JP7731709B2 - Information Exchange System - Google Patents

Description

The present invention relates to an information exchange system that exchanges information between processing equipment and inspection equipment.

Wafer surfaces are divided into multiple ICs, LSIs, and other devices along planned division lines. These are then separated into individual device chips by a dicing machine and used in electrical devices such as mobile phones and personal computers.

The dicing device comprises at least a holding means for holding the workpiece, a cutting means for cutting the workpiece held by the holding means, an X-axis processing feed means for relatively feeding the holding means and the cutting means in the X-axis direction, a Y-axis processing feed means for relatively feeding the holding means and the cutting means in the Y-axis direction perpendicular to the X-axis direction, and a processing control means, and is capable of dividing the wafer into individual device chips with high precision (see, for example, Patent Document 1).

Japanese Patent Application Laid-Open No. 2001-50214

When processing wafers using the above-mentioned dicing machine, high processing precision is required, and it is necessary to regularly inspect whether the processing quality of the dicing machine is being maintained appropriately. The wafer is attached to a frame equipped with an opening for accommodating the wafer via adhesive tape, and even after the wafer is separated into individual device chips, the shape of the wafer is maintained by the adhesive tape and frame, and it is transported to the inspection process carried out in the inspection machine.

In this inspection process, the wafer, which has been divided into individual device chips as the object to be inspected, is imaged by an inspection means to check for chipping along the cut division lines, whether the cut grooves are properly formed along the planned division lines, and whether the devices are contaminated.

However, although processing information generated when cutting a wafer, including the load current value of the processing feed means, the load current value of the cutting means, the amount of cutting water, abnormal sounds, and the processing sequence, is stored in the processing control means of the dicing device, this processing information is not fully reflected in the inspection device that performs the inspection process, and there is a problem in that this processing information cannot be properly utilized in the inspection process.

The present invention was developed in light of the above facts, and its main technical objective is to provide an information exchange system that can effectively utilize processing information in inspections performed by inspection equipment.

In order to solve the above-mentioned main technical problem, according to the present invention, there is provided an information exchange system for exchanging information between a processing device and an inspection device, wherein the processing device comprises at least workpiece holding means for holding a workpiece, processing means for processing the workpiece held by the workpiece holding means, X-axis processing feed means for relatively processing-feeding the workpiece holding means and the processing means in the X-axis direction, Y-axis processing feed means for relatively processing-feeding the workpiece holding means and the processing means in the Y-axis direction perpendicular to the X-axis direction, and processing control means, and the inspection device comprises inspection object holding means for holding an inspection object processed by the processing device, inspection means for imaging the inspection object held by the inspection object holding means to inspect the processing state, and inspection feed means for relatively processing the inspection object holding means and the inspection means in the X-axis direction. an X-axis inspection feed means for feeding the object to be inspected relative to the object to be inspected in the Y-axis direction perpendicular to the X-axis direction; a Y-axis inspection feed means for feeding the object to be inspected and the inspection means relatively in the Y-axis direction perpendicular to the X-axis direction; and an inspection control means, wherein the processing control means specifies the area to be processed on the workpiece by X-coordinates and Y-coordinates, and includes an information storage unit for storing processing information obtained by processing by the X-coordinates and Y-coordinates, and the inspection control means extracts processing information corresponding to the X-coordinates and Y-coordinates of the object to be inspected imaged by the inspection means from the processing control means, and the inspection control means includes an image storage unit for storing the image of the object to be inspected imaged by the inspection means by the X-coordinates and Y-coordinates, and the processing control means extracts the image corresponding to the processing information specified by the X-coordinates and Y-coordinates from the image storage unit of the inspection control means.

The processing control means may include a processing address conversion unit that converts X and Y coordinates into addresses, and the inspection control means may include an inspection address conversion unit that converts X and Y coordinates into addresses, so that addresses can be used instead of X and Y coordinates.

The workpiece is a wafer with multiple devices formed on its surface, partitioned by planned division lines. The wafer is supported via tape on a frame with an opening for accommodating the wafer. The processing means is a cutting means equipped with a rotatable cutting blade, and the processing performed on the wafer may be cutting along the planned division lines. X and Y coordinates may be set for each planned division line, or the X and Y coordinates may be converted into addresses. Furthermore, an ID may be associated with the workpiece, and information including the processing device that processed the workpiece, the date and time of processing, the processing location, the inspection device that inspected the object, the inspection date and time, and the inspection location may be identified by the ID.

The information exchange system of the present invention is an information exchange system for exchanging information between a processing device and an inspection device, wherein the processing device comprises at least workpiece holding means for holding a workpiece, processing means for processing the workpiece held by the workpiece holding means, X-axis processing feed means for relatively processing-feeding the workpiece holding means and the processing means in the X-axis direction, Y-axis processing feed means for relatively processing-feeding the workpiece holding means and the processing means in the Y-axis direction perpendicular to the X-axis direction, and processing control means, and the inspection device comprises inspection object holding means for holding an inspection object processed by the processing device, inspection means for imaging the inspection object held by the inspection object holding means and inspecting the processing state, X-axis inspection feed means for relatively inspecting-feeding the inspection object holding means and the inspection means in the X-axis direction, and the inspection object holding means. The inspection control device is provided with at least a Y-axis inspection feed means for relatively inspecting and feeding the step and the inspection means in the Y-axis direction perpendicular to the X-axis direction, and an inspection control means, wherein the processing control means specifies the area to be processed on the workpiece by X-coordinates and Y-coordinates, and includes an information storage unit for storing processing information obtained by processing by the X-coordinates and Y-coordinates, and the inspection control means extracts processing information corresponding to the X-coordinates and Y-coordinates of the object to be inspected imaged by the inspection means from the processing control means, and the inspection control means includes an image storage unit for storing the image of the object to be inspected imaged by the inspection means by the X-coordinates and Y-coordinates, and the processing control means extracts the image corresponding to the processing information specified by the X-coordinates and Y-coordinates from the image storage unit of the inspection control means, so that the processing information corresponding to the area imaged by the inspection device can be utilized.

1 is a perspective view of a dicing device and an inspection device in which the information exchange system of this embodiment is implemented. FIG. 2 is a perspective view of a wafer as a workpiece. FIG. 2 is a perspective view showing a state in which cutting is performed in a dicing device. 10 is a conceptual diagram showing an outline of processing information stored in an information storage unit of a processing control means of a dicing device. FIG. FIG. 2 is a perspective view showing an aspect in which an inspection is performed in the inspection device.

An embodiment of an information exchange system configured based on the present invention will be described in detail below with reference to the accompanying drawings.

Figure 1 shows a dicing device 2 arranged as a processing device that constitutes the information exchange system of this embodiment, and an inspection device 3 that inspects the test pieces processed by the dicing device 2.

The dicing device 2 shown in the upper part of Figure 1 has a roughly rectangular parallelepiped device housing 20 and is configured to include a chuck table 21 arranged as a workpiece holding means for holding a wafer 10, which is the workpiece, and cutting means 22, which is a processing means for cutting the wafer 10 held on the chuck table 21.

Although not shown, the interior of the device housing 20 is provided with an X-axis machining feed means that relatively feeds the chuck table 21 and cutting means 22 in the X-axis direction indicated by the arrow X in the figure, and a Y-axis machining feed means that relatively feeds the chuck table 21 and cutting means 22 in the Y-axis direction indicated by the arrow Y in the figure, which is perpendicular to the X-axis direction.

The dicing device 2 further includes a cassette 23 (shown by a two-dot chain line) that stores multiple wafers 10, a temporary storage table 24 that carries out and temporarily stores the wafers 10 stored in the cassette 23, a carrying-in/out means 25 that carries out the wafers 10 to the temporary storage table 24, a transport means 26 that rotates and transports the wafers 10 carried out to the temporary storage table 24 onto the chuck table 21, and a cleaning means 27 (details omitted) that cleans the wafers 10 that have been cut by the cutting means 22. The dicing device 2 is provided with a wafer 10 conveying means 27 for conveying the cut wafer 10 from the chuck table 21 to the cleaning means 27, an imaging means 29 for imaging the wafer 10 on the chuck table 21, a processing control means 100 for controlling each operating part of the dicing device 2, and a display means M1 having a touch panel function for displaying the processing conditions performed by the dicing device 2 and images captured by the imaging means 29 and for inputting desired processing conditions by touch operation. When the wafer 10 is conveyed out of the cassette 23 by the conveying in/out means 25, the height of the cassette 23 is appropriately adjusted by an elevating means (not shown). In addition, although not shown, the dicing device 2 is equipped with an X-coordinate position detection sensor that identifies the position of the chuck table 21 in the X-axis direction, a Y-coordinate position detection sensor that identifies the position in the Y-axis direction, and a circumferential position sensor that identifies the angular position in the rotational direction. These make it possible to accurately identify the X- and Y-coordinates of the chuck table 21 imaged by the imaging means 19, and to accurately position the cutting means 22 at the desired X- and Y-coordinate positions on the wafer 10.

The cutting means 22 is provided with a cutting water supply nozzle 22a that supplies pure cutting water to the cutting area when cutting the wafer 10 held by suction on the chuck table 21. The cutting water supplied from the cutting water supply nozzle 22a is collected through an appropriate collection path, filtered by a filtration device, and either reused or discharged to the outside. The processing control means 100 shown in Figure 1 is composed of a computer, and although it is shown outside the device housing 20 for convenience of explanation, it is actually housed inside the device housing 20. The processing control means 100 is also provided with an information storage unit 110 and a processing address conversion unit 120. The information storage unit 110 stores processing information such as the load current value when the X-axis processing feed means is operated by the electric motor when processing the wafer 10, the load current value of the electric motor that rotates the cutting blade of the cutting means 22, the amount of cutting water supplied from the cutting water supply nozzle 22a, the processing sound during cutting processing, and the processing order, in association with the X and Y coordinates of the wafer 10 to be cut. The processing address conversion unit 120 will be explained later.

The inspection device 3 shown at the bottom of Figure 1 includes an inspection object holding means 32 that holds the wafer 10 that has been processed by the dicing device 2, which is the processing device of this embodiment, and is now the inspection object; an inspection means 36 that takes an image of the wafer 10 held by the inspection object holding means 32 and inspects the wafer 10; a moving means 33 that moves the inspection object holding means 32 and the inspection means 36 relative to one another; and an inspection control means 200 that controls the inspection of the inspection object in the inspection device 3.

The specimen holding means 32 comprises a rectangular X-axis movable plate 32a mounted on the base 3a for movement in the X-axis direction; a rectangular Y-axis movable plate 32b mounted for movement in the Y-axis direction along guide rails 32c, 32c on the X-axis movable plate 32a; a cylindrical support 32d fixed to the upper surface of the Y-axis movable plate 32b; a rectangular cover plate 32e fixed to the upper end of the support 32d; a circular chuck table 32f extending upward through an elongated hole formed in the cover plate 32e; and clamps 32g evenly spaced around the periphery of the chuck table 32f. The chuck table 32f is rotatable by a rotary drive means (not shown). The upper surface of the chuck table 32f is made of a porous material with air permeability and is connected to a suction means (not shown) via a flow path passing through the support 32d.

The moving means 33 includes an X-axis inspection feed means 34 that relatively feeds the object to be inspected in the X-axis direction, and a Y-axis inspection feed means 35 that relatively feeds the object to be inspected holding means 32 and the inspection means 36 in the Y-axis direction, which is perpendicular to the X-axis direction. The X-axis inspection feed means 34 includes a ball screw 342 extending in the X-axis direction on the base 3a, and a motor 341 connected to one end of the ball screw 342. A nut portion (not shown) of the ball screw 342 is formed on the underside of the X-axis movable plate 32a. The X-axis inspection feed means 34 converts the rotational motion of the motor 341 into linear motion using the ball screw 342 and transmits it to the X-axis movable plate 32a, moving the X-axis movable plate 32a back and forth in the X-axis direction along the guide rails 3b, 3b on the base 3a. The Y-axis moving means 35 has a ball screw 352 extending in the Y-axis direction on the X-axis movable plate 32a, and a motor 351 connected to one end of the ball screw 352. A nut portion (not shown) of the ball screw 352 is formed on the underside of the Y-axis movable plate 32b. The Y-axis inspection feed means 35 converts the rotational motion of the motor 351 into linear motion using the ball screw 352 and transmits it to the Y-axis movable plate 32b, moving the Y-axis movable plate 32b back and forth in the Y-axis direction along the guide rails 32c, 32c on the X-axis movable plate 32a.

Although not shown in the figure, the inspection device 3 is equipped with an X-coordinate position detection sensor that identifies the position of the chuck table 32f in the X-axis direction, a Y-coordinate position detection sensor that identifies the position in the Y-axis direction, and a circumferential position sensor that identifies the angular position in the rotational direction, allowing the X-coordinate and Y-coordinate of a predetermined position on the wafer 10 imaged by the inspection means 36 to be accurately determined.

At the rear of the inspection object holding means 32, a vertical wall 3c extends upward from the top surface of the base 3a, and a horizontal wall 3d extends horizontally from the top end of the vertical wall 3c. The horizontal wall 3d houses the optical system of the inspection means 36. A display means M2 is disposed above the horizontal wall 3d. The inspection control means 200 described above is implemented by a computer. For convenience of explanation, the inspection control means 200 is shown external to the inspection apparatus 3 in FIG. 1, but is actually housed inside the inspection apparatus 3. The X-axis inspection feed means 34, Y-axis inspection feed means 35, inspection means 36, display means M2, etc. are connected to the inspection control means 200 and are controlled based on instruction signals issued by the inspection control means 200 to inspect the wafer 10, which is the workpiece. The inspection control means 200 also includes an inspection address conversion unit 210 and an image storage unit 220, which will be described later.

Between the dicing apparatus 2 and the inspection apparatus 3, a communication means 5 is provided for exchanging information between the inspection control means 200 of the inspection apparatus 3 and the processing control means 100 of the dicing apparatus 2. Using the communication means 5, processing information corresponding to the X and Y coordinates of the wafer 10 imaged by the inspection means 36 can be extracted from the processing control means 100. More specifically, the communication means 5 in this embodiment can utilize the Internet, for example. Processing information stored in the processing control means 100 of the dicing apparatus 2 is transmitted to the server 4 via the Internet communication network 52, and the processing information transmitted to the server 4 is transmitted to the inspection control means 200 of the inspection apparatus 3 via the Internet communication network 54. The means by which the inspection control means 200 extracts the processing information of the inspected object from the processing control means 100 is not limited to this. For example, it may be realized by a wired communication network directly connecting the processing control means 100 and the inspection control means 200 without going through the server 4, or a wireless communication network connecting the two.

The procedure for processing a workpiece using the dicing apparatus 2 described with reference to Figure 1 will now be described. Figure 2 shows a wafer 10, which is the workpiece of this embodiment. The wafer 10 is a wafer having a surface 10a partitioned by planned division lines 14 and having multiple devices 12 formed thereon. The wafer 10 is supported via tape T on a frame F having an opening Fa for accommodating the wafer 10. In this embodiment, an ID assigned to each individual wafer 10 is displayed on the front surface of the frame F using a sticker or the like. The ID is, for example, ID-123456. The sticker displaying the ID may also be attached to the tape T.

A plurality of wafers 10 are accommodated in a cassette 23 shown in FIG. 1 and are loaded into the dicing apparatus 2. The wafers 10 are transferred from the cassette 23 to a temporary placement table 24 by a transfer means 25, and then transferred to and placed on the chuck table 21 by a transfer means 26, where they are held by suction. The wafer 10 held by suction on the chuck table 21 is moved by an X-axis processing feed means (not shown) and positioned directly below the imaging means 29, as shown in FIG. 2. The imaging means 29 images the front surface 10a of the wafer 10 to align the predetermined dividing lines 14 of the wafer 10 in the X-axis direction and detect the areas to be machined by the cutting means 22. Here, as shown in FIG. 2, on the front surface 10a of the wafer 10, there are n horizontal dividing lines 14 along the X-axis direction and m vertical dividing lines along the Y-axis direction. Each of the planned division lines 14 can be identified using the X-coordinates and Y-coordinates on the chuck table 21, which are omitted from FIG. 2 . More specifically, the first to n-th planned division lines 14 aligned adjacently in the Y-axis direction along the X-axis direction can be identified by Y-coordinates _Y1 , _Y2 , _Y3 , ... Yn, and the area to be cut in the X-axis direction of each planned division line 14 can be identified by X-coordinates _X1 to Xm. Furthermore, the first to m-th planned division lines 14 aligned along the Y-axis direction in the drawing can be identified by X-coordinates _X1 , _X2 , _X3 , ... Xm, and the area to be cut in the Y-axis direction of each planned division line 14 can be identified by Y-coordinates _Y1 to Yn. Coordinate information of these planned division lines 14 is stored as processing information related to the processing area in the information storage unit 110 of the processing control means 100 of the dicing apparatus 2.

The machining control means 100 of this embodiment further includes a machining address conversion unit 120 that converts the X coordinates ( _X1 to Xm) and Y coordinates ( _Y1 to Yn) for specifying the position of the planned division line 14 as the machining area into addresses. The machining address conversion unit 120 converts the X coordinates and Y coordinates specifying each of the planned division runs 14 into predetermined addresses. The addresses are letters, numbers, or combinations thereof assigned to each of the planned division lines 14. For example, the planned division line 14 specified by the Y coordinate _Y1 of the planned division line 14 along the X-axis direction is converted into an address such as "horizontal number 1," the planned division line 14 specified by the Y coordinate _Y2 is converted into an address such as "horizontal number 2," and the Y coordinates _Y3 and on up to the Y coordinate Yn are converted into addresses such as "horizontal number 3" to "horizontal number n," and are stored in the information storage unit 110 of the machining control means 100. Similarly, the planned division line 14 specified by the X coordinate _X1 of the planned division line 14 along the Y-axis direction is converted into an address such as "vertical number 1", the planned division line 14 specified by the X coordinate _X2 is converted into an address such as "vertical number 2", and the X coordinates from _X3 onwards up to X coordinate Xm are converted into addresses such as "vertical number 3" to "vertical number m", and these are stored in the information storage unit 110 of the processing control means 100. Note that the notation forms of "horizontal number n" and "vertical number m" converted as described above are not limited to these, and for example, "horizontal number n" may be converted simply to "An", and "vertical number m" may be converted simply to "Bm".

Once the area of the planned dividing line 14 to be cut has been detected based on the X and Y coordinates as described above, the wafer 10 is positioned in the processing area directly below the cutting means 22, as shown in FIG. 3. As shown in FIG. 3, the cutting means 22 includes a spindle unit 22b, which includes a rotating spindle 22c to the tip of which a cutting blade 22d is fixed, and a blade cover 22e that protects the cutting blade 22d. The cutting blade 22d is configured to be rotatable together with the rotating spindle 22c in the direction indicated by arrow R1. A cutting water supply nozzle 22a is disposed adjacent to the cutting blade 22d on the blade cover 22e, supplying cutting water W to the cutting position. The cutting water is introduced through a cutting water supply port 22f in the blade cover 22e.

Once the wafer 10 has been moved to the processing area, the cutting blade 22d is rotated in the direction indicated by R1 by an electric motor (not shown), the cutting blade 22d is positioned on a predetermined dividing line 14 of the wafer 10, cutting water W is supplied from the cutting water supply port 22f, and cutting is performed based on the processing sequence stored in the processing control means 100. More specifically, the X-axis processing feed means is operated to move the wafer 10 in the X-axis direction indicated by the arrow X in Figure 3, forming a cutting groove 16. After forming the cutting groove 16, the Y-axis processing feed means is operated to index and feed the wafer 10 in the Y-axis direction indicated by the arrow Y in the figure by the spacing of the dividing line 14, forming a new cutting groove 16. By repeating this process, cutting grooves 16 are formed along all the dividing lines 14 along the X-axis direction, i.e., along the area specified by the Y coordinates _Y1 to Yn, or by row 1 to row n when expressed as addresses.

As described above, once the cutting grooves 16 have been formed along all of the planned dividing lines 14 along the X-axis direction, the chuck table 21 is rotated 90 degrees to position the direction perpendicular to the planned dividing lines 14 along which the cutting grooves 16 have been formed as the X-axis direction, and similarly to the above, cutting grooves 16 are formed along the planned dividing lines 14 identified by the X coordinates _X1 to Xm, or by vertical numbers 1 to m when expressed as addresses, thereby completing the cutting process for all of the planned dividing lines 14 on the wafer 10.

As described above, the processing control means 100 of the dicing device 2 of this embodiment stores processing information corresponding to the processing position specified by the X and Y coordinates. More specifically, the information storage unit 110 stores the load current value when the X-axis processing feed means is operated by the electric motor when processing the wafer 10, the load current value of the electric motor that rotates the cutting blade 22d of the cutting means 22, the amount of cutting water W supplied from the cutting water supply nozzle 22a, the processing sound during cutting processing, etc.

4 shows a conceptual diagram of specific processing information (only a portion of which is shown) stored in the information storage unit 110, and for example, the information stored is associated with an ID provided on the wafer 10, which is the workpiece, and stores processing information generated in conjunction with the cutting processing described above, along with information such as the model number of the processing device that processed the wafer 10, the processing date and time, and the processing location. In the illustrated embodiment, the load current value (I ₁ ) of the electric motor that rotates the cutting blade of the cutting means 22, the amount of cutting water (Wm) supplied from the cutting water supply nozzle 22a, and the processing sound (S) during cutting processing are shown, and this processing information is stored in correspondence with the X coordinate, Y coordinate, and address information of horizontal numbers 1 to n and vertical numbers 1 to m of the planned division line 14 on which the cut grooves 16 are formed. For example, it is possible to identify at which X-coordinate position a point P1 indicating an abnormal value of the load current value ( _I1 ) when the X-axis processing feed means is operated by an electric motor and a point P2 indicating an abnormal value of the processing sound (S) occur when cutting the planned dividing line 14 identified by the Y-coordinate _Y2 (or the second line in the row). Furthermore, the processing information stored in the information storage unit 110 also stores the processing order for processing the multiple planned dividing lines 14 on the wafer 10, as shown in the lower part of the figure. The processing order can affect processing quality, and it is possible to know in what order the planned dividing line 14 identified by the Y-coordinate _Y2 (or the second line in the row) was processed, which is important information when a problem occurs in the cutting process.

As described above, the wafer 10 processed in the dicing device 2 is transported to the inspection device 3 described with reference to FIG. 1, where it is placed on the chuck table 32f of the inspection object holding means 32 and held by suction. Next, the X-axis inspection feed means 34 and the Y-axis inspection feed means 35 are operated to position the wafer 10 directly below the inspection means 36, as shown in FIG. 5. Next, the predetermined kerfs 16 of the wafer 10 are aligned in the X-axis direction, and the area to be imaged is detected by the inspection means 36. Here, as shown in FIG. 5, the front surface 10a of the wafer 10 has n horizontal kerfs 16 aligned along the X-axis direction and m vertical kerfs 16 aligned along the Y-axis direction. Each kerf 16 can be identified using the X- and Y-coordinates on the chuck table of the inspection device 3, which are omitted from FIG. 5. More specifically, the first to nth cut grooves 16 aligned adjacently in the Y-axis direction along the X-axis direction can be identified by Y-coordinates _Y1 ', _Y2 ', _Y3 '...Yn', and the range in which the cut grooves 16 are formed in the X-axis direction can be identified by X-coordinates _X1 ' to Xm'. Furthermore, the first to mth cut grooves 16 aligned along the Y-axis direction in the figure can be identified by X-coordinates _X1 ', _X2 ', _X3 '...Xm', and the range in which each cut groove 16 is formed in the Y-axis direction can be identified by _Y1 ' to Yn'. The coordinate information of these cut grooves 16 is linked to the image captured by the inspection means 36 and stored together with the image in the image storage unit 220 of the inspection control means 200 arranged in the inspection device 3. When the image is stored in the image storage unit 220, the ID information arranged on the frame F described above is also stored along with the type of inspection equipment used to inspect the wafer 10, the date and time of the inspection, the location of the inspection, etc.

The inspection device 3 of this embodiment further includes an inspection address conversion unit 210 that converts the X coordinates ( _X1 ' to Xm') and Y coordinates ( _Y1 ' to Yn') used to identify the position of the cut groove 16 as the inspection area into addresses. The inspection address conversion unit 210 converts the X coordinates and Y coordinates that identify each of the cut grooves 16 into predetermined addresses. The addresses are letters, numbers, or a combination thereof that are assigned to each of the cut grooves 16 themselves. In principle, the conversion by the inspection address conversion unit 210 is performed according to substantially the same procedure as the conversion rule executed by the machining address conversion unit 120 of the machining control means 100 described above. For example, a cutting groove 16 specified by a Y coordinate _Y1 ' of a horizontal cutting groove 16 along the X-axis direction is converted to, for example, "horizontal number 1," a cutting groove 16 specified by a Y coordinate _Y2 ' is converted to, for example, "horizontal number 2," and Y coordinates _Y3 ' and thereafter up to Y coordinate Yn' are sequentially converted to, for example, "horizontal number 3" to "horizontal number n," and these are stored in the inspection address conversion unit 210 of the inspection control means 200. Similarly, a cutting groove 16 specified by an X coordinate _X1 ' of a cutting groove 16 along the Y-axis direction perpendicular to the X-axis direction is converted to, for example, "vertical number 1," and a cutting groove 16 specified by an X coordinate _X2 ' is converted to, for example, "vertical number 2," and X coordinates _X3 ' and thereafter up to X coordinate Xm' are sequentially converted to, for example, "vertical number 3" to "vertical number m," and these are stored in the inspection address conversion unit 210 of the inspection control means 200. The address given to the cut groove 16 imaged by the inspection means 36 in the inspection device 3 corresponds to the address of the planned dividing line 14 converted by the processing address conversion unit 120, and this address becomes an address that identifies the same area on the wafer 10. Note that the notation format when converting the above-mentioned X coordinate and Y coordinate information into an address is not limited to "nth horizontal number" and "mth vertical number", etc., and for example, "1st horizontal number" may be converted to "A1", and "1st vertical number" may be converted to "B1", etc. Note that the notation of the address is matched to the notation of the address converted by the processing address conversion unit 120 of the processing control means 100 of the dicing device 2.

Inspection by the inspection device 3 is performed, for example, by imaging the cut grooves 16 using the inspection means 36 in accordance with the processing sequence in which the cut grooves 16 were formed by the dicing device 2 described above.

The inspection device 3 can capture an image of the cut groove 16 of the wafer 10 using the inspection means 36 and detect chipping 18 occurring in the cut groove 16, which is displayed on the display means M2 shown in FIG. 5. Then, processing information corresponding to the Y coordinate _Y2 ' and X coordinates _X5 ' to X6' of the area of the cut groove 16 where such chipping 18 was detected is extracted from the information storage unit 110 in the processing control means 100 of the dicing device 2 described with reference to FIG. _4. When the processing information is referenced in correspondence with the X and Y coordinate positions corresponding to the above chipping 18, as shown in FIG. 4, an abnormal load current value is detected corresponding to the X and Y coordinates, as indicated by P1 in the figure, and it is confirmed that an abnormal noise was generated, as indicated by P2 in the figure. In this way, the processing information stored in the processing control means 100 can be used as a clue to determine the cause of the chipping 18.

However, when the wafer 10 is mounted on the frame F via the tape T as described above, even if the wafer 10 divided by the cutting process performed on the dicing device 2 is transported from the dicing device 2 to the inspection device 3 and placed and held so that the X and Y coordinates on the chuck table 21 of the dicing device 2 correspond to the X and Y coordinates on the chuck table 32 of the inspection device 3, the tape T may expand or contract, causing the X and Y coordinates of the planned division lines 14 identified on the chuck table 21 of the dicing device 2 to not accurately match the X and Y coordinates of the cut grooves 16 identified on the inspection device 3. In particular, when the devices 12 on the wafer 10 are microdevices measuring 1 mm square or less, the planned division lines 14 identified by the X and Y coordinates on the dicing device 2 and the cut grooves 16 identified by the X and Y coordinates on the inspection device 3 may not match and may become misaligned, resulting in a problem of inappropriate information exchange. To address this issue, in this embodiment, when the wafer 10 is processed by the dicing apparatus 2 and inspected by the inspection apparatus 3, the above inspection is performed using the addresses converted by the processing address conversion unit 120 of the processing control means 100 of the dicing apparatus 2 and the inspection address conversion unit 210 of the inspection control means 200 of the inspection apparatus 3. As described above, the addresses converted by the inspection address conversion unit 210 correspond to the addresses converted by the processing address conversion unit 120 arranged in the processing control means 100 of the dicing apparatus 2. By using the addresses converted by the inspection address conversion unit 210 and the addresses converted by the processing address conversion unit 120, information can be appropriately exchanged without being affected by misalignment of the X and Y coordinates, and it becomes possible to correlate and verify the defective areas of the cut groove 16 imaged by the inspection means 36 with the processing information stored in the information storage unit 110 of the processing control means 100.

In the above-described embodiment, the wafer 10 is imaged by the inspection means 36 of the inspection device 3, and processing information corresponding to the area identified by the X-coordinate, Y-coordinate, or address information is extracted from the processing control means 100 of the dicing device 2. However, in this embodiment, an image storage unit 220 is provided that stores the image of the wafer 10 imaged by the inspection means 36 of the inspection control means 200 in X-coordinate and Y-coordinate format. The processing control means 100 can also use the above-described communication means 5 to extract images corresponding to the processing information stored in correspondence with the X-coordinate and Y-coordinate from the image storage unit 220 of the inspection control means 200. With this configuration, after the inspection by the inspection device 3 is completed, if a possible cutting processing abnormality is discovered by referring to the processing information stored in the processing control means 100 of the dicing device 2, an image of the position on the wafer 10 corresponding to the X-coordinate and Y-coordinate where the possible abnormality was discovered can be extracted from the image storage unit 220 provided in the inspection control means 200. This makes it possible to more efficiently discover abnormalities in the wafer 10 and identify their causes. In this case, too, it is possible to identify the location of a possible abnormality or the location of the image to be extracted based on address information instead of X and Y coordinates.

Furthermore, a TEG (Test Elementary Group) that evaluates and manages the devices 12 formed on the wafer 10 may be disposed on the planned dividing line 14 of the wafer 10. As part of the above-mentioned processing information, the position where the TEG is disposed may be stored in the information storage unit 110 of the processing control means 100 in correspondence with the X and Y coordinates, and may be included in the processing information extracted from the processing control means 100 during inspection performed by the inspection device 3.

2: Dicing device 20: Device housing 21: Chuck table 22: Cutting means 22a: Cutting water supply nozzle 22b: Spindle unit 22c: Rotating spindle 22d: Cutting blade 22e: Blade cover 22f: Cutting water supply port 23: Cassette 24: Temporary placement table 25: Carrying-in/out means 26: Transporting means 27: Cleaning means 28: Cleaning and transporting means 29: Imaging means 3: Inspection device 3a: Base 3b: Guide rail 3c: Vertical wall 3d: Horizontal wall 32: Inspection object holding means 32a: X-axis direction movable plate 32b: Y-axis direction movable plate 32c: Guide rail 32d: Support 32e: Cover plate 32f: Chuck table 32g: Clamp 33: Moving means 34: X-axis inspection feed means 341: Motor 342: Ball screw 35: Y-axis inspection feed means 351: Motor 352: Ball screw 36: Inspection means 4: Server 5: Communication means 52, 54: Internet 10: Wafer 12: Device 14: Planned division line 16: Cut groove 18: Chipping 100: Processing control means 110: Information storage unit 120: Processing address conversion unit 200: Inspection control means 210: Inspection address conversion unit 220: Image storage unit

Claims (5)

An information exchange system for exchanging information between a processing device and an inspection device,
The processing device includes at least a workpiece holding means for holding a workpiece, a processing means for processing the workpiece held by the workpiece holding means, an X-axis processing feed means for relatively feeding the workpiece holding means and the processing means in the X-axis direction, a Y-axis processing feed means for relatively feeding the workpiece holding means and the processing means in the Y-axis direction perpendicular to the X-axis direction, and a processing control means,
The inspection device comprises at least an inspection object holding means for holding an inspection object processed by the processing device, an inspection means for taking an image of the inspection object held by the inspection object holding means and inspecting the processing state, an X-axis inspection feed means for relatively inspecting the inspection object holding means and the inspection means in the X-axis direction, a Y-axis inspection feed means for relatively inspecting the inspection object holding means and the inspection means in the Y-axis direction perpendicular to the X-axis direction, and an inspection control means,
The processing control means specifies an area to be processed on the workpiece by X-coordinate and Y-coordinate, and includes an information storage unit that stores processing information obtained by processing by X-coordinate and Y-coordinate,
The inspection control means extracts processing information corresponding to the X coordinate and Y coordinate of the object to be inspected, the image of which has been captured by the inspection means , from the processing control means;
The inspection control means includes an image storage unit that stores an image of the object to be inspected captured by the inspection means in terms of X and Y coordinates,
The processing control means is an information exchange system that extracts an image corresponding to processing information specified by X and Y coordinates from the image storage unit of the inspection control means . The processing control means includes a processing address conversion unit that converts the X coordinate and the Y coordinate into an address,
The inspection control means includes an inspection address conversion unit that converts X and Y coordinates into addresses,
2. An information exchange system according to claim 1 , wherein an address is used instead of X and Y coordinates . the workpiece is a wafer having a surface on which a plurality of devices are formed and partitioned by planned division lines, the wafer being supported via a tape on a frame having an opening for accommodating the wafer;
3. The information exchange system according to claim 1 , wherein the processing means is a cutting means having a rotatable cutting blade, and the processing performed on the wafer is a cutting process for cutting the planned dividing lines . 4. An information exchange system according to claim 1 , wherein an X coordinate and a Y coordinate are set for each planned division line, or the X coordinate and the Y coordinate are converted into an address . 2. The information exchange system according to claim 1, wherein an ID is provided in association with the workpiece, and information including the processing device that processed the workpiece, the date and time of processing, the location of processing, the inspection device that inspected the object to be inspected, the date and time of inspection, and the location of inspection is identified by the ID .