JP7645487B2 - Component mounting device and component mounting method - Google Patents

Description

This disclosure relates to a component mounting device and a component mounting method.

Conventionally, there is known a component mounter that mounts electronic components on a board (see, for example, Patent Document 1). The component mounter of Patent Document 1 is equipped with a camera that captures components such as electronic components and circuit boards illuminated by a light source. This component mounter is equipped with an image processing means that processes the image signal from the camera each time a component is captured by the camera while the component mounter is in operation to recognize component information such as the position and orientation of the component and detect the brightness of a predetermined portion of the captured image of the component, and a brightness adjustment means that adjusts the shutter speed of the camera and/or the illumination luminance of the light source based on the brightness detected by the image processing means while the component mounter is in operation.

JP 2006-210531 A

It is assumed that the light source disclosed in Patent Document 1 is used to image and recognize components picked up by nozzles mounted on a head in which the nozzles are arranged in multiple rows along a predetermined direction, while moving (scanning) above the camera. In this case, the component mounter of Patent Document 1 detects the brightness of the captured image of the component each time the camera images the component, and adjusts the camera shutter speed or the illumination level of the light source, etc., so that the lighting conditions are set for each component held by each nozzle before imaging. Therefore, since the lighting conditions are adjusted for each component each time, the movement speed of the head becomes slow, and it may take a long time to image and recognize the components. On the other hand, if the movement speed of the head is made too fast, the accuracy of component recognition based on the captured image may decrease.

The present disclosure provides a component mounting device and a component mounting method that can determine the head movement speed taking into account the lighting conditions for each component held by each nozzle, and can reduce the time required to image and recognize the components as much as possible, improving productivity while suppressing a decrease in component recognition accuracy.

One aspect of the present disclosure is a method for manufacturing a printing system comprising: a head having a plurality of nozzles arranged along a first direction, the nozzles being arranged in a plurality of rows in a direction perpendicular to the first direction; a movement control unit that moves the head along the first direction; an imaging unit that includes an illumination unit that illuminates each component held by each nozzle of the head and images the components from below; an imaging control unit that controls imaging by the imaging unit and illumination conditions by the illumination unit at the time of imaging; a component recognition unit that recognizes the components from an image captured by the imaging unit; and a component mounting unit that mounts the components on a board with the head based on a recognition result by the component recognition unit; the control unit controls the movement speed of the head moving in the first direction above the imaging unit based on the lighting conditions when imaging each component held in each nozzle of the head, determines whether the lighting conditions for illuminating each component held by each nozzle are the same for each nozzle set formed by a plurality of nozzles at the same position in the first direction in the multiple rows of the head, and moves the head at a first speed if the lighting conditions are the same for all nozzle sets, and moves the head at a second speed slower than the first speed if the lighting conditions are different for at least one nozzle set.

One aspect of the present disclosure includes a step of moving a head along a first direction, the head having a plurality of nozzles arranged along a first direction and arranged in a plurality of rows in a direction perpendicular to the first direction; a step of controlling lighting conditions at the time of imaging by an illumination unit that illuminates components held by each nozzle of the head, and controlling imaging by an imaging unit that images the components from below; a step of recognizing the components from an image captured by the imaging unit; and a step of mounting the components on a board with the head based on the component recognition result, wherein the step of moving the head includes a step of controlling lighting conditions at the time of imaging for each component held by each nozzle of the head, the step of controlling lighting conditions at the time of imaging by an imaging unit that images the components from below, the step of recognizing the components from an image captured by the imaging unit, and based on the above, controlling the movement speed of the head in the first direction , the step of controlling the movement speed of the head including the steps of: determining whether or not the illumination conditions for illuminating each component held by each nozzle are the same for each nozzle set formed by a plurality of nozzles at the same position in the first direction in the plurality of rows possessed by the head; and moving the head at a first speed if the illumination conditions are the same for all nozzle sets, and moving the head at a second speed slower than the first speed if the illumination conditions are different for at least one nozzle set .

According to the present disclosure, the head movement speed can be determined taking into account the lighting conditions for each component held by each nozzle, and the time required to image and recognize the components can be shortened as much as possible, improving productivity while suppressing a decrease in component recognition accuracy.

FIG. 2 is a top view illustrating a mechanical configuration of the component mounting device according to the first embodiment; FIG. 2 is a side view illustrating a mechanical configuration of the component mounting apparatus shown in FIG. FIG. 3 is a perspective view illustrating the operation of the moving head shown in FIG. FIG. 3 is a side view illustrating a mechanical configuration of the component recognition camera shown in FIG. FIG. 5 is a perspective view illustrating a mechanical configuration of the lighting unit shown in FIG. FIG. 2 is a schematic diagram illustrating an arrangement of a plurality of component holding nozzles on a moving head; FIG. 2 is a block diagram illustrating a functional configuration of a control unit of the component mounting device shown in FIG. FIG. 13 is a schematic diagram illustrating each image capture timing and each image capture range in a time-shifted lighting mode; FIG. 13 is a schematic diagram illustrating an example of an imaging timing and an imaging range in a simultaneous lighting mode; A table showing an example of the determination result of simultaneous lighting possible determination for each nozzle set. 1 is a flowchart illustrating an example of an operation of a component mounting device. 9 is a flow chart illustrating the operation of the component mounting apparatus;

Below, the embodiments will be described in detail with reference to the drawings as appropriate. However, more detailed explanation than necessary may be omitted. For example, detailed explanation of already well-known matters or duplicate explanation of substantially identical configurations may be omitted. This is to avoid the following explanation becoming unnecessarily redundant and to facilitate understanding by those skilled in the art. Note that the attached drawings and the following explanation are provided to enable those skilled in the art to fully understand this disclosure, and are not intended to limit the subject matter described in the claims.

For example, the term "part" or "device" in the embodiments is not limited to a physical configuration that is mechanically realized by hardware, but also includes configurations whose functions are realized by software such as a program. Furthermore, the functions of one configuration may be realized by two or more physical configurations, or the functions of two or more configurations may be realized by, for example, one physical configuration.

<Mechanical configuration of the component mounting device>
First, the mechanical configuration of the component mounting device 1 will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a top view illustrating the mechanical configuration of the component mounting device 1 according to the first embodiment. Fig. 2 is a side view illustrating the mechanical configuration of the component mounting device 1 shown in Fig. 1. In Fig. 1 and Fig. 2, the front side of the component mounting device 1 (the lower side in the plane of Fig. 1 and the left side in the plane of Fig. 2) is also referred to as the front side, and the back side of the component mounting device 1 (the upper side in the plane of Fig. 1 and the right side in the plane of Fig. 2) is also referred to as the rear side.

One or more component mounting devices 1 are arranged in a mounting board manufacturing line for mounting various components P to a board W, and mount the components P in a predetermined position and orientation on the board W transported from upstream of the mounting board manufacturing line.

As shown in Figures 1 and 2, the component mounting device 1 is mainly configured to include a main body mechanism 10 (an example of a component mounting unit) that mounts components P (e.g., electronic components such as ICs (integrated circuits), transistors, and capacitors, lead components, chip components, or BGA (ball grid array) components) on a board W by the operation of each component mechanism, and a control unit 40 that controls the operation of the main body mechanism 10. The main body mechanism 10 has a mounting machine main body 11 composed of a base 12 and the like, and a head unit 23 that is movable relative to the mounting machine main body 11. The control unit 40 is stored inside the base 12 (see below) of the component mounting device 1, and controls various mechanisms such as the mounting machine main body 11 and the head unit 23.

A board transport mechanism 13 is disposed in the center of the base 12 of the mounting machine main body 11 along the X direction (the transport direction of the board W) shown in FIG. 1. The board transport mechanism 13 has a pair of conveyor sections 14 extending along the X direction, and transports the board W placed on the pair of conveyor sections 14, positions it at a predetermined mounting position, and holds it.

A pair of component supply mechanisms 15 are disposed facing each other on both the front and rear sides of the board transport mechanism 13 (top and bottom sides in the plane of FIG. 1, left and right sides in the plane of FIG. 2). Each of the pair of component supply mechanisms 15 has a feeder base 16 in which a slot 17 is provided, and multiple tape feeders 18 are attached in parallel to the slots 17 as part feeders.

The component mounting device 1 further includes a feeder cart 19. The feeder cart 19 includes a carriage section 20 with multiple wheels disposed on its underside, and multiple reel stock sections (not shown) disposed on the upper side of the carriage section 20. A reel 21 is housed in each of the multiple reel stock sections. A carrier tape 22 containing a component P is pulled out from each of the reels 21, and the component P is supplied to the tape feeder 18 of the component supply mechanism 15. As a result, the tape feeder 18 of the component supply mechanism 15 pitch-feeds the carrier tape 22 in the tape feed direction, thereby supplying the component P to a pick-up position where the component P is picked up by the moving head 26 of the head unit 23 described below.

The head unit 23 is disposed above the base 12 and is configured to be movable between a mounting position and a removal position where the component supply mechanism 15 and the substrate W are disposed. Specifically, the head unit 23 is capable of linear movement along the X and Y directions by an X-axis table mechanism 25 and a Y-axis table mechanism 24 that are disposed orthogonal to each other on a plane substantially parallel to the surface of the substrate W.

On the upper surface of the base 12, a Y-axis table mechanism 24 is disposed along the Y direction. A pair of front and rear X-axis table mechanisms 25 are disposed along the X direction, and are attached to each of the Y-axis table mechanisms 24 so as to be slidable along the Y direction. A moving head 26 is attached to the tip of each of the pair of front and rear X-axis table mechanisms 25 so as to be slidable along the X direction. That is, in the first embodiment, the moving head 26 is mounted on the head unit 23, and the moving head 26 is provided so as to be movable independently of each other by the X-axis table mechanism 25 and the Y-axis table mechanism 24. As a result, the moving head 26 is arbitrarily positioned on a plane approximately parallel to the surface of the substrate W, that is, on the horizontal plane (XY plane). Both the X-axis table mechanism 25 and the Y-axis table mechanism 24 are configured with linear guide drive mechanisms.

A component recognition camera 28 (an example of an imaging unit) is disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. A component holding nozzle 27 (see below) attached to the moving head 26 picks up and holds a component P from the component supply mechanism 15 and passes above the component recognition camera 28. At this time, the component recognition camera 28 captures an image of the component P adsorbed and held by the component holding nozzle 27 as it passes by, at a predetermined timing and under predetermined lighting conditions (see below). The captured image is subjected to a recognition process, allowing the component P to be identified and its position detected with high precision.

In addition, a nozzle holder 38 and a waste box 37 are further disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. The nozzle holder 38 stores multiple types of component holding nozzles 27 of the moving head 26 corresponding to the components P to be held. By having the moving head 26 access the nozzle holder 38 and performing a predetermined nozzle replacement operation, a component holding nozzle 27 (described below) suitable for the object to be held is attached to the moving head 26. The waste box 37 is formed in a box shape and has an internal space, in which components P determined to be defective as a result of recognition of the image captured by the component recognition camera 28 are discarded.

<Configuration and operation of moving head>
Next, the configuration and operation of the moving head 26 will be described with reference to Fig. 3. Fig. 3 is a perspective view illustrating the operation of the moving head 26 shown in Fig. 2.

The moving head 26 is a multiple-head having multiple moving heads 26, and multiple component holding nozzles 27 are arranged side by side at the bottom end of each moving head 26 (see FIG. 6A). For example, the moving head 26 is provided with multiple component holding nozzles 27 (e.g., eight nozzles) in multiple rows (e.g., two rows). In addition, a reflector (an example of a first reflector) (not shown) is fixed to the moving head 26 to reflect illumination light emitted from the transmitted illumination unit 34 (see below). The reflector is positioned above the held component P.

Each of the component holding nozzles 27 uses air pressure, for example, to vacuum-suck and hold the component P from the tape feeder 18 of the component supply mechanism 15, and moves up and down individually. The moving head 26 also has a Z-axis lifting mechanism (not shown) that individually lifts and lowers each of the component holding nozzles 27, and a θ-axis rotation mechanism (not shown) that individually rotates each of the component holding nozzles 27 around the nozzle axis. The Y-axis table mechanism 24 and the X-axis table mechanism 25 are driven to position the moving head 26 arbitrarily in the horizontal plane (XY plane). This movement causes the moving head 26 to suck up and pick up the component P by the component holding nozzle 27 from the pick-up position of the tape feeder 18 of the component supply mechanism 15.

A board recognition camera 36 (see FIG. 1) is fixed to the moving head 26. The board recognition camera 36 is disposed on the underside of the X-axis table mechanism 25 and moves integrally with the moving head 26. As the moving head 26 moves, the board recognition camera 36 passes above the board W positioned by the board transport mechanism 13 and images the board W. The image capture result (image capture information) is similarly processed for recognition, thereby detecting the position and orientation of the board W.

As a result of detecting the position of the board W, the moving head 26 uses its component holding nozzles 27 to place components P at their respective mounting points (e.g., the mounting positions and mounting orientations at which the components P should be placed on the board W) in accordance with instructions from the control unit 40. This mounting of components P at one time is carried out until all of the components P that have been sucked and held by each of the component holding nozzles 27 of the moving head 26 have been placed on the board W. In this way, the components P are held and moved by the component holding nozzles 27 of the moving head 26 between the removal position and the mounting operation position, and are finally placed on the board W.

The component mounting device 1 repeatedly performs a series of operations, using the component holding nozzle 27 of the moving head 26 to pick up and mount multiple components P, then move back to the pick-up position, until mounting is completed at all of the multiple mounting points on the board W. By repeating this operation, multiple components P are sequentially mounted on each of the boards W that are transported in sequence, and after mounting, the boards W on which all of the components P have been mounted are transported to a downstream process. In this way, the mounting machine main body 11 and the head unit 23 operate in coordination, and this coordinated operation is executed according to instructions from the control unit 40.

In addition, in the first embodiment, a series of work units consisting of the forward movement from the removal of component P at the removal position to the mounting work position of component P, and the subsequent return movement to the removal position, is also referred to as a "one turn" work unit. The forward movement from the removal position to the mounting work position in one turn is hereinafter also referred to simply as "forward movement in one turn."

<Configuration of the parts recognition camera>
Next, the configuration of the component recognition camera 28 will be described with reference to Figures 4 and 5. Figure 4 is a side view illustrating the mechanical configuration of the component recognition camera 28 shown in Figure 2. Figure 5 is a perspective view illustrating the mechanical configuration of the lighting unit 31 shown in Figure 4. For ease of explanation, Figure 4 also illustrates the moving head 26 that moves above the component recognition camera 28 and on its optical axis, and also illustrates a schematic diagram of the internal structure of the lighting unit of the component recognition camera 28, as described below.

As shown in FIG. 4, the part recognition camera 28 has an image sensor section 29 and an illumination unit section 31. The part recognition camera 28 turns on the illumination unit section 31 for the part P held by the moving head 26 only during the forward movement in one turn (i.e., the forward movement in one direction), and captures images continuously from below using the image sensor section 29 in accordance with that timing.

The part recognition camera 28 can capture images according to a scan imaging method, and has an ROI (Region Of Interest) function using an area sensor. The part recognition camera 28 can capture images by setting multiple ROI ranges for the imaging sensor unit 29 using the ROI function, and continuously switching between these ROI ranges. The ROI range corresponds to the imaging range of the imaging sensor unit 29. The set ROI ranges may differ in position, size, etc.

The imaging sensor unit 29 has a generally cylindrical housing 30 and an imaging element (not shown) built into the housing 30. The imaging element is, for example, a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The imaging sensor unit 29 has a shutter function and is configured to be able to capture an image by exposing it to light at a predetermined timing in accordance with a command from an imaging processing unit 47 (see below) of the control unit 40. The imaging sensor unit 29 transmits the results of imaging by the imaging element (imaging information) to the control unit 40.

The component recognition camera 28 also has a center camera 29A and a side camera 29B as the imaging sensor unit 29. The center camera 29A is arranged so that its optical axis is aligned along the vertical direction (Z direction), and is capable of capturing an image of the component P moving above the component recognition camera 28. The side cameras 29B are arranged on both sides of the center camera 29A in the horizontal direction, and are arranged so that their optical axes are inclined relative to the vertical direction (Z direction), and are capable of capturing an image of the component P moving above the component recognition camera 28.

The lighting unit 31 has a box-shaped housing 32, and is arranged in a stacked state on top of the housing 30 of the imaging sensor 29. The lighting unit 31 has a plurality of reflective lighting units 33, a plurality of transmitted lighting units 34, a plurality of side lighting units 35, and a coaxial lighting unit 39, which are each arranged inside the housing 32. By appropriately using the plurality of reflective lighting units 33, the plurality of transmitted lighting units 34, the plurality of side lighting units 35, and the coaxial lighting unit 39, the component mounting device 1 lights up the moving component P under lighting conditions according to the component P, for example, and images the component P.

Each of the multiple reflective lighting sections 33 is arranged approximately parallel to the bottom wall 32p (i.e., the XY plane, horizontal plane) of the housing 32 of the lighting unit section 31, and its irradiation direction is set along the optical axis of the center camera 29A. When the reflective lighting section 33 is turned on, its illumination light is irradiated in an approximately vertical direction (approximately the Z direction). A transparent glass G is arranged in the horizontal direction between the reflective lighting section 33 and the component holding nozzle 27 that holds the component P to be illuminated. Reflective lighting is also called oblique lighting.

The component P held by the component holding nozzle 27 is illuminated by the reflective illumination unit 33 at any timing while it is moving above the component recognition camera 28, and the underside of the component P is illuminated through the transparent glass G. In response to this illumination timing, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

Each of the multiple transmitted illumination units 34 is disposed at an angle to the bottom wall 32p and side wall 32q (i.e., the Z direction) of the housing 32, and the illumination direction is oblique to the optical axis of the center camera 29A. A shielding plate B is disposed between each of the reflected illumination units 33 and transmitted illumination units 34. Similarly, the shielding plate B is disposed at an angle to both the bottom wall 32p and side wall 32q of the housing 32.

When the transmitted illumination unit 34 is turned on, the illumination light is emitted obliquely in the vertical direction (Z direction) and the horizontal direction (XY plane). At any point while the component P held by the component holding nozzle 27 is moving above the component recognition camera 28, the transmitted illumination unit 34 turns on the reflector of the moving head 26, thereby illuminating the component P. In response to this lighting timing, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

Each of the multiple side lighting units 35 is disposed approximately parallel to the side wall 32q of the housing 32 of the lighting unit 31, and the direction of illumination is perpendicular to the optical axis of the center camera 29A. The multiple side lighting units 35 are disposed above the reflective lighting unit 33 and the transmitted lighting unit 34. When the side lighting unit 35 is turned on, the illumination light is emitted along a horizontal plane.

The component P held by the component holding nozzle 27 is illuminated by the side lighting unit 35 at any timing while moving above the component recognition camera 28, illuminating the sides of the component P. In response to this illumination timing, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

The coaxial lighting section 39 is disposed approximately parallel to the side wall 32q of the housing 32 of the lighting unit section 31, and its irradiation direction is perpendicular to the optical axis of the center camera 29A. The coaxial lighting section 39 is disposed below the reflective lighting section 33. When the coaxial lighting section 39 is turned on, the illumination light is irradiated along a horizontal plane. In addition, the component recognition camera 28 has a reflector C (e.g., a mirror) (an example of a second reflector) disposed at a position spaced apart from the coaxial lighting section 39 in the XY plane. The coaxial lighting section 39 turns on the reflector C to illuminate the area above the reflector C.

At any point while the component P held by the component holding nozzle 27 is moving above the component recognition camera 28, the coaxial lighting unit 39 lights up the reflector C, which in turn illuminates the underside of the component P through the transparent glass G. In response to this illumination, at least one of the center camera 29A and the side camera 29B captures an image of the component P.

The timing of illumination by the illumination units may overlap, and multiple illumination units may be turned on simultaneously to illuminate component P. Which illumination unit illuminates component P may be determined based on the illumination conditions.

In accordance with instructions from the control unit 40, the part recognition camera 28 detects an image of the part P by turning on the lighting unit 31 and capturing an image according to the lighting conditions corresponding to the part P while the part P is moving above the part recognition camera 28.

As shown in FIG. 5, in the lighting unit 31, multiple side lighting sections 35 are arranged in a circular ring shape along the horizontal direction. Multiple reflective lighting sections 33 are arranged on the negative side of the Z direction from the side lighting sections 35. The central area surrounded by the multiple reflective lighting sections 33 is a space without illumination. Multiple transmitted lighting sections 34 are arranged outside the multiple reflective lighting sections 33 (opposite the central area). A coaxial lighting section 39 and a reflector C are arranged on the negative side of the reflective lighting sections 33 in the Z direction. The light irradiated by the coaxial lighting section 39 is reflected by the reflector C and passes through the central area surrounded by the multiple reflective lighting sections 33 to proceed to the positive side of the Z direction.

<Specific example of arrangement of component holding nozzles on moving head>
FIG. 6A is a schematic diagram illustrating an example of an arrangement of a plurality of component holding nozzles 27 on the moving head 26.

In FIG. 6A, the moving head 26 has, for example, eight component holding nozzles 27 capable of holding components P arranged in two rows along the moving direction A of the moving head 26. Note that two rows and eight nozzles are just an example, and other multiple row numbers and multiple numbers may be used. The position of the component recognition camera 28 is fixed. As the moving head 26 moves, the component recognition camera 28 sequentially captures images of each component P held by the two rows of component holding nozzles 27. In this case, two components P held by two component holding nozzles 27 at the same position along the moving direction A in each row (for example, the first nozzle position, the second nozzle position, ... from the right in FIG. 6A) are captured simultaneously or at different times.

The multiple component holding nozzles 27 in each row of the moving head 26 at the same position along the moving direction A are also referred to as "nozzle sets." The moving head 26 illustrated in FIG. 6A has eight nozzle sets NS. For the sake of explanation, the component holding nozzles 27 in the moving head 26 arranged in the row on the upper side of FIG. 6A (the end side of FIG. 7A described later) are also referred to as "front row nozzles" (first row nozzles). Similarly, for the sake of explanation, the component holding nozzles 27 in the moving head 26 arranged in the row on the lower side of FIG. 6A (the center side of FIG. 7A described later) are also referred to as "rear row nozzles" (second row nozzles). The front row nozzles NA hold the component PA. The rear row nozzles NB hold the component PB.

<Software configuration of component mounting device>
Next, a software configuration (functional configuration) of the control unit 40 of the component mounting device 1 will be described with reference to the drawing. Fig. 6B is a block diagram illustrating an example of the functional configuration of the control unit 40 of the component mounting device 1 shown in Fig. 1.

The control unit 40 of the component mounting device 1 is configured with a general-purpose computer, and a program as software stored in a storage device such as the computer's ROM (Read Only Memory) or RAM (Random Access Memory) is executed by an arithmetic unit such as the CPU (Central Processing Unit). That is, each block shown in the control unit 40 in FIG. 6 represents a function realized by software such as a program. However, the function represented by each block is not limited to software, and each may be configured by hardware as the physical configuration of the "device."

The control unit 40 includes a memory unit 41, an operation mode setting unit 45, a mechanism driving unit 46, and an image capture processing unit 47. The memory unit 41 stores and holds at least part information 42a, lighting condition information 42b, image capture timing information 42c, and movement speed information 42d. The image capture processing unit 47 includes a camera control unit 48 and a part recognition unit 50.

The operation mode setting unit 45 sets the operation mode of the component mounting device 1. For example, the operation mode setting unit 45 sets the operation mode based on the lighting conditions at the time of imaging each component P held by each component holding nozzle 27 of the moving head 26. The setting information of the operation mode may be stored in the memory unit 41. The operation modes include a simultaneous lighting mode and a time-delay lighting mode. The simultaneous lighting mode is an operation mode in which each component P held by the component holding nozzle 27 in the same nozzle set NS is illuminated at the same imaging timing and is imaged collectively within a common imaging range. The time-delay lighting mode is an operation mode in which each component P held by the component holding nozzle 27 in the same nozzle set NS is illuminated at different imaging timing and is imaged individually within different imaging ranges.

The operation mode setting unit 45 performs a simultaneous lighting possible determination for each nozzle set NS. In the simultaneous lighting possible determination, it is determined whether the lighting conditions of each component P (e.g., components PA, PB) held by multiple component holding nozzles 27 (e.g., front row nozzles NA and rear row nozzles NB) in the same nozzle set NS are the same. In the simultaneous lighting possible determination, it is determined that simultaneous lighting is possible or that simultaneous lighting is not possible (also described as time-delay lighting possible). The operation mode setting unit 45 determines that simultaneous lighting is possible if the above lighting conditions are the same, and determines that time-delay lighting is possible if the above lighting conditions are different.

The operation mode setting unit 45 determines the operation mode based on the result of the simultaneous lighting possible judgment for each nozzle set NS. If it is judged that time-delay lighting is possible for at least one nozzle set NS, that is, if the illumination conditions of the part PA held by the front row nozzle NA in the same nozzle set NS and the illumination conditions of the part PB held by the rear row nozzle NB are different in at least one nozzle set NS, the operation mode setting unit 45 sets the time-delay lighting mode. If it is judged that simultaneous lighting is possible for all nozzle sets NS, that is, if the illumination conditions of the part PA held by the front row nozzle NA in the same nozzle set NS and the illumination conditions of the part PB held by the rear row nozzle NB are the same in all nozzle sets NS, the operation mode setting unit 45 sets the simultaneous lighting mode.

The operation mode setting unit 45 acquires production data, for example, from an external device, and performs simultaneous lighting possible determination and operation mode setting based on the production data. This production data includes information such as the type of each component P mounted on the board W, and may be data summarizing the mounting position or mounting posture of each component P on the board W. The operation mode may be set, for example, each time production data is acquired. The production data may include information on multiple (e.g., 16) components P held at one time by each component holding nozzle 27 of the moving head 26, and different production data may be acquired each time. Therefore, the operation mode setting unit 45 may acquire production data for each turn, and set the simultaneous lighting mode or the time-delay lighting mode as the operation mode based on the production data. The operation mode setting unit 45 can switch between the simultaneous lighting mode and the time-delay lighting mode at each turn based on the production data.

The operation mode setting unit 45 may identify each component P held by each component holding nozzle 27 based on the production data, i.e., obtain the type of component P. Then, by referring to the illumination condition information 42b, it may determine each illumination condition corresponding to the type of each component P. Furthermore, the operation mode setting unit 45 may refer to the imaging timing information 42c and determine the imaging timing based on the operation mode. Furthermore, the operation mode setting unit 55 may refer to the movement speed information 42d and determine the movement speed of the moving head 26 based on the operation mode.

The part information 42a stores information such as the external shape of each type of part P, and the presence or absence of electrodes and the number of electrodes. The part information 42a is used, for example, to recognize the part P.

The lighting condition information 42b stores information about the lighting conditions when the component P is imaged. The lighting conditions may be different for each component P to be illuminated and held by the component holding nozzle 27, for example, and may be determined for each type of component P. Therefore, the lighting conditions may be determined for each position of each component holding nozzle 27 that holds each component P in the moving head 26.

The lighting condition information 42b may include information on the brightness (e.g., lighting value) of each lighting channel formed for each lighting unit for illuminating each component P. The lighting value corresponds to the current value flowing through each lighting (e.g., LED) of each lighting channel, and is a value that represents the level of LED current, and is also called a lamp value. The lighting value can take any value in the range of 0 to 255, for example. The lighting condition information 42b may include information indicating whether each lighting channel is turned on or off (i.e., whether it is turned on or off). The information indicating whether each lighting channel is turned on or off may include information on a combination of multiple lighting channels to be turned on.

In addition, the lighting condition information 42b may include information regarding the overall brightness of the lighting by the lighting unit section 31, rather than information regarding the brightness of each lighting channel. In other words, the lighting value may correspond to a value indicating the overall brightness of the lighting by the lighting unit section 31, rather than the individual brightness of each lighting channel.

Each illumination channel may include a reflected illumination channel, a transmitted illumination channel, a side illumination channel, and a coaxial illumination channel. The reflected illumination channel is an illumination channel formed by one or more reflected illumination units 33. The transmitted illumination channel is an illumination channel formed by one or more transmitted illumination units 34. The side illumination channel is an illumination channel formed by one or more side illumination units 35. The coaxial illumination channel is an illumination channel formed by a coaxial illumination unit 39. Each illumination channel differs in the illumination unit used for illumination or the direction of illumination, i.e., the illumination method is different.

The lighting channel may be turned on or off by the lighting value of the lighting channel. For example, a lighting value of 0 may indicate that lighting channel, and a lighting value of any value between 1 and 255 may indicate that the lighting channel is turned on. Note that when lighting conditions are switched, if the lighting channel to be turned on is switched, the lighting value of each lighting channel does not need to be switched. Also, when lighting conditions are switched, if the lighting value is switched, the lighting channel to be turned on does not need to be switched.

In the imaging timing information 42c, information regarding the imaging timing (shutter timing) for imaging the part P is stored. In the imaging timing information 42c, for example, information regarding the timing of lighting and camera imaging during the forward movement in one turn (also simply referred to as imaging timing) may be stored. The imaging timing may be determined for each operation mode.

In the movement speed information 42d, information on the movement speed of the moving head 26 is stored. The movement speed may be determined for each operation mode. For example, the movement speed information 42d includes high speed information used when the operation mode is set to the simultaneous lighting mode, and medium speed (medium speed) information used when the operation mode is set to the time-delay lighting mode. The movement speed information 42 may include other (e.g., low) speed information. The high speed is, for example, speed V1 (e.g., 2 to 3 m/sec). The medium speed is, for example, speed V2 (e.g., 1 to 2 m/sec).

The mechanism drive unit 46 controls the main body mechanism unit 10, and for example controls the drive of the board transport mechanism 13, the component supply mechanism 15, and the head unit 23 so that they operate in coordination with each other. The mechanism drive unit 46 controls the moving head 26 of the head unit 23. The control of the moving head 26 includes controlling the movement of the moving head 26, or controlling the suction of the component P by the component holding nozzle 27 of the moving head 26. The control of the moving head 26 also includes controlling the speed of the moving head 26. The mechanism drive unit 46 may control the moving speed (scanning speed) of the moving head 26 when passing above the component recognition camera 28 based on the operation mode. The mechanism drive unit 46 may also control the speed of the moving head 26 based on a user operation via an operation device (not shown) of the component mounting device 1.

The camera control unit 48 of the imaging processing unit 47 controls the imaging by the imaging sensor unit 29 of the part recognition camera 28 and the lighting conditions by the lighting unit unit 31 during imaging. The camera control unit 48 also determines the imaging range for imaging each part P based on the operation mode. Thus, the camera control unit 48 illuminates the part P and captures an image of the part P, for example, at an imaging timing, under lighting conditions, and in an imaging range based on the production data and the operation mode. The captured image is transmitted to the part recognition unit 50.

Therefore, under the control of the camera control unit 48, the part recognition camera 28 captures images of each part P during its forward movement in one turn with the imaging timing, imaging range, and lighting conditions according to the operating mode.

The component recognition unit 50 of the imaging processing unit 47 recognizes each feature of each component P held by the component holding nozzle 27 based on the multiple acquired images. The features of the component P may include, for example, the position of the component P, the attitude of the component P, the polarity of the component P, the three-dimensional shape of the component P, the external shape of the component P, characters added to the component P, or alignment. The alignment here refers to the arrangement of one or more electrodes in the component P.

The component recognition unit 50 sends information on the recognition results to the mechanism drive unit 46. The mechanism drive unit 46 controls the movement of the moving head 26 of the head unit 23 based on the recognition results. The head unit 23 uses the moving head 26 to mount the component P on the substrate W in a predetermined position and orientation based on the recognition results by the component recognition unit 50.

The polarity of a component P indicates the front and back of the component P. For example, the polarity (front and back) may be indicated by chamfering a predetermined location of the component P (for example, one of the four corners (for example, the lower left corner)). For example, the component P is mounted so that there is a chamfer at a predetermined location. In addition to the chamfering at the predetermined location, the polarity may be determined based on whether or not there is text in the center of the component P.

In addition, the imaging information of the board recognition camera 36 is also transmitted to the imaging processing unit 47, which, like the component recognition unit 50, recognizes the position and posture of the board W from the imaging information (image) and transmits the recognition result to the mechanism driving unit 46.

Next, we will explain the imaging control and movement control in each operation mode.

Figure 7A is a schematic diagram illustrating the imaging timing and imaging range in the time-delay lighting mode. In Figure 7A, since the time-delay lighting mode is used, the illumination conditions for each component P in at least one nozzle set NS are different.

In the time-delay lighting mode, the mechanism drive unit 46 sets the moving speed of the moving head 26 to speed V2 (an example of a medium speed) and moves the moving head 26 above the component recognition camera 28. By setting the moving speed to speed V2, the component mounting device 1 can secure time to switch the lighting conditions and capture images of each component P in the same nozzle set NS. In addition, in the time-delay lighting mode, the camera control unit 48 controls each nozzle set NS to capture images of each component P at different imaging timings and in different imaging ranges under each illumination condition for capturing images of each component P. For example, the component recognition camera 28 captures an image of a component PA held by a front row nozzle NA in a specified nozzle set NS under illumination condition LA, imaging timing TA, and imaging range CA. For example, the component recognition camera 28 captures an image of a component PB held by a rear row nozzle NB in a specified nozzle set NS under illumination condition LB, imaging timing TB, and imaging range CB. In other words, the camera control unit 48 captures an image of the part PA under illumination conditions LA at imaging timing TA (first imaging for a given nozzle set NS), and captures an image of the part PB under illumination conditions LB at the next imaging timing TB immediately (after a short time) after imaging timing TA (second imaging for a given nozzle set NS).

The imaging range CA is a range in which the component PA held by the front row nozzles NA of a given nozzle set NS is reflected, but the component PB held by the rear row nozzles is not reflected. The imaging range CB is a range in which the component PB held by the rear row nozzles NB of a given nozzle set NS is reflected, but the component PA held by the front row nozzles NA is not reflected. The imaging ranges CA and CB may have the same shape and size.

In this way, when the component mounting device 1 is set to the time-delay lighting mode, the moving speed of the moving head 26 is set to medium, so that the lighting conditions and imaging range can be switched and multiple images can be taken while the moving head 26 is moving. Therefore, the component mounting device 1 can reliably capture images of each component P and prevent a decrease in the recognition accuracy of the component P.

Figure 7B is a schematic diagram illustrating the imaging timing and imaging range in the simultaneous illumination mode. In Figure 7B, since the simultaneous illumination mode is used, the illumination conditions for each component P of each nozzle set NS are the same for all nozzle sets NS.

In the simultaneous lighting mode, all the illumination conditions of all the nozzle sets NS may be the same. For example, all the illumination conditions of all the nozzle sets NS may be the same as the illumination condition LC1. In the simultaneous lighting mode, the illumination conditions within the same nozzle set NS are the same for all the nozzle sets NS, but the illumination conditions between different nozzle sets NS may be different. For example, the illumination conditions of each of the components PA and PB held by the front row nozzles NA and rear row nozzles NB of the first nozzle set may be illumination condition LC11, the illumination conditions of each of the components PA and PB held by the front row nozzles NA and rear row nozzles NB of the second nozzle set may be illumination condition L12, and the illumination conditions of each of the components PA and PB held by the front row nozzles NA and rear row nozzles NB of the third nozzle set may be illumination condition LC13. Note that illumination conditions LC1, LC11, LC12, and LC13 are examples of illumination conditions LC.

In the simultaneous lighting mode, the mechanism drive unit 46 sets the moving speed of the moving head 26 to a speed V1 (an example of a high speed) faster than the speed V2, and moves the moving head 26 above the component recognition camera 28. By setting the moving speed to speed V1, the component mounting device 1 can image each component P at high speed without switching the illumination conditions and imaging range in each nozzle set NS. Also, in the simultaneous lighting mode, the camera control unit 48 controls each nozzle set NS to image each component P under the same illumination conditions for imaging each component P, at the same imaging timing, and in the same imaging range. For example, the component recognition camera 28 images the component PA held by the front row nozzle NA and the component PB held by the rear row nozzle NB in a given nozzle set NS at once under the illumination conditions LC, imaging timing TC, and imaging range CC. In other words, multiple components PA and PB of the same nozzle set NS are included in the same imaging range CC at the same time and are imaged at the same time. The imaging range CC is the range in which multiple components P held by each component holding nozzle 27 of the same nozzle set NS are captured.

In this way, when the illumination conditions for each component P of each nozzle set NS are the same for all nozzle sets NS, the component mounting device 1 does not need to switch illumination conditions to capture images of multiple components PA, PB in the same nozzle set NS. Therefore, the component mounting device 1 can capture images of each component PA, PB in one go under the same illumination conditions LC, in the same imaging range CC, and at the same imaging timing TC. Therefore, even if the moving head 26 is moved at high speed, the component mounting device 1 can illuminate and capture each component PA, PB under the same desired illumination conditions. Therefore, the component mounting device 1 can increase the imaging speed of each component P, and even in this case, each component P can be imaged under the desired illumination conditions, thereby preventing a decrease in the recognition accuracy of the component P.

<Determining whether each nozzle set can be lit simultaneously>
Next, an example of the determination result of simultaneous illumination possible determination for each nozzle set NS will be described.

Figure 8 is a table illustrating the results of simultaneous lighting possible determination for each nozzle set NS. Table T1 in Figure 8 shows the results of simultaneous lighting possible determination according to the type of component PA held by the front row nozzle NA (also referred to as the front row side suction component type) and the type of component PB held by the rear row nozzle NB (also referred to as the rear row side suction component type). The type of component P includes, for example, chip components, lead components, BGA components, etc. The lighting conditions are determined according to the type of component P. Note that in Figure 8, when simultaneous lighting is possible, it is simply written as "simultaneous", and when time-difference lighting is possible, it is simply written as "time difference".

Table T1 holds multiple patterns 1 to 6, each including information on the front row pickup component type, the rear row pickup component type, and information on the result of a simultaneous lighting possible determination for the combination of the front row pickup component type and the rear row pickup component type. The front row nozzle NA and the rear row nozzle NB in the same pattern in table T1 are component holding nozzles 27 included in the same nozzle set NS. Each pattern here assumes that the default lighting conditions, and the default lighting channel and lighting value are used. Note that the types of components P shown in table T1 are just an example, and other types of components P may be included.

Pattern 1 indicates that if the type of component PA held by the front row nozzle NA is a chip component and the type of component PB held by the rear row nozzle NB is a lead component, they can be lit simultaneously. Chip components are illuminated, for example, by a reflected illumination channel. Lead components are illuminated, for example, by a reflected illumination channel. Thus, in pattern 1, the illumination conditions for each component PA, PB in the same nozzle set NS are the same, and it is determined that they can be lit simultaneously.

In pattern 2, when the type of component PA held by the front row nozzle NA is a chip component and the type of component PB held by the rear row nozzle NB is a BGA component, this indicates that time-shift lighting is possible. BGA components have ball-shaped electrodes and are illuminated, for example, by a side illumination channel. Therefore, in pattern 2, the illumination conditions for each component PA, PB in the same nozzle set NS are different, and it is determined that time-shift lighting is possible.

Pattern 3 indicates that time-shift lighting is possible when the type of component PA held by the front row nozzles NA is a lead component and the type of component PB held by the rear row nozzles NB is a BGA component. In pattern 3, the lighting conditions for each component PA, PB in the same nozzle set NS are different, and it is determined that time-shift lighting is possible.

Pattern 4 indicates that if the type of component PA held by the front row nozzle NA is a chip component and the type of component PB held by the rear row nozzle NB is a chip component, they can be lit simultaneously. In pattern 4, the illumination conditions for each component PA and PB in the same nozzle set NS are the same, and it is determined that they can be lit simultaneously.

Pattern 5 indicates that if the type of component PA held by the front row nozzle NA is a lead component and the type of component PB held by the rear row nozzle NB is a lead component, they can be lit simultaneously. In pattern 5, the lighting conditions for each component PA and PB in the same nozzle set NS are the same, and it is determined that they can be lit simultaneously.

Pattern 6 indicates that if the type of component PA held by the front row nozzle NA is a BGA component and the type of component PB held by the rear row nozzle NB is a BGA component, they can be lit simultaneously. In pattern 6, the illumination conditions for each component PA and PB in the same nozzle set NS are the same, and it is determined that they can be lit simultaneously.

The operation mode setting unit 45 identifies each part PA, PB held by the front row nozzles NA and rear row nozzles NB of each nozzle set NS based on the production data, and identifies the illumination conditions for each part PA, PB. Based on the illumination conditions for each part PA, PB identified, the operation mode setting unit 45 determines whether each nozzle set NS can be illuminated simultaneously or with a time lag, as exemplified in table T1.

In addition, it is assumed that the lighting conditions for each component P are default settings for patterns 1 to 6 of table T1. The default settings of the lighting conditions for each component P may be included in the lighting condition information 42b and stored in the storage unit 41. Here, the lighting conditions may be other than the default settings. For example, the operation mode setting unit 45 may acquire input information for changing the lighting conditions (lighting channel or lighting value, etc.) from the user via an operation device (not shown) provided in the component mounting device 1. The operation mode setting unit 45 may adjust the lighting channel or lighting value, etc. based on this input information. In this case, even if the lighting conditions for imaging each component P are the same in the default settings such as patterns 1, 4 to 6 and it is determined that simultaneous lighting is possible, the lighting conditions are no longer the same by changing the lighting channel or lighting value, etc. For this reason, in this case, the operation mode setting unit 45 may determine that simultaneous lighting is not possible (time-difference lighting is possible) for the corresponding nozzle set NS.

<Component mounting device operation>
Next, the operation of the component mounting apparatus 1 will be described.
9 and 10 are flow charts illustrating the operation of the component mounting apparatus 1. A counter posF (an integer variable) for sequentially counting the front row nozzles NA of the multiple nozzle sets NS of the moving head 26 is stored in the memory unit 41 of the control unit 40. Similarly, a counter posR (an integer variable) for sequentially counting the rear row nozzles NB of the multiple nozzle sets NS is stored in the memory unit 41 of the control unit 40.

Here, it is assumed that the moving head 26 has 2 rows x 8 component holding nozzles 27 as shown in Figure 6A, with the front row nozzles NA identified by identification numbers 1 to 8 and the rear row nozzles NB identified by identification numbers 9 to 16. For example, the front row nozzles NA and rear row nozzles NB are arranged in ascending order of their identification numbers (1, 2, 3, ... and 9, 10, 11, ...) starting from the direction of travel of the moving head 26 in the moving direction A. Therefore, the combination of the front row nozzles NA and rear row nozzles NB of each nozzle set NS is expressed as follows, where each nozzle set NS = (identification number of the front row nozzles NA, identification number of the rear row nozzles NB): That is, the first nozzle set NS = (1, 9), the second nozzle set NS = (2, 10), the third nozzle set NS = (3, 11), the fourth nozzle set NS = (4, 12), the fifth nozzle set NS = (5, 13), the sixth nozzle set NS = (6, 14), the seventh nozzle set NS = (7, 15), and the eighth nozzle set NS = (8, 16).

The mechanism drive unit 46 transmits an instruction to the head unit 23 to have the moving head 26 pick up and pick up the component P from the pick-up position (S11). The head unit 23 picks up the component P from the pick-up position. The mechanism drive unit 46 starts the forward movement (head movement) in one turn from the time of transmission of S11, and moves the moving head 26 of the head unit 23 above the component recognition camera 28 while holding the component P (S12). The operation mode setting unit 45 then initializes the counters posF and posR, i.e., assigns the integer "1" to the counter posF and the integer "9" to the counter posR, and counts that the nozzle set NS to be processed is the first one (first nozzle set NS) (S13).

Based on the production data, the operation mode setting unit 45 acquires the illumination conditions (also referred to as the illumination conditions of posF) for imaging the component P held in the front row nozzle NA corresponding to the value of posF, and the illumination conditions (also referred to as the illumination conditions of posR) for imaging the component P held in the rear row nozzle NB corresponding to the value of posR. For example, when the first nozzle set NS is the target, the operation mode setting unit 45 acquires the illumination conditions corresponding to the front row nozzle NA with identification number 1 and the illumination conditions corresponding to the rear row nozzle NB with identification number 9. The operation mode setting unit 45 determines whether the illumination conditions of posF and the illumination conditions of posR are the same (S14). In other words, the operation mode setting unit 45 determines whether the illumination conditions of each component P held in the nozzle set NS to be processed are the same (corresponding to a simultaneous illumination possible determination).

If the lighting conditions of posF and posR are the same (Yes in S14), the operation mode setting unit 45 determines that simultaneous lighting is possible for the nozzle set NS being processed (S15). On the other hand, if the lighting conditions of posF and posR are different (No in S14), the operation mode setting unit 45 determines that time-delay lighting is possible for the nozzle set NS being processed (S16).

The operation mode setting unit 45 determines whether posF=8 (S17). That is, it determines whether the processes of S14 to S16 have been performed for all eight nozzle sets NS of the moving head 26. If posF=8 is not true, that is, if there are remaining nozzle sets NS for which the processes of S14 to S16 have not been performed, the operation mode setting unit 45 adds a value of 1 to the value of posF and adds a value of 1 to the value of posR (S18). Then, the process proceeds to S14. Note that in S17, the operation mode setting unit 45 may determine whether posR=16, rather than whether posF=8.

The operation mode setting unit 45 determines whether all nozzle sets NS (also called all pos) can be lit simultaneously (S19).

If simultaneous lighting is possible for all nozzle sets NS (Yes in S19), the operation mode setting unit 45 sets the operation mode of the component mounting device 1 to simultaneous lighting mode (S20). In the simultaneous lighting mode, the camera control unit 48 does not switch the imaging range and illumination conditions for imaging each component PA, PB held by the front row nozzles NA and rear row nozzles NB in the same nozzle set NS, but sets it so that each component PA, PB is illuminated and imaged at the same timing. Also, in the simultaneous lighting mode, the mechanism driving unit 46 sets the movement speed of the moving head 26 to high speed (for example, speed V1) (S21).

If time-delay lighting is possible for at least one nozzle set NS (No in S19), the operation mode setting unit 45 sets the operation mode of the component mounting device 1 to time-delay lighting mode (S22). In the time-delay lighting mode, the camera control unit 48 switches the imaging range and lighting conditions for imaging each component PA, PB held by the front row nozzles NA and the rear row nozzles NB in the same nozzle set NS, and sets it so that each component PA, PB is illuminated and imaged at different imaging timings TA, TB. Also, in the time-delay lighting mode, the mechanism driving unit 46 sets the moving speed of the moving head 26 to a medium speed (e.g., speed V2) (S23).

When the moving head 26 is set to high speed in S21, it moves at high speed in the moving direction A under the control of the mechanism drive unit 46. Also, when the moving head 26 is set to medium speed in S23, it moves at medium speed in the moving direction A under the control of the mechanism drive unit 46.

The camera control unit 48 controls the moving head 26 to illuminate each nozzle set NS under each lighting condition and capture an image of each part PA, PB while the moving head 26 is moving based on the production data, the operating mode, or information stored in the memory unit 41 (e.g., lighting condition information 42b, imaging timing information 42c) (S24).

When the component recognition camera 28 is set to the simultaneous lighting mode, it is controlled by the camera control unit 48 to illuminate and capture each component PA, PB within the same nozzle set NS at the same timing without switching the imaging range and illumination conditions. In this case, the component recognition camera 28 illuminates and captures the components PA, PB according to a common illumination condition LC for the components PA, PB. Through this imaging, the camera control unit 48 obtains an image GC that shows both the component PA and the component PB. In other words, one image is obtained for each nozzle set NS.

Furthermore, when the component recognition camera 28 is set to the time-difference lighting mode, the camera control unit 48 controls the camera to switch the imaging range and lighting conditions within the same nozzle set NS to illuminate and image each component PA, PB at different times. In this case, the component recognition camera 28 illuminates and images the component PA according to the lighting conditions LA for the component PA, and illuminates and images the component PB according to the lighting conditions LB for the component PB. Through this imaging, the camera control unit 48 obtains an image GA in which the component PA is captured and an image GB in which the component PB is captured. In other words, multiple images are obtained for each nozzle set NS.

When the image acquisition of each component P (PA, PB) by each nozzle set NS is completed, the component recognition unit 50 performs image recognition for each acquired image (S25). In this case, the component recognition unit 50 recognizes, for example, each component P held by each component holding nozzle 27 (front row nozzles NA and rear row nozzles NB of each nozzle set NS) by image recognition of each image, and acquires recognition information for each component P. The recognition information for the component P here may include, for example, position information and orientation information for the component P, discrimination information for the polarity of the component P, information on the measurement results of the 3D measurement, information on the recognition results of the outer shape of the component P, information on the recognition results of the characters attached to the component P, or information on the recognition results of the alignment of the component P. The component recognition unit 50 sends the recognition results of the image recognition to the mechanism drive unit 46.

Shortly after the component holding nozzles 27 of each nozzle set NS pass above the component recognition camera 28, the moving head 26 reaches the vicinity of the mounting position of each component P. Then, the mechanism driving unit 46 ends the movement of the moving head 26 above the component recognition camera 28 (S26). Based on the recognition results by the component recognition unit 50, the mechanism driving unit 46 commands the moving head 26 of the head unit 23 to mount each component P in a specified position and orientation on the board W. Following the command from the mechanism driving unit 46, the head unit 23 uses the moving head 26 to mount each component P on the board W (S27).

In this way, the component mounting device 1 can be set to the simultaneous lighting mode when it is not necessary to switch the lighting conditions for imaging each component P within the same nozzle set NS in all nozzle sets NS of the moving head 26. Also, the component mounting device 1 can be set to the time-delay lighting mode when it is necessary to switch the lighting conditions for imaging each component P within the same nozzle set NS in at least one nozzle set NS of the moving head 26. In the simultaneous lighting mode, the component mounting device 1 can collectively image and recognize each component P held in the same nozzle set NS by speeding up the movement of the moving head 26, while shortening the time required to image each component P. In the time-delay lighting mode, the component mounting device 1 can ensure time to switch the lighting conditions or imaging range for imaging each component P by slowing down the movement of the moving head 26 from high speed (for example, to medium speed), and can image and recognize each component P individually.

In addition, even if the component mounting device 1 has a moving head 26 with multiple rows of component holding nozzles 27, rather than constantly performing multiple imaging with separate exposures for the front row nozzles NA and the rear row nozzles NB in the same nozzle set NS, it can perform imaging with a single exposure depending on the lighting conditions, thereby increasing the movement speed of the moving head 26. In addition, the component mounting device 1 can switch between multiple operating modes according to production data, minimizing the need to perform multiple imaging within the same nozzle set NS and moving the moving head 26 at an optimal speed, thereby maintaining the accuracy of component recognition and improving productivity as much as possible.

As described above, the component mounting device 1 of the present embodiment includes the moving head 26 (an example of a head), the operation mode setting unit 45 (an example of a movement control unit), the mechanism driving unit 46 (an example of a movement control unit), the component recognition camera 28 (an example of an imaging unit), the camera control unit 48 (an example of an imaging control unit), the component recognition unit 50, and the head unit 23 (an example of a component mounting unit). The moving head 26 has a plurality of component holding nozzles 27 (an example of a nozzle) arranged along the moving direction A (an example of a first direction) and arranged in multiple rows in a direction perpendicular to the moving direction A. The mechanism driving unit 46 moves the moving head 26 along the moving direction A. The component recognition camera 28 includes an illumination unit 31 (an example of an illumination unit) that illuminates each component P held by each component holding nozzle 27 of the moving head 26, and images the component P from below. The camera control unit 48 controls the imaging by the component recognition camera 28 and the illumination conditions by the illumination unit 31 during imaging. The component recognition unit 50 recognizes the component P from the image captured by the component recognition camera 28. The head unit 23 mounts the component P on the board W using the moving head 26 based on the recognition results by the component recognition unit 50. The operation mode setting unit 45 and the mechanism driving unit 46 control the movement speed of the moving head 26, which moves in the movement direction A above the component recognition camera 28, based on the lighting conditions when the image of each component P held by each component holding nozzle 27 of the moving head 26 is captured.

As a result, the component mounting device 1 can shorten the time required to image and recognize the components P and improve productivity by accelerating the movement speed of the moving head 26 as much as possible according to the lighting conditions of each component P held by the multiple component holding nozzles 27, while reliably imaging the components P according to the lighting conditions and suppressing a decrease in the recognition accuracy of the components P.

The operation mode setting unit 45 may also determine whether the illumination conditions for illuminating each component P held by each component holding nozzle 27 are the same for each nozzle set NS formed by multiple component holding nozzles 27 at the same position in the multiple rows of movement direction A of the moving head 26. If the illumination conditions are the same for all nozzle sets NS, the mechanism driving unit 46 may move the moving head 26 at a speed V1 (an example of a first speed). If the illumination conditions are different for at least one nozzle set NS, the mechanism driving unit 46 may move the moving head 26 at a speed V2 (an example of a second speed) that is slower than speed V1.

As a result, when the illumination conditions for each component P held by each component holding nozzle 27 in the nozzle set NS are the same across all nozzle sets NS, the component mounting device 1 can shorten the imaging time because there is no need to switch illumination conditions, and can therefore increase the movement speed of the moving head 26. Also, when the illumination conditions for each component P differ within at least one nozzle set NS, the component mounting device 1 can keep the movement speed of the moving head 26 at a medium speed in order to ensure imaging time for switching illumination conditions.

In addition, when the lighting conditions are the same for all nozzle sets NS, the camera control unit 48 may control each component P for each nozzle set NS to be illuminated under the same lighting conditions at the same timing and to capture images of each component P at the same time.

This allows the component mounting device 1 to capture multiple components P in one image for one nozzle set NS. Even in this case, the component mounting device 1 can ensure the appropriate brightness for each component P, and can suppress a decrease in the recognition accuracy of the component P based on the captured image.

In addition, when the lighting conditions are different for at least one nozzle set NS, the camera control unit 48 may control each nozzle set NS to be illuminated at different times under the lighting conditions corresponding to each component P, and to capture an image of each component P individually.

This allows the component mounting device 1 to capture multiple components P by capturing images of one nozzle set NS multiple times. In this case, different illumination is performed according to the illumination conditions of each component P held by one nozzle set NS, ensuring suitable brightness for each component P and suppressing a decrease in the recognition accuracy of the component P based on the captured image.

The camera control unit 48 may also acquire information on the type (kind) of the part P and determine the lighting conditions for each part P based on the type of the part P. The information on the type of the part P may be acquired from the production data.

As a result, the component mounting device 1 can switch the lighting conditions depending on whether the component holding nozzle 27 is holding a chip component, a lead component, or a BGA component, for example, and determine the lighting conditions suitable for imaging each component P.

The lighting unit section 31 may also have multiple lighting channels with different lighting methods. The lighting conditions may include information about the lighting channel used to capture the image.

As a result, when the component mounting device 1 switches the illumination channel (e.g., the reflected illumination channel, the side illumination channel, the transmitted illumination channel, or the coaxial illumination channel) used to illuminate each component P in the same nozzle set NS, it can illuminate and image the component P with the illumination channel to be used while moving the moving head 26 at a medium speed in the time-delay lighting mode. Also, when the component mounting device 1 does not switch the illumination channel to be used to illuminate each component P in the same nozzle set NS, it can illuminate and image the component P with the illumination channel to be used while moving the moving head 26 at high speed in the simultaneous lighting mode.

The lighting conditions may also include a lighting value that indicates the brightness of the lighting provided by the lighting unit 31. The lighting value may be a variable value.

As a result, when the component mounting device 1 switches the illumination value used for illuminating each component P in the same nozzle set NS, for example, it can illuminate and image the component P with the illumination value to be used while moving the moving head 26 at a medium speed in the time-delay lighting mode. Also, when the component mounting device 1 does not switch the illumination value used for illuminating each component P in the same nozzle set NS, it can illuminate and image the component P with the illumination value to be used while moving the moving head 26 at a high speed in the simultaneous lighting mode. Also, for example, even when imaging the same component P held by each component holding nozzle 27 in the same nozzle set NS in all nozzle sets NS, the component mounting device 1 can use the simultaneous lighting mode in the case of default illumination values, and the time-delay lighting mode in the case of adjusting the illumination value by user operation, etc.

Although various embodiments have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that a person skilled in the art can come up with various modified or revised examples within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present disclosure. Furthermore, the components in the above embodiments may be combined in any manner as long as it does not deviate from the spirit of the present disclosure.

In the above embodiment, a moving head 26 having 2 rows x 8 component holding nozzles 27 is exemplified, but this is not limited to the above. For example, the moving head 26 may have three or more rows of component holding nozzles 27, or may have 8, 12, 14, or 16 component holding nozzles 27 per row.

The present disclosure is useful for a component mounting device and a component mounting method that can determine the head movement speed taking into account the lighting conditions for each component held by each nozzle, and can reduce the time required to image and recognize the components as much as possible, thereby improving productivity, while suppressing a decrease in component recognition accuracy.

1 Component mounting device 10 Main mechanism section 11 Mounting machine main body 12 Base 13 Board transport mechanism 14 Conveyor section 15 Component supply mechanism 16 Feeder base 17 Slot 18 Tape feeder 19 Feeder cart 20 Cart section 21 Reel 22 Carrier tape 23 Head unit 24 Y-axis table mechanism 25 X-axis table mechanism 26 Moving head 27 Component holding nozzle 28 Component recognition camera 29 Imaging sensor section 30 Housing 31 Illumination unit section 33 Reflection illumination section 34 Transmitted illumination section 35 Side illumination section 36 Board recognition camera 37 Disposal box 38 Nozzle holder 39 Coaxial illumination section 40 Control section 41 Memory section 42a Component information 42b Illumination condition information 42c Imaging timing information 42d Moving speed information 45 Operation mode setting section 46 Mechanism driving section 47 Imaging processing section 48 Camera control section 50 Component recognition section B Shielding plate C Reflector CA, CB, CC Imaging range G Transmission glass NA Front row nozzle NB Rear row nozzle NS Nozzle set P, PA, PB Component T1 Table W Board

Claims (7)

a head having a plurality of nozzles arranged along a first direction, the nozzles being arranged in a plurality of rows in a direction perpendicular to the first direction;
a movement control unit that moves the head along the first direction;
an imaging unit including an illumination unit that illuminates each component held by each nozzle of the head and that images the component from below;
an imaging control unit that controls imaging by the imaging unit and lighting conditions by the lighting unit during imaging;
a component recognition unit that recognizes the component from the image captured by the imaging unit;
a component mounting unit that mounts the component on a board using the head based on a recognition result by the component recognition unit,
The movement control unit is
controlling a moving speed of the head moving in the first direction above the imaging unit based on an illumination condition at the time of imaging each component held by each nozzle of the head;
determining whether or not illumination conditions for illuminating each component held by each nozzle are the same for each nozzle set formed by a plurality of nozzles in the plurality of rows of the head that are located at the same position in the first direction;
moving the head at a first speed when the illumination conditions are the same for all nozzle sets;
moving the head at a second speed slower than the first speed when the illumination conditions are different for at least one nozzle set;
Parts mounting device. The imaging control unit is
When the illumination conditions are the same for all the nozzle sets, control is performed so that each component is illuminated under the same illumination conditions at the same timing for each nozzle set, and images of each component are captured collectively.
2. The component mounting apparatus according to claim 1 . The imaging control unit is
When the illumination conditions are different for at least one nozzle set, control is performed so that each nozzle set is illuminated under each illumination condition corresponding to each component at a different timing, and each component is individually imaged.
2. The component mounting apparatus according to claim 1 . The imaging control unit is
Acquire information on the type of the part;
determining the illumination conditions for each component based on the type of the component;
The component mounting device according to any one of claims 1 to 3 . The illumination unit has a plurality of illumination channels with different illumination methods,
The lighting conditions include information on a lighting channel used to capture the image.
The component mounting device according to any one of claims 1 to 4 . the lighting condition includes an illumination value indicating a brightness of the lighting by the lighting unit,
The illumination value is a variable value.
The component mounting device according to any one of claims 1 to 5 . a step of moving a head, the head having a plurality of nozzles arranged along a first direction and arranged in a plurality of rows in a direction perpendicular to the first direction, along the first direction;
controlling lighting conditions when an image is captured by an illumination unit that illuminates a component held by each nozzle of the head, and controlling imaging by an imaging unit that images the component from below;
Recognizing the component from an image captured by the imaging unit;
mounting the component on a board using the head based on a result of the component recognition;
having
The step of moving the head includes:
controlling a moving speed of the head moving in the first direction above the imaging unit based on an illumination condition at the time of imaging each component held by each nozzle of the head ,
The step of controlling the moving speed of the head includes:
determining whether or not illumination conditions for illuminating each component held by each nozzle are the same for each nozzle set formed by a plurality of nozzles at the same position in the first direction in the plurality of rows possessed by the head;
moving the head at a first speed when the illumination conditions are the same for all nozzle sets, and moving the head at a second speed slower than the first speed when the illumination conditions are different for at least one nozzle set.
How to install parts.

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