JP7809127B2 - Wiring formation method - Google Patents

Description

The present invention relates to a wiring formation method that forms wiring using a metal-containing liquid containing metal fine particles.

The following patent document describes a technology for forming wiring using a metal-containing liquid that contains metal microparticles.

JP 2012-084566 A

When wiring is formed using a metal-containing liquid containing metal microparticles, the metal-containing liquid is layered to form the wiring. Therefore, the objective of this specification is to properly form wiring by layering the metal-containing liquid.

In order to solve the above-mentioned problems, this specification discloses a wiring formation method including: a first discharging step of discharging a metal-containing liquid containing metal fine particles in a first array pattern consisting of an array of ink dots in multiple rows extending in a predetermined direction; and a second discharging step of discharging the metal-containing liquid onto the metal-containing liquid discharged in the first discharging step in a second array pattern obtained by removing one row of ink dots located at an end of the first array pattern in the predetermined direction from the first array pattern, the second discharging step being a position shifted in the predetermined direction from the discharge position of the metal-containing liquid in the first discharging step by a distance corresponding to an interval narrower than the pitch of the ink dots, wherein the first discharging step is a discharging step for odd-numbered layers and the second discharging step is a discharging step for even-numbered layers, the metal-containing liquid is discharged at different discharge positions for the odd-numbered layers and the even-numbered layers, and wiring is formed by stacking multiple layers of the metal-containing liquid, wherein the metal-containing liquid is discharged onto the odd-numbered layers of the multiple layers in the first array pattern and the metal-containing liquid is discharged onto the even-numbered layers of the multiple layers in the second array pattern .

In the present disclosure, metal-containing liquid is ejected in a first array pattern consisting of an array of multiple rows of ink dots extending in a predetermined direction. Then, metal-containing liquid is ejected onto the metal-containing liquid in an array pattern obtained by removing one row of ink dots located at the end of the first array pattern in the predetermined direction, at a position shifted in the predetermined direction from the ejection position of the first array pattern by a distance corresponding to an interval narrower than the pitch of the ink dots. Furthermore, as the array pattern of the metal ink for the Nth layer, a first array pattern consisting of an array of multiple rows of ink dots extending in the predetermined direction is calculated. Then, as the array pattern of the metal ink for the (N+1)th layer, an array pattern obtained by removing one row of ink dots located at the end of the first array pattern in the predetermined direction and removing one row of ink dots located at the end in a direction intersecting the predetermined direction from the first array pattern is calculated, shifted in the predetermined direction from the ejection position of the first array pattern by a distance corresponding to an interval narrower than the pitch of the ink dots. This allows the metal-containing liquid to be layered to form appropriate wiring.

FIG. 1 is a diagram showing a circuit forming device. FIG. 2 is a block diagram showing a control device. FIG. 2 is a cross-sectional view showing a circuit in a state where a resin laminate is formed. FIG. 2 is a cross-sectional view showing a circuit in a state where wiring is formed on a resin laminate. FIG. 2 is a diagram showing a nozzle surface of an inkjet head. FIG. 10 is a diagram showing an arrangement pattern. FIG. 10 is a diagram showing an arrangement pattern. 1A and 1B are diagrams showing arrangement patterns and wiring of odd-numbered and even-numbered layers; FIG. 1 is a diagram showing conventional wiring. FIG. 10 is a diagram showing an arrangement pattern of odd-numbered layers. FIG. 10 is a diagram showing an arrangement pattern of even-numbered layers. 12A and 12B are diagrams showing wiring formed by the arrangement pattern of FIG. 10 and the arrangement pattern of FIG. 11; FIG. 10 is a diagram showing an arrangement pattern of odd-numbered layers. FIG. 10 is a diagram showing an arrangement pattern of even-numbered layers.

Figure 1 shows a circuit forming apparatus 10. The circuit forming apparatus 10 includes a conveying device 20, a first modeling unit 22, a second modeling unit 24, and a control device (see Figure 2) 28. The conveying device 20, the first modeling unit 22, and the second modeling unit 24 are arranged on a base 29 of the circuit forming apparatus 10. The base 29 is generally rectangular, and in the following description, the longitudinal direction of the base 29 will be referred to as the X-axis direction, the lateral direction of the base 29 as the Y-axis direction, and the direction perpendicular to both the X-axis and Y-axis directions as the Z-axis direction. The Z-axis direction is the same as the vertical direction.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 29 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. The X-axis slide mechanism 30 also includes an electromagnetic motor (see Figure 2) 38, which is driven to move the X-axis slider 36 to any position in the X-axis direction. The Y-axis slide mechanism 32 also includes a Y-axis slide rail 50 and a table 52. The Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. A table 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see Figure 2) 56, and the table 52 moves to any position in the Y-axis direction when driven by the electromagnetic motor 56. As a result, the table 52 moves to any position on the base 29 when driven by the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The table 52 has a base 60, a holding device 62, and an elevating device (see Figure 2) 64. The base 60 is formed in a flat plate shape, and a pallet 70 (see Figure 3) is placed on its upper surface. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. The holding devices 62 clamp both edges of the pallet 70 in the X-axis direction when placed on the base 60, thereby holding the pallet 70 in a fixed position. The elevating device 64 is disposed below the base 60 and raises and lowers the base 60.

The first modeling unit 22 is a unit that models the wiring of the circuit board and has a first printing unit 72 and a baking unit 74. The first printing unit 72 has an inkjet head (see Figure 2) 76 that ejects metal ink in a linear pattern. The metal ink is made by dispersing nanometer-sized metal particles, such as silver particles, in a solvent. The surfaces of the metal particles are coated with a dispersant to prevent aggregation in the solvent. The inkjet head 76 ejects the metal ink from multiple nozzles using, for example, a piezoelectric method using piezoelectric elements.

The baking unit 74 has an infrared irradiation device 78 (see Figure 2). The infrared irradiation device 78 is a device that irradiates the ejected metal ink with infrared rays, and the metal ink irradiated with infrared rays is baked to form wiring. Note that baking of metal ink is a phenomenon in which energy is applied, causing the solvent to evaporate and the protective film on the metal particles, i.e., the dispersant, to decompose, and the metal particles to come into contact or fuse together, thereby increasing conductivity. Then, when the metal ink is baked, metal wiring is formed.

The second modeling unit 24 is a unit that models the resin layer of the circuit board, and has a second printing unit 84 and a curing unit 86. The second printing unit 84 has an inkjet head (see Figure 2) 88 that ejects ultraviolet-curable resin. The ultraviolet-curable resin is a resin that hardens when exposed to ultraviolet light. The inkjet head 88 may be, for example, a piezo-type inkjet head using a piezoelectric element, or a thermal-type inkjet head that heats the resin to generate bubbles and ejects the resin from multiple nozzles.

The curing unit 86 has a planarizing device (see Figure 2) 90 and an irradiation device (see Figure 2) 92. The planarizing device 90 flattens the top surface of the UV-curable resin ejected by the inkjet head 88. For example, it makes the thickness of the UV-curable resin uniform by leveling the surface of the UV-curable resin and scraping off excess resin with a roller or blade. The irradiation device 92 is equipped with a mercury lamp or LED as a light source and irradiates the ejected UV-curable resin with ultraviolet light. This hardens the ejected UV-curable resin, forming a resin layer.

As shown in FIG. 2, the control device 28 also includes a controller 110 and multiple drive circuits 112. The multiple drive circuits 112 are connected to the electromagnetic motors 38, 56, holding device 62, lifting device 64, inkjet head 76, infrared irradiation device 78, inkjet head 88, flattening device 90, and irradiation device 92. The controller 110 is primarily a computer, including a CPU, ROM, RAM, etc., and is connected to the multiple drive circuits 112. As a result, the operation of the transport device 20, first modeling unit 22, and second modeling unit 24 is controlled by the controller 110.

In the circuit forming device 10, with the above-described configuration, a resin laminate is formed on the pallet 70 placed on the base 60 of the table 52, and wiring is formed on the upper surface of the resin laminate, thereby forming a circuit board.

Specifically, when the pallet 70 is set on the base 60 of the table 52, the table 52 moves to below the second modeling unit 24. Then, in the second modeling unit 24, a resin laminate 122 is formed on the pallet 70, as shown in FIG. 3. The resin laminate 122 is formed by repeatedly ejecting ultraviolet curable resin from the inkjet head 88 and irradiating the ejected ultraviolet curable resin with ultraviolet light by the irradiation device 92.

More specifically, in the second printing section 84 of the second modeling unit 24, the inkjet head 88 dispenses a thin film of UV-curable resin onto the top surface of the pallet 70. Then, once the UV-curable resin has been dispensed in a thin film, the UV-curable resin is flattened by the flattening device 90 in the curing section 86 so that the film thickness of the UV-curable resin is uniform. Then, the irradiation device 92 irradiates the thin film of UV-curable resin with ultraviolet light. This forms a thin film resin layer 124 on the pallet 70.

Next, the inkjet head 88 ejects a thin film of UV-curable resin onto the thin-film resin layer 124. The thin-film UV-curable resin is then flattened by the flattening device 90, and the irradiation device 92 irradiates the ejected thin-film UV-curable resin with UV light, thereby laminating thin-film resin layers 124 on top of each other. In this way, the ejection of UV-curable resin onto the thin-film resin layer 124 and the irradiation with UV light are repeated, laminating multiple resin layers 124 and forming the resin laminate 122.

Next, once the resin laminate 122 is formed, the table 52 moves below the first modeling unit 22. Then, in the first printing section 72 of the first modeling unit 22, the inkjet head 76 ejects metal ink 130 in lines in accordance with the circuit pattern onto the upper surface of the resin laminate 122, as shown in FIG. 4. Next, in the baking section 74 of the first modeling unit 22, the infrared irradiation device 78 irradiates infrared rays onto the metal ink 130 ejected in accordance with the circuit pattern. This bakes the metal ink 130, and wiring 132 is formed on the upper surface of the resin laminate 122.

In this way, the resin laminate 122 is formed on the pallet 70 in the second modeling unit 24, and the wiring 132 is formed on the resin laminate 122 in the first modeling unit 22, thereby forming the circuit board 136. The wiring 132 formed on the resin laminate 122 is formed by layering metal ink 130. More specifically, a first layer of metal ink 130 is ejected onto the top surface of the resin laminate 122, and the first layer of metal ink 130 is irradiated with infrared rays. This causes the first layer of metal ink 130 to bake, forming a thin metal film of the first layer. Next, a second layer of metal ink 130 is ejected onto the first layer of thin metal film, and the second layer of metal ink 130 is irradiated with infrared rays. This causes the second layer of metal ink 130 to bake, forming a thin metal film of the second layer. In this way, by repeatedly ejecting the metal ink 130 and irradiating with infrared rays, thin metal films are layered and wiring 132 of a predetermined thickness is formed.

However, when metal ink is ejected from the inkjet head 76, the metal ink is ejected from multiple nozzle holes. However, misalignment of the metal ink dots (hereinafter referred to as "ink dots") ejected from the multiple nozzle holes may result in disconnected wiring. Specifically, as shown in FIG. 5 , multiple nozzle holes 152 are formed in the nozzle surface 150 of the inkjet head 76. The nozzle surface 150 is generally rectangular and is disposed on the inkjet head 76 with its longitudinal direction facing the X direction. The multiple nozzle holes 152 are formed in two rows extending in the X direction on the nozzle surface 150. In other words, the longitudinal direction of the multiple nozzle holes 152 is the longitudinal direction of the nozzle surface 150, which is the X direction. The multiple nozzle holes 152 aligned in the X direction are formed at an equal pitch. In other words, the multiple nozzle holes 152 aligned in the X direction are formed so that the spacing between adjacent nozzle holes 152 is the same. When the inkjet head 76 ejects the metal ink, the inkjet head 76 moves in the Y direction, ejecting the metal ink in an array pattern consisting of multiple rows of ink dots.

Specifically, as shown in FIG. 6, for example, the metal ink is ejected in an array pattern consisting of multiple rows of ink dots 160 extending in the X direction. The array pattern is designed to create overlapping areas of the ink dots 160 (hatched in FIG. 5). When the array pattern is designed, the ejection pitch of the metal ink in the Y direction is calculated based on the diameter of the ink dots 160, i.e., the diameter of the metal ink droplets at which the ink lands. The metal ink is then ejected at the calculated ejection pitch, resulting in an array pattern with overlapping areas of the ink dots 160. The array pattern is the array pattern of one layer of metal ink, and multiple layers of metal ink ejected in this array pattern are stacked to form wiring. The ejection position of the metal ink in each of the multiple layers is the same. In other words, the metal ink is ejected at a predetermined position according to the array pattern. The metal ink is then irradiated with infrared light to form the first layer of thin metal film. Next, metal ink is ejected onto the first metal thin film layer in accordance with an array pattern at the same positions as the first metal ink ejection positions, and infrared light is irradiated, forming a second metal thin film layer. In this way, by repeating the ejection of metal ink at the same positions according to the array pattern and the irradiation of infrared light, metal thin films are stacked and wiring is formed.

However, misalignment of the ink dots 160 may occur due to tolerances in the positional accuracy of the multiple nozzle holes formed in the nozzle surface 150 of the inkjet head 76. Furthermore, when a large printing area is divided and printed using a single inkjet head or multiple inkjet heads, misalignment of the ink dots 160 may occur at the joints between the divided prints. In such cases, if the misalignment of the ink dots 160 becomes greater than the overlapping area of the ink dots 160, there is a risk of an open circuit being formed. Specifically, even when metal ink is ejected according to an array pattern, misalignment of the ink dots 160 results in gaps 166 without overlapping areas (hatched), as shown in Figure 7. Therefore, when the ejected metal ink is irradiated with infrared rays, a discontinuous metal thin film with gaps 166 is formed. As described above, even if metal ink is repeatedly ejected at the same position according to the array pattern and irradiated with infrared rays, gaps 166 remain, resulting in an open circuit.

In consideration of this, wiring is formed by differentiating the ejection positions of the metal ink for odd-numbered layers from the ejection positions of the metal ink for even-numbered layers. Specifically, for example, when forming the first layer of metal thin film, metal ink is ejected at a predetermined position according to an array pattern, resulting in the metal ink being ejected in an array pattern consisting of multiple rows of ink dots 160a, as shown in FIG. 8. The metal ink is then irradiated with infrared rays, forming the first layer of metal thin film 168a. Note that gaps 166a are formed in the first layer of metal thin film 168a. Furthermore, when forming the second layer of metal thin film, metal ink is ejected according to the array pattern at a position shifted 0.5 pixels in the X direction from the ejection position of the metal ink for the first layer. As a result, the metal ink is ejected in an array pattern consisting of multiple rows of ink dots 160b, as shown in FIG. 8. The metal ink is then irradiated with infrared rays, forming the second layer of metal thin film 168b.

A gap 166b also occurs in the second metal thin film 168b. Thus, when the first metal thin film 168a and the second metal thin film 168b are described individually, gaps 166a and 166b occur between the metal thin films 168a and 168b, as shown in FIG. 8. However, in reality, the second metal thin film 168b is stacked on top of the first metal thin film 168a, resulting in a gapless wiring 170, as shown in FIG. 8. One pixel is the formation pitch of the multiple nozzle holes 152 extending in the X direction. In other words, one pixel is the distance between the centers of two adjacent nozzle holes 152 of the multiple nozzle holes 152 extending in the X direction, and is the distance between the centers of two adjacent ink dots of the multiple ink dots 160 extending in the X direction. Furthermore, in the above explanation, the wiring 170 is formed by stacking two layers of metal thin films 168a, b, but if, for example, seven layers of metal thin films are stacked to form the wiring, the metal ink for the first, third, fifth, and seventh layers is ejected at a predetermined position according to an array pattern, and the metal ink for the second, fourth, and sixth layers is ejected at a position shifted 0.5 pixels in the X direction from the predetermined position according to an array pattern. In this way, by ejecting the metal ink for odd-numbered layers at a predetermined position according to an array pattern, and the metal ink for even-numbered layers at a position shifted 0.5 pixels in the X direction from the predetermined position according to an array pattern, wiring without gaps can be formed.

However, when metal ink is ejected onto the odd-numbered metal thin film layers according to an array pattern at a predetermined position, and metal ink is ejected onto the even-numbered metal thin film layers according to an array pattern at a position shifted 0.5 pixels in the X direction from the predetermined position, the width of the wiring may increase depending on the direction in which the wiring extends. Specifically, even if metal ink is ejected onto the even-numbered metal thin film layers at a position shifted 0.5 pixels in the X direction from the ejection position of the odd-numbered metal ink, as shown in Figure 9, the length of wiring 170a extending in the X direction increases by a distance equivalent to 0.5 pixels, but the width (= W1) does not increase. On the other hand, when metal ink is ejected onto the even-numbered metal thin film layers at a position shifted 0.5 pixels in the X direction from the ejection position of the odd-numbered metal ink, the length of wiring 170b extending in the Y direction remains unchanged, but the width (= W2) increases by a distance equivalent to 0.5 pixels. In this way, the width dimension (= W2) of the wiring 170b extending in the Y direction is wider than the width dimension (= W1) of the wiring 170a extending in the X direction by a distance equivalent to 0.5 pixels.

As such, if the wiring width increases depending on the direction in which the wiring extends, the thicker wiring may result in a short circuit. Furthermore, forming a wiring with a width of W2 when the wiring width is W1 in the circuit design is undesirable, as it results in wiring not being formed as designed. In light of this, the array pattern for even-numbered layers, in which metal ink is ejected at a position shifted 0.5 pixels in the X direction from the ejection position of the metal ink for odd-numbered layers, is an array pattern obtained by removing a row of ink dots 160 located at the edge in the X direction from the array pattern for odd-numbered layers. Specifically, for example, array pattern 180a for odd-numbered layers is shown in Figure 10. Then, a row of ink dots 160c (dotted line in Figure 10) located at the edge in the X direction is removed from array pattern 180a for odd-numbered layers. As a result, array pattern 180b for even-numbered layers, as shown in Figure 11, is an array pattern obtained by removing a row of ink dots 160c located at the edge in the X direction from array pattern 180a for odd-numbered layers. Then, by ejecting the metal ink in odd-numbered layers at a predetermined position according to array pattern 180a (Figure 10), and the metal ink in even-numbered layers at a position shifted 0.5 pixels in the X direction from the predetermined position according to array pattern 180b (Figure 11), it is possible to form wires of the same width regardless of the direction in which the wires extend. In other words, as shown in Figure 12, the width (= W1) of wire 170b extending in the Y direction can be made the same as the width (= W1) of wire 170a extending in the X direction.

However, by making the even-layer array pattern 180b an array pattern in which one row of ink dots 160c located at the end in the X direction is removed from the odd-layer array pattern 180a, the width of the wiring can be made the same, but the electrical quality of the wiring changes depending on the direction in which the wiring extends. Specifically, when the even-layer array pattern 180b is an array pattern in which one row of ink dots 160c located at the end in the X direction is removed from the odd-layer array pattern 180a, one row of ink dots 160c in the width direction (X direction) is removed from the wiring 170b extending in the Y direction. On the other hand, one row of ink dots 160c in the length direction (X direction) is removed from the wiring 170a extending in the X direction. In other words, the ink dots 160c in the width direction (Y direction) are not removed from the wiring 170a extending in the X direction. For this reason, the cross-sectional area in the width direction of the wiring 170b extending in the Y direction is smaller than the cross-sectional area of the wiring 170a extending in the X direction. In this way, if the cross-sectional area in the width direction of the wiring 170b extending in the Y direction differs from the cross-sectional area of the wiring 170a extending in the X direction, the resistance value and other properties will differ depending on the direction in which the wiring extends, and the electrical quality of the wiring will change.

In consideration of this, the array pattern for the even-numbered layers is an array pattern in which not only a row of ink dots 160c located at the end in the X direction is removed from the array pattern 180a for the odd-numbered layers, but also a row of ink dots located at the end in the X direction. Specifically, as shown in Figure 13, a row of ink dots 160c located at the end in the X direction is removed from the array pattern 180a for the odd-numbered layers, and a row of ink dots 160d located at the end in the Y direction (shown by the dashed-dotted line in Figure 10) are also removed. As a result, as shown in Figure 14, the array pattern 180c for the even-numbered layers is an array pattern in which not only a row of ink dots 160c located at the end in the X direction is removed from the array pattern 180a for the odd-numbered layers, but also a row of ink dots 160d located at the end in the Y direction. Then, by ejecting the metal ink for odd-numbered layers at a predetermined position according to array pattern 180a (Figure 13), and the metal ink for even-numbered layers at a position shifted 0.5 pixels in the X direction from the predetermined position according to array pattern 180c (Figure 14), it is possible to make the cross-sectional area of the wiring in the width direction the same regardless of the direction in which the wiring extends. This makes it possible to make the electrical quality of wiring 170b extending in the Y direction the same as the electrical quality of wiring 170a extending in the X direction. In other words, wiring with the same electrical quality can be formed regardless of the direction in which the wiring extends.

As shown in FIG. 2, the controller 110 of the control device 28 has a first calculation unit 200, a second calculation unit 202, a first ejection unit 204, and a second ejection unit 206. The first calculation unit 200 is a functional unit that allows the controller 110 to calculate the odd-layer array pattern 180a, which consists of an array of multiple rows of ink dots. The second calculation unit 202 is a functional unit that removes one column of ink dots 160c and one row of ink dots 160d from the odd-layer array pattern 180a and calculates an array pattern shifted 0.5 pixels in the X direction from the ejection position of the metal ink for the odd layer as the even-layer array pattern 180c. The first ejection unit 204 is a functional unit that ejects metal ink according to the odd-layer array pattern 180a. The second ejection unit 206 is a functional unit for ejecting metal ink onto the metal ink ejected in the odd-numbered layers, at a position shifted 0.5 pixels in the X direction from the ejection position of the metal ink in the odd-numbered layers, according to the array pattern 180c for the even-numbered layers.

In the above embodiment, the control device 28 is an example of an information processing device. The nozzle hole 152 is an example of a nozzle hole. The first calculation unit 200 is an example of a first calculation unit. The second calculation unit 202 is an example of a second calculation unit. Furthermore, the process performed by the first discharge unit 204 is an example of a first discharge process. The process performed by the second discharge unit 206 is an example of a second discharge process.

The present invention is not limited to the above-described embodiment, and can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above-described embodiment, the metal ink for the even-numbered layers is ejected at a position shifted by 0.5 pixels in the X direction from the ejection position of the metal ink for the odd-numbered layers according to array pattern 180c, which is obtained by removing one column of ink dots 160c and one row of ink dots 160d from array pattern 180a for the odd-numbered layers. On the other hand, the metal ink for the even-numbered layers may be ejected at a position shifted by 0.5 pixels in the X direction from the ejection position of the metal ink for the odd-numbered layers according to array pattern 180b, which is obtained by removing one column of ink dots 160c from array pattern 180a for the odd-numbered layers. In such a case, although the electrical quality of the wiring varies depending on the direction in which the wiring extends, wiring of the same width can be formed regardless of the direction in which the wiring extends.

In addition, in the above embodiment, metal ink is ejected in accordance with the even-layer array pattern 180c at a position shifted 0.5 pixels in the X direction from the ejection position of the odd-layer metal ink, but the amount of shift need only be narrower than 1 pixel. Therefore, metal ink should be ejected in accordance with the even-layer array pattern 180c at a position shifted in the X direction by a distance greater than 0 pixels and narrower than 1 pixel from the ejection position of the odd-layer metal ink.

In addition, in the above embodiment, the array pattern is calculated in the controller 110 of the control device 28, and the operation of the first modeling unit 22 is controlled so that metal ink is ejected according to the calculated array pattern. Alternatively, the array pattern may be calculated in an information processing device different from the control device 28. The array pattern calculated in the information processing device may then be input to the control device 28, and the control device 28 may control the operation of the first modeling unit 22 so that metal ink is ejected according to the input array pattern. In other words, the information processing device may include the first calculation unit 200 and the second calculation unit 202, and the controller 110 of the control device 28 may include the first ejection unit 204 and the second ejection unit 206.

In addition, in the above examples, metal ink for forming wiring is used as the metal-containing liquid, but various metal-containing liquids can be used as long as they contain metal microparticles. Specifically, for example, a conductive paste in which micrometer-sized metal microparticles are dispersed in a solvent can be used as the metal-containing liquid.

28: Control device (information processing device) 152: Nozzle hole 200: First calculation unit 202: Second calculation unit 204: First discharge unit (first discharge process) 206: Second discharge unit (second discharge process)

Claims (3)

a first ejection step of ejecting a metal-containing liquid containing metal fine particles in a first arrangement pattern consisting of an arrangement of ink dots in a plurality of rows extending in a predetermined direction;
a second ejection step of ejecting the metal-containing liquid onto the metal-containing liquid ejected in the first ejection step, in a second arrangement pattern obtained by removing one row of ink dots located at an end in the predetermined direction from the first arrangement pattern, at a position shifted in the predetermined direction by a distance corresponding to an interval narrower than the pitch of the ink dots from the ejection position of the metal-containing liquid in the first ejection step;
Including,
the first discharge step is a discharge step for an odd-numbered layer,
the second discharge step is a discharge step for an even-numbered layer,
The metal-containing liquid is discharged at different discharge positions for odd-numbered layers and even-numbered layers, and wiring is formed by stacking multiple layers of the metal-containing liquid .
The wiring forming method , wherein the metal-containing liquid is discharged onto odd-numbered layers of the plurality of layers in the first arrangement pattern, and onto even-numbered layers of the plurality of layers in the second arrangement pattern . The second discharge step includes:
2. The wiring formation method according to claim 1, wherein the metal-containing liquid is ejected onto the metal-containing liquid ejected in the first ejection process in an arrangement pattern obtained by removing not only the one column of ink dots from the first arrangement pattern but also one row of ink dots located at the end in a direction intersecting the specified direction. The wiring formation method described in claim 1 or claim 2, wherein the predetermined direction is the longitudinal direction of an array of nozzle holes that eject the metal-containing liquid.