JP7745199B2 - Component placement device - Google Patents

Description

This disclosure relates to a component mounting device.

Patent Document 1 discloses a component mounting system that uses a mark plate formed into a rectangular shape from quartz glass with a low coefficient of expansion, with four circular marks arranged in a straight line on its surface, mounted on a base. The marks are captured by a camera, and positional deviations caused by thermal expansion of the component mounting machine during component mounting are corrected.

International Publication No. 2018/225242

However, with the configuration disclosed in Patent Document 1, as the substrate size increases, the mark plate also becomes longer. Long mark plates are inconvenient to handle. Furthermore, long mark plates tend to be more difficult or expensive to manufacture.

The objective of this disclosure is to provide a component mounting device that makes it easy to handle the mark placement section where marks are placed, and that can correct misalignment during component mounting.

A component mounting device according to one aspect of the present disclosure comprises a mounting head that is movable relative to a base and picks up components from a component supply unit provided on the base side and mounts the components on a board; a mark placement unit that is provided on the base side and has a plurality of marks arranged at predetermined intervals; an imaging unit that is provided on the mounting head and captures images of the marks; and a control unit that calculates the amount of misalignment of the mounting head based on images captured by the imaging unit, and the mark placement unit is composed of at least a first mark placement unit and a second mark placement unit that are arranged adjacent to each other.

This disclosure provides a component mounting device that makes it easy to handle the mark placement area where marks are placed and can correct misalignment during component mounting.

FIG. 1 is a plan view of a component mounting device according to an embodiment of the present invention; 2 is a partial cross-sectional view (cross-section AA) of the component mounting device in FIG. 1; FIG. 10 is a diagram showing an example in which a first mark placement unit and a second mark placement unit are arranged side by side on a base; FIG. 10 is a diagram for explaining an example in which the first mark placement unit and the second mark placement unit according to the present embodiment are placed on the base in a shifted manner. FIG. 1 is a diagram for explaining a first example of a case in which a first mark placement unit and a second mark placement unit according to the present embodiment are arranged side by side on a base; FIG. 10 is a diagram for explaining a second example in which the first mark placement unit and the second mark placement unit according to the present embodiment are arranged side by side on the base; FIG. 1 is a block diagram showing the configuration of a control system of a component mounting device according to an embodiment of the present invention. 1 is a flowchart showing the flow of a component mounting method according to an embodiment of the present invention.

Embodiments of the present disclosure will be described in detail below, with appropriate reference to the drawings. However, more detailed description than necessary may be omitted. For example, detailed descriptions of well-known matters and redundant descriptions of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter of the claims.

(Present embodiment)
The configuration of a component mounting apparatus 1 that mounts components on a circuit board will be described with reference to Figures 1 and 2. Figure 1 shows a plan view of the component mounting apparatus 1. Figure 2 shows a partial cross-sectional view (cross-section A-A) of the component mounting apparatus 1 in Figure 1.

Hereinafter, the substrate transport direction (left-right direction on the paper surface of Figure 1) is defined as the X direction, the direction perpendicular to the X direction in the horizontal plane (up-down direction on the paper surface of Figure 1) is defined as the Y direction, and the height direction perpendicular to the horizontal plane (up-down direction on the paper surface of Figure 2) is defined as the Z direction.

In Figure 1, a board transport mechanism 2 that transports boards in the X direction is disposed in the center of the base 1a. The board transport mechanism 2 is composed of two parallel transport rails 2a. The board transport mechanism 2 transports a board 3 carried in from the upstream side, and positions and holds it on a mounting stage set up for component mounting work.

Component supply units 4 are located on both sides of the board transport mechanism 2. Each component supply unit 4 has multiple tape feeders 5 installed in parallel.

The tape feeder 5 supplies components to the component suction position of the mounting head 8 by pitch-feeding the carrier tape containing the components in a direction (tape feed direction) from outside the component supply unit 4 toward the board transport mechanism 2.

A Y-axis beam 6 equipped with a linear drive mechanism is disposed at one end of the upper surface of the base 1a in the X direction. Two X-axis beams 7, also equipped with linear drive mechanisms, are connected to the Y-axis beam 6 so that they can move freely in the Y direction.

A mounting head 8 is attached to each of the two X-axis beams 7 so that it can move freely in the X direction. The mounting head 8 is a multiple-head equipped with multiple holding heads. As shown in Figure 2, a suction nozzle 8a is attached to the bottom end of each holding head, which can pick up and hold a component D and can be raised and lowered individually.

By driving the Y-axis beam 6 and the X-axis beam 7, the mounting head 8 can move freely in the X and Y directions.

As a result, the two mounting heads 8 use the suction nozzles 8a to pick up components D from the component suction positions of the tape feeders 5 of their corresponding component supply units 4, and then transfer and mount the components D to the mounting points on the board 3 positioned by the board transport mechanism 2.

The Y-axis beam 6 and X-axis beam 7 constitute a head movement mechanism 9 that moves the mounting head 8 horizontally (X direction, Y direction).

In this way, the mounting head 8 is arranged to be able to move horizontally relative to the base 1a, picking up components D from the component supply unit 4 arranged on the base 1a side and mounting them on the board 3.

A component recognition camera 10 is disposed between the component supply unit 4 and the board transport mechanism 2. When the mounting head 8 picks up a component D from the component supply unit 4 and moves above the component recognition camera 10, the component recognition camera 10 captures and recognizes the component D held by the mounting head 8.

The mounting heads 8 are equipped with board recognition cameras 11 that are positioned on the underside of the X-axis beams 7 and move integrally with the mounting heads 8. As the mounting heads 8 move, the board recognition cameras 11 move above the boards 3 positioned on the board transport mechanism 2, capturing and recognizing the boards 3. Note that the board recognition cameras 11 may also be referred to as imaging units.

When the mounting head 8 mounts a component on the board 3, the position (mounting position) at which the component D is mounted on the board 3 is corrected (i.e., misalignment) based on the recognition results of the component D by the component recognition camera 10 and the board recognition results by the board recognition camera 11.

During component mounting operations, in which the mounting head 8 is moved by the head movement mechanism 9 to remove components D from the component supply unit 4 and transfer them to the board 3, mounting turns in which the mounting head 8 is repeatedly moved between the component supply unit 4 and the board 3 are frequently performed. This repetitive movement generates heat from the linear drive mechanism or sliding parts of the Y-axis beam 6 or X-axis beam 7 that make up the head movement mechanism 9, and this heat can cause thermal deformation (e.g., thermal expansion) of the Y-axis beam 6 or X-axis beam 7. For example, the Y-axis beam 6 or X-axis beam 7 can expand, contract, bend, or twist due to thermal deformation. Because the magnitude of thermal deformation depends on the temperature of the Y-axis beam 6 or X-axis beam 7, the shape of the Y-axis beam 6 or X-axis beam 7 can change over time.

When the Y-axis beam 6 or X-axis beam 7 is thermally deformed, a misalignment occurs between the mounting position where the suction nozzle 8a actually places the component D on the board 3 and the ideal mounting position where there is no thermal deformation in the Y-axis beam 6 or X-axis beam 7 (hereinafter referred to as the "ideal mounting position").

To detect this misalignment, a mark placement unit 40 with multiple marks arranged at a predetermined interval is installed on the base 1a. In other words, the mark placement unit 40 is intended to detect misalignment (misalignment in the X direction and Y direction) in the horizontal plane (XY plane) of the mounting head 8. For example, as shown in FIG. 1, four mark placement units 40 are installed on the top surface of the base 1a so as to surround the board 3 positioned on the board transport mechanism 2. Note that the mark placement unit 40 may also be referred to by other terms such as a mark plate, mark bar, or thermal correction bar.

The marks on the mark placement unit 40 are recognized by the board recognition camera 11, which moves with the mounting head 8, and are compared with the ideal mounting position, making it possible to detect misalignment of the mounting head 8 in the horizontal plane. Next, the mark placement unit 40 according to this embodiment will be described in detail.

<Details of mark placement>
The thermal expansion coefficient of the material making up the mark placement section 40 is smaller than the thermal expansion coefficient of the material making up the base 1a. For example, the mark placement section 40 is made up of quartz glass, and the base 1a is made up of iron. The thermal expansion coefficient of quartz glass is 0.6×10 ⁻⁶ (1/°C), and the thermal expansion coefficient of iron is 11.7×10 ⁻⁶ (1/°C), so the rate of thermal expansion of the mark placement section 40 is much smaller than that of the base 1a.

When using quartz glass for the mark placement section 40, the difficulty and cost of manufacturing increases dramatically as the length of the mark placement section increases. Furthermore, a relatively long mark placement section is inconvenient to handle during transportation, etc. Therefore, one option is to arrange multiple relatively short mark placement sections side by side on the base 1a and use them as a single mark placement section 40. However, when multiple mark placement sections are arranged on the base 1a, the distance between the mark placement sections may change due to thermal expansion of the base 1a. Therefore, simply recognizing the marks on each mark placement section cannot adequately correct misalignment. For example, as shown in Figure 3, when a first mark placement section 41 and a second mark placement section 42 are arranged side by side on the base 1a to form a single mark placement section 40, the distance d between the first mark placement section 41 and the second mark placement section 42 may increase due to thermal expansion of the base 1a.

In light of this situation, the following describes a component mounting device 1 that is equipped with multiple mark placement units and can correct misalignment of the mounting head 8.

Note that the following explanation will be given for the case where one mark placement unit 40 is realized by a first mark placement unit 41 and a second mark placement unit 42, but one mark placement unit 40 may also be realized by three or more mark placement units. Furthermore, the following explanation will be given for a mark placement unit 40A (see Figure 1) arranged along the X-axis beam 7, but the following explanation can also be applied to a mark placement unit 40B (see Figure 1) arranged along the Y-axis beam 6.

Figure 4 is a diagram illustrating an example of when the first mark placement section 41 and the second mark placement section 42 are installed offset from each other on the base 1a.

As shown in FIG. 4, the first mark placement section 41 has a rectangular shape when viewed from the normal direction to the surface (horizontal or XY plane) of the base 1a, and has circular marks 43 spaced at predetermined intervals (e.g., equal intervals) along the length. Similarly, the second mark placement section 42 has a rectangular shape when viewed from the normal direction to the surface (horizontal or XY plane) of the base 1a, and has circular marks 44 spaced at predetermined intervals (e.g., equal intervals) along the length. Note that the shapes of the marks 43 and 44 are not limited to circles, and may be polygonal, cross-shaped, or the like.

As shown in Figure 4, the second mark placement section 42 is installed adjacent to the first mark placement section 41 in a position that does not overlap with the longitudinal extension of the first mark placement section 41.

In addition, the second mark placement section 42 may be installed on the base 1a so that the longitudinal direction of the second mark placement section 42 is aligned with the longitudinal direction of the first mark placement section 41.

In addition, the second mark placement section 42 may be installed at a position where the extension line 51 of the short side of the second mark placement section 42 intersects (e.g., perpendicular to) the long side 52 of the first mark placement section 41.

In addition, the second mark placement section 42 may be positioned so that a line 54 that passes through the mark 44A at the end E2 of the second mark placement section 42 and is perpendicular to the long side 53 of the second mark placement section 42 passes through the mark 43A at the end E1 of the first mark placement section 41. This allows the board recognition camera 11 to capture an image of two adjacent marks 43 or 44 on either the first mark placement section 41 or the second mark placement section 42 at any position of the X-axis beam 7.

When the first mark placement unit 41 and the second mark placement unit 42 are installed as shown in Figure 4, the calculation unit 30b (see Figure 7) calculates the amount of positional deviation by the following processes (A1) to (A3).

(A1) When at least two marks 43 in the first mark placement section 41 are captured in an image captured by the board recognition camera 11, the calculation unit 30b calculates the amount of positional deviation using the distance between two adjacent marks 43 in the first mark placement section 41.

(A2) When at least two marks 44 in the second mark placement section 42 are captured in an image captured by the board recognition camera 11, the calculation unit 30b calculates the amount of positional deviation using the distance between two adjacent marks 44 in the second mark placement section 42.

(A3) When both the mark 43 in the first mark placement section 41 and the mark 44 in the second mark placement section 42 are captured in an image captured by the board recognition camera 11, the calculation unit 30b calculates the amount of positional deviation using the distance between two adjacent marks 43 or 44 in either the first mark placement section 41 or the second mark placement section 42.

That is, by placing the first mark placement unit 41 and the second mark placement unit 42 on the base 1a as shown in Figure 4 and having the calculation unit 30b perform the above-mentioned processing, the amount of positional deviation is calculated using the distance between two adjacent marks (43 or 44) on the same mark placement unit (41 or 42) at any position in the X direction.

As a result, even if the positional relationship between the first mark placement section 41 and the second mark placement section 42 changes due to thermal deformation of the base 1a, the amount of positional misalignment is not affected by the thermal deformation of the base 1a. Therefore, positional misalignment during component mounting can be corrected with high precision.

Figure 5 is a diagram illustrating a first example in which the first mark placement section 41 and the second mark placement section 42 are placed side by side on the base 1a.

As shown in Figure 5, the second mark placement section 42 is installed adjacent to the first mark placement section 41 at a position overlapping the longitudinal extension of the first mark placement section 41.

When the first mark placement unit 41 and the second mark placement unit 42 are installed as shown in Figure 5, the calculation unit 30b (see Figure 7) calculates the amount of positional deviation by performing the following steps S11 to S13.

(S11) The calculation unit 30b calculates the distance X1 between the marks 43A and 44A from an image 61 captured by the board recognition camera 11 in the area where the first mark placement area 41 and the second mark placement area 42 are adjacent to each other before the base 1a changes over time, in which both the mark 43A at the end E1 of the first mark placement area 41 and the mark 44A at the end E2 of the second mark placement area 42 are captured.

(S12) The calculation unit 30b calculates the distance X2 between the marks 43A and 44A from the captured image 61, which captures both the marks 43A and 44A after the base 1a has changed over time.

(S13) When calculating the amount of misalignment using the mark 44 of the second mark placement unit 42, the calculation unit 30b calculates the amount of misalignment by shifting the position of the mark 44 in the X direction by ΔXa = X2 - X1. In other words, the calculation unit 30b shifts the position of the second mark placement unit 42 in the X direction by ΔXa, using the position of the first mark placement unit 41 as a reference.

In this way, by placing the first mark placement unit 41 and the second mark placement unit 42 on the base 1a as shown in Figure 5 and having the calculation unit 30b perform the above-mentioned processing, the amount of positional deviation in the X direction at which the mark 44 of the second mark placement unit 42 is imaged is corrected by ΔXa.

As a result, even if the positional relationship (e.g., distance d) between the first mark placement section 41 and the second mark placement section 42 changes due to thermal deformation of the base 1a, the amount of misalignment is corrected taking into account the effects of thermal deformation of the base 1a. In other words, misalignment during component mounting can be corrected with high precision.

Figure 6 is a diagram illustrating a second example in which the first mark placement section 41 and the second mark placement section 42 are installed side by side on the base 1a.

As shown in Figure 6, the second mark placement section 42 is positioned adjacent to and overlaps the longitudinal extension of the first mark placement section 41.

When the first mark placement unit 41 and the second mark placement unit 42 are installed as shown in Figure 6, the calculation unit 30b (see Figure 7) calculates the amount of positional deviation by performing the following steps S21 to S23.

(S21) The calculation unit 30b calculates the distance X3 between two adjacent marks 43B, 43C in the first mark arrangement unit 41. Note that the calculation unit 30b may calculate X3 from one captured image that includes both adjacent marks 43B, 43C, or may calculate X3 by combining two captured images that each include two adjacent marks 43B, 43C.

(S22) The calculation unit 30b calculates the distance X4 between the mark 43A at the end E1 of the first mark placement unit 41 and the mark 44A at the end E2 of the second mark placement unit 42 in an area where the first mark placement unit 41 and the second mark placement unit 42 are adjacent to each other. Note that the calculation unit 30b may calculate X4 from one captured image that includes both the mark 43A and the mark 44A, or may calculate X4 by combining two captured images that each include the mark 43A and the mark 44A.

(S23) When calculating the amount of misalignment using the mark 44 in the second mark placement unit 42, the calculation unit 30b shifts the position of the mark 44 in the X direction by ΔXb = X4 - X3 to calculate the amount of misalignment.

In this way, by placing the first mark placement unit 41 and the second mark placement unit 42 on the base 1a as shown in Figure 6 and having the calculation unit 30b perform the above-mentioned processing, the amount of positional deviation in the X direction at which the mark 44 of the second mark placement unit 42 is imaged is corrected by ΔXb.

As a result, even if the positional relationship (e.g., distance d) between the first mark placement section 41 and the second mark placement section 42 changes due to thermal deformation of the base 1a, the amount of misalignment is corrected taking into account the effects of thermal deformation of the base 1a. In other words, misalignment during component mounting can be corrected with high precision.

If there is space on the base 1a for the first mark placement section 41 and the second mark placement section 42 to be offset, the installation shown in Figure 4 can be used, and if there is no space on the base 1a for the first mark placement section 41 and the second mark placement section 42 to be offset, the installation shown in Figure 5 or Figure 6 can be used. This allows this embodiment to be used with component mounting devices 1 of various sizes and shapes.

<Hardware configuration>
Next, the configuration of the control system of the component mounting device 1 will be described with reference to Fig. 7. Fig. 7 is a block diagram showing the configuration of the control system of the component mounting device.

The control unit 30 is an overall control device for the component mounting device 1. The control unit 30 may be referred to by other terms such as a CPU (Central Processing Unit), processor, or controller. The control unit 30 executes processing programs stored in the memory unit 31 to control the board transport mechanism 2, component supply unit 4, mounting head 8, head movement mechanism 9, and display unit 33 of the component mounting device 1.

The display unit 33 is a liquid crystal display or the like that displays various information, including images captured by the component recognition camera 10 and the board recognition camera 11.

The memory unit 31 stores various data used in component mounting operations, such as mounting data 31a and misalignment amount data 31b. The memory unit 31 may be configured as read-only memory (ROM), random access memory (RAM), flash memory, or a combination of these.

Mounting data 31a includes data such as the type and mounting position of the component D to be mounted, and is stored for each type of board to be produced.

The control unit 30 has internal control functions including a recognition processing unit 32, an implementation control unit 30a, and a calculation unit 30b.

The recognition processing unit 32 performs recognition processing on the images captured by the component recognition camera 10 and the board recognition camera 11. For example, the recognition processing unit 32 recognizes the component D, the board 3, or the marks 43, 44 of the mark placement unit 40 from the captured images.

The mounting control unit 30a controls the board transport mechanism 2, component supply unit 4, mounting head 8, and head movement mechanism 9 to perform the task of removing components D from the component supply unit 4 and transferring and mounting them on the board 3 (component mounting task).

As described above, the calculation unit 30b calculates the amount of misalignment of the mounting head 8 relative to the reference position based on the positional relationship between at least two of the marks 43, 44 of the first mark placement unit 41 and/or the second mark placement unit 42 contained in the image captured by the board recognition camera 11. The calculation unit 30b stores the calculated amount of misalignment in the memory unit 31 as misalignment amount data 31b.

<Component mounting method>
8, the flow of the component mounting method for mounting the component D on the board 3 by the component mounting apparatus 1 will be described. FIG. 8 is a flowchart showing the flow of the component mounting method.

The mounting control unit 30a controls the head movement mechanism 9 to move the mounting head 8 to the reference position, and controls the board recognition camera 11 to capture images of the marks 43 and 44 on the mark placement unit 40 (S41).

The recognition processing unit 32 recognizes marks 43 and 44 from the image captured in step S41 (S42).

As described above, the calculation unit 30b calculates the amount of misalignment of the mounting head 8 positioned at the reference position based on the positional relationship between the marks 43 and 44 recognized from the captured image (S43). The calculation unit 30b may store the calculated amount of misalignment in the memory unit 31 as misalignment amount data 31b.

The mounting control unit 30a performs the component mounting operation (S44). That is, the mounting control unit 30a controls the mounting head 8 to remove component D from the component supply unit 4 and transfer and mount it on the board 3. At this time, the mounting control unit 30a corrects the mounting position of component D based on the amount of positional deviation stored in the memory unit 31.

The mounting control unit 30a determines whether the specified component mounting work has been completed (S45).

If the specified component mounting work has not been completed (S45: NO), the mounting control unit 30a returns the process to step S44.

If the specified component mounting work is completed (S45: YES), the mounting control unit 30a ends this process. After this process is completed, the board 3 on which the components have been mounted is removed, and the next board 3 on which the components will be mounted is brought in.

Steps S41 to S45 may be repeated until the production of the specified number of mounting boards is completed.

Furthermore, steps S41 to S43 do not necessarily have to be performed every time components are mounted on the board 3. In other words, steps S41 to S43 may be performed at a predetermined frequency, taking into account fluctuations over time (changes over time) in the thermal deformation of the X-axis beam 7 (or Y-axis beam 6).

(Summary of the Disclosure)
The contents of this disclosure can be expressed as follows:

<Expression 1>
The component mounting device 1 comprises a mounting head 8 that is movable relative to the base 1a and picks up a component D from a component supply unit 4 provided on the base 1a side and mounts the component D on a board 3, a mark placement unit 40 that is provided on the base 1a side and has a plurality of marks 43, 44 arranged at a predetermined interval, an imaging unit 11 that is provided on the mounting head 8 and images the marks 43, 44, and a control unit 30 that calculates the amount of positional deviation of the mounting head 8 based on the image captured by the imaging unit 11, and the mark placement unit 40 is composed of at least a first mark placement unit 41 and a second mark placement unit 42 that are arranged adjacent to each other.
As a result, the size of each of the first mark placement unit 41 and the second mark placement unit 42 is smaller than when the mark placement unit 40 is handled as a single component, making it easier to handle the mark placement units. In addition, the component mounting device 1 can correct positional deviations during component mounting by using the marks 43, 44 on the first mark placement unit 41 and the second mark placement unit 42.

<Expression 2>
In the component mounting device 1 described in Expression 1, the first mark placement section 41 and the second mark placement section 42 are rectangular when viewed from the normal direction of the base 1a, and the second mark placement section 42 may be installed in a position that does not overlap with the longitudinal extension line of the first mark placement section 41.
This allows the imaging unit 11 to capture images of the marks 43 and 44 while the first mark arrangement unit 41 and the second mark arrangement unit 42 move in the longitudinal direction.

<Expression 3>
In the component mounting device 1 described in expression 2, the second mark placement section 42 may be installed at a position where an extension line of the short side of the second mark placement section 42 intersects with the long side of the first mark placement section 41.
As a result, the first mark placement section 41 and the second mark placement section 42 are installed approximately parallel to each other, so that the imaging section 11 can image the marks 43 and 44 as the first mark placement section 41 and the second mark placement section 42 move longitudinally.

<Expression 4>
In the component mounting device 1 described in expression 3, the second mark placement section 42 may be installed at a position where a line passing through the mark 44 at the end of the second mark placement section 42 and perpendicular to the long side of the second mark placement section 42 passes through the mark 43 at the end of the first mark placement section 41.
As a result, the control unit 30 can calculate the amount of misalignment at any position by using the spacing between two adjacent marks 43 in the first mark placement unit 41 or the spacing between two adjacent marks 44 in the second mark placement unit 42. In this case, even if the positional relationship between the first mark placement unit 41 and the second mark placement unit 42 changes due to thermal deformation of the base 1a, the amount of misalignment is not affected by the thermal deformation of the base 1a. As a result, the component mounting device 1 can accurately correct misalignment during component mounting.

<Expression 5>
In the component mounting device 1 described in Expression 1, the first mark placement section 41 and the second mark placement section 42 are rectangular when viewed from the normal direction of the base 1a, the second mark placement section 42 is installed at a position overlapping on an extension line of the longitudinal direction of the first mark placement section 41, the imaging section 11 captures an image including the mark 43 of the first mark placement section 41 and the mark 44 of the second mark placement section 42, and the control section 30 may calculate the amount of positional deviation based on the change over time in the distance between the mark 43 of the first mark placement section 41 and the mark 44 of the second mark placement section 42 contained in the captured image.
This allows the control unit 30 to calculate the amount of misalignment based on the change over time in the distance between the mark 43 of the first mark placement unit 41 and the mark 44 of the second mark placement unit 42, which is included in the captured image. In other words, even if the positional relationship between the first mark placement unit 41 and the second mark placement unit 42 changes due to thermal deformation of the base 1 a, the amount of misalignment is corrected taking into account the effect of the thermal deformation of the base 1 a. As a result, the component mounting device 1 can accurately correct misalignment during component mounting.

<Expression 6>
In the component mounting device 1 described in Expression 1, the first mark placement section 41 and the second mark placement section 42 are rectangular when viewed from the normal direction of the base 1a, and the second mark placement section 42 is installed at a position overlapping on the longitudinal extension line of the first mark placement section 41, and the control section 30 may calculate the amount of positional deviation based on the spacing between at least two marks 43 in the first mark placement section 41 and the positional relationship between the mark 43A at the end of the first mark placement section 41 and the mark 44A at the end of the second mark placement section 42.
This allows the control unit 30 to correct the amount of misalignment at the position where the mark 44 of the second mark placement unit 42 is imaged, based on the spacing between at least two marks 43 in the first mark placement unit 41 and the positional relationship between the mark 43A at the end of the first mark placement unit 41 and the mark 44A at the end of the second mark placement unit 42. In other words, even if the positional relationship between the first mark placement unit 41 and the second mark placement unit 42 changes due to thermal deformation of the base 1a, the amount of misalignment is corrected taking into account the effect of the thermal deformation of the base 1a. As a result, the component mounting device 1 can accurately correct misalignment during component mounting.

<Expression 7>
In the component mounting device 1 according to any one of Expressions 1 to 6, the thermal expansion coefficients of the first mark placement section 41 and the second mark placement section 42 may be smaller than the thermal expansion coefficient of the base 1a.
This allows the control unit 30 to use the first mark placement unit 41 and the second mark placement unit 42, which have small thermal expansion coefficients, to correct the positional deviation (i.e., misalignment) of the component D mounted on the substrate 3 that may occur due to the thermal expansion of the base 1a.

Although the embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It will be clear to those skilled in the art that various modifications, alterations, substitutions, additions, deletions, and equivalents may be conceived within the scope of the claims, and it is understood that these also fall within the technical scope of the present disclosure. Furthermore, the components of the above-described embodiments may be combined in any manner as long as they do not deviate from the spirit of the invention.

The technology disclosed herein has the effect of correcting misalignment of the mounting head caused by changes over time, and is useful in the field of component mounting, where components are mounted on boards.

1 Component mounting device 1a Base 2 Board transport mechanism 2a Transport rail 3 Board 4 Component supply unit 5 Tape feeder 6 Y-axis beam 7 X-axis beam 8 Mounting head 8a Suction nozzle 9 Head moving mechanism 10 Component recognition camera 11 Board recognition camera 30 Control unit 30a Mounting control unit 30b Calculation unit 31 Memory unit 31a Mounting data 31b Position deviation amount data 32 Recognition processing unit 33 Display unit 40 Mark placement unit 41 First mark placement unit 42 Second mark placement unit 43, 43A, 43B, 43C Mark 44, 44A Mark D Component

Claims (8)

a mounting head that is provided so as to be movable relative to a base and that picks up components from a component supply unit provided on the base side and mounts the components on a board;
a mark placement unit provided on the base side and having a plurality of marks placed at predetermined intervals;
an imaging unit provided in the mounting head for imaging the mark;
a control unit that calculates a positional deviation amount of the mounting head based on the image captured by the imaging unit,
the mark placement unit is configured by at least a first mark placement unit and a second mark placement unit ,
an end of the first mark arrangement portion and an end of the second mark arrangement portion are arranged adjacent to each other;
Component placement device. the first mark arrangement portion and the second mark arrangement portion are rectangular when viewed from a normal direction of the base,
the second mark arrangement portion is disposed at a position not overlapping with an extension line of the first mark arrangement portion in the longitudinal direction;
2. The component mounting device according to claim 1. the second mark arrangement portion is disposed at a position where an extension line of a short side of the second mark arrangement portion intersects with a long side of the first mark arrangement portion;
3. The component mounting device according to claim 2. the second mark arrangement portion is disposed at a position where a line passing through the mark at an end of the second mark arrangement portion and perpendicular to a long side of the second mark arrangement portion passes through the mark at an end of the first mark arrangement portion;
4. The component mounting apparatus according to claim 3. the first mark arrangement portion and the second mark arrangement portion are rectangular when viewed from a normal direction of the base,
the second mark arrangement portion is disposed at a position overlapping an extension line of the first mark arrangement portion in a longitudinal direction,
the imaging unit captures an image including the mark in the first mark arrangement area and the mark in the second mark arrangement area;
the control unit calculates the amount of positional deviation based on a change over time in a distance between the mark in the first mark arrangement unit and the mark in the second mark arrangement unit, the change being included in the captured image.
2. The component mounting device according to claim 1. the first mark arrangement portion and the second mark arrangement portion are rectangular when viewed from a normal direction of the base,
the second mark arrangement portion is disposed at a position overlapping an extension line of the first mark arrangement portion in a longitudinal direction,
the control unit calculates the amount of misalignment based on an interval between at least two of the marks in the first mark arrangement unit and a positional relationship between the mark at an end of the first mark arrangement unit and the mark at an end of the second mark arrangement unit.
2. The component mounting device according to claim 1. the thermal expansion coefficients of the first mark placement portion and the second mark placement portion are smaller than the thermal expansion coefficient of the base;
7. The component mounting apparatus according to claim 1. the imaging unit is capable of imaging the marks of the first mark arrangement unit and the marks of the second mark arrangement unit by movement of the mounting head.
2. The component mounting device according to claim 1.