JP7747490B2 - Grinding equipment - Google Patents

Description

The present invention relates to a grinding device that grinds wafers held on a chuck table.

A grinding device that grinds wafers holds the wafer by suction on the holding surface of a chuck table and grinds the wafer with a grinding wheel while supplying grinding water (see, for example, Patent Document 1). After grinding is complete, a mixture of water and air is ejected from the holding surface of the chuck table, breaking the surface tension of the grinding water that has entered between the wafer and the holding surface and separating the wafer from the holding surface (see, for example, Patent Document 1). The mixture ejected from the holding surface passes through the interior of a porous member, causing the air and water to impact processing debris that has entered the porous member and eject it from the holding surface. However, the processing debris adheres to the underside of the wafer. Therefore, a cleaning mechanism that cleans the entire underside of the wafer has been proposed (see, for example, Patent Documents 2 and 3).

Furthermore, when the upper surface of a wafer held on the holding surface of the chuck table is suction-held by a holding pad and transported, there is a problem in that processing debris ejected from the holding surface can find its way around to the upper surface of the wafer and adhere to the suction surface of the holding pad. To address this problem, a configuration has been proposed in which the transport mechanism used to transport the ground wafer is equipped with a shower ring that sprays water in a circular pattern around the outside of the suction surface (see, for example, Patent Documents 4 and 5).

JP 2013-145776 A Japanese Patent Application Publication No. 11-031674 JP 2010-094785 A Japanese Patent Application Laid-Open No. 2000-208593 JP 2010-114353 A

However, in the case of a holding pad whose suction surface holds the entire top surface of the wafer by suction, even if water is sprayed from the shower ring, water can seep into the gap between the top surface of the wafer, which has unevenness due to grinding marks after grinding, and the flat surface of the suction surface of the holding pad, causing processing debris to adhere to the suction surface and the top surface of the wafer. Even in grinding machines equipped with a spinner cleaning unit that cleans the top surface of the wafer after grinding, there is the problem that it is difficult to remove processing debris that has adhered to the suction surface and the top surface of the wafer.

The present invention was developed in consideration of these problems, and aims to prevent processing debris from adhering to the top surface of a wafer when the wafer is released from the holding surface in a grinding device that grinds a wafer held on the holding surface of a chuck table.

The present invention provides a grinding device comprising: a chuck table including a porous member that suction-holds a wafer on a holding surface and a frame that exposes the holding surface and accommodates the porous member; a table support unit that has a support surface that supports the lower surface of the chuck table; a grinding mechanism that grinds the wafer suction-held by the holding surface with a grinding wheel; and a control unit, wherein the porous member has an annular barrier that rises from the lower surface toward the holding surface and does not reach the holding surface;
The frame body has a supply hole that supplies water to the center of the underside of the porous member and an annular fluid jetting portion that supplies fluid to the porous member outside the barrier, the table support portion has a water jetting portion that communicates with the supply hole and jets water from the center of the support surface, and a fluid jetting portion that communicates with the annular fluid jetting portion, and the control portion jets the water from the central portion of the holding surface via the water jetting portion and the supply hole, and jets water from the outer periphery of the holding surface via the fluid jetting portion and the annular fluid jetting portion, thereby cleaning the holding surface that is not holding a wafer .
The grinding device may include a holding pad that holds the wafer held by the holding surface, and a carrying-out mechanism that carries the wafer out of the holding surface, and the control unit may control the holding of the wafer, the water ejection unit to eject water from the center of the holding surface, and the holding pad holding the wafer to move in a direction away from the holding surface, thereby moving the wafer out of the holding surface, and the annular fluid ejection unit to eject water from the outer periphery of the holding surface that is not holding the wafer, thereby cleaning the holding surface .

The grinding device of the present invention sprays water from the central part of the holding surface through the water spray section and supply hole to separate the wafer from the holding surface, thereby reducing the risk of processing debris that has entered the outer periphery of the holding surface scattering and adhering to the top surface of the wafer or the holding surface of the holding pad.
Furthermore, the risk of processing debris adhering to the central portion of the underside of the wafer due to the water jetted from the water jetting portion is reduced, so there is no need to clean the central portion of the underside of the wafer after grinding.

FIG. 1 is a perspective view showing an example of a grinding device. FIG. 2 is a cross-sectional view schematically illustrating an example of a chuck table. 1 is a cross-sectional view schematically illustrating an example of a chuck table, a loading mechanism, and a loading/unloading mechanism. FIG. 10 is a cross-sectional view schematically showing a state in which a wafer is carried out from a chuck table. 10 is a perspective view showing an example of a lower surface cleaning mechanism that cleans the lower surface of the wafer and the suction surface of the holding pad. FIG.

The grinding device 1 shown in Figure 1 is a device that grinds a wafer 10 held on a chuck table 2 using a grinding mechanism 3.

The front of the grinding apparatus 1 is provided with cassette placement areas 61 and 62 on which cassettes 610 and 620 containing wafers 10 are placed. Cassette 610 contains, for example, wafers 10 before grinding, and cassette 620 contains, for example, wafers 10 after grinding.

A robot 63 is disposed behind the cassette placement area (+Y side) to load and unload wafers 10 into and from cassettes 610 and 620. The robot 63 includes a hand 631 that holds the wafer 10 by suction, an inversion drive unit 632 that inverts the hand 631, and an arm unit 633 that is connected to the inversion drive unit 632 and rotates and raises and lowers the hand 631.

A temporary placement mechanism 64 is provided within the range of motion of the hand 631, on which the wafer 10 is temporarily placed before grinding. The temporary placement mechanism 64 is equipped with a placement table 641 on which the wafer 10 is placed, and multiple positioning pins 642 arranged in an arc and movable radially toward the center of the placement table 641. With the wafer 10 placed on the placement table 641, the multiple positioning pins 642 move toward each other, allowing the wafer 10 to be aligned to a predetermined position.

A cleaning mechanism 65 for cleaning the ground wafer 10 is disposed within the range of motion of the hand 631, aligned in the X-axis direction with the temporary placement mechanism 64. The cleaning mechanism 65 includes a spinner table 651 that holds the ground wafer 10 by suction, a cleaning liquid nozzle 652 that sprays cleaning liquid onto the wafer 10 held on the spinner table 651, and an air nozzle 653 that sprays high-pressure air onto the cleaned wafer 10 to dry it.

The chuck table 2 comprises a porous member 21 having a holding surface 210 on its surface that holds the wafer 10 by suction, and a frame 22 that houses the porous member 21, with the holding surface 210 exposed from the inner periphery of the frame 22. The holding surface 210 and the upper surface 220 of the frame 22 are formed flush with each other.

Below the chuck table 2 is a table support section 23 having a support surface 230 that supports the underside of the chuck table 2. A rotating shaft 240 is connected to the lower part of the table support section 23, and the rotating shaft 240 is rotatably supported by a support plate 241. The support plate 241 is supported at least at three points by three support shafts 242 (only two are shown in Figure 1). Of these, at least two support shafts 242 have the function of adjusting the height of the chuck table 2 and thereby adjusting the inclination of the holding surface 210.

The chuck table 2 is driven by a horizontal movement mechanism 4 to move in the Y-axis direction. The horizontal movement mechanism 4 includes a ball screw 40 with a rotation axis in the Y-axis direction, a motor 41 that rotates the ball screw 40, a pair of guide rails 42 arranged parallel to the ball screw 40, and a slide plate 43 whose bottom makes sliding contact with the guide rails 42 and has an internal nut (not shown) that screws onto the ball screw 40. A support shaft 242 is provided on the top of the slide plate 43. When the ball screw 40 rotates, the slide plate 43 moves in the Y-axis direction, guided by the guide rails 42. As the slide plate 43 moves in the Y-axis direction, the chuck table 2 also moves in the Y-axis direction.

A thickness gauge 66 for measuring the thickness of the wafer 10 is disposed to the side of the movement path of the chuck table 2 in the Y-axis direction. The thickness gauge 66 includes a first measuring unit 661 that contacts the upper surface 220 of the frame 22 of the chuck table 2 to measure the height of that upper surface 220, and a second measuring unit 662 that contacts the upper surface 100 of the wafer 10 held on the holding surface 210 to measure the height of that upper surface 100. The thickness of the wafer 10 is calculated from the difference between the measurement values of the first measuring unit 661 and the second measuring unit 662.

A carry-in mechanism 71 is disposed near the temporary placement mechanism 64, which carries the wafer 10 from the placement table 641 onto the chuck table 2. The carry-in mechanism 71 includes a holding unit 740 that suction-holds the top surface 100 of the wafer 10 before grinding, an arm unit 731 to the tip of which the holding unit 740 is connected, an elevation drive unit 737 that raises and lowers the holding unit 740 and the arm unit 731, and a rotation drive unit (not shown) that rotates the holding unit 740 and the arm unit 731.

A carry-out mechanism 72 is disposed near the cleaning mechanism 65, which carries the ground wafer 10 from the chuck table 2 to the spinner table 651. The carry-out mechanism 72 includes a holder 740 that holds the top surface 100 of the ground wafer 10 by suction, an arm 731 to the tip of which the holder 740 is connected, an elevation drive unit 737 that raises and lowers the holder 740 and arm 731, and a rotation drive unit (not shown) that rotates the holder 740 and arm 731.

The grinding mechanism 3 includes a spindle 30 having a rotation axis extending in the Z-axis direction, a spindle rotation mechanism 31 that rotates the spindle 30, a spindle housing 32 that rotatably supports the spindle 30, a mount 33 connected to the lower end of the spindle 30, and a grinding wheel 34 attached to the mount 33. When the spindle rotation mechanism 31 rotates the spindle 30, the grinding wheel 34 also rotates. The grinding wheel 34 is composed of a base 340 fixed to the mount 33 and multiple grinding stones 341 fixed in a ring shape to the underside of the base 340.

The grinding mechanism 3 is supported by the grinding feed mechanism 5 so that it can be raised and lowered. The grinding feed mechanism 5 includes a ball screw 50 with a rotation axis in the Z-axis direction, a motor 51 that rotates the ball screw 50, a pair of guide rails 52 arranged parallel to the ball screw 50, a lift plate 53 whose sides are in sliding contact with the guide rails 52 and which has an internal nut (not shown) that screws onto the ball screw 50, and a holder 54 connected to the lift plate 53 and supports the spindle housing 32. When the ball screw 50 rotates, the lift plate 53 moves in the Z-axis direction, guided by the guide rails 52, and the grinding mechanism 3 also moves in the Z-axis direction.

The grinding device 1 is equipped with a control unit 8 that controls the chuck table 2, grinding mechanism 3, horizontal movement mechanism 4, grinding feed mechanism 5, robot 63, cleaning mechanism 65, thickness measuring device 66, carry-in mechanism 71, carry-out mechanism 72, etc.

As shown in FIG. 2, the lower end of the rotating shaft 240 is rotatably supported by a shaft support portion (rotary joint) 243. A driven pulley 244 is disposed around the rotating shaft 240, and a drive pulley 245 is disposed to the side of the driven pulley 244. The drive pulley 245 is driven by a motor 246. A belt 247 is wound around the drive pulley 245 and the driven pulley 244. When the drive pulley 245 is driven by the motor 246 and rotates, the rotational force is transmitted to the driven pulley 244 by the belt 247, causing the rotating shaft 240 to rotate, and the chuck table 2 to rotate.

A first flow path 251 and a second flow path 252 for passing fluid are formed through the frame 22, table support 23, rotation shaft 240, and shaft support 243. The upper end of the first flow path 251 opens to a supply hole 223 formed in the center of the recess 222 of the frame 22. The supply hole 223 is connected to the porous member 21 above it and supplies water to the center of the underside of the porous member 21. A water jet 231 is formed midway along the first flow path 251 at the center of the support surface 230 of the table support 23. The lower part of the first flow path 251 is connected to a central valve 253 through the shaft support 243. The central valve 253 is connected to a suction source 261, an air supply source 262, and a water supply source 263 via valves 254, 255, and 256.

The upper end of the second flow path 252 opens at an annular fluid ejection section 224 formed on the outer periphery of the recess 222 of the frame 22. A fluid ejection section 232 is formed midway along the second flow path 252, on the outer periphery of the water ejection section 231. The lower part of the second flow path 252 is connected to an annular valve 257 through the shaft support section 243. The annular valve 257 is connected to a suction source 261, an air supply source 262, and a water supply source 263 via valves 254, 255, and 256. That is, the first flow path 251 and the second flow path 252 converge at a common flow path 258 beyond the central valve 253 and the annular valve 257. A pressure gauge 259 is connected to the common flow path 258 to measure the pressure within the common flow path 258.

A ring-shaped barrier 225 is provided inside the porous member 21, rising from the underside of the porous member 21 toward the holding surface 210 but not reaching the holding surface 210. The barrier 225 divides the porous member 21 into a central region 226 and an annular region 227. The barrier 225 may also be formed to reach the holding surface 210.

3, the carry-in mechanism 71 and the carry-out mechanism 72 are configured in the same manner and will be described using the same reference numerals. The carry-in mechanism 71 and the carry-out mechanism 72 each include an arm 731, an elevation drive unit 737 that raises and lowers the arm 731, an annular support member 733 fixed to the arm 731, at least three pins 736 that have enlarged heads 734 and that fit loosely into through holes 735 formed in the annular support member 733, and a holder 740 connected to the lower ends of the pins 736. The pins 736 hang down with their enlarged heads 734 supported on the upper surface of the annular support member 733.
The holding part 740 includes a frame 741 to which the pins 736 are connected, and a holding pad 742 that is held from above and the sides by the frame 741. The holding pad 742 is formed of, for example, a porous material, and its lower surface serves as a suction surface 743 that suction-holds the upper surface 100 of the wafer 10.
The holding pad 742 may also be an edge clamp that supports the outer periphery of the wafer 10 .

An air flow path 751 is formed through the annular support member 733 and the frame body 741. The upper part of the air flow path 751 branches into two paths, one of which is connected to a suction source 753 via a valve 752, and the other to an air supply source 755 via a valve 754.

Next, the operation of the grinding apparatus 1 shown in Figure 1 when grinding the top surface 100 of a wafer 10 will be described. Multiple wafers 10 are stored inside the cassette 610 shown in Figure 1. Then, by rotating and raising and lowering the arm unit 633, the hand 631 of the robot 63 enters the inside of the cassette 610 and suction-holds one wafer 10. The hand 631 then retracts outside the cassette 610 and places the wafer 10 on the placement table 641 of the temporary placement mechanism 64. The positioning pins 642 then move toward each other, and the wafer 10 is aligned in a predetermined position.

Next, the arm unit 731 of the loading mechanism 71 pivots to move the holding unit 740 above the wafer 10 placed on the loading table 641. The lifting/lowering drive unit 737 then lowers the holding unit 740 and opens the valve 752 shown in FIG. 3 to apply suction force to the suction surface 743 of the holding pad 742, thereby suction-holding the upper surface 100 of the wafer 10. Next, the lifting/lowering drive unit 737 raises the holding unit 740, and then the swivel drive unit pivots the arm unit 731 to move the wafer 10 above the chuck table 2, which has been positioned in advance in the -Y direction. The lifting/lowering drive unit 737 then lowers the holding unit 740, and the wafer 10 is placed on the holding surface 210 of the chuck table 2. In the chuck table 2, by opening the central valve 253, the annular valve 257, and the valve 254, the first flow path 251 and the second flow path 252 are connected to the suction source 261, and a suction force is applied to the holding surface 210, sucking and holding the lower surface 101 of the wafer 10 on the holding surface 210. Next, the valve 752 is closed to release the suction force of the suction surface 743, and then the lifting and lowering drive unit 737 raises the holding unit 740, thereby separating the suction surface 743 from the upper surface 100 of the wafer 10.

Next, the horizontal movement mechanism 4 moves the chuck table 2 in the +Y direction to position the wafer 10 below the grinding mechanism 3. Then, the chuck table 2 rotates, driven by the motor 246. The spindle rotation mechanism 31 shown in FIG. 1 rotates the spindle 30 to rotate the grinding wheel 341. The grinding feed mechanism 5 then lowers the grinding mechanism 3, bringing the rotating grinding wheel 341 into contact with the top surface 100 of the wafer 10. This causes the top surface 100 of the wafer 10 to be ground. During grinding, the tip of the first measuring part 661 of the thickness gauge 66 is brought into contact with the top surface 220 of the frame 22, and the tip of the second measuring part 662 of the thickness gauge 66 is brought into contact with the top surface 100 of the wafer 10. The thickness of the wafer 10 is calculated from the difference between the measurements of the first measuring part 661 and the second measuring part 662. When the calculated thickness reaches the specified value, the grinding feed mechanism 5 raises the grinding mechanism 3, ending grinding.

Next, the horizontal movement mechanism 4 moves the chuck table 2 in the -Y direction. Then, under the control of the control unit 8, the arm unit 731 of the carry-out mechanism 72 is rotated to move the holding unit 740 above the wafer 10 held on the chuck table 2. Then, as shown in FIG. 3, under the control of the control unit 8, the lifting drive unit 737 lowers the holding unit 740, bringing the suction surface 743 closer to the ground upper surface 100 of the wafer 10. Then, when the suction surface 743 comes into contact with the upper surface 100, the valve 752 is opened under the control of the control unit 8, and the upper surface 100 of the wafer 10 is suction-held on the suction surface 743. Note that, although protective tape 11 is attached to the lower surface 101 of the wafer 10 in the example shown in FIG. 3, there are cases in which protective tape 11 is not attached.

Next, under the control of the control unit 8, the valve 254 is closed to release the suction force on the holding surface 210 of the chuck table 2, the annular valve 257 is also closed, and the central valve 253 and valve 256 are opened. This causes water from the water supply source 263 to pass through the common flow path 258 and rise up the first flow path 251, pass through the water ejection unit 231, and be ejected from the supply hole 223. The water then passes through the interior of the porous member 21 and is ejected from the center of the holding surface 210. This causes the wafer 10 to float slightly above the holding surface 210. Because a barrier 225 is formed in the porous member 21, it is possible to prevent water from flowing toward the periphery within the porous member 21.

In this way, water is ejected from the center of the holding surface 210, causing the protective tape 11 side to separate from the holding surface 210. Then, as shown in Fig. 4, the lifting and lowering drive unit 737 lifts the holding unit 740, which suction-holds the upper surface 100 of the wafer 10 on the suction surface 743 under the control of the control unit 8, and the wafer 10 is carried out from the chuck table 2.
Furthermore, the risk of processing debris adhering to the protective tape 11 on the underside of the wafer 10 due to the water jetted from the supply holes 223 is reduced, so there is no need to clean the central portion of the underside of the protective tape 11 after grinding.

Grinding debris generated by grinding the top surface 100 of the wafer 10 enters the gap between the holding surface 210 and the protective tape 11 from the outer periphery of the wafer 10, and accumulates on the outer periphery of the gap, but the grinding device 1 is provided with supply holes 223 that spray water only from the center, and the water used to separate the wafer 10 from the holding surface 210 is sprayed from the center of the holding surface 210, so it is possible to prevent the water from scattering the grinding debris and causing it to wrap around to the top surface 100. This reduces the risk of grinding debris adhering to the top surface 100 of the wafer 10.
Note that the water sprayed from the holding surface 210 separates the wafer 10 from the holding surface 210, and a water layer is formed between the holding surface 210 and the underside of the protective tape 11 on the wafer 10. In order to break the surface tension caused by this water layer, the holding part 740 that has been raised by the formation of the water layer may be rotated by the rotation drive part, and the water in the water layer may be caused to drip from the outer periphery of the holding surface 210 of the chuck table 2, thereby breaking the surface tension of the water, and then the lift drive part 737 may lift the holding part 740 and carry the wafer 10 out of the chuck table 2.

The wafer 10, now separated from the holding surface 210, is moved above the spinner table 651 of the cleaning mechanism 65 by the rotation of the arm unit 731. The lifting/lowering drive unit 737 then lowers the holding unit 740 to place the protective tape 11 side on the spinner table 651. After applying suction force on the spinner table, the lifting/lowering drive unit 737 raises the holding unit 740 to separate it from the wafer 10. The spinner table 651 then rotates, and cleaning liquid is sprayed from the cleaning liquid nozzle 652 toward the upper surface 100 of the wafer 10, thereby cleaning the upper surface 100. After the upper surface 100 has been cleaned, the upper surface 100 is dried by spraying high-pressure air from the air nozzle 653 toward the upper surface 100 of the wafer 10 while the spinner table 651 is rotating.

After the wafer 10 has been cleaned and dried, the arm 633 of the robot 63 is rotated and raised and lowered to suction-hold the top surface 100 of the wafer 10 with the hand 631. The hand 631 is then rotated and raised and lowered to enter a predetermined slot in the cassette 620, and the suction hold by the hand 631 is released, thereby storing the ground wafer 10 in the cassette 620.

In addition, after the wafer 10 is separated from the holding surface 210 of the chuck table 2 and transported to the spinner table 651, the holding surface 210 may be cleaned by closing the central valve 253 and opening the annular valve 257 to spray water from the annular fluid jetting portion 224 through the second flow path 252.

As shown in FIG. 5, a bottom cleaning mechanism 9 may be disposed within the movable range of the holding portion 740 of the unloading mechanism 72. The bottom cleaning mechanism 9 cleans the protective tape 11 attached to the bottom surface 101 of the wafer 10 and the suction surface 743 of the holding pad 742. This bottom cleaning mechanism 9 includes a first cleaning member 91 and a second cleaning member 92 that intersect horizontally. A shaft 93 is connected to the bottom of the intersection. The shaft 93 is driven by a motor 94. The first cleaning member 91 can be raised and lowered independently of the second cleaning member 92. A nozzle 95 is disposed parallel to the first cleaning member 91, and multiple nozzles 951 are aligned longitudinally of the nozzle 95 and open upward. The first cleaning member 91 is formed, for example, by a cleaning grindstone, and the second cleaning member 92 is formed, for example, by a brush made of nylon material. The second cleaning member 92 may also be a sponge.

When cleaning the suction surface 743 of the holding pad 742, the holding part 740 is positioned so that the center of the suction surface 743, which is not holding the wafer 10, is located above the shaft part 93. Then, with the top surface of the first cleaning member 91 positioned higher than the bristles of the brush of the second cleaning member 92, the motor 94 rotates the first cleaning member 91 and the second cleaning member 92. Cleaning liquid is also supplied to the nozzle 95, and the cleaning liquid is sprayed from the spray outlet 951. The holding part 740 is then lowered to bring the suction surface 743 of the holding pad 742 into contact with the rotating first cleaning member 91, thereby scraping off and removing any processing debris adhering to the suction surface 743.

On the other hand, when cleaning the protective tape 11 attached to the underside 101 of the wafer 10, the first cleaning member 91 is lowered and the bristles of the brush of the second cleaning member 92 are positioned higher than the upper surface of the first cleaning member 91. Then, with the holding unit 740 positioned so that the center of the wafer 10 held by suction on the suction surface 743 is positioned above the shaft 93, the motor 94 rotates the first cleaning member 91 and the second cleaning member 92. Furthermore, cleaning liquid is supplied to the nozzle 95 and ejected from the ejection port 951. The holding unit 740 is then lowered to bring the protective tape 11 into contact with the rotating second cleaning member 92, which cleans the suction surface 743 and removes processing debris.

Note that the frame 22 shown in Figure 2-4 is configured with a bottomed recess 222, but a bottomless cylindrical frame can also be used instead of this frame 22. In this case, the frame is formed in an annular shape to support the side of the porous member 21.

1: Grinding device 2: Chuck table 21: Porous member 210: Holding surface 22: Frame 220: Upper surface 222: Recess 223: Supply hole 224: Annular fluid jetting portion 225: Barrier 226: Central region 227: Annular region 23: Table support portion 230: Support surface 231: Water jetting portion 232: Fluid jetting portion 240: Rotating shaft 241: Support plate 242: Support shaft 243: Shaft support portion 244: Driven pulley 245: Drive pulley 246: Motor 247: Belt 251: First flow path, 252: Second flow path 253: Central valve 254, 255, 256: Valve 257: Annular valve 258: Common flow path 259: Pressure gauge 261: Suction source 262: Air supply source 263: Water supply source 3: Grinding mechanism 30: Spindle 31: Spindle rotation mechanism 32: Spindle housing 33: Mount 34: Grinding wheel 340: Base 341: Grinding wheel 4: Horizontal movement mechanism 40: Ball screw 41: Motor 42: Guide rail 43: Slide plate 5: Grinding feed mechanism 50: Ball screw 51: Motor 52: Guide rail 53: Lift plate 54: Holder 61, 62: Cassette placement area 610, 620: Cassette 63: Robot 631: Hand 632: Reversal drive unit 633: Arm unit 64: Temporary placement mechanism 641: Placement table 642: Positioning pin 65: Cleaning mechanism 651: Spinner table 652: Cleaning liquid nozzle 653: Air nozzle 66: Thickness measuring device 661: First measurement unit 662: Second measuring unit 71: Carry-in mechanism 72: Carry-out mechanism 721: Holding pad 722: Arm unit 731: Arm unit 733: Annular support member 734: Head 735: Through hole 736: Pin 737: Lifting drive unit 740: Holding unit 741: Frame 742: Holding pad 743: Suction surface 751: Air flow path 752: Valve 753: Suction source 754: Valve 755: Air supply source 8: Control unit 9: Lower surface cleaning mechanism 91: First cleaning member 92: Second cleaning member 93: Shaft 94: Motor 95: Nozzle 951: Spout 10: Wafer 100: Upper surface 101: Lower surface 11: Protective tape

Claims (2)

A grinding device comprising: a chuck table including a porous member that suction-holds a wafer on a holding surface and a frame that exposes the holding surface and houses the porous member; a table support unit that includes a support surface that supports a lower surface of the chuck table; a grinding mechanism that grinds the wafer suction-held by the holding surface with a grinding wheel; and a control unit,
the porous member includes an annular barrier that rises from a lower surface toward the holding surface and does not reach the holding surface;
the frame includes a supply hole for supplying water to the center of the lower surface of the porous member, and an annular fluid jetting portion for supplying fluid to the porous member outside the barrier;
the table support portion includes a water jetting portion that communicates with the supply hole and jets water from the center of the support surface, and a fluid jetting portion that communicates with the annular fluid jetting portion ;
The control unit causes water to be ejected from the central portion of the holding surface via the water ejection unit and the supply hole to separate the wafer from the holding surface, and causes water to be ejected from the outer periphery of the holding surface via the fluid ejection unit and the annular fluid ejection unit to clean the holding surface that is not holding a wafer.
Grinding equipment. a holding pad for holding a wafer held by the holding surface, and a carrying-out mechanism for carrying out the wafer from the holding surface;
2. The grinding device of claim 1, wherein the control unit controls the holding pad to hold the wafer, the water jetting unit to jet water from the center of the holding surface, and the holding pad holding the wafer in a direction to move it away from the holding surface, thereby separating the wafer from the holding surface, and the annular fluid jetting unit to jet water from the outer periphery of the holding surface where the wafer is not being held, thereby cleaning the holding surface .