JP7718906B2 - Substrate Processing Equipment - Google Patents

Description

The present invention relates to a substrate processing apparatus for processing a substrate.
Substrates to be processed include, for example, semiconductor wafers, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic EL (Electroluminescence) displays, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.

The substrate processing apparatus disclosed in Patent Document 1 below includes a processing cup that surrounds a spin chuck. The processing cup includes two guards that catch chemicals that splash around the substrate held by the spin chuck. The first guard, on the inside, surrounds the spin chuck, and the second guard, on the outside of the first guard, surrounds the spin chuck.

The first guard includes a cylindrical tubular portion, a cylindrical middle portion extending upward from the outer periphery of the top surface of the tubular portion, and an annular inclined portion extending diagonally upward and inward from the upper end of the middle portion.

Japanese Patent Application Laid-Open No. 2020-198356

In the substrate processing apparatus disclosed in Patent Document 1, the airflow (downflow) formed within the chamber passes through the processing cup and is discharged to the exhaust duct. The space below the inclined portion of the first guard is larger than the spaces between the first and second guards. As a result, exhaust efficiency is likely to be insufficient in the space below the inclined portion of the first guard. Insufficient exhaust efficiency is likely to cause turbulence in the airflow, leading to stagnation of the atmosphere. When the atmosphere stagnates, vapor and mist from the chemical liquid contained in the atmosphere may adhere to the substrate, potentially generating particles on the substrate.

Therefore, one object of the present invention is to provide a substrate processing apparatus that can prevent stagnation of the atmosphere below the annular portion of the first guard.

One embodiment of the present invention provides a substrate processing apparatus including: a substrate holding member that holds a substrate horizontally; a chemical solution supply unit that supplies a chemical solution to the substrate held by the substrate holding member; a cylindrical first guard that surrounds the substrate holding member and has a cylindrical portion and an annular portion that extends from the cylindrical portion inward beyond the cylindrical portion; and an annular member that extends obliquely upward from the cylindrical portion inward beyond the cylindrical portion below the annular portion. The annular member has at least one passage permitting portion on the outer periphery of the annular member that allows fluid to pass from above the annular member to below the annular member.

According to this device, an annular member that extends inward from the cylindrical portion of the first guard is provided below the annular portion of the first guard. The outer periphery of the annular member is provided with at least one passage-permitting portion that allows fluid to pass from above the annular member to below the annular member. Therefore, below the annular portion of the first guard, an airflow can be created that flows from above the annular member to below the annular member via the passage-permitting portion. This allows the atmosphere below the annular portion to be rectified, preventing stagnation of the atmosphere.

The chemical solution supplied to the upper surface of the substrate splashes outward from the substrate and is primarily received by the cylindrical portion and the annular member. The passage allowance portion is provided on the outer periphery of the annular member. Therefore, the chemical solution received by the cylindrical portion can pass through the annular member via the passage allowance portion as it falls from the cylindrical portion or flows downward along the cylindrical portion. The annular member protrudes diagonally upward from the cylindrical portion, toward the inside of the cylindrical portion. Therefore, the chemical solution that adheres to the annular member flows along the annular member toward the outer periphery of the annular member. The chemical solution that has flowed to the outer periphery of the annular member passes through the annular member via the passage allowance portion. This prevents the chemical solution that splashes outward from the substrate from accumulating on the annular member. Therefore, when an annular member is provided to rectify the atmosphere, the chemical solution can be prevented from accumulating on the annular member.

In one embodiment of the present invention, the annular member has a plurality of the passage allowing portions arranged along the circumferential direction of the annular member.
Therefore, unevenness in the flow straightening effect in the circumferential direction of the annular member can be reduced, and the chemical liquid that flows along the annular member and reaches the outer periphery of the annular member can be efficiently discharged below the annular member.

In one embodiment of the present invention, the plurality of passage allowance portions are provided at equal intervals along the circumferential direction.
This configuration further reduces unevenness in the circumferential direction of the annular member, and also more efficiently discharges the chemical solution that flows along and on the annular member and reaches the outer periphery of the annular member below the annular member.

In one embodiment of the present invention, the passage allowing portion includes a notch that cuts out an outer circumferential edge of the annular member.
According to this configuration, the outer peripheral edge of the annular member is cut out by the cutout, so that there is no area outside the cutout where the chemical solution can accumulate, and therefore the chemical solution on the annular member can be more efficiently discharged below the annular member.

However, on the other hand, a through hole may be provided that penetrates the outer periphery of the annular member.
In one embodiment of the present invention, the annular member projects from the cylindrical portion parallel to the annular portion.
A radial airflow is formed between the annular member and the annular portion, and flows toward the outer periphery of the annular member. Therefore, if the annular member is parallel to the annular portion, the difference in speed between the radial airflow near the inner periphery of the annular member and the radial airflow near the outer periphery of the annular member can be reduced. This further reduces stagnation of the atmosphere below the annular portion.

In one embodiment of the present invention, the annular member is detachable from the first guard, so that it can be replaced with an annular member suitable for substrate processing as needed.
The substrate processing apparatus may further include a fastening member that fastens the annular member to the cylindrical portion. The annular member may include a fixing portion that is fixed to the cylindrical portion by the fastening member. The fastening member may be capable of fixing the annular member to the first guard and releasing the fixation of the annular member to the first guard.
In one embodiment of the present invention, the chemical solution supply unit includes an upper chemical solution supply member that supplies a chemical solution to an upper surface of the substrate held by the substrate holding member. The substrate processing apparatus further includes a guard drive mechanism that raises and lowers the first guard together with the annular member between a lower position where an inner peripheral edge of the annular member is positioned below an upper surface of the substrate held by the substrate holding member and an upper position where the inner peripheral edge of the annular member is positioned above the upper surface of the substrate held by the substrate holding member. When the first guard is positioned at the upper position, the inner peripheral edge of the annular member is positioned below an upper surface of the substrate held by the substrate holding member.

With this configuration, the top surface of the substrate can be positioned below the inner circumferential edge of the annular portion and above the inner circumferential edge of the annular member. This allows chemical solution that splashes from the top surface of the substrate to flow between the annular member and the annular portion. This promotes the formation of an airflow that flows toward the outside of the cylindrical portion, i.e., toward the passage allowance portion, between the annular member and the annular portion. Furthermore, promoting the formation of an airflow that flows toward the outside of the cylindrical portion reduces the rebound of chemical solution from the annular member and the first guard.

In one embodiment of the present invention, the substrate holding member includes a disk-shaped base and a plurality of gripping pins that grip a peripheral edge of the substrate above the base, and an inner peripheral edge of the annular member laterally faces the base when the first guard is located at the upper position.
With this configuration, the inner peripheral edge of the annular member faces the side of the base, thereby reducing the gap between the base and the annular member. This allows an airflow to flow downward through the gap between the base and the annular member, thereby helping to streamline the atmosphere below the annular portion.

In one embodiment of the present invention, the chemical liquid supply unit includes a lower surface rinse liquid supply member that supplies a rinse liquid to the lower surface of the substrate held by the substrate holding member.
Therefore, with the annular member laterally facing the base of the substrate holding member, i.e., positioned sufficiently lower than the substrate, the rinse liquid can be supplied from the underside rinse liquid supply member to the underside of the substrate. In this case, the first guard and the annular member can be cleaned with the rinse liquid discharged from the underside of the substrate. This allows the chemical liquid adhering to the first guard and the annular member to be removed.

The direction in which the liquid splashes from the lower surface of the substrate is more downward than the direction in which the liquid splashes from the upper surface of the substrate, and therefore the liquid splashing from the lower surface of the substrate is more likely to adhere to the annular member inside the cylindrical portion than the liquid splashing from the upper surface of the substrate.
Therefore, the rinse liquid splashed from the underside of the substrate is more likely to adhere to the inner periphery of the annular member than the chemical liquid splashed from the upper surface of the substrate. This makes it possible to prevent the chemical liquid from remaining on the annular member. Furthermore, compared to when the rinse liquid is supplied to the upper surface of the substrate to clean the first guard and the annular member, it is easier to clean the inner periphery of the annular member. In other words, compared to when the rinse liquid is supplied to the upper surface of the substrate, it is easier to clean the entire annular member.

In a preferred embodiment of the present invention, the substrate processing apparatus further includes a discharge pipe that discharges the atmosphere in the annular portion and the space between the annular members via the passage permitting portion.
According to this configuration, an airflow can be forcibly formed from above the annular member to below the annular member via the passage permitting portion, thereby rectifying the atmosphere below the annular member and preventing stagnation of the atmosphere.

In one embodiment of the present invention, the substrate processing apparatus may further include a cylindrical second guard that is positioned outside the first guard and surrounds the substrate holding member. Furthermore, the substrate processing apparatus may further include a cylindrical third guard that is positioned outside the second guard and surrounds the substrate holding member. In this way, the present invention can also be applied to configurations where multiple guards are provided.

FIG. 1 is a plan view for explaining an example of the configuration of a substrate processing apparatus according to a first embodiment of the present invention. FIG. 2 is a schematic diagram for explaining the configuration of a processing unit provided in the substrate processing apparatus. FIG. 3A is a cross-sectional view of a plurality of guards provided in the processing unit and their surroundings, showing the state when the arrangement of the plurality of guards is in a first arrangement. FIG. 3B is a cross-sectional view of the plurality of guards and their surroundings provided in the processing unit, showing the state when the arrangement of the plurality of guards is in the second arrangement. FIG. 4A is a perspective view of an annular member provided in the processing unit. FIG. 4B is a cross-sectional view taken along line IVB-IVB shown in FIG. FIG. 5 is a block diagram for explaining the electrical configuration of the substrate processing apparatus. FIG. 6 is a flow chart for explaining an example of substrate processing by the substrate processing apparatus. FIG. 7A is a schematic diagram for explaining the state of the multiple guards when the substrate processing is being performed. FIG. 7B is a schematic diagram for explaining the state of the plurality of guards when the substrate processing is being performed. FIG. 8 is a flowchart for explaining a substrate processing according to a modified example. FIG. 9 is a schematic diagram for explaining the state of the plurality of guards when the substrate processing according to the modified example is being performed. FIG. 10A is a perspective view of an annular member according to a first modified example. FIG. 10B is a plan view of the annular member according to the first modified example. FIG. 11 is a plan view of an annular member according to a second modified example. FIG. 12A is a bottom view of an annular member according to a third modified example. FIG. 12B is a schematic diagram of a main part of the annular member according to the third modified example. FIG. 13 is a schematic view for explaining the configuration of a processing unit provided in a substrate processing apparatus according to the second embodiment.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.
<Configuration of Substrate Processing Apparatus According to First Embodiment>
FIG. 1 is a plan view for explaining an example of the configuration of a substrate processing apparatus 1 according to a first embodiment of the present invention.
The substrate processing apparatus 1 is a single-wafer processing apparatus that processes a single substrate W. In this embodiment, the substrate W has a disk shape. The substrate W is a substrate W such as a silicon wafer, and has a pair of main surfaces.

The substrate processing apparatus 1 includes a plurality of processing units 2 that process substrates W, a load port LP (container holding unit) on which carriers C (containers) that accommodate a plurality of substrates W to be processed in the processing units 2 are placed, transport robots (first transport robot IR and second transport robot CR) that transport substrates W between the load port LP and the processing units 2, and a controller 3 that controls each component included in the substrate processing apparatus 1.

The first transport robot IR transports substrates W between the carrier C and the second transport robot CR. The second transport robot CR transports substrates W between the first transport robot IR and the processing unit 2. Each transport robot is, for example, an articulated arm robot.
The processing units 2 are arranged on both sides of the transport path TR along which the substrates W are transported by the second transport robot CR, and are stacked in the vertical direction. The processing units 2 have, for example, the same configuration.

The processing units 2 form four processing towers TW arranged at four horizontally spaced positions. Each processing tower TW includes multiple processing units 2 stacked vertically. The four processing towers TW are arranged two on each side of a transport path TR extending from the load port LP toward the second transport robot CR.
The processing unit 2 has a chamber 4 that accommodates a substrate W during substrate processing. The chamber 4 includes an entrance/exit (not shown) through which the second transport robot CR loads the substrate W into the chamber 4 and unloads the substrate W from the chamber 4, and a shutter unit (not shown) that opens and closes the entrance. The processing liquid supplied to the substrate W in the chamber 4 includes a chemical liquid, a rinse liquid, etc., which will be described in detail later.

<Configuration of processing unit according to first embodiment>
FIG. 2 is a schematic diagram for explaining the configuration of the processing unit 2. As shown in FIG.
The processing unit 2 further includes a spin chuck 5 that rotates the substrate W about a rotation axis A1 while holding the substrate W in a predetermined processing posture, a plurality of processing liquid nozzles (a chemical liquid nozzle 30, an upper surface rinse liquid nozzle 31, and a lower surface rinse liquid nozzle 32) that discharge processing liquid toward the substrate W, and a processing cup 8 that receives processing liquid splashed from the substrate W held on the spin chuck 5. The spin chuck 5, the plurality of processing liquid nozzles, and the processing cup 8 are disposed in the chamber 4.

The rotation axis A1 passes through the center of the substrate W and is perpendicular to each main surface of the substrate W held in the processing position. The processing position is the position of the substrate W shown in FIG. 2, which is a horizontal position in which the main surface of the substrate W is a horizontal plane. When the processing position is horizontal, the rotation axis A1 extends vertically. The spin chuck 5 is an example of a substrate holding member that holds the substrate W in the processing position, and is also an example of a rotary holding member that rotates the substrate W around the rotation axis A1 while holding the substrate W in the processing position.

The spin chuck 5 includes a spin base 21 having a horizontally extending disk shape, a plurality of gripping pins 20 that grip the substrate W above the spin base 21 and grip the peripheral edge of the substrate W above the spin base 21, a rotation shaft 22 that is connected to the spin base 21 and extends vertically, a rotation drive mechanism 23 that rotates the rotation shaft 22 around its central axis (rotation axis A1), and a housing 24 that accommodates the rotation shaft 22 and the rotation drive mechanism 23. The spin base 21 is an example of a disk-shaped base.

The multiple gripping pins 20 are arranged on the upper surface of the spin base 21 at intervals around the circumference of the spin base 21. The rotation drive mechanism 23 includes an actuator such as an electric motor. The rotation drive mechanism 23 rotates the rotation shaft 22, causing the spin base 21 and the multiple gripping pins 20 to rotate around the rotation axis A1. As a result, the substrate W is rotated around the rotation axis A1 together with the spin base 21 and the multiple gripping pins 20.

The multiple gripping pins 20 are movable between a closed position in which they contact the peripheral edge of the substrate W to grip the substrate W, and an open position in which they release the grip on the substrate W. The multiple gripping pins 20 are moved by an opening/closing mechanism (not shown).
When positioned at the closed position, the multiple gripping pins 20 grip the peripheral edge of the substrate W to hold the substrate W horizontally. When positioned at the open position, the multiple gripping pins 20 release their grip on the substrate W while supporting the peripheral edge of the substrate W from below. The opening/closing mechanism includes, for example, a link mechanism and an actuator that applies a driving force to the link mechanism.

The multiple processing liquid nozzles further include a chemical liquid nozzle 30 that ejects a continuous flow of chemical liquid toward the upper surface (upper main surface) of the substrate W held on the spin chuck 5, an upper rinse liquid nozzle 31 that ejects a continuous flow of rinse liquid toward the upper surface of the substrate W held on the spin chuck 5, and a lower rinse liquid nozzle 32 that ejects a continuous flow of rinse liquid toward the lower surface (lower main surface) of the substrate W held on the spin chuck 5.

The chemical nozzle 30 is an example of a chemical supply unit that supplies a chemical to the substrate W held on the spin chuck 5. The chemical nozzle 30 is an example of an upper surface chemical supply member that supplies a processing liquid to the upper surface of the substrate W held on the spin chuck 5.
The upper rinse liquid nozzle 31 and the lower rinse liquid nozzle 32 are both examples of rinse liquid supply units that supply rinse liquid to the substrate W held on the spin chuck 5. The upper rinse liquid nozzle 31 is an example of an upper rinse liquid supply member that supplies rinse liquid to the upper surface of the substrate W held on the spin chuck 5. The lower rinse liquid nozzle 32 is an example of a lower rinse liquid supply member that supplies rinse liquid to the lower surface of the substrate W held on the spin chuck 5.

The chemical liquid nozzle 30 and the upper rinse liquid nozzle 31 are each moved in the horizontal direction by a plurality of nozzle moving mechanisms (a first nozzle moving mechanism 35 and a second nozzle moving mechanism 36).
Each nozzle moving mechanism can move the corresponding nozzle between a central position and a retracted position. The central position is a position where the nozzle faces a central region of the upper surface of the substrate W. The central region of the upper surface of the substrate W is a region on the upper surface of the substrate W that includes the center of rotation (central portion) and a portion surrounding the center of rotation. The retracted position is a position where the nozzle does not face the upper surface of the substrate W and is outside the processing cup 8.

Each nozzle movement mechanism includes an arm (not shown) that supports the corresponding nozzle, and an arm movement mechanism (not shown) that moves the corresponding arm in the horizontal direction. Each arm movement mechanism includes an actuator such as an electric motor or an air cylinder.
Unlike this embodiment, the chemical solution nozzle 30 and the upper surface rinse solution nozzle 31 may be configured to move integrally by a common nozzle movement mechanism. The chemical solution nozzle 30 and the upper surface rinse solution nozzle 31 may be rotary nozzles that rotate about a predetermined rotation axis, or may be linear nozzles that move linearly in the direction in which the corresponding arms extend. The chemical solution nozzle 30 and the upper surface rinse solution nozzle 31 may also be configured to be movable in the vertical direction.

The lower surface rinse liquid nozzle 32 is inserted, for example, into a through-hole formed in the center of the spin base 21 and into the hollow rotation shaft 22. The discharge port of the lower surface rinse liquid nozzle 32 faces, from below, a central region of the lower surface of the substrate W. The central region of the lower surface of the substrate W refers to a region on the lower surface of the substrate W that includes the rotation center (central portion) and a portion surrounding the rotation center.
The chemical solution discharged from the chemical solution nozzle 30 contains, for example, hydrogen peroxide (H ₂ O ₂ ), hydrofluoric acid (HF), dilute hydrofluoric acid (DHF), buffered hydrofluoric acid (BHF), hydrochloric acid (HCl), HPM solution (hydrochloric acid-hydrogen peroxide mixture), SPM solution (sulfuric acid/hydrogen peroxide mixture), ammonia water, TMAH solution (tetramethylammonium hydroxide solution), or APM solution (ammonia-hydrogen peroxide mixture).

The chemical liquid may be a liquid containing at least one of hydrogen peroxide solution, hydrofluoric acid, dilute hydrofluoric acid, buffered hydrofluoric acid, hydrochloric acid, HPM liquid, and SPM liquid. The chemical liquid may also be a liquid containing at least one of ammonia water, APM liquid, and TMAH liquid.
The rinse liquid discharged from the upper rinse liquid nozzle 31 and the lower rinse liquid nozzle 32 is, for example, water such as deionized water (DIW). However, the rinse liquid is not limited to DIW. The rinse liquid is not limited to DIW, and may be a liquid containing at least one of DIW, carbonated water, electrolytic ionized water, diluted hydrochloric acid water (for example, 1 ppm or more and 100 ppm or less), diluted ammonia water (for example, 1 ppm or more and 100 ppm or less), and reduced water (hydrogen water).

The chemical solution nozzle 30 is connected to a chemical solution pipe 40 that guides the chemical solution to the chemical solution nozzle 30. The chemical solution pipe 40 is provided with a chemical solution valve 50 that opens and closes the chemical solution pipe 40. "The chemical solution valve 50 is provided in the chemical solution pipe 40" may also mean that the chemical solution valve 50 is interposed in the chemical solution pipe 40. The same applies to the other valves described below.
The upper rinse liquid nozzle 31 is connected to an upper rinse liquid pipe 41 that guides the rinse liquid to the upper rinse liquid nozzle 31. The upper rinse liquid pipe 41 is provided with an upper rinse liquid valve 51 that opens and closes the upper rinse liquid pipe 41.

The lower rinse liquid nozzle 32 is connected to a lower rinse liquid pipe 42 that guides the rinse liquid to the lower rinse liquid nozzle 32. A lower rinse liquid valve 52 that opens and closes the lower rinse liquid pipe 42 is provided in the lower rinse liquid pipe 42.
Although not shown, chemical liquid valve 50 includes a valve body with a valve seat provided therein, a valve element that opens and closes the valve seat, and an actuator that moves the valve element between an open position and a closed position. Other valves have a similar configuration.

When the chemical liquid valve 50 is opened, a continuous flow of the chemical liquid is discharged from the chemical liquid nozzle 30. When the upper rinse liquid valve 51 is opened, a continuous flow of the rinse liquid is discharged from the upper rinse liquid nozzle 31. When the lower rinse liquid valve 52 is opened, a continuous flow of the rinse liquid is discharged from the lower rinse liquid nozzle 32.
The processing cup 8 includes a plurality of guards 25 that catch processing liquid splashed outward from the substrate W held on the spin chuck 5, a plurality of cups 26 that each catch the processing liquid guided downward by the plurality of guards 25, and a cylindrical outer wall member 27 that surrounds the plurality of guards 25 and the plurality of cups 26.

The multiple guards 25 include a cylindrical first guard 25A that surrounds the spin chuck 5 in a plan view, and a cylindrical second guard 25B that is positioned outside the first guard 25A and surrounds the spin chuck 5 in a plan view. The upper end of each guard 25 is inclined inward so as to be closer to the central axis of the guard 25 than the guard 25 itself. The first guard 25A is also referred to as the inner guard, and the second guard 25B is also referred to as the outer guard.

The cups 26 include a first cup 26A that receives the processing liquid guided downward by the first guard 25A and a second cup 26B that receives the processing liquid guided downward by the second guard 25B. Each cup 26 has the form of an annular groove that opens upward. The second cup 26B is integrally formed with the first guard 25A from a single material.
The guards 25 and the cups 26 are arranged coaxially. The central axes of the guards 25 and the cups 26 coincide with one another and with the rotation axis A1.

The first guard 25A includes a first cylindrical portion 60 that extends in the vertical direction and surrounds the spin chuck 5, a first annular portion 61 that extends from the first cylindrical portion 60 inward, and a first outer cylindrical portion 62 that is positioned outward from the first cylindrical portion 60 at a distance. "Inward of the first cylindrical portion 60" refers to both the central axis side of the first cylindrical portion 60 (radially inward) and the rotation axis A1 side. Conversely, "outward of the first cylindrical portion 60" refers to the opposite side of the central axis of the first cylindrical portion 60 (radially outward) and the opposite side of the rotation axis A1.

The upper end of the first cylindrical portion 60 is connected to the outer end of the first annular portion 61. The upper end of the first outer cylindrical portion 62 extends toward the center of the first cylindrical portion 60 and is connected to the upper end of the first cylindrical portion 60. The first cylindrical portion 60, the first annular portion 61, and the first outer cylindrical portion 62 are integrally formed from a single material.
The second guard 25B includes a second cylindrical portion 70 that extends in the vertical direction and surrounds the spin chuck 5, and a second annular portion 71 that extends from the second cylindrical portion 70 toward the inside of the second cylindrical portion 70 (toward the central axis of the second cylindrical portion).

The first cup 26A includes a first bottom wall 65, a cylindrical first inner wall 66 extending upward from the inner end of the first bottom wall 65, and a cylindrical first outer wall 67 extending upward from the outer end of the first bottom wall 65. The first outer wall 67 is located between the first cylindrical portion 60 and the first outer cylindrical portion 62. The first inner wall 66 engages with the housing 24.
The second cup 26B includes a second bottom wall 75, a cylindrical second inner wall 76 extending upward from the inner end of the second bottom wall 75, and a cylindrical second outer wall 77 extending upward from the outer end of the second bottom wall 75. The second cup 26B is integrally formed with the first guard 25A from a single material. The second inner wall 76 is connected to the first outer cylindrical portion 62.

The processing unit 2 further includes a plurality of guard drive mechanisms 28 (first guard drive mechanism 28A and second guard drive mechanism 28B) that individually raise and lower the plurality of guards.
Although the configuration of each guard drive mechanism 28 is not particularly limited, the guard drive mechanism 28 may include, for example, at least one of a cylinder mechanism, a ball screw mechanism, a linear motor mechanism, and a rack and pinion mechanism.

The guard drive mechanism 28 includes, for example, an actuator (not shown) such as a motor, and a lifting motion transmission mechanism (not shown) that is coupled to the corresponding guard and transmits the driving force applied from the actuator to the guard to lift and lower the guard. The lifting motion transmission mechanism includes, for example, a ball screw mechanism or a rack and pinion mechanism.
The processing unit 2 includes an air blowing unit 37 such as an FFU (fan filter unit) that cleans the outside air of the chamber 4 and sends it into the chamber 4, and an exhaust pipe 38 that exhausts, i.e., discharges, the atmosphere inside the chamber 4. The air blowing unit 37 is disposed on the upper wall of the chamber 4. The exhaust pipe 38 is connected to the outer wall member 27.

The exhaust pipe 38 is connected to an exhaust duct (not shown) that exhausts the atmosphere inside the chamber 4 via the exhaust pipe 38. The atmosphere inside the exhaust duct is sucked in by a suction device (not shown). The suction device includes a suction pump or the like that is provided midway or at the end of the exhaust duct and sucks the exhaust duct. The exhaust duct and suction device are provided in a clean room in which the substrate processing apparatus 1 is installed or in equipment associated with the clean room. The exhaust duct and suction device may be part of the substrate processing apparatus 1.

By the action of the blower unit 37 and the exhaust pipe 38, an air current F directed downward is formed in the space within the chamber 4. The air current F passes through the inside of the processing cup 8 and flows into the exhaust pipe 38.
The processing liquid supplied to the substrate W splashes from the peripheral edge of the substrate W and is received by one of the guards 25. The processing liquid received by the guard 25 is guided to the corresponding cup 26 and is collected or discarded by a drainage pipe (not shown) corresponding to each cup 26.

<Configuration of processing cup according to first embodiment>
3A and 3B are cross-sectional views of multiple guards 25 and their surroundings.
Referring to Figures 3A and 3B, the first annular portion 61 of the first guard 25A is inclined relative to the horizontal direction and includes a first inclined portion 80 extending diagonally upward toward the central axis of the first cylindrical portion 60, a first horizontal portion 81 extending horizontally from the inner end of the first inclined portion 80, and a first hanging portion 82 extending downward from the inner end of the first horizontal portion 81.

The second annular portion 71 of the second guard includes a second inclined portion 90 that is inclined relative to the horizontal direction and extends diagonally upward toward the central axis of the second cylindrical portion 70, a second horizontal portion 91 that extends horizontally from the inner end of the second inclined portion 90, and a second hanging portion 92 that extends downward from the inner end of the second inclined portion 90.
The second annular portion 71 faces the first annular portion 61 from above. The second annular portion 71 extends in parallel with the first annular portion 61.

The processing cup 8 further includes an annular member 100 that extends diagonally upward from the first cylindrical portion 60 below the first annular portion 61 and toward the inside of the first cylindrical portion 60. The annular member 100 includes a lower inclined portion 101 that extends diagonally upward from the first cylindrical portion 60 below the first annular portion 61 and toward the inside of the first cylindrical portion 60, a lower horizontal portion 102 that extends horizontally from the inner end of the lower inclined portion 101, and a lower hanging portion 103 that extends downward from the inner end of the lower horizontal portion 102. The annular member 100 extends from the first cylindrical portion 60 parallel to the first annular portion 61. The annular member 100 has an upper surface 100a that extends diagonally upward toward the central axis of the first cylindrical portion 60.

Figure 4A is a perspective view of the annular member 100. Figure 4B is a cross-sectional view taken along line IVB-IVB in Figure 2. Referring to Figures 4A and 4B, the annular member 100 has a plurality of notches 104 provided in the outer circumferential portion 100b of the annular member 100 (which is also the outer circumferential portion of the lower inclined portion 101) along the circumferential direction CD of the annular member 100. The annular member 100 includes a plurality of partitions 105 that separate the notches 104 from one another.

The outer peripheral portion 100b of the annular member 100 is an annular portion that includes the outer peripheral edge of the annular member 100 and a portion that is further inward than the outer peripheral edge. Conversely, the inner peripheral portion 100c of the annular member 100 is an annular portion that includes the inner peripheral edge of the annular member 100 and a portion that is further outward than the inner peripheral edge. The portion between the outer peripheral portion 100b and the inner peripheral portion 100c is called an intermediate portion.
The annular member 100 is not removable from the first guard 25A. The annular member 100 and the first guard 25A may be integrated together by any method. For example, the annular member 100 may be integrally molded with the first guard 25A using a single material. Alternatively, the annular member 100 may be integrated with the first guard 25A by welding, or by a mechanical connection such as screws, rivets, or press fit.

The outer end of the annular member 100 is connected to the first cylindrical portion 60 of the first guard 25A. Multiple notches 104 are provided at equal intervals along the circumferential direction CD. In the example shown in Figures 4A and 4B, the notches 104 are formed at six locations along the circumferential direction CD. As shown in Figure 4B, the width W1 of the partition portion 105 in the circumferential direction CD is greater than the width W2 of the notch 104 in the circumferential direction CD.

Referring again to Figure 3A, the notch 104 is an example of a passage-permitting portion that allows fluid (treatment liquid, vapor of the treatment liquid, mist of the treatment liquid) to pass from the upper space 110 between the annular member 100 and the first annular portion 61 to the lower space 111 below the annular member 100.
Each guard 25 is raised and lowered between a lower position and an upper position by a corresponding guard drive mechanism 28. Each guard 25 can be positioned in the lower position, the upper position, and positions between them.

The upper position of the first guard 25A is the position shown in Figure 3A, and the lower position of the first guard 25A is the position shown in Figure 3B. The position of the second guard 25B shown in Figures 3A and 3B is the upper position.
When the first guard 25A and the second guard 25B are both in the upper position, the processing liquid splashed from the substrate W is received by the first guard 25A. When the first guard 25A is in the lower position and the second guard 25B is in the upper position, the processing liquid splashed from the substrate W is received by the second guard 25B.

The upper position of each guard 25 is a position where the upper end (inner peripheral edge) of the guard 25 is located above the upper surface of the substrate W held by the spin chuck 5 in the processing attitude. The lower position of each guard 25 is a position where the upper end (inner peripheral edge) of the guard 25 is located below the upper surface of the substrate W held by the spin chuck 5 in the processing attitude.
The arrangement of the multiple guards 25 when the first guard 25A and the second guard 25B are in the upper position, i.e., the arrangement of the multiple guards 25 shown in Fig. 3A, is referred to as the "first arrangement." The arrangement of the multiple guards 25 when the first guard 25A is in the lower position and the second guard 25B is in the upper position, i.e., the arrangement of the multiple guards 25 shown in Fig. 3B, is referred to as the "second arrangement."

The annular member 100 is raised and lowered together with the first guard 25A by the first guard drive mechanism 28A. When the first guard 25A is in the upper position, the inner peripheral edge of the annular member 100 faces the spin base 21 from the side. Therefore, when the first guard 25A is in the upper position, the inner peripheral edge of the annular member 100 is located below the upper surface of the substrate W held by the spin chuck 5 in the processing position.

When the first guard 25A is in the upper position, it is more preferable that the inner peripheral edge of the annular member 100 be located at the same height as the upper surface 21a of the spin base 21, but the position of the inner peripheral edge of the annular member 100 may be lower than the upper surface 21a of the spin base 21. Specifically, when the first guard 25A is in the upper position, the inner peripheral edge of the annular member 100 may be lower than the upper surface 21a of the spin base 21 and face the spin base 21 from the side.

As shown in FIG. 3A, a radial airflow (radial airflow F3) is formed between the annular member 100 and the first annular portion 61, flowing toward the outer periphery 100b of the annular member 100. Furthermore, an outward airflow F1 flows downward between the first cylindrical portion 60 and the second cylindrical portion 70, and an inward airflow F2 flows from the upper space 110 to the lower space 111 through the gap G1 between the inner periphery of the annular member 100 and the spin base 21.

3B , a radial airflow (radial airflow F6) directed toward the first annular portion 61 is formed between the first annular portion 61 and the second annular portion 71. Furthermore, an outward airflow F4 directed from the upper space 110 toward the lower space 111 and an inward airflow F5 directed downward through the gap G2 between the inner peripheral edge of the first annular portion 61 and the spin base 21 are also formed.
Although not shown, when the first guard 25A and the second guard 25B are both in the lower position, the second transport robot CR can load and unload substrates W into and from the chamber 4.

<Electrical Configuration of Substrate Processing According to First Embodiment>
FIG. 5 is a block diagram for explaining the electrical configuration of the substrate processing apparatus 1. As shown in FIG.
The controller 3 includes a microcomputer and controls the control objects provided in the substrate processing apparatus 1 according to a predetermined control program.
Specifically, the controller 3 includes a processor 3A (CPU) and a memory 3B that stores a control program. The controller 3 is configured to perform various controls for substrate processing by the processor 3A executing the control program.

In particular, the controller 3 is programmed to control the first transport robot IR, the second transport robot CR, the rotation drive mechanism 23, the first nozzle moving mechanism 35, the second nozzle moving mechanism 36, the guard drive mechanism 28, the air blowing unit 37, the chemical liquid valve 50, the upper surface rinse liquid valve 51, the lower surface rinse liquid valve 52, etc.
The controller 3 controls the valves to control whether or not the fluid is discharged from the corresponding nozzle, and the flow rate of the fluid discharged from the corresponding nozzle.

The following steps are performed by the controller 3 controlling the components of the substrate processing apparatus 1. In other words, the controller 3 is programmed to perform the following steps.
5 illustrates representative components, but this does not mean that components not illustrated are not controlled by the controller 3, and the controller 3 can appropriately control each component included in the substrate processing apparatus 1. In FIG. 5, components described in each of the modified examples and the second embodiment, which will be described later, are also controlled by the controller 3.

<Example of substrate processing>
Fig. 6 is a flowchart illustrating an example of substrate processing performed by the substrate processing apparatus 1. Figs. 7A and 7B are schematic views illustrating the state of the multiple guards 25 when substrate processing is being performed. Fig. 6 mainly illustrates processing that is realized by the controller 3 executing a program.

In substrate processing using the substrate processing apparatus 1, for example, as shown in FIG. 6, the substrate loading step (step S1), chemical solution supply step (step S2), lower surface rinsing step (step S3), guard switching step (step S4), upper surface rinsing step (step S5), spin drying step (step S6), and substrate unloading step (step S7) are performed in this order. Below, details of the substrate processing will be described, primarily with reference to FIGS. 2 and 6. Reference will also be made to FIGS. 7A and 7B as appropriate.

First, an unprocessed substrate W is loaded from the carrier C into the processing unit 2 by the second transport robot CR (see Figure 1) and transferred to the spin chuck 5 (substrate loading process: step S1). This causes the substrate W to be held horizontally by the spin chuck 5 (substrate holding process). With the substrate W held by the spin chuck 5, the rotation drive mechanism 23 begins to rotate the substrate W (substrate rotation process). The substrate W continues to be held by the spin chuck 5 until the spin dry process (step S6) is completed. During substrate processing, an airflow F (see Figure 2) flowing from above to below is constantly generated within the chamber 4, and the airflow F passes through the inside of the processing cup 8 and flows into the exhaust pipe 38.

After the second transport robot CR retreats to the outside of the processing unit 2, a chemical supplying step (step S2) is performed to supply a chemical to the upper surface of the substrate W. Specifically, the guard drive mechanisms 28 change the arrangement of the guards 25 to the first arrangement. The first nozzle moving mechanism 35 moves the chemical nozzle 30 to the processing position. The processing position is, for example, the central position.
In this state, by opening the chemical valve 50, a continuous flow of the chemical is discharged (supplied) from the chemical nozzle 30 toward the upper surface of the substrate W (chemical discharge step, chemical supply step).

As shown in FIG. 7A, the chemical solution supplied to the upper surface of the substrate W moves toward the peripheral edge of the upper surface of the substrate W due to the centrifugal force of the rotation of the substrate W and spreads over the entire upper surface of the substrate W. This causes the upper surface of the substrate W to be treated with the chemical solution. The chemical solution on the upper surface of the substrate W splashes from the peripheral edge of the upper surface of the substrate W to outside the substrate W and is mainly received by the first cylindrical portion 60 and the annular member 100.

The plurality of notches 104 are provided on the outer circumferential portion 100b of the annular member 100. Therefore, the chemical solution received by the first cylindrical portion 60 passes through the annular member 100 via the plurality of notches 104 when it falls from the first cylindrical portion 60 or when it flows downward along the first cylindrical portion 60.
As described above, the annular member 100 extends obliquely upward from the first cylindrical portion 60 toward the inside of the first cylindrical portion 60. Therefore, the chemical solution adhering to the upper surface 100a of the annular member 100 flows toward the outer circumferential portion 100b of the annular member 100. The chemical solution that has flowed to the outer circumferential portion 100b of the annular member 100 passes through the annular member 100 via the plurality of cutouts 104. This prevents the chemical solution splashed from the substrate W from accumulating on the upper surface 100a of the annular member 100. The chemical solution that flows into the cutouts 104 falls and is received in the first cup 26A (see FIG. 2 ).

7A, during the chemical solution supplying step (step S2), the arrangement of the guards 25 is the first arrangement, so that an outward airflow F1 and an inward airflow F2 are formed.
After the chemical liquid supplying step (step S2), a lower surface rinsing step (step S3) is performed in which a rinsing liquid is supplied to the lower surface of the substrate W to clean the lower surface of the substrate W.

Specifically, the chemical liquid valve 50 is closed to stop the supply of the chemical liquid to the upper surface of the substrate W. Instead, the lower surface rinse liquid valve 52 is opened. This starts the supply of the rinse liquid from the lower surface rinse liquid nozzle 32 to the lower surface of the substrate W. The chemical liquid nozzle 30 is moved to the retracted position.
7B , the rinse liquid supplied to the lower surface of the substrate W moves toward the peripheral edge of the lower surface of the substrate W and spreads over the entire lower surface of the substrate W due to the centrifugal force of the rotation of the substrate W. This cleans the lower surface of the substrate W. Therefore, the chemical liquid that has adhered to the lower surface of the substrate W along the peripheral edge of the substrate W can be removed from the lower surface of the substrate W. The rinse liquid on the lower surface of the substrate W splashes from the peripheral edge of the upper surface of the substrate W and is mainly received by the first cylindrical portion 60 and the annular member 100.

The rinse liquid received by the first cylindrical portion 60 passes through the annular member 100 via the multiple notches 104 as it falls from the first cylindrical portion 60 or flows downward along the first cylindrical portion 60. The rinse liquid adhering to the annular member 100 flows along the annular member 100 toward the outer periphery 100b of the annular member 100. The rinse liquid that has flowed to the outer periphery 100b of the annular member 100 passes through the annular member 100 via the multiple notches 104. This prevents rinse liquid scattered from the substrate W from accumulating on the upper surface 100a of the annular member 100. The rinse liquid that flows into the notches 104 falls and is received in the first cup 26A (see Figure 2).

In the lower surface rinsing process (step S3), rinsing liquid is supplied from the lower surface rinsing liquid nozzle 32 toward the underside of the substrate W while the annular member 100 is laterally facing the spin base 21, i.e., while the annular member 100 is positioned sufficiently lower than the substrate W. As a result, at least a portion of the rinsing liquid splashed from the underside of the substrate W adheres to the upper surface 100a of the annular member 100. The rinsing liquid that has adhered to the upper surface 100a of the annular member 100 flows along the upper surface 100a toward the outer periphery of the annular member 100. This allows the annular member 100 to be cleaned and the rinsing liquid adhering to the annular member 100 to be removed.

The rinse liquid discharged from the substrate W collides with the multiple gripping pins 20. As a result, the rinse liquid spreads out in both the vertical and horizontal directions as it splashes. The rinse liquid splashing from the underside of the substrate W is prevented from splashing upward by the substrate W. Therefore, the direction in which the rinse liquid splashes from the underside of the substrate W is more downward than the direction in which the chemical liquid splashes from the top surface of the substrate W. Therefore, the rinse liquid splashing from the underside of the substrate W is more likely to adhere to the annular member 100, inside the first cylindrical portion 60, than the chemical liquid splashing from the top surface of the substrate W.

For this reason, the rinse liquid splashed from the underside of the substrate W is more likely to adhere to the inner periphery of the annular member 100 (inner peripheral portion 100c) than the chemical liquid splashed from the upper surface of the substrate W. This makes it possible to prevent the chemical liquid from remaining on the annular member 100. Furthermore, it is easier to clean the inner peripheral portion 100c of the annular member 100 than when a rinse liquid is supplied to the upper surface of the substrate W to clean the annular member 100. In other words, it is easier to clean the entire annular member 100 than when a rinse liquid is supplied to the upper surface of the substrate W to clean the annular member 100.

7B , even during the lower surface rinsing step (step S3), the arrangement of the multiple guards 25 is the first arrangement, so that the outer airflow F1 and the inner airflow F2 are formed even during the lower surface rinsing step (step S3).
After the lower surface rinsing step (step S3), a guard switching step (step S4) is performed in which the arrangement of the multiple guards 25 is switched from the first arrangement to the second arrangement.

Specifically, the lower surface rinse liquid valve 52 is closed to stop the supply of rinse liquid to the lower surface of the substrate W. Thereafter, the first guard 25A is moved to the lower position by the first guard drive mechanism 28A. Meanwhile, the second guard 25B is maintained in the upper position. This switches the arrangement of the multiple guards 25 to the second arrangement (the arrangement shown in FIG. 3B ).
After the guard switching step (step S4), an upper surface rinsing step (step S5) is performed in which a rinsing liquid is supplied to the upper surface of the substrate W to clean the upper surface of the substrate W.

Specifically, the second nozzle movement mechanism 36 moves the upper rinse liquid nozzle 31 to the processing position. The processing position is, for example, a position where the upper rinse liquid nozzle 31 faces the central region of the upper surface of the substrate W. By opening the upper rinse liquid valve 51 in this state, a continuous flow of rinse liquid is discharged (supplied) from the upper rinse liquid nozzle 31 toward the upper surface of the substrate W (upper rinse liquid discharge process, upper rinse liquid supply process).

The rinse liquid supplied to the upper surface of the substrate W moves toward the peripheral edge of the upper surface of the substrate W due to the centrifugal force of the rotation of the substrate W and spreads over the entire upper surface of the substrate W. The rinse liquid on the upper surface of the substrate W splashes from the peripheral edge of the upper surface of the substrate W to the outside of the substrate W. The rinse liquid splashed from the upper surface of the substrate W is mainly received by the second cylindrical portion 70 of the second guard 25B. The rinse liquid received by the second cylindrical portion 70 is guided downward by the second cylindrical portion 70 and received in the second cup 26B (see Figure 2). By performing the upper surface rinse process after the lower surface rinse process, the annular member 100 is cleaned prior to the upper surface rinse process, thereby reducing the amount of chemical liquid received by the second guard 25B.

In the upper surface rinsing process (step S5), for example, the rotation of the substrate W may be accelerated from a state in which the substrate W is rotated at a low speed (e.g., 10 rpm) to a high rotation speed (e.g., 1500 rpm), and then the rotation of the substrate W may be again reduced to a low rotation speed (e.g., 10 rpm).
Next, a spin dry process (step S6) is performed in which the substrate W is rotated at high speed to dry the upper surface of the substrate W. Specifically, the upper surface rinse liquid valve 51 is closed to stop the supply of the rinse liquid to the upper surface of the substrate W.

Then, the rotation drive mechanism 23 accelerates the rotation of the substrate W, rotating the substrate W at high speed (for example, 1500 rpm). As a result, a large centrifugal force acts on the rinse liquid adhering to the substrate W, causing the rinse liquid to be thrown off around the substrate W.
After the spin dry step (step S6), the rotation drive mechanism 23 stops the rotation of the substrate W. Thereafter, the second transport robot CR enters the processing unit 2, receives the processed substrate W from the spin chuck 5, and unloads it from the processing unit 2 (substrate unloading step: step S7). The substrate W is handed over from the second transport robot CR to the first transport robot IR, and is stored in the carrier C by the first transport robot IR.

<Summary of First Embodiment>
According to the first embodiment, the annular member 100, which protrudes inward from the first cylindrical portion 60 of the first guard 25A, is provided below the first annular portion 61 of the first guard 25A. The outer peripheral portion 100b of the annular member 100 is provided with a plurality of notches 104 that allow fluid to pass from above the annular member 100 to below the annular member 100. Therefore, below the first annular portion 61 of the first guard 25A, an outward airflow F1 can be formed via the plurality of notches 104, flowing from above the annular member 100 to below the annular member 100. This allows the atmosphere below the first annular portion 61 to be rectified, preventing stagnation of the atmosphere.

The cross-sectional area of the gap G1 between the multiple cutouts 104 and the inner peripheral edge of the annular member 100 and the spin base 21 is smaller than the cross-sectional area of the space below the first annular portion 61 when the annular member 100 is not provided. The linear velocity of the outer airflow F1 and the inner airflow F2 is higher than the linear velocity of the airflow generated below the first annular portion 61 when the annular member 100 is not provided. Linear velocity is the speed of gas per unit area. Therefore, the atmosphere below the first annular portion 61 can be rectified, preventing atmospheric stagnation.

The atmosphere flows into the upper space 110 from the inner peripheral portion 100c of the annular member 100 toward the outer peripheral portion 100b. Therefore, in the upper space 110, the atmosphere is particularly likely to stagnate near the outer peripheral portion 100b of the annular member 100. According to the first embodiment, the multiple cutouts 104 are provided on the outer peripheral portion 100b of the annular member 100. Therefore, stagnation of the atmosphere in the upper space 110 can be suppressed. This prevents chemical vapor and mist contained in the atmosphere from adhering to the substrate W, and suppresses the generation of particles on the substrate W.

The processing liquid supplied to the upper surface of the substrate W splashes off the substrate W. Multiple notches 104 are provided on the outer circumferential portion 100b of the annular member 100. Therefore, the processing liquid received by the first cylindrical portion 60 can pass through the annular member 100 via the multiple notches 104 as it falls from the first cylindrical portion 60 or as it flows downward along the first cylindrical portion 60. The processing liquid adhering to the annular member 100 flows along the annular member 100 toward the outer circumferential portion 100b of the annular member 100.

The processing liquid that has flowed to the outer periphery 100b of the annular member 100 passes through the annular member 100 via the multiple notches 104. This prevents processing liquid that has splashed from the substrate W from accumulating on the upper surface 100a of the annular member 100. Therefore, it is possible to prevent processing liquid from accumulating on the upper surface 100a of the annular member 100 due to the provision of the annular member 100 for rectifying the atmosphere.

According to the first embodiment, the annular member 100 is attached to the first guard 25A and moves up and down integrally with the first guard 25A. Therefore, there is no need to provide a drive mechanism for moving the annular member 100 up and down separately from the first guard drive mechanism 28A. This reduces the cost of the components required to move the multiple guards 25 and the annular member 100 up and down.
Because redeposition of the chemical onto the substrate W is likely to cause particles, it is particularly important to prevent stagnation of the chemical atmosphere in the upper space 110. Therefore, the particle prevention effect of the flow rectification action of the annular member 100 becomes more pronounced when the chemical is supplied to the substrate W.

Even after the supply of the chemical liquid to the substrate W is stopped, the chemical liquid atmosphere may remain in the upper space 110. Therefore, when a rinse liquid is supplied to the substrate W immediately after the chemical liquid supply step (step S2), i.e., in the lower surface rinse step (step S3), it is preferable to keep the arrangement of the multiple guards 25 in the first arrangement.
According to the first embodiment, the annular member 100 is formed with a plurality of notches 104 arranged along the circumferential direction CD. This reduces unevenness in the flow straightening action of the annular member 100 in the circumferential direction CD, and allows the chemical solution that flows along the annular member 100 and reaches the outer circumferential portion 100b of the annular member 100 to be efficiently discharged below the annular member 100.

According to the first embodiment, the plurality of notches 104 are provided at equal intervals along the circumferential direction CD. This further reduces unevenness in the flow straightening action of the annular member 100 in the circumferential direction CD. Furthermore, the chemical solution that flows along the upper surface 100a of the annular member 100 and reaches the outer circumferential portion 100b of the annular member 100 can be more efficiently discharged below the annular member 100.
According to the first embodiment, the outer peripheral edge of the annular member 100 is cut out at multiple locations along the circumferential direction CD. Therefore, there is no portion where the chemical solution can accumulate outside the multiple cutouts 104. Therefore, the chemical solution on the annular member 100 can be more efficiently discharged below the annular member 100.

According to the first embodiment, the annular member 100 protrudes from the first cylindrical portion 60 parallel to the first annular portion 61. If the annular member 100 is parallel to the first annular portion 61, the difference in speed between the radial airflow F3 near the inner peripheral portion 100c of the annular member 100 and the radial airflow F3 near the outer peripheral portion 100b of the annular member 100 can be reduced. This further reduces stagnation of the atmosphere below the first annular portion 61.

When the first guard 25A is in the upper position, the inner peripheral edge of the annular member 100 is located below the upper surface of the substrate W. Therefore, the upper surface of the substrate W can be located below the inner peripheral edge of the first annular portion 61 and above the inner peripheral edge of the annular member 100. This allows chemical liquid splashed from the upper surface of the substrate W to flow between the annular member 100 and the first annular portion 61. This promotes the formation of a radial airflow F3 that flows outward from the first cylindrical portion 60 between the annular member 100 and the first annular portion 61. Furthermore, promoting the formation of the radial airflow F3 reduces the splashing of chemical liquid from the annular member 100 and the first guard 25A.

According to the first embodiment, the inner peripheral edge of the annular member 100 faces the spin base 21 from the side when the first guard 25A is in the upper position. By facing the inner peripheral edge of the annular member 100 to the side of the spin base 21, the gap G1 between the spin base 21 and the annular member 100 can be reduced. This makes it possible to form an airflow (inner airflow F2) that flows downward through the gap between the spin base 21 and the annular member 100. This helps to streamline the atmosphere below the first annular portion 61.

However, unlike the first embodiment, if the cutout 104 is not provided in the outer circumferential portion 100b of the annular member 100, it is difficult to eliminate stagnation of the atmosphere near the outer circumferential portion 100b of the annular member 100. Therefore, even if the inward airflow F2 can be formed, the annular member 100 needs to be provided with the cutout 104.
According to the first embodiment, the exhaust pipe 38 exhausts the atmosphere in the upper space 110 through the plurality of cutouts 104. This forcibly forms the inward airflow F2 and the outward airflow F1. This allows the atmosphere to be rectified below the first annular portion 61, thereby preventing the atmosphere from stagnating.

<Substrate Processing According to Modification>
Fig. 8 is a flowchart illustrating the substrate processing according to the modified example. Fig. 9 is a schematic diagram illustrating the state of the plurality of guards 25 when the substrate processing according to the modified example is being performed.
In the substrate processing according to the modified example, after the chemical liquid supply step (step S2), a rinsing step (step S10) is performed to clean the upper surface of the substrate W as well as the lower surface of the substrate W while maintaining the arrangement of the multiple guards 25 in the first arrangement, as shown in Fig. 9. Specifically, after the supply of the chemical liquid to the upper surface of the substrate W is stopped, the supply of the rinsing liquid from the upper rinse liquid nozzle 31 and the supply of the rinsing liquid from the lower rinse liquid nozzle 32 are started. The rinsing liquid splashed from the substrate W is mainly received by the first cylindrical portion 60 and the annular member 100.

The rinse liquid received by the first cylindrical portion 60 passes through the annular member 100 via the multiple notches 104 as it falls from the first cylindrical portion 60 or flows downward along the first cylindrical portion 60. The rinse liquid adhering to the annular member 100 flows along the annular member 100 toward the outer periphery 100b of the annular member 100. The rinse liquid that has flowed to the outer periphery 100b of the annular member 100 passes through the annular member 100 via the multiple notches 104. This prevents rinse liquid scattered from the substrate W from accumulating on the upper surface 100a of the annular member 100. The rinse liquid that flows into the notches 104 falls and is received in the first cup 26A (see Figure 2).

In the rinsing process (step S10), rinse liquid is supplied to both the upper and lower surfaces of the substrate W while the annular member 100 is laterally facing the spin base 21, i.e., while the annular member 100 is positioned sufficiently lower than the substrate W. As a result, at least a portion of the rinse liquid splashing from the upper and lower surfaces of the substrate W adheres to the upper surface 100a of the annular member 100. The rinse liquid adhering to the upper surface 100a of the annular member 100 flows along the upper surface 100a toward the outer periphery of the annular member 100. This allows the annular member 100 to be cleaned and the rinse liquid adhering to the annular member 100 to be removed.

As described above, the rinse liquid splashed from the underside of the substrate W is more likely to adhere to the annular member 100 inside the first cylindrical portion 60 than the rinse liquid splashed from the upper surface of the substrate W. Therefore, it is easier to clean the inner peripheral edge of the annular member 100 compared to when the rinse liquid is supplied to the upper surface of the substrate W to clean the annular member 100. In other words, it is easier to clean the entire annular member 100 compared to when the rinse liquid is supplied only to the upper surface of the substrate W to clean the annular member 100.

Thereafter, the guard switching step (step S4) is performed. After the guard switching step (step S4), the spin drying step (step S6) is performed. The upper surface rinsing step (step S5) is omitted.
According to the substrate processing of the modified example, it is possible to simultaneously clean the upper and lower surfaces of the substrate W. Therefore, the time required for substrate processing can be shortened compared to the case where the lower surface rinsing step (step S3) is performed after the chemical liquid supplying step (step S2) and the upper surface rinsing step (step S5) is performed after the guard switching step (step S4).

<Annular member according to modified example>
The configurations of the annular member 100 according to the first to third modified examples will be described below.
Fig. 10A is a perspective view of an annular member 100 according to a first modified example. Fig. 10B is a plan view of the annular member 100 according to the first modified example.
In the annular member 100 according to the first modification, the notches 104 are formed at 24 locations along the circumferential direction CD. The width W1 of the partition portion 105 in the circumferential direction CD is smaller than the width W2 of the notch 104 in the circumferential direction CD.

The number of locations where the notches 104 are provided is not limited to six or 24; it is sufficient that the notches 104 are provided in at least one location on the outer periphery of the annular member 100. Furthermore, if the notches 104 are provided in two or more locations, unevenness in the flow regulation in the circumferential direction CD can be reduced, and the chemical liquid that flows along the annular member 100 and reaches the outer periphery 100b of the annular member 100 can be efficiently discharged below the annular member 100.

The annular member 100 shown in Figures 10A and 10B has a larger area (opening area) of the notch 104 in plan view than the annular member 100 shown in Figures 4A and 4B. The drainage efficiency of the annular member 100 shown in Figures 10A and 10B is higher than that of the annular member 100 shown in Figures 4A and 4B. Therefore, less processing liquid splashes onto the peripheral edge of the substrate W than with the annular member 100 shown in Figures 4A and 4B, further reducing the occurrence of substrate defects and other problems. Furthermore, because the opening area is large, the amount of processing liquid remaining on the outer periphery 100b of the annular member 100 can be kept low, making it less likely to become a particle source (particle accumulation).

Figure 11 is a plan view of an annular member 100 according to a second modified example. As shown in Figure 11, a plurality of through holes 106 may be formed in the outer peripheral portion 100b of the annular member 100 instead of a plurality of cutouts 104. When through holes 106 are formed, the peripheral portion 106a of the through holes 106 is located outside the through holes 106. Therefore, as shown in Figures 4A and 4B, a configuration with cutouts 104 can prevent the accumulation of chemical solution on the upper surface 100a of the annular member 100.

Fig. 12A is a bottom view of the annular member 100 according to the third modified example. Fig. 12B is a schematic view of a main part of the annular member 100 according to the third modified example. As shown in Figs. 12A and 12B, the annular member 100 may be detachable from the first guard 25A.
Specifically, the processing cup 8 includes the fastening members 120 by fastening the annular member 100 to the first guard 25A. The multiple fastening members 120 are arranged at equal intervals in the circumferential direction CD.

The fastening member 120 includes a bolt 121 and a nut 122 attached to the bolt shank 121a. A washer (not shown) may be provided between the bolt head 121b and the first cylindrical portion 60. The annular member 100 includes a plurality of fixing portions 107 that extend downward from the outer circumferential end of the lower inclined portion 101 and are fixed to the first cylindrical portion 60 by the fastening member 120.

The number of fastening members 120 provided is the same as the number of fixing portions 107. The fixing portions 107 extend downward from the partition portions 105. Fixing portions 107 are provided on all partition portions 105. Fixing portions 107 do not necessarily have to be provided on all partition portions 105; the number of fixing portions 107 can be any number as long as they can fix the annular member 100 to the first guard 25A.

The annular member 100 has an accommodating recess 108 provided in each fixing portion 107 and accommodating a corresponding nut 122, a mounting surface 108a which forms the bottom of the accommodating recess 108 and on which the nut 122 is placed, and a first insertion hole 108b which passes through the mounting surface 108a and into which the bolt shank 121a is inserted. The number of fixing portions 107 is the same as the number of fastening members 120. The nuts 122 are accommodated in the accommodating recess 108 so as not to rotate.

The first cylindrical portion 60 has second insertion holes 61a, the number of which is the same as that of the first insertion holes 108b, provided at positions overlapping with the first insertion holes 108b, and into which the bolt shanks 121a are inserted.
By rotating the bolt head 121b in the tightening direction, the annular member 100 can be fixed (attached) to the first guard 25A. Conversely, by rotating the bolt head 121b in the loosening direction, the annular member 100 can be released from the first guard 25A. By releasing all of the fastening members 120, the annular member 100 can be removed from the first guard 25A.

In this way, if the annular member 100 is detachable from the first guard 25A, it can be replaced with an annular member 100 that is suitable for the substrate processing being performed. Specifically, the size of the notch 104 can be changed depending on the exhaust flow rate during substrate processing, and the material of the annular member 100 can be changed depending on the type of chemical used in substrate processing.

<Substrate Processing Apparatus According to Second Embodiment>
13 is a schematic diagram for explaining the configuration of a processing unit 2 provided in a substrate processing apparatus 1A according to the second embodiment. In FIG. 13, components equivalent to those shown in the aforementioned FIGS. 1 to 12B are given the same reference numerals as in FIG. 1, and their description will be omitted.
The main difference between the processing unit 2 of the second embodiment and the processing unit 2 of the first embodiment is that the processing cup 8 of the second embodiment further includes a cylindrical third guard 25C that is positioned outside the second guard 25B and surrounds the spin chuck 5, and a third cup 26C that receives the processing liquid guided downward by the third guard 25C.

The third guard 25C includes a third cylindrical portion 130 that extends in the vertical direction and surrounds the spin chuck 5, and a third annular portion 131 that extends from the third cylindrical portion 130 toward the inside of the third cylindrical portion 130 (toward the central axis of the third cylindrical portion 130).
The second guard 25B further includes a second outer cylindrical portion 72 disposed outwardly of and spaced apart from the second cylindrical portion 70. The upper end of the second cylindrical portion 70 is connected to the outer end of the second annular portion 71. The upper end of the second outer cylindrical portion 72 extends inwardly of the second cylindrical portion 70 and is connected to the upper end of the second cylindrical portion 70.

The third cup 26C includes a third bottom wall 135, a cylindrical third inner wall 136 extending upward from the inner end of the third bottom wall 135, and a cylindrical third outer wall 137 extending upward from the outer end of the third bottom wall 135. The third cup 26C is integrally formed with the second guard 25B from a single material. The third inner wall 136 is connected to the second outer cylindrical portion 72.
According to the second embodiment, the same effects as those of the first embodiment can be achieved. The above-described modifications (FIGS. 8 to 12B) can also be applied to the second embodiment.

<Other embodiments>
The present invention is not limited to the above-described embodiment, and can be embodied in other forms.
(1) For example, unlike the above-described embodiments, only the first guard 25A may be provided, instead of multiple guards 25. Furthermore, four or more guards 25 may be provided. The same number of cups 26 as the number of guards 25 may be provided.

(2) The configuration of each guard 25 is not limited to that described above. For example, the diameter of the first cylindrical portion 60 of the first guard 25A does not need to be uniform, and may vary in the vertical direction. The first guard 25A may have a portion that extends diagonally upward from the first cylindrical portion 60 toward the outside of the first cylindrical portion 60, or a portion that extends diagonally upward from the first cylindrical portion 60 toward the inside of the first cylindrical portion 60. Furthermore, the first guard 25A may not be provided with the first hanging portion 82 or the first horizontal portion 81. The same applies to the other guards 25. The annular member 100 may also not be provided with the lower hanging portion 103 or the lower horizontal portion 102.

(3) In each of the above-described embodiments, the spin chuck 5 is a gripping-type spin chuck 5 that grips the periphery of the substrate W with multiple gripping pins 20, but the spin chuck 5 is not limited to a gripping-type spin chuck 5. For example, the spin chuck 5 may be a vacuum suction-type spin chuck 5 that adsorbs the substrate W to the spin base 21. Furthermore, the substrate holding member does not necessarily need to rotate the substrate W, as long as it is configured to hold the substrate W in a processing position (for example, a horizontal position).

(4) In each of the above-described embodiments, when the first guard 25A is in the upper position, the inner peripheral edge of the annular member 100 faces the spin base 21 from the side. However, when the first guard 25A is in the upper position, the inner peripheral edge of the annular member 100 may be located higher than the upper surface 21a of the spin base 21. For example, when the first guard 25A is in the upper position, the inner peripheral edge of the annular member 100 may be located at the same height as the upper surface of the substrate W, or at a height between the upper surface of the substrate W and the spin base 21.

(5) In each of the above-described embodiments, the processing liquid is configured to be ejected from multiple nozzles. However, unlike the above-described embodiments, the processing liquid may be ejected toward the upper surface of the substrate W from a fixed nozzle whose position in the horizontal direction is fixed, or multiple processing liquids may be ejected from a single nozzle. Furthermore, the chemical liquid supply member, upper surface rinse liquid supply member, and lower surface rinse liquid supply member do not need to have the form of a nozzle, and may be configured in a form other than a nozzle as long as they are members provided with an ejection port for ejecting liquid.

(6) Also, unlike the above-described embodiments, a lower chemical nozzle may be provided to supply chemical liquid to the lower surface of the substrate W, and the lower surface of the substrate W may be treated with chemical liquid during substrate processing. The lower chemical nozzle is an example of a chemical liquid supply unit. Both the chemical liquid nozzle 30 (upper chemical liquid nozzle) and the lower chemical liquid nozzle may be provided, in which case the upper chemical liquid nozzle and the lower chemical liquid nozzle constitute a chemical liquid supply unit.

(7) Furthermore, the substrate processing is not limited to those shown in Figures 6 and 8. For example, the lower surface rinsing step may be omitted from the substrate processing of Figure 6. If a lower surface chemical nozzle is provided instead of the chemical nozzle 30, the chemical solution is supplied to the lower surface of the substrate W in the chemical solution supplying step.
(8) Unlike the above-described embodiments, a shielding plate (not shown) may be provided that faces the upper surface of the substrate W from above and has a circular shape that is the same size as the substrate W in a plan view. The shielding plate is disposed in a position close to the upper surface of the substrate W, thereby suppressing the inflow of airflow between the upper surface of the substrate W and the shielding plate.

(9) In each of the above-described embodiments, the controller 3 controls the entire substrate processing apparatus 1. However, the controllers that control the components of the substrate processing apparatus 1 may be distributed across multiple locations.
(10) In the above-described embodiments, the substrate processing apparatus 1, 1A includes transport robots (first transport robot IR and second transport robot CR), multiple processing units 2, and a controller 3. However, the substrate processing apparatus 1, 1A may be configured with a single processing unit 2 and a controller 3 and may not include a transport robot. Alternatively, the substrate processing apparatus 1, 1A may be configured with only a single processing unit 2. In other words, the processing unit 2 may be an example of the substrate processing apparatus.

(11) In the above embodiment, expressions such as "along,""horizontal,""vertical," and "cylindrical" are used, but they do not necessarily have to be "along,""horizontal,""vertical," and "cylindrical" in a strict sense. In other words, these expressions allow for deviations in manufacturing precision, installation precision, and the like.
(12) Although each component may be shown as a schematic block, the shape, size, and positional relationship of each block do not represent the shape, size, and positional relationship of each component.

Various other modifications may be made within the scope of the claims.

1: Substrate processing apparatus 1A: Substrate processing apparatus 5: Spin chuck (substrate holding member)
20: Grip pin 21: Spin base (base)
25A: First guard 25B: Second guard 25C: Third guard 28A: First guard drive mechanism (guard drive mechanism)
30: Chemical nozzle (chemical supply unit, upper chemical supply member)
31: Upper surface rinse liquid nozzle 32: Lower surface rinse liquid nozzle (lower surface rinse liquid supply member)
38: Discharge pipe 60: First cylindrical portion (cylindrical portion)
61: First annular portion (annular portion)
100: Annular member 100b: Outer periphery 104: Notch (passage permitting portion)
106: Through hole (passage allowance portion)
110: Upper space (space between the annular member and the annular portion)
W: substrate

Claims (12)

a substrate holding member that holds the substrate horizontally;
a chemical liquid supply unit that supplies a chemical liquid to the substrate held by the substrate holding member;
a cylindrical first guard surrounding the substrate holding member, the first guard having a cylindrical portion and an annular portion extending inward from the cylindrical portion;
an annular member that is below the annular portion and extends obliquely upward from the cylindrical portion toward the inside of the cylindrical portion , the annular member being detachable from the first guard ;
a fastening member that fixes the annular member to the cylindrical portion ,
the annular member includes a fixing portion fixed to the cylindrical portion by the fastening member,
the annular member has at least one passage allowing portion on an outer circumferential portion of the annular member that allows a fluid to pass from above the annular member to below the annular member,
The fastening member is capable of fixing the annular member to the first guard and releasing the fixing of the annular member to the first guard . The substrate processing apparatus of claim 1, wherein the annular member has a plurality of the passage-permitting portions arranged along the circumferential direction of the annular member. The substrate processing apparatus of claim 2, wherein multiple passage permitting portions are provided at equal intervals along the circumferential direction. The substrate processing apparatus of any one of claims 1 to 3, wherein the passage-permitting portion includes a notch that cuts out the outer periphery of the annular member. The substrate processing apparatus of any one of claims 1 to 4, wherein the passage-permitting portion includes a through-hole that penetrates the outer periphery of the annular member. The substrate processing apparatus of any one of claims 1 to 5, wherein the annular member protrudes from the cylindrical portion parallel to the annular portion. the chemical solution supply unit includes an upper surface chemical solution supply member that supplies a chemical solution to an upper surface of the substrate held by the substrate holding member,
a guard drive mechanism that raises and lowers the first guard together with the annular member between a lower position where an inner peripheral edge of the annular portion is positioned below an upper surface of the substrate held by the substrate holding member and an upper position where the inner peripheral edge of the annular portion is positioned above an upper surface of the substrate held by the substrate holding member,
7. The substrate processing apparatus according to claim 1 , wherein an inner peripheral edge of the annular member is positioned below an upper surface of the substrate held by the substrate holding member when the first guard is positioned at the upper position. the substrate holding member includes a disk-shaped base and a plurality of gripping pins that grip a peripheral edge portion of the substrate above the base,
The substrate processing apparatus according to claim 7 , wherein an inner peripheral edge of the annular member laterally faces the base when the first guard is located at the upper position. The substrate processing apparatus according to claim 8 , further comprising a lower surface rinse liquid supply member that supplies a rinse liquid to a lower surface of the substrate held by the substrate holding member. The substrate processing apparatus according to claim 1 , further comprising an exhaust pipe that exhausts the atmosphere in the annular portion and the space between the annular members via the passage permitting portion. The substrate processing apparatus according to claim 1 , further comprising a cylindrical second guard disposed outside the first guard and surrounding the substrate holding member. The substrate processing apparatus according to claim 11 , further comprising a cylindrical third guard disposed outside the second guard and surrounding the substrate holding member.