) of the housing 32, and the illumination direction is oblique to the optical axis of the center camera 29A. A shielding plate B is disposed between each of the reflected illumination units 33 and transmitted illumination units 34. Similarly, the shielding plate B is disposed at an angle to both the bottom wall 32p and side wall 32q of the housing 32.

When the transmitted illumination unit 34 is turned on, the illumination light is emitted obliquely in the vertical direction (Z direction) and the horizontal direction (XY plane). At time t2 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28, the transmitted illumination unit 34 turns on the reflector of the moving head 26, thereby illuminating the component P. In response to this lighting time t2, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

Each of the multiple side lighting units 35 is disposed approximately parallel to the side wall 32q of the housing 32 of the lighting unit 31, and the direction of illumination is perpendicular to the optical axis of the center camera 29A. The multiple side lighting units 35 are also disposed above the reflective lighting unit 33 and the transmitted lighting unit 34. When the side lighting unit 35 is turned on, the illumination light is emitted along a horizontal plane.

When the component P held by the component holding nozzle 27 moves above the component recognition camera 28 at time t3, the side lighting unit 35 lights up the component P, illuminating the sides of the component P. At the time t3 when the component P is turned on, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

The coaxial lighting section 39 is disposed approximately parallel to the side wall 32q of the housing 32 of the lighting unit section 31, and its irradiation direction is perpendicular to the optical axis of the center camera 29A. The coaxial lighting section 39 is disposed below the reflective lighting section 33. When the coaxial lighting section 39 is turned on, the illumination light is irradiated along a horizontal plane. In addition, the component recognition camera 28 has a reflector C (e.g., a mirror) (an example of a second reflector) disposed at a position spaced apart from the coaxial lighting section 39 in the XY plane. The coaxial lighting section 39 turns on the reflector C to illuminate the area above the reflector C.

At time t4 when the component P held by the component holding nozzle 27 moves above the component recognition camera 28, the coaxial lighting unit 39 lights up the reflector C, which illuminates the underside of the component P through the transparent glass G. At the same time as this illumination occurs at time t4, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

Note that the illumination timings t1 to t4 by each lighting unit are any of multiple image capture timings within the time of forward movement in one turn. Furthermore, the illumination timings by each lighting unit may overlap, and multiple lighting units may be turned on simultaneously to illuminate component P.

The part recognition camera 28 detects multiple types of images by switching the lighting conditions and turning on the camera and capturing images at each of multiple capture timings when the part P is moving above it in accordance with instructions from the control unit 40.

As shown in FIG. 5, in the lighting unit 31, multiple side lighting sections 35 are arranged in a circular ring shape along the horizontal direction. Multiple reflective lighting sections 33 are arranged on the negative side of the Z direction from the side lighting sections 35. The central area surrounded by the multiple reflective lighting sections 33 is a space without illumination. Multiple transmitted lighting sections 34 are arranged outside the multiple reflective lighting sections 33 (opposite the central area). A coaxial lighting section 39 and a reflector C are arranged on the negative side of the reflective lighting sections 33 in the Z direction. The light irradiated by the coaxial lighting section 39 is reflected by the reflector C and passes through the central area surrounded by the multiple reflective lighting sections 33 to proceed to the positive side of the Z direction.

<Software configuration of component mounting device>
Next, a software configuration (functional configuration) of the control unit 40 of the component mounting device 1 will be described with reference to Fig. 6. Fig. 6 is a block diagram illustrating an example of the functional configuration of the control unit 40 of the component mounting device 1 shown in Fig. 1.

The control unit 40 of the component mounting device 1 is configured with a general-purpose computer, and a program as software stored in a storage device such as the computer's ROM (Read Only Memory) or RAM (Random Access Memory) is executed by an arithmetic unit such as the CPU (Central Processing Unit). That is, each block shown in the control unit 40 in FIG. 6 represents a function realized by software such as a program. However, the function represented by each block is not limited to software, and each may be configured by hardware as the physical configuration of the "device."

The control unit 40 includes a memory unit 41, a mechanism drive unit 46, and an image capture processing unit 47. The mechanism drive unit 46 controls the main body mechanism unit 10, and controls the drive of, for example, the board transport mechanism 13, the component supply mechanism 15, and the head unit 23 so that they operate in coordination with each other.

The storage unit 41 stores at least mounting information 42, component information 43, lighting condition information 44, and imaging timing information 45. The mounting information 42 stores information such as the type of component P to be mounted on each board W, and the mounting position and mounting posture of the component P on the board W. The component information 43 stores information such as the external shape of each type of component P, and the presence or absence of electrodes and the number of electrodes.

The lighting condition information 44 stores information about the lighting conditions when the component P is imaged. The lighting condition information 44 may include information about the brightness of each lighting channel formed for each lighting unit (e.g., lighting value). The lighting value corresponds to the current value flowing through each lighting (e.g., LED) of each lighting channel, and is a value that represents the level of LED current, and is also called a lamp value. The lighting value can take any value in the range of 0 to 255, for example. The lighting condition information 44 may include information indicating whether each lighting channel is lit (i.e., whether it is lit or off). The information indicating whether each lighting channel is lit may include information about a combination of multiple lighting channels to be lit.

In addition, the lighting condition information 44 may include information regarding the overall brightness of the lighting by the lighting unit section 31, rather than information regarding the brightness of each lighting channel. In other words, the lighting value may correspond to a value indicating the overall brightness of the lighting by the lighting unit section 31, rather than the individual brightness of each lighting channel.

Each illumination channel may include a reflected illumination channel, a transmitted illumination channel, a side illumination channel, and a coaxial illumination channel. The reflected illumination channel is an illumination channel formed by one or more reflected illumination units 33. The transmitted illumination channel is an illumination channel formed by one or more transmitted illumination units 34. The side illumination channel is an illumination channel formed by one or more side illumination units 35. The coaxial illumination channel is an illumination channel formed by a coaxial illumination unit 39. Each illumination channel differs in the illumination unit used for illumination or the direction of illumination, i.e., the illumination method is different.

The lighting channel may be turned on or off by the lighting value of the lighting channel. For example, a lighting value of 0 may indicate that lighting channel, and a lighting value of any value between 1 and 255 may indicate that the lighting channel is turned on. Note that when switching lighting conditions, if the lighting channel to be turned on is switched, it is not necessary to switch the lighting value of each lighting channel. Also, when switching lighting conditions, if the lighting value is switched, it is not necessary to switch the lighting channel to be turned on.

The imaging timing information 45 stores information regarding imaging timing (shutter timing) for imaging part P multiple times. The imaging timing information 45 may store, for example, information regarding the timing of turning on the lights and capturing images with the camera multiple times during the forward movement in one turn (also simply referred to as imaging timing).

The imaging processing unit 47 has a camera control unit 48 and a part recognition unit 50.

The camera control unit 48 controls the imaging by the imaging sensor unit 29 of the part recognition camera 28 and the lighting conditions by the lighting unit unit 31 at the time of imaging. For example, the camera control unit 48 reads the lighting condition information 44 and the imaging timing information 45 from the memory unit 41, and captures multiple images by illuminating the part P held by the head unit 23 under multiple lighting conditions corresponding to the purpose of imaging the part P or the type of the part P, at multiple imaging timings according to the imaging timing information 45.

As a specific example, during one turn of forward movement, the camera control unit 48 turns on the lighting unit 31 under lighting conditions LA at the image capture timing TA when the component P is moving above the component recognition camera 28, and acquires an image G1 (see, for example, FIG. 10A described later) showing the component P. Then, during the same one turn of forward movement, the camera control unit 48 turns on the lighting unit 31 under lighting conditions LB at the next image capture timing TB immediately (after a short time) after the image capture timing TA, and acquires an image G2 (see, for example, FIG. 10B described later) showing the same component P. Note that various lighting conditions may be applied depending on the type or application of the component P, and are set before the component mounting device 1 actually starts operating. The captured images G1 and G2 are sent to the component recognition unit 50.

The component recognition unit 50 recognizes each feature of the component P held by the component holding nozzle 27 based on the multiple acquired images (e.g., image G1 and image G2). The features of the component P may include, for example, the position of the component P, the orientation of the component P, the polarity of the component P, the three-dimensional shape of the component P, the external shape of the component P, or characters added to the component P. Based on the recognition results by the component recognition unit 50, the head unit 23 mounts the component P on the substrate W in a predetermined position and orientation with its moving head 26.

The polarity of a component P indicates the front and back of the component P. For example, the polarity (front and back) may be indicated by chamfering a predetermined location of the component P (for example, one of the four corners (for example, the lower left corner)). For example, the component P is mounted so that there is a chamfer at a predetermined location. In addition to the chamfering at the predetermined location, the polarity may be determined based on whether or not there is text in the center of the component P.

In addition, the imaging information of the board recognition camera 36 is also transmitted to the imaging processing unit 47, which, like the component recognition unit 50, recognizes the position and posture of the board W from the imaging information (image) and transmits the recognition result to the mechanism driving unit 46.

Figure 7 is a schematic diagram illustrating an example of the arrangement of component holding nozzles 27 that mount components P, and the imaging timing under each lighting condition when imaging components P mounted on the component holding nozzles 27.

Each moving head 26 has eight component holding nozzles 27 capable of holding components P arranged in two rows along the component movement direction A. Note that two rows and eight nozzles are just an example, and other multiple number of rows and multiple numbers may be used. The position of the component recognition camera 28 is fixed. As the moving head 26 moves, the image sensor unit 29 sequentially captures images of each component P held by the two rows of component holding nozzles 27. In this case, two components P held by two component holding nozzles 27 at the same position along the movement direction A in each row (for example, the first nozzle position, the second nozzle position, etc. from the right in FIG. 7) are simultaneously captured. In other words, these two components P are simultaneously included in the image capture range of the image sensor unit 29. A plurality of component holding nozzles 27 at the same position along the movement direction A in each row is also referred to as a "nozzle set." The moving head 26 illustrated in FIG. 7 has eight nozzle sets.

The imaging sensor unit 29, under the control of the camera control unit 48, performs a first image of the component P under illumination condition LA at imaging timing TA during the forward movement in one turn, and performs a second image of the component P under illumination condition LB at the next imaging timing TB immediately (after a very short time) after the imaging timing TA. In FIG. 7, the imaging range of the first image is indicated by imaging range CA, and the imaging range of the second image is indicated by imaging range CB. That is, the imaging sensor unit 29 images almost the same location twice. Note that the imaging ranges CA and CB have the same shape and size. In this way, the component mounting device 1 can obtain images of the subject (component P) illuminated under two illumination conditions in one scan (forward movement in one turn) by suppressing a decrease in the moving speed of the moving head 26 due to imaging, and can improve the image recognition accuracy based on this image.

Next, we will explain the workpiece reflectance and image brightness when illuminated and imaged under each lighting condition. Workpiece reflectance is the reflectance of each workpiece (for example, the mold or electrode in part P). Workpiece reflectance differs depending on the characteristics of each workpiece. For example, a workpiece made of a metal material has a high workpiece reflectance, while a workpiece made of a resin material has a low reflectance. Image brightness corresponds to the pixel value of the captured image and is represented by a value between 0 and 255, for example.

Figure 8A is a graph illustrating the workpiece reflectance and image brightness of each part of a part when it is illuminated and imaged with an illumination value of 50. The illumination value of 50 here is not the individual brightness of each illumination channel, but a value indicating the brightness obtained by the overall illumination by the illumination unit section 31. This illumination value is an example of the illumination condition LA for the first image capture.

In the case of an illumination value of 50, the electrode portion of part P has a higher workpiece reflectance than the molded portion. The image brightness of the molded portion is 50, and the image brightness of the electrode portion is 250. In other words, the electrode portion has a higher image brightness than the molded portion. In other words, the molded portion does not reflect much of the illuminated light, so the image brightness of the captured image is low and close to black. On the other hand, the electrode portion reflects a lot of the illuminated light, so the image brightness of the captured image is high and close to white. Therefore, in an image captured under illumination with an illumination value of 50, only the electrode portion is very bright, and it can be said to be an image suitable for checking the alignment based on the arrangement of the electrode portions. Here, alignment refers to the arrangement of one or more electrodes in part P.

Figure 8B is a graph illustrating the workpiece reflectance and image brightness of each part of a part when it is illuminated and imaged with an illumination value of 150. The illumination value 150 here is not the individual brightness of each illumination channel, but a value indicating the brightness obtained by the overall illumination by the illumination unit section 31. This illumination value is an example of the illumination condition LB for the second imaging.

In the case of an illumination value of 150, the electrode portion of part P has a higher workpiece reflectance than the molded portion. The image brightness of the molded portion is 150, and the image brightness of the electrode portion is 250. In other words, the image brightness of the electrode portion is higher than that of the molded portion. Compared to the case of an illumination value of 50, the image brightness of the molded portion is higher, and the image brightness of the molded portion is about the same. Therefore, in an image captured under illumination with an illumination value of 150, the electrode portion is very bright, and the molded portion is also bright. Therefore, for example, the character portion written on the molded portion of part P is also bright, and the image can be said to be suitable for character recognition. The control unit 40 can decipher the content of the character by performing image recognition of the character portion based on the captured image, and can track this part P based on the result of decoding the character of part P, so various inspections or traceability, etc. are possible for part P.

In this way, in the first exposure, the component recognition camera 28 may capture an image G1 at an illumination value that illuminates the electrode portion of the component in order to obtain a brightness suitable for component alignment. In the second exposure, the component recognition camera 28 may switch the illumination value from the first exposure and capture an image G2 at an illumination value three times the illumination value of the first illumination unit 31 in order to obtain a brightness that allows the shading of the molded portion of the component P to be distinguished. This allows the component mounting device 1 to obtain images with a wide dynamic range using images G1 and G2, and improves the various recognition accuracy of the component P based on images G1 and G2.

Next, we will explain specific examples of lighting conditions that take into account each lighting channel.

Figure 9 is a table showing specific examples of illumination conditions for a part P that is imaged multiple times. In table T1 of Figure 9, the illumination conditions include information on the illumination values of each illumination channel. Illumination channel CH1 is a reflected illumination channel. Illumination channel CH2 is a transmitted illumination channel. Illumination channel CH3 is a side illumination channel. Illumination channel CH4 is a coaxial illumination channel.

Furthermore, in table T1, a combination of the first imaging of part P and the second imaging of part P is shown as an illumination pattern. Table T1 shows illumination patterns 1 to 4. For example, in illumination pattern 1, the first imaging is performed under illumination condition LA, the illumination value of illumination channel CH1 is a value of 100, and the illumination values of the other illumination channels CH2 to CH4 are a value of 0. Furthermore, in illumination pattern 1, the second imaging is performed under illumination condition LB, and the illumination values of each of illumination channels CH1 to CH4 are all a value of 50.

In addition, in table T1, the first image capture has the same image use for all illumination patterns 1 to 4, and the illumination condition LA is a fixed condition. The image is used for alignment. An image for alignment is an image for recognizing the arrangement of electrodes in component P.

On the other hand, in table T1, the second image capture has different uses for the images captured with each of illumination patterns 1 to 4, and the illumination condition LB is variable. For example, the second image captured with illumination pattern 1 is used for character recognition. An image for character recognition is an image for recognizing characters attached to component P. The illumination condition LB in this case is as described above.

For example, the second image captured for illumination pattern 2 is used for polarity determination. An image for polarity determination is an image for determining the polarity indicating the front or back of the electrode pattern. In this case, the illumination condition LB is such that the illumination value of illumination channel CH1 is 100, the illumination value of illumination channel CH2 is 100, the illumination value of illumination channel CH3 is 30, and the illumination value of illumination channel CH4 is 0.

For example, the second image captured for illumination pattern 3 is used for 3D (three-dimensional) measurement. An image for 3D measurement is an image for measuring the height (length in the thickness direction) of component P. The illumination condition LB in this case has an illumination value of 50 for illumination channel CH1 and an illumination value of 0 for the other illumination channels CH2 to CH4.

For example, the second image captured for illumination pattern 4 is used for contour recognition. An image for contour recognition is an image for recognizing the contour (silhouette, for example, mold contour) of part P. The illumination condition LB in this case is such that the illumination value of illumination channel CH1 is 0, the illumination value of illumination channel CH2 is 90, the illumination value of illumination channel CH3 is 0, and the illumination value of illumination channel CH4 is 10.

The lighting conditions for each image capture are stored in the storage unit 41 and are included in the lighting condition information 44, for example. The lighting condition information 44 may be stored for each lighting pattern as shown in FIG. 9. The lighting condition information 44 may also be stored in the storage unit 41 for each purpose of the image captured each time. Note that the lighting condition LA for the first image capture is a variable condition like the lighting condition LB for the second image capture, and image capture may be performed for purposes other than alignment.

Figure 10A is an image diagram illustrating an image of a component P captured under illumination conditions LA for alignment. Image G1 in Figure 10A is an image for alignment obtained by capturing an image under illumination conditions LA of illumination patterns 1 to 4 shown in Figure 9 or illumination conditions LA as illumination value 50 by the illumination unit section 31 shown in Figure 8A. Image G1 is obtained, for example, by capturing an image the first time.

In image G1, multiple electrodes 61 are arranged along each edge of component P, which has a substantially rectangular shape. In FIG. 10A, the image brightness of each electrode is relatively greater than the image brightness of its surroundings, thereby clearly indicating the arrangement of the electrodes 61. By performing image recognition on image G1, the component recognition unit 50 can easily recognize the alignment of the electrodes 61 on component P, and can easily mount component P based on this alignment.

Figure 10B is an image diagram illustrating an image of a part P captured under illumination conditions LB for character recognition. Image G2 in Figure 10B is an image for character recognition obtained by capturing an image under illumination conditions LB of the illumination pattern 1 shown in Figure 9 or illumination conditions LB as illumination value 150 by the illumination unit section 31 shown in Figure 8B. Image G2 is obtained by capturing an image for the second time, for example.

In image G2, multiple electrodes 61 are arranged along each edge of component P having a substantially rectangular shape. In addition, inside the arrangement of multiple electrodes 61, there is a mold 63 to which characters are added in character section 62. In FIG. 10B, the arrangement of electrodes 61 is clearly shown, and the characters added to character section 62 of mold 63 are clearly shown. The component recognition unit 50 is able to extract and recognize characters on component P by performing image recognition on image G2. Furthermore, being able to recognize characters improves traceability of component P based on the characters even during manufacture or after shipment of component P. Therefore, even if component P is a very expensive component (e.g., a BGA component), for example, the component mounting device 1 can manage the serial rod of this component P and quickly respond when a problem occurs in the market.

In addition, the electrode 61 is also shown in image G2, but the mold 63 other than the electrode 61 is also shown brightly, so the difference in brightness between the electrode 61 and other parts is smaller than in image G1 of FIG. 10A. Therefore, the contrast of the image brightness in image G2 is smaller. Therefore, compared to image G2, image G1 has a greater contrast of each electrode and has higher recognition accuracy for alignment based on image recognition. Therefore, image G1 is more preferable as an image for alignment than image G2.

In this way, the component recognition camera 28 may acquire image G1 by capturing an image illuminated under the illumination condition LA for the first image capture. The component recognition camera 28 may acquire image G2 by changing the illumination condition for the second image capture and capturing an image illuminated under the illumination condition LB for the second image capture. In image G1, the electrode 61 has high brightness and high contrast, so the component mounting device 1 can improve the recognition accuracy of the alignment of the component P. Also, in image G2, the characters in the character portion 62 have high brightness, so the component mounting device 1 can improve the inspection accuracy or traceability accuracy of the component P.

<Operation of component mounting device>
Next, the operation of the component mounting device will be described.
Fig. 11 is a flowchart illustrating an example of an operation flow executed by the control unit 40 shown in Fig. 5. Note that a counter n (an integer variable) for sequentially counting the multiple nozzle sets NS of the moving head 26 is stored and held in the memory unit 41 of the control unit 40.

The mechanism driving unit 46 transmits an instruction to the head unit 23 to have the moving head 26 pick up and pick up the component P from the pick-up position (S11). The head unit 23 picks up the component P from the pick-up position. The mechanism driving unit 46 starts the forward movement (head movement) for one turn from the time of transmission of S11, and moves the moving head 26 of the head unit 23 above the component recognition camera 28 while holding the component P (S12). The control unit 40 then initializes the counter n (i.e., assigns the integer "1" to the counter n) and counts that the nozzle set NS to be imaged is the first one (S13).

The camera control unit 48 of the imaging processing unit 47 determines whether or not it is the first imaging timing TA based on the imaging timing information 45 (S14). If it is not the first imaging timing TA (No in S14), it waits until it is the first imaging timing TA.

If it is the first imaging timing TA, the camera control unit 48 controls to illuminate the component P according to the illumination condition LA based on the illumination condition information 44, and controls to capture an image of the component P in an illuminated state (S15). For example, at the first imaging timing TA, the camera control unit 48 turns on the illumination channel based on the illumination condition LA in the illumination unit section 31 with an illumination value based on the illumination condition LA, and causes the component recognition camera 28 to capture an image. This allows the camera control unit 48 to acquire an image G1 at the first imaging timing TA for capturing an image of each component P held by the nozzle set NS corresponding to the counter n.

The camera control unit 48 determines whether or not it is the second imaging timing TB based on the imaging timing information 45 (S16). If it is not the second imaging timing TB (No in S16), the camera control unit 48 waits until the second imaging timing TB occurs.

If it is the second imaging timing TB, the camera control unit 48 controls to illuminate the component P according to the illumination condition LB based on the illumination condition information 44, and controls to capture an image of the component P in an illuminated state (S17). For example, the camera control unit 48 turns on the illumination channel based on the illumination condition LB in the illumination unit 31 at the illumination value based on the illumination condition LB at the second imaging timing TB, and causes the component recognition camera 28 to capture an image. This allows the camera control unit 48 to capture the image G2 at the second imaging timing TB for capturing an image of each component P held by the nozzle set NS corresponding to the counter n. In other words, the camera control unit 48 captures the image G2 at the second imaging timing TB immediately (after a short time) after the first imaging timing TA, in a state where the illumination condition is switched and illumination is performed.

In addition, in S17, the camera control unit 48 may acquire information on the purpose of the image via an operation device (not shown), and determine the lighting conditions LB for the second image capture based on the lighting condition information 44 stored in the storage unit 41 and the information on the purpose of the image. This allows the camera control unit 48 to acquire image G2 by capturing an image under lighting conditions LB suitable for the purpose desired by the user, for example.

The control unit 40 determines whether the counter n is 8, that is, whether the processing of S14 to S17 has been completed for all nozzle sets NS (here, eight nozzle sets) (S18). If the processing has not been completed up to the eighth nozzle set NS, which corresponds to n=8, the control unit 40 adds the integer 1 to the value of counter n (S19) and proceeds to S14 to execute the processing for the next nozzle set NS.

In other words, the camera control unit 48 alternately captures an image G1 based on the lighting condition LA and an image G2 based on the lighting condition LB, one at a time, and these images G1 and G2 are regarded as images of the first set (first nozzle set NS). After capturing the first set, the mechanism drive unit 46 continues to move the moving head 26 along the movement direction A until the component holding nozzle 27 is no longer present (here, until the eighth nozzle set NS is reached), and the camera control unit 48 controls the capturing of images by the component recognition camera 28.

When the eighth nozzle set NS has been processed, the component recognition unit 50 performs image recognition on each image G1 obtained by the first imaging of each nozzle set NS (S20). In this case, the component recognition unit 50 can obtain, for example, alignment information for each component P held by each component holding nozzle 27 by image recognition of each image G1. The component recognition unit 50 sends the recognition results of the image recognition to the mechanism drive unit 46.

The component recognition unit 50 also performs image recognition on each image G2 obtained by the second imaging of each nozzle set NS (S21). In this case, the component recognition unit 50 can obtain information on the recognition results corresponding to each application (e.g., character recognition, polarity discrimination, 3D measurement, or external shape recognition) that corresponds to the illumination condition LB through image recognition of each image G2. That is, the component recognition unit 50 can obtain, for example, information on the recognition results of characters attached to the component P, information on the discrimination of the polarity (e.g., front and back) of the component P, information on the measurement results of 3D measurement, or information on the recognition results of the external shape of the component P. The component recognition unit 50 sends the recognition results of the image recognition to the mechanism drive unit 46.

Shortly after the component holding nozzles 27 of each nozzle set NS pass above the component recognition camera 28, the moving head 26 reaches the vicinity of the mounting position of the component P. Then, the mechanism driving unit 46 ends movement above the component recognition camera 28 (S22). Based on the recognition result by the component recognition unit 50, the mechanism driving unit 46 commands the moving head 26 of the head unit 23 to mount the component P in a specified position and orientation on the board W. The head unit 23 mounts the component P on the board W using the moving head 26 in accordance with the command from the mechanism driving unit 46 (S23).

With such a component mounting device 1, the component mounting device 1 captures the same component P multiple times during one turn of forward movement, so that in order to obtain multiple images G1 and G2, only one scan in the movement direction A is required, and the movement of the moving head 26 can be completed in a short time. Therefore, the component mounting device 1 can shorten the time required to capture the image of each component P, and shorten the time required to complete recognition of each component P. For example, while it takes several hundred ms for the moving head 26 to move two turns, by performing multiple exposures and capturing images in one turn, it only takes a time on the order of microseconds.

In addition, the component mounting device 1 sets different lighting conditions LA, LB when capturing the multiple images G1, G2, so that multiple images G1, G2 with different pixel brightness values can be obtained. This ensures a wide range of pixel brightness values (dynamic range) contained across the multiple images G1, G2. Therefore, the component mounting device 1 can recognize different states or postures of the component P based on the multiple images G1, G2 in which the component P is captured, thereby improving the recognition accuracy of the component P.

In other words, the component mounting device 1 captures images of the same component P multiple times at different brightnesses with time-delay lighting, expanding the dynamic range across multiple images and improving the recognition accuracy of the component P. Furthermore, the component mounting device 1 does not require the moving head 26 to hold each component P and move back and forth multiple times over the same location to capture images, reducing the imaging time and production tactical loss.

As described above, the component mounting device 1 of this embodiment includes a lighting unit 31 (an example of a lighting unit) that illuminates the component P held by the moving head 26 (an example of a head), a component recognition camera 28 (an example of an imaging unit) that images the component P from below, a camera control unit 48 (an example of an imaging control unit) that controls the imaging by the component recognition camera 28 and the illumination conditions including information on the brightness of the illumination by the lighting unit 31 at the time of imaging, a component recognition unit 50 that recognizes the component P from the images G1 and G2 captured by the component recognition camera 28, and a head unit 23 (an example of a component mounting unit) that mounts the component P on the board W with the moving head 26 based on the recognition result by the component recognition unit 50. The camera control unit 48 turns on the lighting unit 31 under the illumination condition LA (an example of a first illumination condition) at the imaging timing TA (an example of a first timing) when the component P is moving above the component recognition camera 28, and causes the component recognition camera 28 to capture an image G1 (an example of a first image). The camera control unit 48 turns on the lighting unit 31 under lighting condition LB (an example of a second lighting condition) at image capture timing TB (an example of a second timing) when the part P is moving above the part recognition camera 28, and acquires an image G2 (an example of a second image) by having the part recognition camera 28 capture an image. The part recognition unit 50 recognizes the part P based on the images G1 and G2.

As a result, the component mounting device 1 acquires multiple images G1, G2 in which the same component P is captured under different lighting conditions LA, LB, making it possible to obtain images with a wide dynamic range and improving the recognition accuracy of the component P. In addition, the component mounting device 1 can capture images twice under different lighting conditions during one movement (during the forward movement in one turn), eliminating the need for the moving head 26 to move back and forth to capture images twice, and shortening the time required to recognize the component P.

The lighting unit section 31 may also have multiple lighting channels CH1 to CH4 with different lighting methods. The lighting condition LA may include a lighting value indicating the brightness of the first lighting by each of the multiple lighting channels CH1 to CH4. The lighting condition LB may include a lighting value indicating the brightness of the second lighting by each of the multiple lighting channels CH1 to CH4.

This allows the component mounting device 1 to set the brightness for each lighting channel under each of the lighting conditions LA and LB, and to adjust the brightness in more detail to illuminate the component P. Therefore, the component mounting device 1 can further improve the recognition accuracy of the component P.

The lighting unit section 31 may also have multiple lighting channels CH1 to CH4 with different lighting methods. The lighting condition LA may include information on the lighting channel used to capture the image G1. The lighting condition LB may include information on the lighting channel used to capture the image G2.

As a result, the component mounting device 1 can adjust the illuminated position and brightness of the component P by using different lighting channels or a combination of different lighting channels to capture images G1 and G2, thereby improving the recognition accuracy of the component P.

The camera control unit 48 may also obtain information on the purpose of the image G2 and determine the lighting condition LB based on the purpose of the image G2.

This allows the component mounting device 1 to capture the image G2 under illumination conditions LB suitable for each application of component P recognition (e.g., checking characters attached to the component P, determining the polarity of the component P, or 3D measurement of the component P, or external shape recognition of the component P). Therefore, the component mounting device 1 can use the captured image G2 to improve the recognition accuracy of the component P corresponding to each application.

Also, the lighting condition LA may be a fixed condition. The lighting condition LB may be a variable condition.

As a result, the component mounting device 1 can acquire the required image G1 for component recognition by setting the lighting conditions LA for obtaining the image G1. Also, the component mounting device 1 can acquire the image G2 captured under the lighting conditions LB suited to the desired application by setting the lighting conditions LB for obtaining an arbitrary image G2 for component recognition.

The multiple illumination channels may also include a transmitted illumination channel CH2 that illuminates a first reflector disposed above the component P, a side illumination channel CH3 that illuminates the side of the component P, a reflected illumination channel CH1 that illuminates the underside of the component P, and a coaxial illumination channel CH4 that illuminates a reflector C (an example of a second reflector) disposed below the component P.

This allows the component mounting device 1 to obtain images G1 and G2 captured by illuminating the component P from various angles.

Although various embodiments have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that a person skilled in the art can come up with various modified or revised examples within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present disclosure. Furthermore, the components in the above embodiments may be combined in any manner as long as it does not deviate from the spirit of the present disclosure.

The present disclosure is useful for component mounting devices and component mounting methods that can improve the accuracy of image-based component recognition by ensuring a wide dynamic range for multiple images, shorten the time required for component recognition, and improve component mounting efficiency.

1 Component mounting device 10 Main mechanism section 11 Mounting machine main body 12 Base 13 Board transport mechanism 14 Conveyor section 15 Component supply mechanism 16 Feeder base 17 Slot 18 Tape feeder 19 Feeder cart 20 Cart section 21 Reel 22 Carrier tape 23 Head unit 24 Y-axis table mechanism 25 X-axis table mechanism 26 Moving head 27 Component holding nozzle 28 Component recognition camera 29 Imaging sensor section 30 Housing 31 Illumination unit section 33 Reflection illumination section 34 Transmitted illumination section 35 Side illumination section 36 Board recognition camera 37 Disposal box 38 Nozzle holder 40 Control section 41 Memory section 42 Mounting information 43 Component information 44 Illumination condition information 45 Imaging timing information 46 Mechanism driving section 47 Imaging processing section 48 Camera control section 50 Component recognition section 61 Electrode 62 Character section 63 Mold B Shielding plate C Reflector G Transparent glass G1, G2 Image P Part W Board

Claims (7)

an imaging unit that captures an image of the component from below within an imaging range that includes the entire component ; and
an imaging control unit that controls imaging by the imaging unit and lighting conditions including information on the brightness of lighting by the lighting unit at the time of imaging;
a component recognition unit that recognizes the component from the image captured by the imaging unit;
a component mounting unit that mounts the component on a board using the head based on a recognition result by the component recognition unit,
the imaging control unit, at a first timing when the component is moving above the imaging unit, turns on the illumination unit under a first illumination condition and causes the imaging unit to capture an image, thereby obtaining a first image including the entire component , and, at a second timing when the component is moving above the imaging unit, turns on the illumination unit under a second illumination condition different from the first illumination condition and causes the imaging unit to capture an image, thereby obtaining a second image including the entire component ;
The part recognition unit recognizes the part based on the first image and the second image.
Parts mounting device. The illumination unit has a plurality of illumination channels with different illumination methods,
the first lighting condition includes a lighting value indicating a brightness of a first lighting by each of the plurality of lighting channels;
the second lighting condition includes a lighting value indicating a brightness of the second lighting by each of the plurality of lighting channels;
2. The component mounting apparatus according to claim 1. The illumination unit has a plurality of illumination channels with different illumination methods,
the first illumination condition includes information of an illumination channel used to capture the first image;
The second illumination condition includes information of an illumination channel used to capture the second image.
3. The component mounting device according to claim 1 or 2. The imaging control unit is
Obtaining information regarding a purpose of the second image;
determining the second lighting condition based on an intended use of the second image;
The component mounting device according to any one of claims 1 to 3. the first lighting condition is a fixed condition;
the second lighting condition is a variable condition;
5. The component mounting apparatus according to claim 4. The plurality of illumination channels include:
a transillumination channel for illuminating a first reflector disposed above the component;
a side illumination channel for illuminating the side of the component;
a reflected illumination channel for illuminating an underside of the component;
a coaxial illumination channel that illuminates a second reflector disposed below the component;
4. The component mounting device according to claim 2 or 3. controlling lighting conditions including information about the brightness of lighting when an image is captured by an illumination unit that illuminates the component held by the head, and controlling imaging by an imaging unit that captures an image of the component held by the head from below in an imaging range that includes the entire component ;
Recognizing the component from an image captured by the imaging unit;
mounting the component on a board using the head based on a result of the component recognition;
having
The step of controlling the imaging includes:
acquiring a first image including the entire part by turning on the illumination unit under a first illumination condition and causing the imaging unit to capture an image at a first timing when the part is moving above the imaging unit;
and acquiring a second image including the entire part by turning on the illumination unit under a second illumination condition different from the first illumination condition and causing the imaging unit to capture an image at a second timing when the part is moving above the imaging unit ,
The step of recognizing the part includes a step of recognizing the part based on the first image and the second image.
How to install parts.

Images