JP7649983B2 - Component mounting device and component mounting method - Google Patents

Description

This disclosure relates to a component mounting device and a component mounting method.

In a semiconductor or other circuit board manufacturing factory, multiple mounting board production lines are installed, and multiple component mounting devices are arranged on each mounting board production line. Each component mounting device mounts electronic components or other components at the position on the circuit board where cream solder has been printed. In recent years, in order to increase the productivity of circuit board manufacturing factories, there has been a demand for improving the operating efficiency of these component mounting devices as well.

Conventionally, there is known a component mounting device in which a moving head is equipped with a nozzle and a mark, a camera captures an image of the component and the mark held by the nozzle, the captured image is analyzed to calculate the relative position and orientation deviation between the mark and the component, and the relative position and orientation deviation between the nozzle and the component is corrected based on the calculated position and orientation deviation. Patent Document 1 also discloses a configuration in which both the component and the mark are positioned on a plane on which the camera focuses so that the component and the mark can be clearly captured.

JP 2005-222976 A

However, in the configuration disclosed in Patent Document 1, the size of the part that can be held by the nozzle is limited to a size that will not collide with the mark when the part is rotated to correct the misalignment of the relative orientation between the nozzle and the part. If the mark is positioned above the bottom end of the nozzle, it is possible to prevent the part from colliding with the mark when the part is rotated for correction, but since the mark is positioned above the plane on which the camera focuses, it is difficult to clearly capture an image of both the part and the mark.

The objective of this disclosure is to provide a component mounting device and a component mounting method that can position the mark above the bottom end of the nozzle and capture clear images of both the component and the mark.

A component mounting device according to one aspect of the present disclosure includes a nozzle that holds a component and moves toward a board on which the component is to be mounted; a mark that is fixed adjacent to the nozzle, located above a lower end of the nozzle, and moves with the nozzle; a first illumination unit that illuminates the component held by the nozzle with light of a first wavelength; a second illumination unit that illuminates the mark with light of a second wavelength different from the first wavelength; an imaging unit that images the component illuminated with the light of the first wavelength and the mark illuminated with the light of the second wavelength from below; and a control unit that corrects a positional and directional deviation of the component relative to the nozzle based on a positional relationship between the component and the mark included in an image captured by the imaging unit.

A component mounting method according to one aspect of the present disclosure includes illuminating a component held by a nozzle with light of a first wavelength, illuminating a mark that is fixed adjacent to the nozzle, is located above the lower end of the nozzle, and moves with the nozzle with light of a second wavelength different from the first wavelength, capturing images of the component illuminated with the light of the first wavelength and the mark illuminated with the light of the second wavelength from below, and correcting a positional and directional deviation of the component relative to the nozzle based on the positional relationship between the component and the mark contained in the captured image.

These comprehensive or specific aspects may be realized by a system, device, method, integrated circuit, computer program, or recording medium, or by any combination of a system, device, method, integrated circuit, computer program, and recording medium.

According to the present disclosure, the mark can be positioned above the bottom end of the nozzle, and both the part and the mark can be clearly imaged.

FIG. 2 is a top view illustrating a mechanical configuration of the component mounting device according to the embodiment; FIG. 2 is a side view illustrating a mechanical configuration of the component mounting apparatus shown in FIG. FIG. 3 is a perspective view illustrating the operation of the moving head and the component holding nozzle shown in FIG. FIG. 3 is a side view illustrating a mechanical configuration of the component recognition camera and the head unit illustrated in FIG. FIG. 5 is a perspective view illustrating a mechanical configuration of the lighting unit shown in FIG. 1 is a table illustrating a first wavelength and a second wavelength according to an embodiment of the present invention; FIG. 1 is a diagram for explaining the positional relationship between a component and a reference mark. FIG. 2 is a block diagram illustrating a functional configuration of a control unit of the component mounting apparatus shown in FIG. 1 is a flowchart illustrating a component mounting process according to an embodiment of the present invention.

Below, the embodiments of the present disclosure will be described in detail with reference to the drawings as appropriate. However, more detailed explanation than necessary may be omitted. For example, detailed explanation of already well-known matters and duplicate explanation of substantially identical configurations may be omitted. This is to avoid the following explanation becoming unnecessarily redundant and to facilitate understanding by those skilled in the art. Note that the attached drawings and the following explanation are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

For example, the term "part" or "device" in the embodiments is not limited to a physical configuration that is mechanically realized by hardware, but also includes configurations whose functions are realized by software such as a program. Also, the functions of one configuration may be realized by two or more physical configurations, or the functions of two or more configurations may be realized by, for example, one physical configuration.

(Present embodiment)
<Mechanical configuration of the component mounting device>
Fig. 1 is a top view illustrating the mechanical configuration of a component mounting apparatus 1 according to the present embodiment, Fig. 2 is a side view illustrating the mechanical configuration of the component mounting apparatus 1 shown in Fig. 1.

For ease of explanation, the axis extending in the height direction from the floor surface on which the component mounting device 1 is installed is referred to as the Z axis. The axis perpendicular to the Z axis (i.e., parallel to the floor surface) and extending from the front of the component mounting device 1 (the lower side of the paper in FIG. 1) to the rear side of the component mounting device 1 (the upper side of the paper in FIG. 1) is referred to as the Y axis. The axis perpendicular to the Y axis and the Z axis is referred to as the X axis. For ease of explanation, the positive direction of the Z axis may be referred to as "up", the negative direction of the Z axis as "down", the positive direction of the Y axis as "front", the negative direction of the Y axis as "rear", the positive direction of the X axis as "right", and the negative direction of the Y axis as "left". These directional expressions are used for ease of explanation and are not intended to limit the position of the structure during actual use.

One or more component mounting devices 1 are arranged on a mounting board production line for mounting and manufacturing various components P on a board W. The component mounting device 1 mounts the components P in a predetermined position and orientation on the board W transported from upstream of the mounting board production line.

As shown in Figures 1 and 2, the component mounting device 1 is configured to include a main body mechanism unit 10 (an example of a component mounting unit) and a control unit 40. The main body mechanism unit 10 mounts components P (e.g., electronic components such as ICs (Integrated Circuits), transistors or capacitors, lead components, chip components, and/or BGA (Ball Grid Array) components) on a board W mainly through the operation of each component mechanism. The control unit 40 controls the operation of the main body mechanism unit 10.

The main body mechanism section 10 includes a mounting machine main body 11 that is composed of a base 12 and the like, and a head unit 23 that is configured to be movable relative to the mounting machine main body 11. The control section 40 is housed inside the base 12 (see below) of the component mounting device 1, and controls various mechanisms such as the mounting machine main body 11 and the head unit 23.

A board transport mechanism 13 is disposed in the center of the base 12 of the mounting machine main body 11 along the X direction (the transport direction of the board W) shown in FIG. 1. The board transport mechanism 13 includes a pair of conveyor units 14 extending along the X direction. The board transport mechanism 13 transports the board W placed on the pair of conveyor units 14, and positions and holds it at a predetermined mounting position.

A pair of component supply mechanisms 15 are arranged facing each other on both the front and rear sides of the board transport mechanism 13. Each of the pair of component supply mechanisms 15 has a feeder base 16 in which a slot 17 is provided. A number of tape feeders 18 are attached in parallel to the slot 17 as part feeders.

The component mounting device 1 further includes a feeder cart 19. The feeder cart 19 includes a carriage section 20 with a plurality of wheels disposed on its underside, and a plurality of reel stock sections (not shown) disposed on the upper side of the carriage section 20. A reel 21 is accommodated in each of the plurality of reel stock sections. A carrier tape 22 containing a component P is pulled out from each of the reels 21, and the component P is supplied to the tape feeder 18 of the component supply mechanism 15. The tape feeder 18 of the component supply mechanism 15 supplies the component P by pitch-feeding the carrier tape 22 in the tape feed direction. A component holding nozzle 27 attached to a moving head 26 of a head unit 23 described below picks up (e.g., holds by suction) the component P supplied by the tape feeder 18. The position where the component holding nozzle 27 picks up the component P may be referred to as a component removal position. Although only one moving head 26 and one component holding nozzle 27 are shown in FIG. 2, there may be multiple moving heads 26 and multiple component holding nozzles 27, and they may be arranged in multiple columns and/or multiple rows, for example, as shown in FIG. 7A and FIG. 7B.

The head unit 23 is disposed above the base 12 and is configured to be movable between a mounting position where the component supply mechanism 15 and the substrate W are disposed, and a component removal position. Specifically, the head unit 23 is capable of linear movement along the X and Y directions by an X-axis table mechanism 25 and a Y-axis table mechanism 24 that are disposed orthogonal to each other on a plane substantially parallel to the surface of the substrate W.

On the upper surface of the base 12, a Y-axis table mechanism 24 is disposed along the Y direction. A pair of front and rear X-axis table mechanisms 25 are disposed along the X direction and are attached to each of the Y-axis table mechanisms 24 so as to be slidable along the Y direction. A moving head 26 is attached to the tip of each of the pair of front and rear X-axis table mechanisms 25 so as to be slidable along the X direction. That is, the moving head 26 is mounted on the head unit 23, and the moving head 26 is provided so as to be movable independently of each other by the X-axis table mechanism 25 and the Y-axis table mechanism 24. As a result, the moving head 26 is arbitrarily positioned on a plane approximately parallel to the surface of the substrate W, that is, on the horizontal plane (XY plane). Both the X-axis table mechanism 25 and the Y-axis table mechanism 24 are configured with linear guide drive mechanisms.

A component recognition camera 28, which is an example of an imaging unit, is disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. A component holding nozzle 27 (see below) attached to the moving head 26 moves and passes above the component recognition camera 28 while taking out a component P from the component supply mechanism 15 and holding it by suction. At this time, the component recognition camera 28 takes an image of the component P held by the component holding nozzle 27 that it passes over, one or more times, while illuminating it at a predetermined timing.

In addition, a nozzle holder 38 and a waste box 37 are further disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. The nozzle holder 38 stores multiple types of component holding nozzles 27 of the moving head 26 corresponding to the components P to be held. By having the moving head 26 access the nozzle holder 38 and performing a predetermined nozzle replacement operation, a component holding nozzle 27 (described below) suitable for the object to be held is attached to the moving head 26. The waste box 37 is formed in a box shape and has an internal space, in which components P determined to be defective as a result of the image captured by the component recognition camera 28 are discarded.

<Configuration and Operation of Moving Head>
Next, the configuration and operation of the moving head 26 and the component holding nozzle 27 will be described with reference to Fig. 3. Fig. 3 is a perspective view illustrating the operation of the moving head 26 and the component holding nozzle 27 shown in Fig. 2.

Here, the description will be given with reference to FIG. 3, focusing on one moving head 26 and component holding nozzle 27. However, there may be multiple moving heads 26 and component holding nozzles 27, and they may be arranged in multiple columns and/or multiple rows. Also, FIG. 3 omits depiction of the illumination unit and related parts (e.g., reflectors) and mark tube 60, which will be described later.

The component holding nozzles 27 use, for example, air pressure to vacuum-suck and hold the components P from the tape feeder 18 of the component supply mechanism 15, and raise and lower them individually. The moving head 26 also includes a Z-axis lifting mechanism (not shown) that raises and lowers each of the component holding nozzles 27 individually, and a θ-axis rotation mechanism (not shown) that rotates each of the component holding nozzles 27 individually about the nozzle axis. The Y-axis table mechanism 24 and the X-axis table mechanism 25 are driven to position the moving head 26 arbitrarily in the horizontal plane (XY plane). With this movement, the moving head 26 uses the component holding nozzles 27 to suck and pick up the components P from the component pick-up position of the tape feeder 18 of the component supply mechanism 15.

The component recognition camera 28 captures an image of the component P from below while the component holding nozzle 27 holding the component P is moving to the position of the board W. The control unit 40 analyzes the image captured by the component recognition camera 28 to recognize the component P. In addition, the control unit 40 calculates the position and orientation of the component P held by the component holding nozzle 27 relative to the component holding nozzle 27. The position and orientation of the component P relative to the component holding nozzle 27 are based on the position and orientation when the component holding nozzle 27 accurately holds the component P. Hereinafter, the magnitude of the position and orientation of the component P relative to the component holding nozzle 27 may be referred to as the deviation amount of the position and orientation of the component P. The deviation amount of the position of the component P may be expressed as the amount of movement in the X and Y directions on the XY plane. The deviation amount of the orientation of the component P may be expressed as a rotation angle on the XY plane.

A board recognition camera 36 (see Figures 1 and 2) is fixed to the moving head 26. The board recognition camera 36 is disposed on the underside of the X-axis table mechanism 25 and moves integrally with the moving head 26. As the moving head 26 moves, the board recognition camera 36 passes above the board W positioned by the board transport mechanism 13 and images the board W. The image capture result (image capture information) is similarly processed for recognition, thereby detecting the position and orientation of the board W.

As a result of detecting the position of the board W, the control unit 40 moves the component holding nozzle 27 of the moving head 26 to the mounting point of the component P held by the component holding nozzle 27, and mounts the component P at the mounting point in a mounting attitude. The mounting point indicates the position on the board W where the component P should be mounted. The mounting attitude indicates the attitude (e.g., orientation) of the component P when it is mounted at the mounting point. At this time, the moving head 26 performs XY movement and axial rotation to correct the amount of deviation in the position and orientation of the component P described above, and then mounts the component P at the mounting point. This corrects the relative deviation between the component holding nozzle 27 and the component P, and the component P is accurately mounted at the mounting point.

The above movement and mounting operations may be repeated until all of the components P held by each of the multiple component holding nozzles 27 have been mounted on the board W. In this manner, the components P are held and moved by the component holding nozzles 27 of the moving head 26 between the component removal position and the mounting operation position, and are finally mounted on the board W.

The component mounting device 1 repeatedly performs a series of operations, such as removing and mounting multiple components P using the component holding nozzle 27 of the moving head 26, and then moving back to the component removal position, until mounting is completed at all of the multiple mounting points on the board W. By repeating this operation, a large number of components P are sequentially mounted on each of the boards W that are transported in sequence. Then, after mounting, the boards W on which all of the components P have been mounted are transported to a downstream process. In this way, the mounting machine main body 11 and the head unit 23 operate in coordination, and this coordinated operation is executed under the instructions of the control unit 40.

In addition, in this embodiment, a series of work units consisting of the movement from the removal of component P at the component removal position to the mounting work position of component P, and the subsequent return movement to the component removal position, may be referred to as a "one turn" work unit. The movement from the component removal position to the mounting work position in one turn may be referred to simply as "the movement in one turn" below.

<Component Recognition Camera Configuration>
Next, the configuration of the component recognition camera 28 will be described with reference to Fig. 4 and Fig. 5. Fig. 4 is a side view illustrating the mechanical configuration of the component recognition camera 28 and the head unit 23 shown in Fig. 2. Fig. 5 is a perspective view illustrating the mechanical configuration of the lighting unit section 31 shown in Fig. 4.

As shown in FIG. 4, the part recognition camera 28 includes an image sensor unit 29 and an illumination unit unit 31.

The imaging sensor unit 29 is disposed so that its optical axis is aligned along the vertical direction (Z direction) and captures an image of the component P moving above the component recognition camera 28 from below. The imaging sensor unit 29 includes a substantially cylindrical housing 30 and a lens 71 and an imaging element 72 built into the housing 30. There may be one lens 71 or multiple lenses 71. The imaging element 72 may be configured with a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The imaging sensor unit 29 has a shutter function and performs exposure and imaging at a predetermined timing according to a command from an imaging processing unit 47 (see below) of the control unit 40. The imaging sensor unit 29 transmits the result of imaging by the imaging element 72 (image) to the control unit 40. The imaging sensor unit 29 and the head unit 23 will be described in more detail later.

The part recognition camera 28 can capture images according to a scan imaging method and may have a region of interest (ROI) function using an area sensor. The part recognition camera 28 may set multiple ROIs (e.g., two ROIs) on the imaging sensor unit 29 using the ROI function and capture images by continuously switching between the ROIs.

The lighting unit section 31 includes a box-shaped housing 32, multiple reflective lighting sections 33, multiple transmitted lighting sections 34, multiple side lighting sections 35, and a coaxial lighting section 39. The reflective lighting section 33 may be referred to as an oblique lighting section, a component lighting section, or a first lighting section. The reflective lighting section 33, the transmitted lighting section 34, the side lighting section 35, and the coaxial lighting section 39 are disposed inside the housing 32. The housing 32 of the lighting unit section 31 is disposed in a connected state in a stacked state on top of the housing 30 of the image sensor section 29.

As shown in FIG. 5, the multiple side illumination units 35 are arranged in a circular ring shape along the horizontal direction. The multiple reflective illumination units 33 are arranged below the side illumination units 35 and around the center inside the ring formed by the multiple side illumination units 35 so that a space is formed in the center. The multiple transmitted illumination units 34 are arranged between the reflective illumination units 33 and the side illumination units 35. The coaxial illumination unit 39 and the reflector C are arranged below the reflective illumination units 33.

The reflective illumination section 33 is disposed approximately parallel to the bottom wall 32p (i.e., the XY plane, horizontal plane) of the housing 32 of the illumination unit section 31. The reflective illumination section 33 is disposed so that the irradiation direction is along the optical axis of the imaging sensor section 29. When emitting light, the reflective illumination section 33 irradiates light along an approximately vertical direction (Z direction). A transparent glass (not shown) may be disposed along the horizontal direction between the component P held by the component holding nozzle 27 and the reflective illumination section 33.

The reflective illumination unit 33 emits light at a timing t1 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28. As a result, the underside of the component P held by the component holding nozzle 27 is illuminated by the light irradiated from the reflective illumination unit 33 and transmitted through the transparent glass. In response to this timing t1, the imaging sensor unit 29 captures an image of the component P.

The multiple reflective lighting units 33 may constitute a reflective lighting channel. The control unit 40 may control the light emission in units of reflective lighting channels.

The transmitted illumination unit 34 is disposed at an angle to the bottom wall 32p and side wall 32q (i.e., the Z direction) of the housing 32. The transmitted illumination unit 34 is provided so that the irradiation direction is oblique to the optical axis of the image sensor unit 29. A shielding plate B is disposed between the reflective illumination unit 33 and the transmitted illumination unit 34. Similar to the transmitted illumination unit 34, the shielding plate B is disposed so as to be oblique to both the bottom wall 32p and side wall 32q of the housing 32.

When the transillumination unit 34 emits light, it irradiates the light obliquely in the vertical direction (Z direction) and the horizontal direction (XY plane). The transillumination unit 34 emits light at a timing t2 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28. As a result, the component P held by the component holding nozzle 27 is illuminated by the light emitted from the transillumination unit 34 and reflected by the reflector of the moving head 26. In response to this timing t2, the imaging sensor unit 29 captures an image of the component P.

The multiple transillumination units 34 may constitute a transillumination channel. The control unit 40 may control the light emission on a per-translumination channel basis.

The side illumination section 35 is disposed approximately parallel to the side wall 32q of the housing 32 of the illumination unit section 31. The side illumination section 35 is disposed so that the illumination direction is perpendicular to the optical axis of the image sensor section 29. The side illumination section 35 is also disposed above the reflective illumination section 33 and the transmitted illumination section 34. When the side illumination section 35 emits light, it irradiates light along a horizontal plane.

The side illumination unit 35 emits light at time t3 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28. As a result, the side of the component P held by the component holding nozzle 27 is illuminated by the light emitted from the side illumination unit 35. In response to this time t3, the imaging sensor unit 29 captures an image of the component P.

The coaxial lighting section 39 is disposed approximately parallel to the side wall 32q of the housing 32 of the lighting unit section 31. The coaxial lighting section 39 is disposed so that the irradiation direction is perpendicular to the optical axis of the imaging sensor section 29. The coaxial lighting section 39 is disposed below the reflective lighting section 33. When the coaxial lighting section 39 emits light, it irradiates light along a horizontal plane. In addition, a reflector C (e.g., a mirror) included in the part recognition camera 28 is disposed at a position spaced apart from the coaxial lighting section 39 in a direction along the XY plane. The light irradiated from the coaxial lighting section 39 is reflected upward by the reflector C and illuminates the area above the reflector C.

The coaxial lighting unit 39 emits light at timing t4 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28. As a result, the lower part of the component P held by the component holding nozzle 27 is illuminated by light that is irradiated from the coaxial lighting unit 39, reflected upward by the reflector C, and passes through the central space surrounded by the multiple reflective lighting units 33 and the transparent glass. In response to this timing t4, the imaging sensor unit 29 captures an image of the component P.

The coaxial lighting unit 39 may constitute a coaxial lighting channel. The control unit 40 may control the light emission on a coaxial lighting channel basis.

The light emission timings t1 to t4 of each of the lighting units 33, 34, 35, and 39 may be any of a number of image capture timings within the time of the forward movement in one turn. The light emission timings of each of the lighting units 33, 34, 35, and 39 may overlap. For example, at least two of the multiple lighting units 33, 34, 35, and 39 may emit light simultaneously to illuminate the component P.

<Details of the image sensor and head unit>
Next, the imaging sensor section 29 and the head unit 23 according to the present embodiment will be described in detail with reference to Figures 4 to 7. Figure 6 is a table illustrating the first wavelength and the second wavelength according to the present embodiment. Figure 7 is a diagram for explaining the positional relationship between the component P and the reference mark 61.

As shown in FIG. 4, the head unit 23 includes a moving head 26 that extends downward, and a cylindrical marking tube 60 that also extends downward. A component holding nozzle 27 is attached to the moving head 26. The marking tube 60 is provided adjacent to the moving head 26 at a position a predetermined distance away from the moving head 26. A translucent reference mark 61 is provided on the underside of the marking tube 60.

The reference mark 61 is used when the component recognition camera 28 recognizes the component P and calculates the amount of deviation in the position and orientation of the component P relative to the component holding nozzle 27. For example, the component recognition camera 28 captures an image including the component P and the reference mark 61. The control unit 40 analyzes the captured image to recognize the component P and the reference mark 61, and calculates the amount of deviation in the relative position and orientation of the component P with respect to the reference mark 61. The control unit 40 then uses this calculated amount of deviation to calculate the amount of deviation in the position and orientation of the component P with respect to the component holding nozzle 27, as described above.

The reference mark 61 (i.e., the lower surface of the mark tube 60) is located above the lower end of the component holding nozzle 27. As a result, as shown in FIG. 7B, when the component holding nozzle 27 rotates on its axis to correct the amount of deviation in the orientation of the component P when mounting the component P (i.e., when the orientation of the component P is rotated), the component P does not collide with the mark tube 60. Therefore, according to this embodiment, it is possible to handle a component P of a size that would interfere with the reference mark 61 if the orientation of the component P is rotated. Note that, as shown in FIG. 7A, when the component recognition camera 28 images the component P and the reference mark 61, the component P has not yet been rotated, so the component P does not interfere with the reference mark 61. Therefore, the component recognition camera 28 can image both the component P and the reference mark 61.

By adopting a configuration in which the reference mark 61 is positioned above the lower end of the component holding nozzle 27, as shown in FIG. 4, the distance from the lens 71 to the reference mark 61 becomes greater than the distance from the lens 71 to the component P. Therefore, a configuration is required to clearly capture images of both the component P and the reference mark 61. The component mounting device 1 according to this embodiment has a configuration to achieve this. This will be explained in detail below.

The reflective illumination unit 33 irradiates light 101 of a first wavelength toward the component. A mark illumination unit 62 is provided inside the mark tube 60. The mark illumination unit 62 may be interpreted as a second illumination unit. The mark illumination unit 62 irradiates light 102 of a second wavelength toward the reference mark 61 (i.e., downward). The first wavelength and the second wavelength are different wavelengths.

Lens 71 may be a lens 71 having chromatic aberration characteristics such that the focal position shifts depending on the first wavelength and the second wavelength. For example, lens 71 may be a lens 71 in which the position of component P is the focal position at the first wavelength, and the position of reference mark 61 is the focal position at the second wavelength. This allows image sensor 72 to clearly capture images of both component P and reference mark 61.

Alternatively, the lens 71 may be a lens having a predetermined chromatic aberration characteristic. In this case, the first wavelength may be a wavelength at which the position of the component P is the focal position of the lens 71, and the second wavelength may be a wavelength at which the position of the reference mark 61 is the focal position of the lens 71. This allows the imaging element 72 to clearly capture images of both the component P and the reference mark 61.

In other words, the component mounting device according to this embodiment may be configured with a combination of the first wavelength, the second wavelength, and the lens 71 such that both the component P held by the component holding nozzle 27 and the image mark are clearly imaged on the image sensor 72.

The second wavelength may be shorter than the first wavelength. In this case, for example, as shown in FIG. 6, the first wavelength may be in the range of 600 nm to 900 nm, and the second wavelength may be in the range of 400 nm to 550 nm.

The above-described configuration makes it possible to handle components P of a size that would interfere with the reference mark 61 if the orientation of the component P were rotated, and to capture clear images of both the component P and the reference mark 61.

<Software Configuration of Component Mounting Device>
Next, a software configuration (functional configuration) of the control unit 40 of the component mounting device 1 will be described with reference to Fig. 8. Fig. 8 is a block diagram illustrating an example of the functional configuration of the control unit 40 of the component mounting device 1 shown in Fig. 1.

The control unit 40 of the component mounting device 1 may be configured by a general-purpose computer equipped with a storage device represented by a ROM (Read Only Memory) and a RAM (Random Access Memory), and a calculation device represented by a CPU (Central Processing Unit). The calculation device realizes the software configuration (functional configuration) shown in FIG. 8 by reading and executing a computer program stored in the storage device. That is, each block shown in the control unit 40 in FIG. 8 represents a function realized by software. However, at least a part of the functions represented as blocks is not limited to software, and may be realized by the physical configuration (hardware) of the "device".

The control unit 40 includes a memory unit 41, a mechanism drive unit 46, and an image processing unit 47. The mechanism drive unit 46 controls the drive of the main body mechanism unit 10. For example, the mechanism drive unit 46 controls the drive of the board transport mechanism 13, the component supply mechanism 15, and the head unit 23, and causes the board transport mechanism 13, the component supply mechanism 15, and the head unit 23 to operate in a coordinated manner.

The storage unit 41 holds at least mounting information 42, component information 43, and imaging timing information 45. The mounting information 42 includes information such as the type of component P to be mounted on each board W, and the mounting position and mounting attitude (e.g., orientation) of the component P on the board W. The component information 43 may include information such as the external shape of each type of component P, and the presence or absence of electrodes or the number of electrodes.

The imaging timing information 45 may include information indicating the light emission timing of the lighting channel and information indicating the imaging timing of the component P. The number of imaging timings may be multiple. The imaging timing may be interpreted as shutter timing. The number of light emission timings may be multiple. For example, the imaging timing information 45 may include information indicating the light emission timing of the lighting channel during the forward movement in one turn and information indicating the imaging timing of the imaging sensor unit 29.

The imaging processing unit 47 includes a camera control unit 48 and a part recognition unit 50.

The camera control unit 48 controls the imaging of the imaging sensor unit 29 and the light emission of the lighting unit 31 at the imaging timing. For example, the camera control unit 48 reads the imaging timing information 45 from the memory unit 41. Then, the camera control unit 48 causes the lighting channel to emit light at each imaging timing indicated by the imaging timing information 45, and causes the imaging sensor unit 29 to capture an image of the component P.

The component recognition unit 50 recognizes the characteristics of the component P contained in the image captured by the image capture sensor unit 29 based on the image. The characteristics of the component P may include at least one of the position of the component P, the attitude of the component P, the polarity of the component P, the three-dimensional shape of the component P, the external shape of the component P, and characters added to the component P. The moving head 26 and the component holding nozzle 27 mount the component P at the mounting point on the board W based on the recognition result by the component recognition unit 50.

The imaging information of the board recognition camera 36 may also be transmitted to the imaging processing unit 47. The imaging processing unit 47, like the component recognition unit 50, may recognize the position and posture of the board W from the imaging information (image) and transmit the recognition result to the mechanism driving unit 46.

<Operation flow>
Next, an example of a component mounting process performed by the component mounting device 1 will be described with reference to Fig. 9. Fig. 9 is a flow chart illustrating the component mounting process according to the present embodiment. When an instruction to start production is received, the component mounting device 1 starts the following process.

In S101, the control unit 40 determines whether it is time to perform a correction process for the change over time of the component mounting device 1. The correction process for the change over time is a process performed to correct distortion of the device due to heat generation or the like. For example, the correction process for the change over time involves capturing an image of the device in an initial state with the component recognition camera 28, storing the captured image, capturing an image of the device in a current state with the component recognition camera 28, comparing the captured image of the device in the initial state with the captured image of the device in the current state, and performing correction based on the change over time. The process of S101 may use the image captured by the component recognition camera 28 in this correction process for the change over time. If it is time to perform the correction process for the change over time (S101: YES), in S102, the control unit 40 measures the position of the reference mark 61 on the XY plane using the image captured by the component recognition camera 28 in the correction process for the change over time. Hereinafter, the position on the XY plane is referred to as the XY position. In this case, the control unit 40 may measure the XY position of the reference mark 61 by moving the head unit 23 and the reference mark 61 in the positive direction of the X axis at a low speed (e.g., 600 mm/sec) while passing them above the component recognition camera 28. This allows the XY position of the reference mark 61 to be measured more accurately.

If it is not time to perform the time-dependent change correction process (S101: NO), then in S103, the component holding nozzle 27 picks up and holds the component P at the component removal position. Then, the component holding nozzle 27 passes above the component recognition camera 28.

In step S104, the component recognition camera 28 captures an image of the component P held by the component holding nozzle 27 passing above, and the reference mark 61 adjacent to the component holding nozzle 27. At this time, as described above, the reflective illumination unit 33 irradiates the held component P with light 101 of the first wavelength, and the mark illumination unit 62 irradiates the reference mark 61 with light 102 of the second wavelength. This allows the image sensor unit 29 to clearly capture an image of both the component and the reference mark 61.

In S105, the control unit 40 analyzes the image captured in S104 to recognize the XY position of the reference mark 61, as well as the XY position and orientation of the part P.

In S106, the control unit 40 measures the first-stage XY position and orientation of the component P based on the relative positional relationship between the reference mark 61 and the component P recognized in S105. By measuring the first-stage XY position and orientation of the component P using the reference mark 61 in this way, even if the head unit 23 shakes during imaging in S104, for example, the relative position of the component P with respect to the reference mark 61 does not change, and the control unit 40 can accurately measure the first-stage XY position and orientation of the component P.

In addition, the control unit 40 takes into account the deviation between the XY position of the reference mark 61 measured in S106 and the XY position of the reference mark 61 measured in S101, and calculates the second-stage XY position indicating a more accurate XY position of the part P from the first-stage XY position of the part P. For example, the control unit 40 calculates the second-stage XY position of the part P using the following formula 1.

XY position of part P in the second stage=XY position of part P in the first stage−(XY position of reference mark 61 recognized in S105−XY position of reference mark 61 measured in S101)
... (Equation 1)

Because both the component P and the reference mark 61 are clearly captured in the image, the control unit 40 can accurately calculate the first-stage XY position of the component P, the second-stage XY position of the component P, and the orientation of the component P. Note that the second-stage XY position of the component P calculated using Equation 1 may correspond to the amount of deviation in the position of the component P relative to the component holding nozzle 27, as described above.

In S107, the component holding nozzle 27 mounts the component P on the board W. At this time, the component holding nozzle 27 may move and rotate about its axis so as to correct the amount of deviation in the position and orientation of the component P calculated in S106, and then mount the component P on the board W. As described above, the lower surface of the mark tube 60 is located above the lower end of the component holding nozzle 27, so that even if the component holding nozzle 27 rotates the orientation of the component P for correction in S107, the component P will not collide with the mark tube 60. Therefore, the component mounting device 1 can also handle a component P of a size that would interfere with the reference mark 61 if the orientation of the component P was rotated.

In S108, the control unit 40 determines whether production has ended. If the control unit 40 determines that production has not ended (S108: NO), the process returns to S101. If the control unit 40 determines that production has ended (S108: YES), the process ends.

The process of measuring the relative position and orientation of component P with respect to reference mark 61 described above is performed when the component holding nozzle 27 performs a scan in which it passes diagonally above the component recognition camera 28 in the XY plane (hereinafter referred to as a diagonal scan), but does not have to be performed when the component holding nozzle 27 performs a scan in which it passes above the component recognition camera 28 in the X direction in the XY plane (hereinafter referred to as a linear scan). This is because the head unit 23 is prone to shaking when performing a diagonal scan, but does not shake much when performing a linear scan.

Although the embodiments have been described above with reference to the attached drawings, the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications, corrections, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also fall within the technical scope of the present disclosure. Furthermore, the components in the above-described embodiments may be combined in any manner as long as it does not deviate from the spirit of the invention.

The technology disclosed herein is useful for devices that mount components on substrates.

LIST OF SYMBOLS 1 Component mounting device 10 Main mechanism section 11 Mounting machine main body 12 Base 13 Board transport mechanism 14 Conveyor section 15 Component supply mechanism 16 Feeder base 17 Slot 18 Tape feeder 19 Feeder cart 20 Cart section 21 Reel 22 Carrier tape 23 Head unit 24 Y-axis table mechanism 25 X-axis table mechanism 26 Moving head 27 Component holding nozzle 28 Component recognition camera 29 Imaging sensor section 31 Illumination unit section 32 Housing 33 Reflection illumination section 34 Transmitted illumination section 35 Side illumination section 36 Board recognition camera 37 Disposal box 38 Nozzle holder 39 Coaxial illumination section 40 Control section 41 Memory section 42 Mounting information 43 Component information 45 Imaging timing information 46 Mechanism driving section 47 Imaging processing section 48 Camera control unit 50 Component recognition unit 60 Mark tube 61 Reference mark 62 Mark illumination unit 71 Lens 72 Image pickup element 101 Light of first wavelength 102 Light of second wavelength B Shielding plate C Reflecting plate P Component W Substrate

Claims (5)

a nozzle that holds a component and moves toward a board on which the component is to be mounted;
a mark fixed adjacent to the nozzle, positioned above a lower end of the nozzle, and moving with the nozzle;
a first illumination unit that illuminates the component held by the nozzle with light of a first wavelength;
a second illumination unit that illuminates the mark with light having a second wavelength different from the first wavelength;
an imaging unit that images, from below, the component illuminated with the light of the first wavelength and the mark illuminated with the light of the second wavelength;
a control unit that corrects a deviation in position and orientation of the component with respect to the nozzle based on a positional relationship between the component and the mark included in an image captured by the imaging unit ,
the imaging unit includes a lens having chromatic aberration characteristics in which focal positions are different at the first wavelength and the second wavelength,
Parts mounting device. the first wavelength is a wavelength at which the position of the component held by the nozzle is the focal position of the lens;
the second wavelength is a wavelength at which the position of the mark is the focal position in the lens;
2. The component mounting apparatus according to claim 1 . The second wavelength is shorter than the first wavelength.
3. The component mounting device according to claim 1 or 2 . the first wavelength is in the range of 600 nm to 900 nm;
The second wavelength is in the range of 400 nm to 550 nm.
4. The component mounting apparatus according to claim 3 . illuminating a part held by the nozzle with light of a first wavelength;
a mark fixed adjacent to the nozzle, located above a lower end of the nozzle, and moving together with the nozzle is illuminated with light of a second wavelength different from the first wavelength;
The component illuminated with the light of the first wavelength and the mark illuminated with the light of the second wavelength are imaged from below by an image capturing unit including a lens having chromatic aberration characteristics in which focal positions differ at the first wavelength and the second wavelength ;
correcting a position and orientation deviation of the component with respect to the nozzle based on a positional relationship between the component and the mark included in the captured image;
How to install parts.

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