JP7715564B2 - Processing system and inspection target selection method - Google Patents

Description

The present invention relates to a processing system having a processing device that processes workpieces and an inspection device that inspects the workpieces, and a method for selecting an inspection target to be inspected by the inspection device in the processing system.

By forming multiple devices on the surface of a thin wafer and then dividing the wafer into individual devices, device chips for use in electronic devices can be formed. To divide a workpiece such as a wafer, for example, a cutting device that can cut the workpiece with an annular cutting blade or a laser processing device that processes the workpiece by irradiating it with a laser beam is used. The processing device processes the workpiece under specified processing conditions to obtain the desired processing results.

However, there are cases where the processing device does not properly process the workpiece due to reasons such as a malfunction in the factory equipment in which the processing device is installed, a malfunction in the tools equipped in the processing device, or a malfunction in the processing device itself. This can result in damage to the workpiece or chips, or the resulting chips being defective. Therefore, to confirm that the workpiece has been properly processed, the workpiece processed by the processing device is photographed and inspected with a camera unit (see Patent Documents 1 and 2).

Japanese Patent Application Laid-Open No. 2021-32588 JP 2016-197702 A

To inspect the workpieces processed by the processing equipment and the resulting chips for abnormalities with high precision, it is preferable to capture high-resolution images of the entire processed workpiece using a camera unit. However, capturing high-resolution images of the entire workpiece using a camera unit takes a significant amount of time.

To prevent this, one approach would be to prepare numerous inspection devices and operate them in parallel in order to inspect the workpieces processed one after another by the processing equipment and detect any abnormalities. However, the costs of preparing and operating numerous inspection devices are high, and securing the space to install the inspection devices can also be an issue, reducing the efficiency of workpiece processing.

The present invention was made in consideration of these problems, and its purpose is to provide a processing system and a method for selecting an inspection target that can efficiently detect abnormalities in a workpiece without reducing the processing efficiency of the workpiece.

According to one aspect of the present invention, there is provided a processing system having a processing device that processes a workpiece and an inspection device that inspects the workpiece, wherein the processing device comprises a processing unit that processes the workpiece held by a chuck table and an abnormality detection unit that detects abnormalities that occur while the processing unit is processing the workpiece, and the inspection device comprises a camera unit that photographs the workpiece after processing to form a photographed image, an inspection unit that processes the photographed image to inspect the condition of the workpiece, and a recording unit that records the inspection results by the inspection unit together with the photographed image, and further comprises an inspection object selection unit that selects the workpiece being processed by the processing device as an inspection object for the inspection device when the abnormality detection unit detects the abnormality, and when the abnormality detection unit does not detect the abnormality while the workpiece is being processed by the processing unit, the processing system is characterized in that the workpiece is not selected as an inspection object for the inspection device and is not sent to the inspection device . According to one aspect of the present invention, there is provided a processing system having a processing device that processes a workpiece and an inspection device that inspects the workpiece, wherein the processing device comprises a processing unit that processes the workpiece held by a chuck table and an abnormality detection unit that detects abnormalities that occur while the processing unit is processing the workpiece, and the inspection device comprises a camera unit that photographs the workpiece after processing to form a photographed image, an inspection unit that processes the photographed image and inspects the condition of the workpiece, and a recording unit that records the inspection results by the inspection unit along with the photographed image, and further comprises an inspection object selection unit that selects the workpiece that was being processed by the processing device when the abnormality detection unit detects the abnormality as an inspection object for the inspection device, so that workpieces that are in high need of inspection are inspected preferentially by the inspection device.

Preferably, the abnormality detection unit detects an abnormality when any of the vibration, current, voltage, load, speed, torque, pressure, temperature, or flow rate observed by the processing device falls outside of an allowable range.

Furthermore, preferably, the inspection object selection unit further selects the workpiece that is to be processed first after maintenance of the processing device is performed or after a setting change is made as the inspection object of the inspection device.

Preferably, the inspection device further includes a support table that supports the workpiece, and a movement unit that moves the camera unit and the support table relatively, and the captured image is formed from multiple small images captured sequentially by the camera unit for each small section of the workpiece while changing the camera unit's capture area by moving the support table that supports the workpiece and the camera unit relatively using the movement unit.

More preferably, the inspection device further includes a display unit that can display an enlarged image of a portion of the captured image, as well as the area of the workpiece that appears in the enlarged image.

Preferably, the inspection device further has a support table equipped with a transparent body for supporting the workpiece, the camera unit includes an upper camera that directly photographs the workpiece supported on the support table from above, and a lower camera that photographs the workpiece from below through the transparent body, and the recording unit records the photographed images consisting of associated pairs of upper camera images of a part of the workpiece photographed by the upper camera and lower camera images of the part of the workpiece photographed by the lower camera.More preferably, the inspection unit of the inspection device inspects the workpiece with content set in accordance with the content of the abnormality detected by the abnormality detection unit while the workpiece is being processed by the processing unit.

According to another aspect of the present invention, there is provided a method for selecting an inspection object for selecting a workpiece to be inspected by the inspection device in a processing system having a processing device that processes a workpiece using a processing unit and an inspection device that photographs the workpiece with a camera unit to inspect the state of the workpiece, the method comprising: a processing step in which the workpiece is processed by the processing unit in the processing device; a determination step in which the workpiece processed by the processing device is to be an inspection object for the inspection device; and an inspection step in which the workpiece selected as the inspection object in the determination step is inspected by the inspection device, wherein in the processing step, an abnormality that occurs while the workpiece is being processed by the processing unit is detected by an abnormality detection unit provided in the processing device, and in the determination step, when the abnormality detection unit detects the abnormality, the workpiece being processed by the processing device is selected as the inspection object for the inspection device, and when the abnormality detection unit does not detect the abnormality, the workpiece is not selected as the inspection object for the inspection device. According to another aspect of the present invention, there is provided a method for selecting an inspection object for selecting a workpiece to be inspected by the inspection device in a processing system having a processing device that processes a workpiece using a processing unit and an inspection device that photographs the workpiece with a camera unit to inspect the state of the workpiece, the method comprising: a processing step in which the workpiece is processed by the processing unit in the processing device; a determination step in which the workpiece processed by the processing device is to be an inspection object for the inspection device; and an inspection step in which the workpiece selected as the inspection object in the determination step is inspected by the inspection device, wherein in the processing step, an abnormality that occurs while the workpiece is being processed by the processing unit is detected by an abnormality detection unit provided in the processing device, and in the determination step, when the abnormality detection unit detects the abnormality, the workpiece being processed by the processing device is selected as the inspection object for the inspection device, and workpieces that are most in need of inspection are preferentially inspected by the inspection device.

Preferably, the abnormality detection unit detects an abnormality when any of the vibration, current, voltage, load, speed, torque, pressure, temperature, or flow rate observed by the processing device falls outside of an allowable range.

Preferably, the determining step further determines the workpiece to be machined first after maintenance of the processing device or a setting change as the inspection target of the inspection device.More preferably, the inspecting step inspects the workpiece with the set content by referring to the content of the abnormality detected by the abnormality detection unit in the processing step.

In a processing system and inspection target selection method according to one aspect of the present invention, the processing unit processes the workpiece while an abnormality that occurs while the processing device is processing the workpiece is detected by an abnormality detection unit provided in the processing device.

If the anomaly detection unit detects an abnormality before processing is completed, the processed workpiece is selected for inspection by the inspection device. The selected workpiece is then inspected by the inspection device. On the other hand, if the anomaly detection unit does not detect an abnormality before processing of the workpiece is completed, it is unlikely that an abnormality has occurred in the workpiece, so the workpiece is removed from the processing system without being sent to the inspection device.

In this case, not all workpieces processed by the processing equipment are inspected by the inspection equipment. In other words, the number of workpieces to be inspected can be reduced, reducing the financial and time costs required for inspection and eliminating the need to prepare multiple inspection devices. This improves the processing efficiency of workpieces in the processing system. Furthermore, because workpieces that are highly in need of inspection and for which an abnormality has been detected by the anomaly detection unit are inspected by the inspection equipment on a priority basis, it is less likely that an abnormality in a workpiece will be missed.

Therefore, the present invention provides a processing system and a method for selecting an inspection target that can efficiently detect abnormalities in a workpiece without reducing the processing efficiency of the workpiece.

FIG. 2 is a perspective view schematically showing a workpiece. FIG. 1 is a perspective view schematically showing a processing system. FIG. 1 is a plan view schematically illustrating a configuration example of a processing system. FIG. 1 is a perspective view schematically showing an inspection device. FIG. 5A is a perspective view that schematically shows the support table, and FIG. 5B is a perspective view that schematically shows the camera unit. 4 is a cross-sectional view schematically showing the positional relationship between a support table, a camera unit, and a workpiece when inspecting the workpiece. FIG. FIG. 10 is a perspective view schematically illustrating another configuration example of the processing system. 10 is a plan view schematically showing how the workpiece is photographed successively while changing the photographing area of the camera unit. FIG. FIG. 10 is a block diagram schematically illustrating another configuration example of the machining system. FIG. 2 is a plan view schematically showing a display example of a display unit. 1 is a flowchart illustrating the flow of each step of a method for selecting a workpiece to be inspected.

An embodiment of one aspect of the present invention will be described with reference to the accompanying drawings. Figure 2 is a perspective view schematically illustrating a processing system 2 according to this embodiment. The processing system 2 according to this embodiment includes a processing device 4 that processes a workpiece and an inspection device 56 that inspects the workpiece.

First, we will explain the workpiece. The workpiece is, for example, a roughly disk-shaped wafer made of Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductor material. Alternatively, the workpiece may be a substrate made of a material such as sapphire, glass, or quartz. The workpiece may also be a package substrate containing multiple device chips sealed with a mold resin or the like.

Figure 1 is a perspective view that schematically shows a wafer, which is an example of a workpiece 1. The surface 1a of the workpiece 1 is divided by, for example, a plurality of mutually intersecting planned division lines called streets 3. Devices 5, such as ICs (Integrated Circuits) and LSIs (Large-Scale Integrated Circuits), are formed in each area of the surface 1a of the workpiece 1 divided by the streets 3. Individual device chips can be formed by dividing the workpiece 1 along the streets 3.

However, the workpiece 1 processed by the processing system 2 according to this embodiment is not limited to this, and devices do not have to be formed on the surface 1a. Below, the processing system 2 according to this embodiment will be described using as an example a case where the workpiece 1 is a wafer on which multiple devices 5 are formed and which is divided along streets 3.

As shown in Figure 1, before the workpiece 1 is loaded into the processing device 4, the workpiece 1 is integrated with an annular frame 9 and tape 7 attached to cover the opening of the frame 9, forming a frame unit 11. The workpiece 1 is attached to the tape 7 and attached to the frame 9 via the tape 7. In this state, the workpiece 1 is loaded into the processing device 4 and divided. The individual chips formed are then supported by the tape 7. Forming the frame unit 11 makes it easier to handle the workpiece 1 and the chips.

To divide the workpiece 1, for example, a laser processing device is used that irradiates the workpiece 1 with a laser beam along the streets 3 to laser-process the workpiece 1. Alternatively, a cutting device is used that cuts the workpiece 1 along the streets 3 with an annular cutting blade. Below, the processing system 2 according to this embodiment will be described using an example in which the processing device 4 is a cutting device, but the processing device 4 included in the processing system 2 according to this embodiment is not limited to a cutting device.

In the processing system 2 according to this embodiment, to confirm that the workpiece 1 has been properly processed by the processing device 4, the processed workpiece 1 is sent to the inspection device 56, where it is photographed and inspected using a camera unit. In the inspection device 56, for example, the workpiece 1 is inspected along the streets 3 to investigate the position and width of the processing marks, as well as the shape, size, and distribution of chippings formed in the workpiece 1 along the processing marks. The size of the device chips formed by dividing the workpiece 1 is also confirmed.

In the processing system 2 according to this embodiment, a processing device 4 and an inspection device 56 are connected. However, the processing device 4 and the inspection device 56 may be independent of each other, and the processing system 2 may include multiple processing devices 4 and multiple inspection devices 56. Figure 2 is a perspective view that schematically shows a processing system 2 in which one processing device 4 and one inspection device 56 are connected to each other. Note that some components, such as the housings that make up the processing device 4 and the inspection device 56, are omitted from Figure 2 and other figures.

The processing device 4 includes a base 6a that supports each component. A cassette support table 6b that can be raised and lowered is provided at the front corner of the base 6a. A cassette (not shown) that houses multiple frame units 11 is placed on the top surface of the cassette support table 6b.

A rectangular opening 10 that is long in the X-axis direction (processing feed direction) is formed on the top surface of the base 6a adjacent to the cassette support base 6b. The opening 10 is fitted with a chuck table 14, an X-axis direction movement mechanism (not shown) that moves the moving table 12 on which the chuck table 14 is mounted in the X-axis direction, and a dustproof and drip-proof cover 10a that covers the X-axis direction movement mechanism.

The processing device 4 is provided with a transport unit 16 that transports in and out frame units 11 housed in cassettes placed on the cassette support base 6b. The transport unit 16 has a pair of guide rails 18 that are parallel to the Y-axis direction and disposed on the front surface of the upright portion 6c of the base 6a. A movable body 20 is slidably attached to the pair of guide rails 18. A nut portion (not shown) is provided on the rear side of the movable body 20, and a ball screw 22 that is parallel to the guide rails 18 is threaded into this nut portion.

A pulse motor 24 is connected to one end of the ball screw 22. When the pulse motor 24 rotates the ball screw 22, the moving body 20 moves in the Y-axis direction along the guide rail 18. An arm 26 extending along the X-axis direction is connected to the lower end of the moving body 20 via an elevation mechanism. A plurality of suction parts 28 are arranged on the underside of the arm 26, corresponding to the size of the frame 9. Furthermore, a push-pull mechanism 30 facing the cassette support base 6b is arranged in the center of the arm 26.

A pair of transport rails 8 are also provided on the upper surface of the base 6a, spanning the opening 10. The pair of transport rails 8 are spaced apart by a width smaller than the diameter of the frame 9, but can move away from each other.

The transport unit 16 moves in the Y-axis direction and inserts the tip of the push-pull mechanism 30 into a cassette placed on the cassette support base 6b, thereby gripping the frame 9 of the frame unit 11 housed in the cassette. By gripping the frame 9 with the push-pull mechanism 30 and moving the arm 26 in the opposite direction along the Y-axis, the frame unit 11 can be pulled out onto the pair of transport rails 8.

Then, the push-pull mechanism 30 releases its grip on the frame 9, and the suction part 28 of the transport unit 16 contacts the frame 9 from above, sucking and holding the frame 9 with the suction part 28. The frame unit 11 is then lifted upward from the transport rails 8, the gap between the pair of transport rails 8 is widened, and the frame unit 11 is lowered, allowing the frame unit 11 to be transported onto the chuck table 14.

A porous member is disposed on the upper surface of the chuck table 14, which holds the workpiece 1, and the upper surface of the porous member serves as the holding surface for holding the frame unit 11. The porous member is connected to a suction source (not shown) via a suction path (not shown) formed inside the chuck table 14. When this suction source is activated, negative pressure acts on the frame unit 11 (workpiece 1) via the suction path and porous member, allowing the frame unit 11 to be suction-held by the chuck table 14.

Figure 3 is a plan view showing a schematic configuration of the processing system 2. The processing device 4 includes a processing unit 32 that processes the workpiece 1. The processing unit 32 is a cutting unit that includes, for example, an annular cutting blade 34, a spindle inserted into a through-hole in the cutting blade 34, and a spindle housing 36 that houses one end of the spindle.

The spindle serves as the axis of rotation for rotating the cutting blade 34. The spindle housing 36 houses a rotary drive source, such as a motor (not shown), that rotates the spindle. When the rotating cutting blade 34 cuts into the workpiece 1 held on the chuck table 14, the workpiece 1 is cut.

Note that, although the processing device 4 shown in FIG. 3 is equipped with two processing units 32 that cut the workpiece 1, the processing device 4 is not limited to this. For example, the processing device 4 may be equipped with only one processing unit 32. Furthermore, if the processing device 4 is a laser processing device, the processing unit 32 is a laser processing unit that laser processes the workpiece 1.

As shown in Figures 2 and 3, the processing device 4 has an opening 38 adjacent to the opening 10 on the top surface of the base 6a. A cleaning device 40 is disposed inside the opening 38, which can clean the workpiece 1 processed by the processing unit 32. The processed workpiece 1 is transported onto the cleaning table of the cleaning device 40 by a transport unit 16 or the like, and the cleaning table on which the workpiece 1 is placed is rotated at high speed while high-pressure cleaning liquid is sprayed onto the workpiece 1 from a nozzle (not shown), thereby cleaning the workpiece 1.

The workpiece 1 may be transported into the cleaning device 40 by a transport unit 42. The transport unit 42 has a pair of guide rails 44 arranged on the front surface of the upright portion of the base 6a, parallel to the Y-axis direction. A movable body 46 is slidably attached to the pair of guide rails 44. A nut portion (not shown) is provided on the rear side of the movable body 46, and a ball screw 48 parallel to the guide rails 44 is threaded into this nut portion.

A pulse motor 50 is connected to one end of the ball screw 48. When the pulse motor 50 rotates the ball screw 48, the moving body 46 moves in the Y-axis direction along the guide rail 44. An arm 52 is connected to the lower end of the moving body 46 via an elevation mechanism. The arm 52 is provided with a holding mechanism 54 equipped with multiple suction parts (not shown) arranged to correspond to the size of the frame 9.

For example, if multiple devices 5 are formed on the surface of the workpiece 1 and the workpiece 1 is divided into individual devices 5 by the processing unit 32 of the processing device 4, individual device chips are formed. To confirm that the workpiece 1 has been processed appropriately, the processed workpiece 1 is inspected by the inspection device 56.

After cleaning of the workpiece 1 by the cleaning device 40 is completed, the workpiece 1 is held by the holding mechanism 54 and transported to the inspection device 56 by the transport unit 42. Note that the workpiece 1 may be transported to the inspection device 56 by the transport unit 16 instead of the transport unit 42. Here, if the orientation of the cleaning table is adjusted in advance before the transport units 16 and 42 hold the workpiece 1, the orientation of the workpiece 1 transported to the inspection device 56 can be aligned to the specified orientation.

For example, the inspection device 56 inspects the workpiece 1 along the dividing grooves (machining marks) formed in the workpiece 1, and investigates the shape, size, and distribution of chippings formed in the workpiece 1 along the dividing grooves. The size of the device chips formed by dividing the workpiece 1 is also confirmed.

The inspection device 56 can simultaneously observe a portion of the workpiece 1 from both the top side (front surface 1a side) and the bottom side (back surface 1b side). If the inspection device 56 is connected to the processing device 4 as shown in Figure 2, the workpiece 1 can be inspected immediately after processing. However, the inspection device 56 is not limited to this.

Figure 4 is a perspective view showing a schematic diagram of the inspection device 56. The inspection device 56 includes a base 60 that supports each component of the inspection device 56. The base 60 has an opening 62 formed along the X-axis direction. The inspection device 56 includes a support table 58 that is arranged to straddle the opening 62 of the base 60 and can hold the workpiece 1, and a camera unit 82 that can photograph the workpiece 1 held on the support table 58.

The inspection device 56 includes an X-axis movement unit 64a that can move the support table 58 and the camera unit 82 relatively along the X-axis direction, and a Y-axis movement unit 64b that can move the support table 58 and the camera unit 82 relatively along the Y-axis direction. Figure 5(A) shows a schematic perspective view of the X-axis movement unit 64a and support table 58 of the inspection device 56. Figure 5(B) shows a schematic perspective view of the camera unit 82.

The X-axis movement unit 64a is provided with a guide rail 66a extending along the X-axis direction on the side of the opening 62 on the top surface of the base 60. Furthermore, a guide rail 66b extending parallel to the guide rail 66a is provided on the side of the opening 62 on the opposite side of the top surface of the base 60 from the guide rail 66a. A moving body 68a is slidably mounted on the guide rail 66a, and a moving body 68b is slidably mounted on the guide rail 66b.

A bridge-like support structure 74 is disposed above the moving bodies 68a and 68b, spanning both bodies 68a and 68b. A nut portion (not shown) is provided at the lower end of one of the moving bodies 68a and 68b, and a ball screw 70 parallel to the guide rails 66a and 66b is threadedly engaged with this nut portion.

A pulse motor 72 is connected to one end of the ball screw 70. When the pulse motor 72 rotates the ball screw 70, the moving bodies 68a, 68b move in the X-axis direction along the guide rails 66a, 66b, and the bridge-like support structure 74 moves in the X-axis direction. The support table 58 is supported by the support structure 74 at a position overlapping with the opening 62 of the base 60. The X-axis movement unit 64a moves the support structure 74 along the X-axis direction, thereby moving the support table 58 along the X-axis direction.

The support table 58 has a disc-shaped transparent body 76 exposed at the top and bottom. The transparent body 76 is made of a material such as glass or resin. The upper surface of the transparent body 76 serves as a mounting surface 76a on which the workpiece 1 is placed via tape 7. The support table 58 can support the workpiece 1 placed on the mounting surface 76a.

Figure 6 includes a cross-sectional view showing the support table 58. The transparent body 76 is also exposed on the back side opposite the placement surface 76a, so the workpiece 1 placed on the placement surface 76a can be observed from below through the transparent body 76.

The support table 58 has a tape holding section 78 with a tape suction holding surface 78b on the outer periphery of the mounting surface 76a. The tape holding section 78 has a suction groove 78a formed in the tape suction holding surface 78b. A suction source (not shown) is connected to the suction groove 78a via a suction path (not shown). The support table 58 further has an annular frame support section 80 that is arranged around the tape holding section 78 and can support the frame 9 of the frame unit 11.

When the frame unit 11 is placed on the support table 58 so that the frame support portion 80 and the frame 9 overlap, and the suction source is activated, the workpiece 1 is suction-held to the support table 58 via the tape 7. At this time, suction is applied between the support table 58 and the tape 7, causing the tape 7 to adhere to the entire surface of the mounting surface 76a, so the workpiece 1 held on the support table 58 will not shift during inspection.

For example, even if the workpiece 1 is a warped wafer or the like, when the workpiece 1 is held on the support table 58, the tape 7 adheres to the entire mounting surface 76a. Therefore, the workpiece 1 is suction-held on the support table 58 with the warp reduced. If the warp of the workpiece 1 held on the support table 58 is reduced, the camera's focus is less likely to shift from the workpiece 1 when photographing each area of the workpiece 1 in succession, allowing the workpiece 1 to be photographed more clearly.

Here, it is preferable that the height of the mounting surface 76a of the transparent body 76 is lower than the height of the tape suction holding surface 78b of the tape holding portion 78. Furthermore, the suction groove 78a formed in the tape suction holding surface 78b may reach the transparent body 76. In this case, when the frame unit 11 is placed on the support table 58, a gap is formed between the tape 7 and the mounting surface 76a, and when the suction source connected to the suction groove 78a is activated, the area of the tape 7 that overlaps with the workpiece 1 is quickly sucked through this gap.

Figure 6 shows a schematic cross-sectional view of the frame unit 11 and support table 58 when the workpiece 1 is being held by suction on the support table 58. As shown in Figure 6, when the suction source is activated, the gap between the tape 7 and the mounting surface 76a is evacuated, bringing the tape 7 and the mounting surface 76a into close contact.

In addition, after inspection of the workpiece 1 is completed, when the suction source is stopped and the frame unit 11 is removed from the support table 58, the mounting surface 76a may be coated with, for example, a fluororesin to facilitate peeling of the tape 7 from the mounting surface 76a.

Next, the camera unit 82 will be described. As shown in FIG. 4, the camera unit 82 is supported by, for example, a gate-shaped support structure 84 disposed on the base 60 so as to straddle the opening 62, the X-axis movement unit 64a, and the support table 58. A Y-axis movement unit 64b that moves the camera unit 82 along the Y-axis direction is disposed on the support structure 84.

The Y-axis movement unit 64b has a pair of guide rails 86 arranged along the Y-axis direction on the upper surface of the support structure 84. A moving body 88 that supports the camera unit 82 is slidably attached to the pair of guide rails 86. A nut portion (not shown) is provided on the underside of the moving body 88, and a ball screw 90 that is parallel to the pair of guide rails 86 is threaded into this nut portion.

A pulse motor 92 is connected to one end of the ball screw 90. When the pulse motor 92 rotates the ball screw 90, the moving body 88 moves in the Y-axis direction along the guide rail 86, and the camera unit 82 moves in the Y-axis direction. The X-axis moving unit 64a and the Y-axis moving unit 64b work together to function as a moving unit that can move the support table 58 and camera unit 82 relatively in a direction parallel to the mounting surface 76a.

The camera unit 82 includes an upper camera 106a disposed above the transparent body 76 of the support table 58, and a lower camera 106b disposed below the transparent body 76. As shown in FIG. 5(B), the camera unit 82 further includes a connecting portion 108 that connects the upper camera 106a and the lower camera 106b.

The upper camera 106a is supported by a columnar support structure 94a. An elevator mechanism 96a that raises and lowers the upper camera 106a is disposed on the front surface of the columnar support structure 94a. The elevator mechanism 96a has a pair of guide rails 98a along the Z-axis direction, a moving body 100a slidably mounted on the guide rails 98a, and a ball screw 102a threaded into a nut portion provided on the rear surface of the moving body 100a.

An upper camera 106a is fixed to the front of the moving body 100a. A pulse motor 104a is connected to one end of the ball screw 102a. When the pulse motor 104a rotates the ball screw 102a, the moving body 100a moves in the Z-axis direction along the guide rail 98a, and the upper camera 106a fixed to the moving body 100a moves up and down.

The upper end of the connecting portion 108 is connected, for example, to the lower end of the rear surface of the support structure 94a, and the lower end of the connecting portion 108 is connected to the upper end of the rear surface of the columnar support structure 94b that supports the lower camera 106b. An elevating mechanism 96b, configured similarly to the elevating mechanism 96a disposed on the support structure 94a, is disposed on the front surface of the support structure 94b.

The lifting mechanism 96b has a pair of guide rails 98b along the Z-axis direction, a moving body 100b slidably mounted on the guide rails 98b, and a ball screw 102b threaded into a nut portion provided on the rear surface of the moving body 100b. A pulse motor 104b is connected to one end of the ball screw 102b. When the ball screw 102b is rotated by the pulse motor 104b, a lower camera 106b fixed to the front surface of the moving body 100b moves up and down.

The upper camera 106a faces downward and can directly photograph the workpiece 1 supported on the support table 58 from above. The lower camera 106b faces upward and can photograph the workpiece 1 from below through the transparent body 76 and tape 7. The upper camera 106a and the lower camera 106b are, for example, area cameras, line cameras, 3D cameras, or infrared cameras.

When photographing the workpiece 1 through the transparent body 76 and tape 7, the contrast of the resulting photographed image may be reduced due to the influence of spherical aberration. Therefore, the lower camera 106b may have a correction unit consisting of a correction collar or the like that can reduce the influence of spherical aberration.

In the camera unit 82, the upper camera 106a and the lower camera 106b are connected to each other by a connecting portion 108 so that they are positioned in the same direction parallel to the mounting surface 76a. In other words, the same position on the top and bottom surfaces of the workpiece 1 can be photographed. The connecting portion 108 is shaped so that it does not interfere with the support table 58, regardless of which part of the workpiece 1 is photographed.

The processing device 4 will be further described using Figure 2. The processing device 4 is equipped with a display unit 110 having a touch panel. The worker operating the processing device 4, for example, uses the touch panel of the display unit 110 to input the conditions for the processing to be performed by the processing device 4. The display unit 110 also has functions such as displaying various types of information, displaying an input screen, and displaying various alarms.

The processing device 4 also includes a control unit 112 that controls each component of the processing device 4. The control unit 112 is configured by a computer including, for example, a processing device such as a processor represented by a CPU (Central Processing Unit), a main memory device such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), or ROM (Read Only Memory), and an auxiliary memory device such as a flash memory, hard disk drive, or solid state drive.

The auxiliary storage device stores software including a specific program. The functions of the control unit 112 are realized by operating the processing device in accordance with this software. Then, by operating the processing device in accordance with software such as a program stored in the auxiliary storage device, the software and processing device (hardware resources) function as concrete means of cooperation. The configuration and functions of the control unit 112 will be described in detail below.

The inspection device 56 is equipped with a display unit 114 that has a touch panel. The operator who operates the display unit 114 uses the touch panel of the display unit 114 to, for example, input conditions for the inspection to be performed by the inspection device 56 and select images to be displayed on the display unit 114. The display unit 114 also has functions such as displaying various types of information, displaying an input screen, and displaying various types of alarms.

The inspection device 56 also includes a control unit 116 that controls each component of the inspection device 56. The control unit 116 is configured, for example, in the same manner as the control unit 112 of the processing device 4. The configuration and function of the control unit 116 will be described in detail below.

In the processing system 2 according to this embodiment, the control units 112, 116 may be connected to each other by wire or wireless communication. Alternatively, the processing system 2 may include a single integrated control unit that controls the processing device 4 and the inspection device 56. The processing system 2 may also include a single display unit that performs the functions of both the display unit 110 of the processing device 4 and the display unit 114 of the inspection device 56.

In the processing system 2, workpieces 1 are successively withdrawn from cassettes placed on the cassette support table 6b, processed by the processing device 4, inspected by the inspection device 56, and returned to the cassette. Here, due to a malfunction in the factory equipment in which the processing system 2 is installed or a malfunction in the processing device 4, the workpieces 1 may not be processed properly, resulting in damage to the workpieces 1 or chips, or the resulting chips may be defective. In the inspection device 56, the workpieces 1 and chips are inspected for any abnormalities, such as damage or processing defects.

Furthermore, in the processing system 2 according to this embodiment, the processing device 4 and the inspection device 56 may be separated. In this case, for example, an operator loads the workpiece 1 into the processing device 4, processes the workpiece 1 using the processing device 4, transports the processed workpiece 1 from the processing device 4 to the inspection device 56, and inspects the workpiece 1 and chips using the inspection device 56.

Furthermore, the processing system according to this embodiment may include multiple processing devices, and may also include multiple inspection devices. Figure 7 is a perspective view that schematically illustrates an example configuration of a processing system 2a that includes three processing devices 4 and one inspection device 56. For example, a workpiece 1 is processed by one of the three processing devices 4, and the processed workpiece 1 is inspected by the inspection device 56.

Here, the inspection device 56 may obtain an image showing the back surface 1b of the workpiece 1 in addition to an image showing the front surface 1a of the workpiece 1. As described above, the support table 58 of the inspection device 56 includes a transparent body 76 that supports the workpiece 1, and the camera unit 82 includes a lower camera 106b that captures an image of the workpiece 1 from below through the transparent body 76. Therefore, the back surface 1b of the workpiece 1 can be captured.

The inspection device 56 can then simultaneously capture images of the same location on the workpiece 1 from above and below using the camera unit 82. The captured images may be configured as a pair of associated upper camera images of a portion of the workpiece 1 captured by the upper camera 106a and lower camera images of the same portion of the workpiece 1 captured by the lower camera 106b. This allows each area of the workpiece 1 to be confirmed from both the front surface 1a and back surface 1b sides, enabling more detailed analysis of any abnormalities that have occurred in the workpiece 1. Note that the lower camera image captured from the back surface 1b side of the workpiece 1 may be flipped upside down or flipped left to right to facilitate comparison with the upper camera image captured from the front surface 1a side of the workpiece 1.

It should be noted that abnormalities can occur in any part of the workpiece 1. For this reason, it is preferable that the entire area of the workpiece 1 is photographed by the camera unit 82, and that the entire area of the workpiece 1 is captured in the photographed image. However, it is difficult to clearly photograph the entire area of the workpiece 1 at once using the camera unit 82. If the resolution of the photographed image is insufficient, it may be impossible to determine the cause of the abnormality that has occurred in the workpiece 1.

It is therefore advisable to use the camera unit 82 to take high-resolution, enlarged images of each small section of the workpiece 1, and then form a captured image based on the small images obtained. That is, when obtaining a captured image, the support table 58 supporting the workpiece 1 and the camera unit 82 are moved relative to each other using the X-axis movement unit 64a and Y-axis movement unit 64b, and the workpiece 1 is photographed while changing the photographing area. The captured image is then formed based on multiple small images of the workpiece 1 taken sequentially by the camera unit 82 for each small section.

Figure 8 is a plan view that schematically shows the photographed area of the workpiece 1, photographed for each small section. In Figure 8, small sections 134 that have already been photographed by the camera unit 82 are shown in solid lines, and small sections 136 that will be photographed by the camera unit 82 are shown in dashed lines.

When photographing the workpiece 1, the workpiece 1 is photographed in one small section, the support table 58 or the like is moved a distance equivalent to one side of that small section, and the workpiece 1 is photographed in the next small section. By repeating this process, the entire area of the workpiece 1 is photographed and multiple small images are obtained. Note that each small section photographed by the camera unit 82 may partially overlap with adjacent small sections.

The captured image can be formed by combining the multiple small images obtained. The captured image is a collection of high-resolution, clear small images, which can be enlarged as needed to analyze each part of the workpiece 1 in detail. However, since it takes an enormous amount of time to capture images of the entire area of the workpiece 1 in small sections, there is a problem that images cannot be captured in time for the workpieces 1 being processed one after another by the processing device 4, and the number of workpieces 1 waiting for inspection increases.

In response to this, one approach would be to prepare a large number of inspection devices 56 and operate them in parallel in order to inspect the workpieces 1 processed one after another by the processing device 4 and detect any abnormalities. However, the costs of preparing and operating a large number of inspection devices 56 are high, and securing the space to install the inspection devices 56 can also be an issue, which can reduce the efficiency of processing the workpieces 1.

In this embodiment, the processing system 2 does not inspect all of the processed workpieces 1, but instead selects and inspects the workpieces 1 to be inspected, so that abnormalities occurring in the workpieces 1 can be detected efficiently without reducing the processing efficiency of the workpieces 1. Below, we will continue to explain the processing system 2 according to this embodiment, focusing on the configuration related to the selection of the inspection target.

Figure 9 is a block diagram showing a schematic configuration of the processing device 4 and inspection device 56 that make up the processing system 2a shown in Figure 7. The configurations of the processing device 4 and inspection device 56 of the processing system 2 shown in Figure 2 and elsewhere are similar to the configurations of the processing device 4 and inspection device 56 of the processing system 2a shown in Figure 7, so reference can be made to the appropriate descriptions for each.

The inspection device 56 has an inspection unit 120 that processes the captured images of the workpiece 1 taken by the camera unit 82 and inspects the condition of the workpiece 1. The inspection unit 120, for example, detects dividing grooves (machining marks) formed in the workpiece 1 along the streets 3 based on the captured images and inspects the quality of these dividing grooves (machining marks). This inspection process is also known as a kerf check.

The inspection unit 120 uses image recognition technology to detect dividing grooves from the captured image, and evaluates the position of the dividing grooves on the street 3, the width of the dividing grooves, and the shape, size, amount, and distribution of chippings formed on both side walls of the dividing grooves. If the specified criteria are met for each item, the processing results are determined to be normal, and if the specified criteria are not met, the workpiece 1 is determined to have an abnormality.

The inspection unit 120 may inspect the workpiece 1 for abnormalities at positions away from the dividing grooves, or may detect abnormalities that appear at positions away from the dividing grooves of the workpiece 1. For example, it may inspect the device 5 for damage such as cracks, or for the presence of contamination on the electrodes of the device 5, or other abnormalities.

The inspection device 56 includes a recording unit 118 in the control unit 116 that records the images captured by the camera unit 82 as well as the inspection results of the workpiece 1 by the inspection unit 120. The recording unit 118 records the captured images and the inspection results in association with each other. This information can be used to analyze abnormalities that occur in the workpiece 1 and to analyze the causes of the abnormalities.

The processing device 4 also includes a measurement unit 122 that measures physical quantities generated in the processing device 4 while processing the workpiece 1, and the control unit 112 includes an abnormality detection unit 124 that detects abnormalities that occur while the processing unit 32 is processing the workpiece 1. The abnormality detection unit 124 detects the occurrence of an abnormality based on the physical quantities measured by the measurement unit 122. The measurement unit 122 measures, for example, physical quantities such as vibration, current, voltage, speed, torque, rotational amount, pressure, temperature, and flow rate.

The measurement unit 122 is, for example, a vibration sensor attached to the processing unit (cutting unit) 32. The vibration sensor detects vibrations that occur as the cutting blade 34 rotates and vibrations that occur when the cutting blade 34 cuts into the workpiece 1. Alternatively, the vibration sensor may be attached to the chuck table 14 and detects vibrations that occur as the chuck table 14 moves.

The measurement unit 122 is, for example, a voltmeter that measures the voltage applied to the machining fluid used in the processing device 4. In the processing device 4, a machining fluid such as pure water is supplied to the cutting blade (processing tool) 34 and the workpiece 1. By passing a current through the machining fluid being used and measuring the voltage, the resistivity of the machining fluid can be measured, providing information on the amount of impurities contained in the machining fluid. Alternatively, the voltmeter is used to measure the output voltage of a non-contact setup device used to adjust (set up) the height of the cutting blade 34.

The measuring unit 122 is, for example, an ammeter installed in the power supply line that supplies power to the machining unit 32. The power supply line is connected to a motor that rotates a spindle connected to the cutting blade 34, and the ammeter can monitor the current of the power supplied to the motor. If there is an abnormality in the machining unit 32, etc., the ammeter may observe an unusual current transition. The ammeter may also be used to measure the resistivity of the machining fluid.

The measuring unit 122 is, for example, a speedometer that measures the movement speed of the machining unit 32 and chuck table 14, which are moved relatively by the moving unit. The measuring unit 122 is also a torque detection unit or rotation amount detection unit that detects the torque or rotation amount of the motor provided in the moving unit or the motor that rotates the chuck table 14.

The measuring unit 122 is, for example, a pressure gauge. The pressure gauge measures the pressure of the air supplied to the spindle or spindle housing 36 of the processing unit 32. Alternatively, the pressure gauge measures the negative pressure applied to the workpiece 1 by the chuck table 14 that sucks the workpiece 1 or the cleaning table of the cleaning device 40, the supply pressure of the processing fluid or cleaning fluid, or the pressure of the dry air from the cleaning device 40.

The measuring unit 122 is, for example, a thermometer. The thermometer measures the temperature of the cooling water or air supplied to the spindle housing 36, the temperature of the machining fluid, the temperature inside and outside the machining device 4, the temperature of the motor of the moving unit, the temperature of the ball screw included in each moving unit, etc. The measuring unit 122 is also a flow meter. The flow meter measures the flow rate of the machining fluid or cleaning fluid, or the flow rate of various types of air, etc.

Note that the measuring unit 122 provided in the processing device 4 is not limited to this, and the measuring unit 122 may be a measuring device capable of measuring other physical quantities. When an abnormality occurs in the processing device 4, various measuring units 122 may detect values of physical quantities that differ from normal.

The processing device 4 includes an allowable range memory unit 126 in the control unit 112, which stores allowable ranges for physical quantities observed by the measurement unit 122. The abnormality detection unit 124 reads the allowable ranges stored in the allowable range memory unit 126, and when any of the values of these physical quantities observed by the measurement unit 122 fall outside the allowable range, it detects this as an abnormality.

The processing device 4 also includes an inspection target selection unit 128 in the control unit 112 that selects the workpieces 1 to be inspected by the inspection device 56. The inspection target selection unit 128 sorts the workpieces 1 processed one after another by the processing device 4 into workpieces 1 to be inspected and workpieces 1 not to be inspected in accordance with predetermined conditions.

For example, the inspection target selection unit 128 selects the workpiece 1 being processed by the processing device 4 when the abnormality detection unit 124 detects an abnormality as the inspection target for the inspection device 56. If the abnormality detection unit 124 detects that an abnormality has occurred in the processing device 4 while the workpiece 1 is being processed, there is a high probability that high-precision processing was not performed on the workpiece 1 and the workpiece 1 was not processed to the expected quality. Such workpieces 1 should be inspected preferentially by the inspection device 56. The inspection device 56 inspects the workpiece 1 selected as the inspection target.

On the other hand, if the abnormality detection unit 124 does not detect that an abnormality has occurred in the processing device 4 while the workpiece 1 is being processed, there is a high probability that high-precision processing has been performed on the workpiece 1 and that the workpiece 1 has been processed to the expected quality. Therefore, there is little need to inspect such workpieces 1 with the inspection device 56, and inspection may be omitted. Workpieces 1 not selected for inspection may be removed from the processing system 2 as is.

In this way, with the processing system 2 according to this embodiment, the inspection target selection unit 128 determines whether or not inspection is required for each workpiece 1 by the inspection device 56, and some workpieces 1 are inspected by the inspection device 56 while other workpieces 1 are not inspected. Workpieces 1 that are most in need of inspection can then be inspected preferentially.

As a result, the financial and time costs required to inspect the workpiece 1 can be reduced and inspection efficiency can be increased, thereby improving the processing efficiency of the processing system 2. Furthermore, if there is leeway in the operating status of the inspection device 56, the workpiece 1 to be inspected can be inspected for longer, thereby improving inspection accuracy.

Note that the requirement for the inspection target selection unit 128 to select the workpiece 1 to be inspected is not limited to the anomaly detection unit 124 detecting an anomaly. A specific situation in which anomalies are likely to occur in the workpiece 1 may also be a requirement for selecting the workpiece 1 to be inspected. For example, the inspection target selection unit 128 may further select the workpiece 1 that is first processed after maintenance is performed on the processing device 4 or after settings are changed as the inspection target for the inspection device 56.

Some parts of the processing device 4 wear out and deteriorate as the workpieces 1 are processed one after another, so the parts are replaced periodically. Alternatively, operation is periodically stopped and maintenance is performed to check the condition of each part. Furthermore, the settings of the processing device 4 may be changed when the type of workpiece 1 processed by the processing device 4 changes, or when the processing conditions for the workpiece 1 change.

Furthermore, when the processing device 4 is a cutting device, the cutting blade 34 attached to the processing unit 32 may become clogged or dull, reducing the cutting ability of the cutting blade 34. Therefore, in order to restore the cutting ability of the cutting blade 34, the cutting device periodically performs a process called dressing, in which a plate called a dressing board is cut into the cutting blade 34 to moderately wear the cutting blade 34.

When the processing device 4 undergoes maintenance, setting changes, or dressing and returns to a new state, it is not guaranteed that the processing device 4 will properly process the workpiece 1 in that state. Therefore, regardless of whether the abnormality detection unit 124 detects an abnormality, the inspection target selection unit 128 selects the workpiece 1 that will be first processed after maintenance, etc., of the processing device 4 as the inspection target for the inspection device 56. It is then desirable to confirm through inspection by the inspection device 56 that the processing device 4 can process the workpiece 1 without any problems.

The processing device 4 may be provided with an information transmitting unit 130 capable of transmitting information to the inspection device 56 via wireless or wired communication. The information transmitting unit 130 may transmit to the inspection device 56 the details of the abnormality detected by the abnormality detection unit 124 and the physical quantities observed by the measurement unit 122. The inspection device 56 may be provided with an information receiving unit 132 capable of receiving various types of information transmitted from the information transmitting unit 130 of the processing device 4.

For example, if the processing device 4 and the inspection device 56 are independent of each other, the information transmitting unit 130 is an antenna capable of transmitting radio waves, and the information receiving unit 132 is an antenna capable of receiving those radio waves. Also, for example, if the processing device 4 and the inspection device 56 are integrated, the information transmitting unit 130 and the information receiving unit 132 are wiring that connects the processing device 4 and the inspection device 56.

Furthermore, if the functions of control unit 116 and control unit 112 are realized by a single integrated control unit, the information transmitting unit 130 and information receiving unit 132 are electronic circuits, etc., included in the control unit.

The functions of the information transmitting unit 130 and the information receiving unit 132 may be interchanged, and the information transmitting unit 130 and the information receiving unit 132 may be used to transmit information from the inspection device 56 to the processing device 4.

The inspection device 56 may change the inspection content for the workpiece 1 depending on the content of the abnormality detected by the abnormality detection unit 124 and the physical quantity observed by the measurement unit 122, which are received from the information transmission unit 130. Furthermore, the recording unit 118 of the inspection device 56 may record the content of the abnormality and the physical quantity linked to the captured image formed by the camera unit 82. In this case, when an abnormality is detected in the workpiece 1, etc., the cause of the abnormality can be investigated from multiple angles.

Furthermore, each workpiece 1 may be provided with ID information for identification purposes. In this case, the ID information read from the workpiece 1 may be linked to the captured image and recorded in the recording unit 118. Information regarding the location of the workpiece 1 in the cassette in which it was stored when it was brought into the processing device 4 may also be sent to the recording unit 118, and this information may be linked to the captured image and recorded in the recording unit 118.

In the processing system 2 according to this embodiment, the display unit 114 may be capable of displaying captured images recorded in the recording unit 118. Figure 10 is a plan view schematically showing the display unit 114 displaying captured images of the workpiece 1. The control unit 116 of the inspection device 56 reads various information and images from the recording unit 118 and displays them on the display unit 114.

As shown in FIG. 10, for example, an upper camera image 13a and a lower camera image 13b are displayed side by side at the top of the display unit 114. Furthermore, enlarged image display areas 15a and 15b are provided at the bottom of the display unit 114, in which multiple enlarged images 17a and 17b, which are enlarged portions of the upper camera image 13a and the lower camera image 13b, are displayed side by side.

For example, upper camera image 13a and lower camera image 13b each display a full view of workpiece 1. The upper camera image 13a and lower camera image 13b, which display a full view of workpiece 1, show the area of workpiece 1 that appears in enlarged images 17a and 17b. For example, frames 21a and 21b indicating the area that appears in enlarged images 17a and 17b are superimposed on upper camera image 13a and lower camera image 13b.

Furthermore, the operator may be able to move the frames 21a, 21b by touching the screen of the display unit 114. In this case, other enlarged images 17a, 17b showing the area indicated by the moved frames 21a, 21b may be displayed at the bottom of the display unit 114. It is preferable that when one frame 21a, 21b is moved, the other frame 21a, 21b moves in conjunction with it so that a specific area of the workpiece 1 can be viewed simultaneously from both the front surface 1a and back surface 1b.

Furthermore, if it is desired to specify the area shown in the enlarged images 17a and 17b in more detail and with greater precision, it is preferable that the upper camera image 13a and the lower camera image 13b shown at the top of the screen can be enlarged. For example, the display unit 114 may display zoom buttons 19a and 19b that can change the zoom ratio of the upper camera image 13a and the lower camera image 13b. When the operator touches the zoom buttons 19a and 19b, the size and zoom ratio of the upper camera image 13a and the lower camera image 13b change.

The display unit 114 may also display various other information. For example, if various physical quantities measured by the measuring unit 122 are transmitted from the processing device 4 and recorded in the recording unit 118, the display unit 114 may display the various physical quantities. The display unit 114 may also display information such as the type, serial number, and manufacturing date and time of the workpiece 1, as well as the processing date and time of the workpiece 1. There are no restrictions on the content of the information displayed on the screen.

Next, we will explain the process of processing the workpiece 1 with the processing device 4, selecting the workpiece 1 to be inspected, and inspecting the selected workpiece 1 with the inspection device 56 in the processing system 2 according to this embodiment. Figure 11 is a flowchart illustrating the flow of each step of the inspection target selection method for selecting the workpiece 1 to be inspected by the inspection device 56 in the processing system 2 having the processing device 4 and the inspection device 56.

First, a cassette containing a frame unit 11 including the workpiece 1 is placed on the cassette support table 6b of the processing device 4 shown in Figure 2. The frame unit 11 is then pulled out of the cassette by the transport unit 16, and the frame unit 11 is then transported onto the chuck table 14 of the processing device 4 by the transport unit 16, where it is suction-held to the chuck table 14.

Next, the processing step S10 is carried out. In processing step S10, the workpiece 1 is processed by the processing unit 32. While the workpiece 1 is being processed, the measurement unit 122 (see Figure 9), which measures various physical quantities, is operated to measure the various physical quantities. Then, the frame unit 11 is transported by the transport unit 42 to the cleaning device 40, where the workpiece 1 is cleaned.

Here, the abnormality detection unit 124 of the control unit 112 detects an abnormality when any of the physical quantities observed by the processing device 4, such as vibration, current, voltage, load, speed, torque, pressure, temperature, or flow rate, falls outside the allowable range. In other words, the abnormality detection unit 124 references the allowable ranges for various physical quantities stored in the allowable range memory unit 126, and detects that an abnormality has occurred in the processing device 4 if the observed physical quantity does not satisfy the allowable range.

Then, a determination step S20 is performed to determine whether the workpiece 1 processed by the processing device 4 should be inspected by the inspection device 56. In this determination step S20, the inspection target selection unit 128 of the control unit 112 determines whether each workpiece 1 needs to be inspected and selects the workpiece 1 to be inspected.

In judgment step S20, the inspection target selection unit 128 selects the workpiece 1 being processed by the processing device 4 when the abnormality detection unit 124 detects an abnormality as the inspection target for the inspection device 56. In addition, the workpiece 1 that is first processed after maintenance on the processing device 4 is performed or after settings are changed may be selected as the inspection target for the inspection device 56.

Furthermore, if the processing device 4 is a cutting device, the inspection object selection unit 128 may select the workpiece 1 that is first processed (cut) after dressing is performed on the cutting blade 34 of the processing unit (cutting unit) 32 as the inspection object of the inspection device 56.

Workpieces 1 that are not selected for inspection in determination step S20 are returned to the cassette placed on the cassette support table 6b (S21) without undergoing inspection step S30, which will be described next. On the other hand, workpieces 1 that are selected for inspection in determination step S20 are sent to the inspection device 56 and inspected by the inspection device 56 (S21).

Next, we will explain the inspection step S30, which is performed on the workpiece 1 selected for inspection in the determination step S20. The workpiece 1 selected for inspection is transported from the cleaning device 40 to the support table 58 of the inspection device 56 by the transport unit 42, and is held by suction on the support table 58.

Then, the workpiece 1 is photographed with the camera unit 82 to obtain a photographed image of the workpiece 1. First, the lifting mechanisms 96a, 96b are operated, etc., to focus the upper camera 106a and the lower camera 106b on the respective surfaces of the workpiece 1 to be photographed. Then, the movement units 64a, 64b are operated to scan the camera unit 82 using the method shown in Figure 8, while photographing various parts of the workpiece 1 with the upper camera 106a of the camera unit 82, etc. The photographed images formed by the camera unit 82 are recorded in the recording unit 118.

After photographing and inspecting the workpiece 1, the frame unit 11 containing the workpiece 1 is transferred by the transport unit 42 and transport unit 16 into a cassette supported on the cassette support table 6b. The cassette is then removed from the processing system 2. The workpiece 1 is processed by the processing device 4 to obtain individual chips. The formed individual chips are picked up from the tape 7 and mounted on the designated mounting target.

Here, the workpiece 1 that is selected as the inspection target in judgment step S20 may be handled differently from the workpiece 1 that is not selected as the subsequent inspection target. For example, the inspection target workpiece 1 may have contamination attached, and it is possible that the contamination may detach from the workpiece 1 during transport and contaminate the transport path. Therefore, a dedicated transport mechanism different from the transport mechanism used to transport other workpieces 1 may be used to transport the inspection target workpiece 1.

Furthermore, the workpiece 1 to be inspected may be placed in a dedicated cassette that is different from the cassettes in which other workpieces 1 are ultimately placed, and then transported out of the processing system 2. Alternatively, if the workpiece 1 to be inspected and other workpieces 1 are placed in the same cassette, information regarding the placement position of the workpiece 1 to be inspected in the cassette may be associated with the captured image and recorded in the recording unit 118.

In the inspection step S30, the quality of the machining marks formed on the workpiece 1 may be evaluated using the captured image. Furthermore, the inspection section 120 of the control unit 116 checks whether or not an abnormality has occurred in the workpiece 1. If it is determined that an abnormality has occurred in the workpiece 1, the cause of the abnormality may be investigated.

Furthermore, if the anomaly detection unit 124 detects an anomaly while the workpiece 1 is being processed by the processing device 4, the inspection device 56 may set the content of the inspection to be performed depending on the content of the anomaly. For example, information about the anomaly detected by the anomaly detection unit 124 in processing step S10 is sent to and recorded in the recording unit 118 of the inspection device 56. Then, when the workpiece 1 is inspected by the inspection device 56, the content of the anomaly recorded in the recording unit 118 is referenced and the content of the inspection is set.

Furthermore, the captured image of the workpiece 1 captured by the camera unit 82 is stored in the recording unit 118. At this time, the physical quantities observed by the processing device 4 may be linked to the captured image and recorded in the recording unit 118. Furthermore, when the quality of the processing marks is evaluated by the inspection device 56, the evaluation results may be linked to the captured image and recorded.

As explained above, with the workpiece selection method according to this embodiment, workpieces 1 that require inspection are inspected by the inspection device 56 on a priority basis, and inspection of other workpieces 1 can be omitted. Therefore, the time and financial costs required for inspection can be reduced compared to when all workpieces 1 processed by the processing device 4 are inspected by the inspection device 56. At the same time, it is less likely that an abnormality occurring in the workpiece 1 will go undetected. Therefore, an abnormality occurring in the workpiece 1 can be efficiently detected without reducing the processing efficiency of the workpiece 1.

Note that one aspect of the present invention is not limited to the description of the above embodiment and can be implemented with various modifications. For example, in the above embodiment, a case was described in which the processing system 2 includes one inspection device 56, but one aspect of the present invention is not limited to this. In other words, the processing system 2 may include multiple inspection devices 56.

Furthermore, in the above embodiment, we have described a case where the abnormality detection unit 124 detects an abnormality while the workpiece 1 is being processed by the processing device 4, or where the workpiece 1 is inspected by the inspection device 56 immediately after maintenance, etc., has been performed on the processing device 4. However, the processing system 2 and workpiece selection method according to this embodiment are not limited to this.

For example, if the anomaly detection unit 124 continues to fail to detect an anomaly in the processing device 4 while workpieces 1 are being processed one after another by the processing device 4, there may be no workpieces 1 sent to the inspection device 56, and the operating time of the inspection device 56 may become short. Therefore, the inspection target selection unit 128 of the control unit 112 of the processing device 4 may select workpieces 1 that are less likely to require inspection as the inspection target when the operating time of the inspection device 56 is short.

If the inspection device 56 has ample operating capacity, the processing efficiency or inspection efficiency of the workpieces 1 will not decrease even if the workpieces 1 to be processed by the processing device 4 are randomly selected and inspected by the inspection device 56. Even for workpieces 1 that do not require inspection to a great extent, there is a non-zero chance that some kind of abnormality will be detected during inspection by the inspection device 56. If the inspection device 56 has ample operating capacity, the inspection efficiency can be further improved by increasing the number of workpieces 1 to be inspected and increasing the operating time of the inspection device 56, as long as no workpieces 1 are left waiting for inspection.

In addition, the structures, methods, etc. related to the above embodiments can be modified as appropriate without departing from the scope of the present invention.

REFERENCE SIGNS LIST 1 Workpiece 1a Surface 1b Back surface 3 Street 5 Device 7 Tape 9 Frame 11 Frame unit 13a Upper camera image 13b Lower camera image 15a, 15b Enlarged image display area 17a, 17b Enlarged image 19a, 19b Enlarge/reduce button 21a, 21b Frame 2, 2a Processing system 4 Processing device 6a Base 6b Cassette support base 6c Standing portion 8 Conveyor rail 10 Opening 10a Dustproof/waterproof cover 12 Moving table 14 Chuck table 16, 42 Conveyor unit 18, 44, 66a, 66b, 86, 98a, 98b Guide rail 20, 46, 68a, 68b, 88, 100a, 100b Moving body 22, 48, 70, 90, 102a, 102b Ball screw 24, 50, 72, 92, 104a, 104b Pulse motor 26, 52 Arm 28 Suction part 30 Push-pull mechanism 32 Processing unit 34 Cutting blade 36 Spindle housing 38 Opening 40 Cleaning device 54 Holding mechanism 56 Inspection device 58 Support table 60 Base 62 Opening 64a, 64b Moving unit 74, 84, 94a, 94b Support structure 76 Transparent body 76a Placement surface 78 Tape holding part 78a Suction groove 78b Tape suction holding surface 80 Frame support part 82 Camera unit 96a, 96b Elevation mechanism 106a Upper camera 106b Lower camera 108 Connecting part 110, 114 Display unit 112, 116 Control unit 118 Recording unit 120 Inspection unit 122 Measurement unit 124 Abnormality detection unit 126 Tolerance range storage unit 128 Inspection object selection unit 130 Information transmission unit 132 Information reception unit 134, 136 Small section

Claims (13)

A processing system having a processing device that processes a workpiece and an inspection device that inspects the workpiece,
The processing device is
a processing unit that processes the workpiece held by the chuck table;
an abnormality detection unit that detects an abnormality that occurs while the workpiece is being processed by the processing unit,
The inspection device comprises:
a camera unit for photographing the processed object and forming a photographed image;
an inspection unit that processes the captured image and inspects the state of the workpiece;
a recording unit that records the photographed image and the inspection results by the inspection unit,
an inspection object selection unit that selects the workpiece being processed by the processing device as an inspection object of the inspection device when the abnormality detection unit detects the abnormality;
A processing system characterized in that if the abnormality detection unit does not detect an abnormality while the workpiece is being processed by the processing unit, the workpiece is not subject to inspection by the inspection device and the workpiece is not sent to the inspection device. A processing system having a processing device that processes a workpiece and an inspection device that inspects the workpiece,
The processing device is
a processing unit that processes the workpiece held by the chuck table;
an abnormality detection unit that detects an abnormality that occurs while the workpiece is being processed by the processing unit,
The inspection device comprises:
a camera unit for photographing the processed object and forming a photographed image;
an inspection unit that processes the captured image and inspects the state of the workpiece;
a recording unit that records the photographed image and the inspection results by the inspection unit,
The processing system further comprises an inspection object selection unit that selects the workpiece being processed by the processing device as an inspection object for the inspection device when the abnormality detection unit detects the abnormality, and the workpiece that is most in need of inspection is inspected preferentially by the inspection device. The machining system of claim 1 or 2, characterized in that the abnormality detection unit detects an abnormality when any of the vibration, current, voltage, load, speed, torque, pressure, temperature, or flow rate observed by the machining device falls outside an allowable range. The processing system according to claim 2, characterized in that the inspection object selection unit further selects the workpiece that is to be processed first after maintenance of the processing device is performed or after a setting change is performed as the inspection object of the inspection device. The inspection device comprises:
a support table for supporting the workpiece;
a moving unit that moves the camera unit and the support table relative to each other,
The processing system described in any one of claims 1 to 4, characterized in that the captured image is formed based on a plurality of small images captured sequentially by the camera unit of the workpiece for each small section by moving the support table supporting the workpiece and the camera unit relative to each other using the moving unit to change the capturing area of the camera unit. The inspection device further includes a display unit;
6. The processing system according to claim 5, wherein the display unit can display an enlarged image of a part of the captured image together with an area of the workpiece that appears in the enlarged image. The inspection device further includes a support table having a transparent body for supporting the workpiece;
the camera unit includes an upper camera that directly photographs the workpiece supported on the support table from above, and a lower camera that photographs the workpiece from below through the transparent body,
The processing system of any one of claims 1 to 4, characterized in that the recording unit records the captured images consisting of an associated pair of upper camera images of a portion of the workpiece taken by the upper camera and lower camera images of the portion of the workpiece taken by the lower camera. The machining system described in any one of claims 1 to 7, characterized in that the inspection unit of the inspection device inspects the workpiece with the content set in accordance with the content of the abnormality detected by the abnormality detection unit while the workpiece is being machined by the machining unit. In a processing system having a processing device that processes a workpiece with a processing unit and an inspection device that photographs the workpiece with a camera unit to inspect the state of the workpiece, a method for selecting an inspection target to be inspected by the inspection device, comprising:
a processing step of processing the workpiece with the processing unit in the processing device;
a determination step of determining whether or not the workpiece processed by the processing device is to be inspected by the inspection device;
an inspection step of inspecting the workpiece selected as the inspection target in the determination step by the inspection device,
In the processing step, an abnormality occurring while the workpiece is being processed by the processing unit is detected by an abnormality detection unit provided in the processing device;
In the judgment step, when the abnormality detection unit detects the abnormality, the workpiece being processed by the processing device is selected as the inspection object of the inspection device, and when the abnormality detection unit does not detect the abnormality, the workpiece is not selected as the inspection object of the inspection device. In a processing system having a processing device that processes a workpiece with a processing unit and an inspection device that photographs the workpiece with a camera unit to inspect the state of the workpiece, a method for selecting an inspection target to be inspected by the inspection device, comprising:
a processing step of processing the workpiece with the processing unit in the processing device;
a determination step of determining whether or not the workpiece processed by the processing device is to be inspected by the inspection device;
an inspection step of inspecting the workpiece selected as the inspection target in the determination step by the inspection device,
In the processing step, an abnormality occurring while the workpiece is being processed by the processing unit is detected by an abnormality detection unit provided in the processing device;
In the judgment step, when the abnormality detection unit detects the abnormality, the workpiece being processed by the processing device is selected as the inspection object of the inspection device, and the workpiece that is most in need of inspection is inspected preferentially by the inspection device. The method for selecting an inspection object according to claim 9 or 10, characterized in that the abnormality detection unit detects as an abnormality any of the vibration, current, voltage, load, speed, torque, pressure, temperature, and flow rate observed by the processing device falling outside of an allowable range. The method for selecting an inspection object described in any one of claims 9 to 11, characterized in that the determination step further determines the workpiece that is first processed after maintenance of the processing device or a setting change is performed as the inspection object of the inspection device. The method for selecting an inspection object according to any one of claims 9 to 12, characterized in that in the inspection step, the workpiece is inspected according to set details based on the details of the abnormality detected by the abnormality detection unit in the processing step.