JP7704566B2 - Dresser board and cutting blade dressing method - Google Patents

Description

The present invention relates to a dresser board used to modify the shape of a cutting blade that cuts a workpiece, and a method for dressing a cutting blade using the dresser board.

A wafer on which multiple devices are formed is divided and diced to produce multiple device chips, each equipped with a device. A package substrate is obtained by mounting multiple device chips on a specified substrate and covering the mounted device chips with a resin sealing material (mold resin). This package substrate is divided and diced to produce multiple packaged devices, each equipped with multiple packaged device chips. The device chips and packaged devices are incorporated into various electronic devices such as mobile phones and personal computers.

A cutting device is used to divide the workpieces such as the above-mentioned wafers and package substrates. The cutting device is equipped with a chuck table that holds the workpiece and a cutting unit that performs cutting processing on the workpiece, and an annular cutting blade is attached to the cutting unit. The cutting blade is rotated and cuts into the workpiece held by the chuck table, cutting and dividing the workpiece.

When cutting a workpiece with a cutting blade continues, the tip of the cutting blade gradually wears down, and the tip surface of the cutting blade changes to a rounded shape (R-shape). When a workpiece is cut with a worn cutting blade and divided into multiple chips, the R-shape of the cutting blade is reflected in the chips, causing the chips to lose their shape and potentially reducing their quality.

Therefore, before cutting a workpiece with a cutting blade, dressing is performed to intentionally wear down the tip of the cutting blade to correct the shape of the cutting blade. Dressing is performed by holding a member for dressing the cutting blade (dresser board) on the chuck table of the cutting device and cutting the cutting blade into the dresser board. For example, Patent Document 1 discloses a method of shaping the tip surface of the cutting blade into a flat shape by cutting the cutting blade into a convex portion formed on a dresser board.

JP 2019-18254 A

As described above, when shaping the tip surface of the cutting blade into a flat shape, for example, a dresser board with a convex portion is used. A dresser board with a convex portion is manufactured by cutting a flat dresser board with a cutting blade and forming multiple linear grooves (concave portions) on the surface side of the dresser board. These grooves are formed so that they are deeper than the cutting depth of the cutting blade into the dresser board when dressing is performed.

However, forming deep grooves in the dresser board reduces the rigidity of the dresser board and creates a stress difference between the front and back sides of the dresser board, which can cause the dresser board to warp. In particular, when a thin dresser board is used to reduce material, etc., warping is more likely to occur when grooves are formed. As a result, the dresser board cannot be held flat by the chuck table, and it can be difficult to accurately cut the cutting blade into the protruding parts of the dresser board.

The present invention was made in consideration of such problems, and aims to provide a dresser board that enables appropriate dressing of cutting blades, and a method of dressing cutting blades using the dresser board.

According to one aspect of the present invention, there is provided a dresser board used to modify the shape of a cutting blade, comprising: a first layer including first abrasive grains and a first binder for securing the first abrasive grains; and a plurality of second layers stacked on the first layer so as to sandwich the first layer, the thickness of the first layer being smaller than the width of the cutting blade, and the second layer including second abrasive grains having an average grain size smaller than that of the first abrasive grains and a second binder for securing the second abrasive grains , the underside of the cutting blade contacting the first layer and both side surfaces of the tip of the cutting blade contacting the second layer, thereby modifying the shape of the tip of the cutting blade so that the underside of the cutting blade approaches a flat shape .

Preferably, the first abrasive grains and the second abrasive grains are green carborundum or white alundum, and the first binder and the second binder are resin bonded. Preferably, the average grain size of the first abrasive grains is 1 μm or more and 200 μm or less, and the average grain size of the second abrasive grains is 0.1 μm or more and 20 μm or less.

According to another aspect of the present invention, there is provided a dresser board used to modify the shape of a cutting blade, comprising a first layer containing abrasive grains and a binder for fixing the abrasive grains, and a plurality of second layers stacked on the first layer so as to sandwich the first layer, wherein the thickness of the first layer is smaller than the width of the cutting blade, and the second layer does not contain abrasive grains, and the underside of the cutting blade contacts the first layer and both side surfaces of the tip of the cutting blade contact the second layer, thereby modifying the shape of the tip of the cutting blade so that the underside of the cutting blade approaches a flat shape .

According to another aspect of the present invention, there is provided a method for dressing a cutting blade using a dresser board to modify the shape of the cutting blade, the dresser board including a first layer including first abrasive grains and a first binder for fixing the first abrasive grains, and a plurality of second layers stacked on the first layer so as to sandwich the first layer, the thickness of the first layer being smaller than the width of the cutting blade, the second layer including second abrasive grains having an average grain size smaller than that of the first abrasive grains and a second binder for fixing the second abrasive grains, and a surface on which the first layer and the second layer are exposed. and moving the cutting blade and the dresser board relatively to each other to cut the tip of the cutting blade into the upper surface side of the dresser board along the first layer, thereby bringing the underside of the cutting blade into contact with the first layer and bringing both side surfaces of the tip of the cutting blade into contact with the second layer, thereby modifying the shape of the tip of the cutting blade so that the underside of the cutting blade approaches a flat shape .

According to another aspect of the present invention, there is provided a method for dressing a cutting blade using a dresser board to modify the shape of the cutting blade, the dresser board including a first layer including abrasive grains and a binder for fixing the abrasive grains, and a plurality of second layers stacked on the first layer so as to sandwich the first layer, the thickness of the first layer being smaller than the width of the cutting blade, the second layer including no abrasive grains, and the dresser board being chucked so that the surfaces on which the first layer and the second layer are exposed are upper surfaces. A method for dressing a cutting blade is provided, the method including the steps of: holding the cutting blade by a table; and moving the cutting blade and the dresser board relatively to cause the tip of the cutting blade to cut into the upper surface side of the dresser board along the first layer, thereby bringing the underside of the cutting blade into contact with the first layer and bringing both side surfaces of the tip of the cutting blade into contact with the second layer, thereby modifying the shape of the tip of the cutting blade so that the underside of the cutting blade approaches a flat shape .

The dresser board according to one aspect of the present invention is composed of a first layer containing abrasive grains and a plurality of second layers stacked on the first layer so as to sandwich the first layer. This makes it possible to dress the cutting blade without forming deep grooves in the dresser board in advance, and suppresses the occurrence of warping of the dresser board. As a result, the dresser board is properly held by the chuck table, and the shape of the cutting blade can be properly corrected.

FIG. FIG. 2A is a perspective view showing a first layer and a second layer, and FIG. 2B is a perspective view showing the first layer and the second layer alternately stacked. FIG. 2 is a perspective view showing a dresser board supported by an annular frame. FIG. FIG. 2 is a partial cross-sectional front view showing a dresser board held by a chuck table. FIG. 6(A) is a partially sectional front view showing the dresser board and the cutting blade in the dressing step, and FIG. 6(B) is a front view showing the cutting blade after the dressing step.

Hereinafter, an embodiment of the present invention will be described with reference to the attached drawings. First, an example of the configuration of a dresser board according to this embodiment will be described. The dresser board according to this embodiment is used to shape (dress) cutting blades. A cutting blade is an annular processing tool that cuts into a workpiece to cut the workpiece.

An example of a workpiece that can be cut by a cutting blade is a disk-shaped silicon wafer. For example, a silicon wafer is divided into a number of rectangular regions by a number of streets (planned division lines) that are arranged in a grid pattern so as to intersect with one another. Furthermore, devices such as ICs (Integrated Circuits), LSIs (Large Scale Integration), LEDs (Light Emitting Diodes), and MEMS (Micro Electro Mechanical Systems) devices are formed in each of the regions divided by the streets. By cutting this silicon wafer with a cutting blade and dividing it along the streets, a number of device chips each equipped with a device are manufactured.

However, there are no restrictions on the material, shape, structure, size, etc. of the workpiece. For example, the workpiece may be a wafer made of semiconductors other than silicon (GaAs, InP, GaN, SiC, etc.), glass, ceramics, resin, metal, etc. Furthermore, there are no restrictions on the type, number, shape, structure, size, arrangement, etc. of devices formed on the workpiece, and the workpiece does not need to have any devices formed on it. Furthermore, the workpiece may be a package substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate.

When processing a workpiece with a cutting blade, the cutting blade is first dressed. Dressing is performed by rotating the cutting blade and cutting the tip of the cutting blade into the dresser board. This causes the tip of the cutting blade to come into contact with the dresser board and wear down, correcting the shape of the tip surface of the cutting blade.

Figure 1 is a perspective view showing a dresser board 11. The dresser board 11 is a rectangular parallelepiped member used for dressing cutting blades, and includes a plurality of first layers 13 and a plurality of second layers 15. The first layers 13 and the second layers 15 are rectangular plate-like members, and are alternately stacked in the thickness direction of the dresser board 11 (the thickness direction of the first layers 13 and the second layers 15).

The first layer 13 includes abrasive grains (first abrasive grains) and a binder (first binder) that fixes the abrasive grains. The second layer 15 includes abrasive grains (second abrasive grains) and a binder (second binder) that fixes the abrasive grains. Green carborundum (GC), white alundum (WA), etc. can be used as the first abrasive grains and the second abrasive grains.

The average particle size of the abrasive grains (second abrasive grains) contained in the second layer 15 is smaller than the average particle size of the abrasive grains (first abrasive grains) contained in the first layer 13. For example, the average particle size of the first abrasive grains is 1 μm or more and 200 μm or less, and the average particle size of the second abrasive grains is 0.1 μm or more and 20 μm or less.

As the first and second bonding materials, a resin bond made of resin or a vitrified bond made of ceramics can be used. In particular, using a resin bond as the first and second bonding materials is preferable because it reduces damage to the cutting blade when the cutting blade is cut into the dresser board 11.

For example, abrasive grains are impregnated into a resin such as phenolic resin or epoxy resin, and the resin is then molded into a plate shape and baked at a predetermined temperature (e.g., 150°C or higher and 200°C or lower), forming plate-shaped first layer 13 and second layer 15. If the first layer 13 and second layer 15 contain abrasive grains, the fluidity of the resin bond decreases, making it easier for the first layer 13 and second layer 15 to maintain their shapes.

Figure 2 (A) is a perspective view showing the first layer 13 and the second layer 15. For example, the dresser board 11 is manufactured by stacking large first layers 13 and second layers 15 alternately, and then cutting the first layers 13 and the second layers 15 simultaneously.

The first layer 13 includes a first surface (front surface) 13a and a second surface (back surface) 13b that are generally parallel to each other and have a rectangular shape. Similarly, the second layer 15 includes a first surface (front surface) 15a and a second surface (back surface) 15b that are generally parallel to each other and have a rectangular shape. The second layer 15 is laminated on the first layer 13 so as to sandwich the first layer 13. Specifically, the second surface 15b of the second layer 15 is fixed to the first surface 13a of the first layer 13, and the first surface 15a of the second layer 15 is fixed to the second surface 13b of the first layer 13. For example, the first layer 13 and the second layer 15 are bonded together via an adhesive.

Figure 2 (B) is a perspective view showing the first layer 13 and the second layer 15 that are alternately stacked. The first layer 13 and the second layer 15 are simultaneously cut with a cutting blade or the like to obtain a dresser board 11 of the desired shape and dimensions.

There is no limit to the number of first layers 13 and second layers 15 that are stacked. However, the top and bottom layers of the dresser board 11 are second layers 15. This results in a structure in which all of the first layers 13 are sandwiched between the second layers 15. As described below, the first layers 13 are used to shape the tip surface of the cutting blade. For this reason, it is preferable that the number of first layers 13 is two or more. This makes it possible to perform multiple shaping of the tip surface of the cutting blade using one dresser board 11.

As shown in FIG. 1, the dresser board 11 includes a first surface (front surface) 11a and a second surface (back surface) 11b that are generally parallel to each other. The first surface 11a corresponds to the first surface 15a of the uppermost second layer 15, and the second surface 11b corresponds to the second surface 15b of the lowermost second layer 15.

The dresser board 11 also includes a pair of third surfaces (side surfaces) 11c connected to the long sides of the first surface 11a and the second surface 11b, and a pair of fourth surfaces (side surfaces) 11d connected to the short sides of the first surface 11a and the second surface 11b. The pair of third surfaces 11c are rectangular flat surfaces that are generally parallel to the length direction of the dresser board 11 (the length direction of the first layer 13 and the second layer 15) and the thickness direction of the dresser board 11. The pair of fourth surfaces are rectangular flat surfaces that are generally parallel to the width direction of the dresser board 11 (the width direction of the first layer 13 and the second layer 15) and the thickness direction of the dresser board 11.

The side surfaces of the first layer 13 and the second layer 15 are exposed on the third surface 11c and the fourth surface 11d. Therefore, the third surface 11c and the fourth surface 11d have a periodic striped pattern (horizontal striped pattern) formed by the side surfaces of the first layer 13 and the second layer 15 being arranged alternately.

The dresser board 11 is used to dress the cutting blade. When dressing the cutting blade, the dresser board 11 is first supported by an annular frame. Figure 3 is a perspective view showing the dresser board 11 supported by an annular frame 17.

The frame 17 is made of a metal such as SUS (stainless steel). A circular opening 17a is provided in the center of the frame 17, penetrating the frame 17 in the thickness direction. The diameter of the opening 17a is larger than the length of each side of the dresser board 11. The dresser board 11 is placed inside the opening 17a.

Tape 19 is attached to the dresser board 11 and the frame 17. Specifically, the center of the tape 19 is attached to the dresser board 11, and the outer periphery of the tape 19 is attached to the frame 17. As a result, the dresser board 11 is supported by the frame 17 via the tape 19.

The tape 19 includes a film-like substrate formed into a circular shape and an adhesive layer (glue layer) provided on the substrate. For example, the substrate is made of a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate, and the adhesive layer is made of an epoxy-, acrylic-, or rubber-based adhesive. The adhesive layer may also be an ultraviolet-curing resin that hardens when exposed to ultraviolet light.

The dresser board 11 is positioned so that tape 19 is attached to one of the pair of third surfaces 11c. Therefore, the dresser board 11 is supported by the frame 17 with the other of the pair of third surfaces 11c that have a striped pattern exposed upward, and the first surface 11a, the second surface 11b, and the pair of fourth surfaces 11d that have a striped pattern exposed to the sides.

The cutting blade is dressed by cutting the cutting blade into the dresser board 11 supported by the frame 17. A cutting device is used to dress the cutting blade. FIG. 4 is a perspective view showing the cutting device 2. In FIG. 4, the X-axis direction (machining feed direction, first horizontal direction) and the Y-axis direction (indexing feed direction, second horizontal direction) are perpendicular to each other. The Z-axis direction (vertical direction, up-down direction, height direction) is perpendicular to the X-axis direction and the Y-axis direction.

The cutting device 2 includes a chuck table (holding table) 4 capable of holding the workpiece and the dresser board 11. The upper surface of the chuck table 4 is a flat surface that is generally parallel to the horizontal direction (XY plane direction) and constitutes a holding surface 4a (see FIG. 5) that holds the workpiece or the dresser board 11. The holding surface 4a is connected to a suction source (not shown) such as an ejector via a flow path (not shown), a valve (not shown), etc. formed inside the chuck table 4.

The chuck table 4 is connected to a ball screw type movement mechanism (not shown) that moves the chuck table 4 along the X-axis direction, and a rotation drive source (not shown) such as a motor that rotates the chuck table 4 around a rotation axis roughly parallel to the Z-axis direction. In addition, a number of clamps 6 (see FIG. 5) that grip and fix the frame 17 are provided around the periphery of the chuck table 4.

A cutting unit 8 capable of cutting the workpiece and the dresser board 11 is provided above the chuck table 4. The cutting unit 8 has a cylindrical housing 10, which accommodates a cylindrical spindle 12 (see FIG. 5) arranged along the Y-axis direction. The tip (one end) of the spindle 12 is exposed to the outside of the housing 10, and the base (other end) of the spindle 12 is connected to a rotational drive source such as a motor.

An annular cutting blade 14 that cuts the workpiece is attached to the tip of the spindle 12. The cutting blade 14 rotates around a rotation axis that is roughly parallel to the Y-axis direction by power transmitted from a rotary drive source via the spindle 12.

For example, a hub-type cutting blade (hub blade) is used as the cutting blade 14. The hub blade is a cutting blade that is an integrated unit of an annular base made of metal or the like and an annular cutting edge formed along the outer periphery of the base. The cutting edge of the hub blade can be formed of an electroformed grinding wheel that contains abrasive grains made of diamond, cubic boron nitride (cBN), or the like, and a binder such as a nickel-plated layer that fixes the abrasive grains.

However, a washer-type cutting blade (washer blade) can also be used as the cutting blade 14. A washer blade is composed only of an annular cutting edge that contains abrasive grains and a bonding material (metal bond, resin bond, vitrified bond, etc.) that fixes the abrasive grains.

When the cutting blade 14 is attached to the cutting unit 8, the cutting blade 14 is covered by a blade cover 16 fixed to the housing 10. The blade cover 16 has a pair of connectors 18 connected to a tube (not shown) through which cutting fluid such as pure water is supplied, and a pair of nozzles 20 connected to the pair of connectors 18. The pair of nozzles 20 are arranged on both side surfaces (front and back sides) of the cutting blade 14 so as to sandwich the lower end of the cutting blade 14. In addition, each of the pair of nozzles 20 is provided with a supply port (not shown) that opens toward the cutting blade 14.

When cutting fluid is supplied to the pair of connections 18, the cutting fluid flows into the pair of nozzles 20, and is supplied from the nozzles of the pair of nozzles 20 toward both sides (front and back) of the cutting blade 14. This cutting fluid cools the cutting blade 14 and the workpiece or dresser board 11 held by the chuck table 4, and washes away chips (cutting chips) generated by the cutting process.

A ball screw type movement mechanism (not shown) that moves the cutting unit 8 is connected to the cutting unit 8. The movement mechanism moves the cutting unit 8 along the Y-axis direction and raises and lowers it along the Z-axis direction. The movement mechanism adjusts the position of the cutting blade 14 in the index feed direction and the cutting depth of the cutting blade 14 into the workpiece or dresser board 11.

The cutting device 2 cuts a workpiece such as a silicon wafer. For example, the cutting blade 14 cuts the silicon wafer along the streets to divide it into multiple device chips.

When the cutting blade 14 continues to cut the workpiece, the tip of the cutting blade 14 wears down and the tip surface of the cutting blade 14 changes to a rounded shape (R-shape) (see Figure 5). If the workpiece is cut and divided into multiple chips with the worn cutting blade 14, the R-shape of the cutting blade 14 is reflected in the chips, causing the chips to lose their shape and potentially degrading their quality.

Therefore, before the cutting blade 14 is used to process a workpiece, dressing is performed to intentionally wear down the tip of the cutting blade 14 to modify the shape of the cutting blade 14. Dressing is performed by cutting the cutting blade 14 into the dresser board 11. Below, a specific example of a cutting blade dressing method that uses the dresser board 11 to modify the shape of the cutting blade 14 will be described.

First, the dresser board 11 is held by the chuck table 4 (holding process). Figure 5 is a partial cross-sectional front view showing the dresser board 11 held by the chuck table 4.

In the holding process, the dresser board 11 supported by the frame 17 is placed on the holding surface 4a of the chuck table 4 via the tape 19. The frame 17 is fixed by a number of clamps 6. When the suction force (negative pressure) of the suction source is applied to the holding surface 4a in this state, the dresser board 11 is sucked and held by the chuck table 4 via the tape 19. As a result, the dresser board 11 is held by the chuck table 4 so that the third surface 11c (see FIG. 1, etc.), on which the side surfaces of the first layer 13 and the second layer 15 are exposed and which present a striped pattern, is the upper surface.

Next, the cutting blade 14 is cut into the upper surface side of the dresser board 11 to modify the shape of the tip of the cutting blade 14 (dressing process). Figure 6 (A) is a partial cross-sectional front view showing the dresser board 11 and the cutting blade 14 in the dressing process.

In the dressing process, first, the chuck table 4 is rotated to align the length direction of the dresser board 11 (the longitudinal direction of the third surface 11c) with the X-axis direction. As a result, the dresser board 11 is positioned so that its length direction is along the X-axis direction, its thickness direction is along the Y-axis direction, and its width direction is along the Z-axis direction.

The cutting unit 8 (see Figures 4 and 5) is also moved along the Y-axis direction to align the first layer 13 of the dresser board 11 with the cutting blade 14 in the Y-axis direction. For example, the cutting blade 14 is positioned so that the center of the first layer 13 in the thickness direction (left-right direction of the paper in Figure 6(A)) and the center of the cutting blade 14 in the width direction (left-right direction of the paper in Figure 6(A)) are aligned in the Y-axis direction. Furthermore, the cutting unit 8 (see Figures 4 and 5) is moved along the Z-axis direction to position the lower end of the cutting blade 14 below the upper surface (third surface 11c) of the dresser board 11.

Then, while rotating the cutting blade 14, the chuck table 4 is moved along the X-axis direction. As a result, the dresser board 11 and the cutting blade 14 move relatively along the processing feed direction, and the tip of the cutting blade 14 cuts into the upper surface side of the dresser board 11 along the first layer 13. As a result, the upper surface side of the dresser board 11 is cut by the cutting blade 14, and a linear groove is formed on the upper surface side of the dresser board 11 along the first layer 13. In addition, the tip of the cutting blade 14 is worn down by contact with the dresser board 11, and the shape of the lower surface (tip surface) 14a of the cutting blade 14 is modified.

Here, the thickness _d1 of the first layer 13 is smaller than the width D of the cutting blade 14. Therefore, the lower surface 14a of the cutting blade 14 contacts the first layer 13 containing abrasive grains with a large grain size (first abrasive grains), and both side surfaces of the tip of the cutting blade 14 contact the second layer 15 containing abrasive grains with a small grain size (second abrasive grains). Therefore, wear easily progresses on the lower surface 14a of the cutting blade 14, and wear does not easily progress on both side surfaces of the tip of the cutting blade 14.

The thicknesses of the first layer 13 and the second layer 15 can be appropriately set according to the width D of the cutting blade 14. Also, the sum ( _d2 + _2d1 ) of the thickness _d2 of the second layer 15 and the thickness _d1 of the two first layers sandwiching the second layer 15 may be smaller than the width D of the cutting blade 14. In this case, when the cutting blade 14 is cut into the dresser board 11, the lower surface 14a of the cutting blade 14 comes into contact with two or more first layers 13.

Figure 6 (B) is a front view showing the cutting blade 14 after the dressing process. When the cutting blade 14 is cut into the dresser board 11 along the first layer 13 as described above, the area of the tip of the cutting blade 14 that is in contact with the first layer 13 wears preferentially, and the roundness of the lower surface 14a of the cutting blade 14 gradually disappears. Then, when the lower surface 14a of the cutting blade 14 becomes flat, the dressing of the cutting blade 14 is completed.

The number of times the cutting blade 14 cuts into the dresser board 11 is set appropriately depending on the shape, material, size, etc. of the cutting blade 14. When the cutting blade 14 cuts into the dresser board 11 multiple times, the cutting blade 14 is cut into the dresser board 11 along the first layer 13 of the first layer, and then the cutting blade 14 is moved in the Y-axis direction and cut into the dresser board 11 along the first layer 13 of the second layer. By repeating this operation, the cutting blade 14 can cut into the dresser board 11 a desired number of times. Then, when grooves are formed along all of the first layers 13, the used dresser board 11 is replaced with a new dresser board 11 (unused dresser board 11).

As described above, the dresser board 11 according to this embodiment is composed of a first layer 13 containing abrasive grains and a plurality of second layers 15 stacked on the first layer 13 so as to sandwich the first layer 13. This makes it possible to dress the cutting blade 14 without forming deep grooves in advance in the dresser board 11, and suppresses the occurrence of warping of the dresser board 11. As a result, the dresser board 11 is properly held by the chuck table 4, and the shape of the cutting blade 14 can be properly corrected.

In the above embodiment, the second layer 15 contains abrasive grains (second abrasive grains) having a smaller average grain size than the first layer 13. However, a layer that does not contain abrasive grains can also be used as the second layer 15. In this case, wear is less likely to occur on both sides of the tip of the cutting blade 14 that contacts the second layer 15, and the lower surface 14a of the cutting blade 14 can be easily modified to a flat shape.

In addition, the structures, methods, etc. according to the above embodiments can be modified as appropriate without departing from the scope of the present invention.

11 Dresser board 11a First surface (front surface)
11b Second side (back side)
11c 3rd side (side)
11d 4th side (side)
13 First layer 13a First surface (surface)
13b 2nd side (back side)
15 Second layer 15a First surface (front surface)
15b 2nd side (back side)
17 Frame 17a Opening 19 Tape 2 Cutting device 4 Chuck table (holding table)
4a Holding surface 6 Clamp 8 Cutting unit 10 Housing 12 Spindle 14 Cutting blade 14a Underside (tip surface)
16 Blade cover 18 Connection part 20 Nozzle

Claims (6)

A dresser board used to modify the shape of a cutting blade,
a first layer including first abrasive grains and a first bond that secures the first abrasive grains;
a plurality of second layers laminated on the first layer so as to sandwich the first layer;
the thickness of the first layer is less than a width of the cutting blade;
the second layer includes second abrasive grains having an average grain size smaller than that of the first abrasive grains, and a second binder that fixes the second abrasive grains;
A dresser board characterized in that the shape of the tip of the cutting blade is modified so that the underside of the cutting blade approaches a flat shape by the underside of the cutting blade contacting the first layer and both sides of the tip of the cutting blade contacting the second layer . the first abrasive grains and the second abrasive grains are green carborundum or white alundum;
2. The dresser board of claim 1, wherein the first bonding material and the second bonding material are resin bonds. The first abrasive grains have an average grain size of 1 μm or more and 200 μm or less,
3. The dresser board according to claim 1, wherein the second abrasive grains have an average grain size of 0.1 [mu]m or more and 20 [mu]m or less. A dresser board used to modify the shape of a cutting blade,
a first layer including abrasive grains and a binder that secures the abrasive grains;
a plurality of second layers laminated on the first layer so as to sandwich the first layer;
the thickness of the first layer is less than a width of the cutting blade;
the second layer does not include abrasive grains;
A dresser board characterized in that the shape of the tip of the cutting blade is modified so that the underside of the cutting blade approaches a flat shape by the underside of the cutting blade contacting the first layer and both sides of the tip of the cutting blade contacting the second layer . A method for dressing a cutting blade using a dresser board to modify a shape of the cutting blade, comprising the steps of:
The dresser board includes a first layer including first abrasive grains and a first binder for fixing the first abrasive grains, and a plurality of second layers stacked on the first layer so as to sandwich the first layer;
the thickness of the first layer is less than a width of the cutting blade;
the second layer includes second abrasive grains having an average grain size smaller than that of the first abrasive grains, and a second binder that fixes the second abrasive grains;
holding the dresser board by a chuck table such that the surface on which the first layer and the second layer are exposed is an upper surface;
and a step of moving the cutting blade and the dresser board relatively to each other to cut the tip of the cutting blade along the first layer into the upper surface of the dresser board, thereby bringing the underside of the cutting blade into contact with the first layer and bringing both sides of the tip of the cutting blade into contact with the second layer, thereby modifying the shape of the tip of the cutting blade so that the underside of the cutting blade approaches a flat shape . A method for dressing a cutting blade using a dresser board to modify a shape of the cutting blade, comprising the steps of:
The dresser board includes a first layer including abrasive grains and a binder for fixing the abrasive grains, and a plurality of second layers stacked on the first layer so as to sandwich the first layer,
the thickness of the first layer is less than a width of the cutting blade;
the second layer does not include abrasive grains;
holding the dresser board by a chuck table such that the surface on which the first layer and the second layer are exposed is an upper surface;
and a step of moving the cutting blade and the dresser board relatively to each other to cut the tip of the cutting blade along the first layer into the upper surface of the dresser board, thereby bringing the underside of the cutting blade into contact with the first layer and bringing both sides of the tip of the cutting blade into contact with the second layer, thereby modifying the shape of the tip of the cutting blade so that the underside of the cutting blade approaches a flat shape .

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