JP7811238B2 - Surface height distribution measuring method and device - Google Patents

Description

The present invention relates to a surface height distribution measurement method and a surface height distribution measurement device for measuring the surface height distribution of a disk-shaped measurement object.

A shape measurement method for measuring the surface height of a disk-shaped object is disclosed, for example, in Patent Document 1. The flatness measurement method disclosed in Patent Document 1 includes three support parts for supporting the disk-shaped object at three points, a pair of capacitance-type displacement sensors for measuring the distance from the top and bottom of the object to the top and bottom surfaces of the object, an elevator and rotation device, and a computer. The elevator and rotation device lifts the object, rotates it by a predetermined angle, and then lowers it to be supported by the support parts. A line passing through the center of the object is scanned and measured with each of the pair of capacitance-type displacement sensors. The computer calculates the thickness of the object based on the measured values on the top and bottom surfaces. The object is then returned to the elevator and rotation device, and the elevator and rotation device lifts, rotates, and lowers the object to scan and measure the next line.

Japanese Patent Application Laid-Open No. 2003-75147

However, the flatness measurement method disclosed in Patent Document 1 involves scanning and measuring one straight line on the way from the elevator and rotation device, and then returning to the elevator and rotation device on the way back to scan and measure the next straight line, so there is room for improvement in terms of shortening the measurement time.

The present invention was made in consideration of the above circumstances, and its purpose is to provide a surface height distribution measurement method and device that can shorten measurement time.

After extensive investigation, the inventors have found that the above object can be achieved by the present invention described below. That is, a surface height measurement method according to one aspect of the present invention is a method for measuring a surface height distribution of a disk-shaped measurement target, comprising: a first measurement step of measuring a first surface height distribution on a first straight line of the measurement target by using a displacement meter that measures the distance to the surface of the measurement target while moving the measurement target relative to a first position from the first position to the second position at mutually different positions; a first rotation step of rotating the measurement target by a predetermined angle in a circumferential direction at the second position after the first measurement step is completed; a second measurement step of measuring a second surface height distribution on a second straight line of the measurement target by using the displacement meter while moving the measurement target relative to the displacement meter between the second position and the first position; and a second rotation step of rotating the measurement target by the predetermined angle in the circumferential direction at the first position after the second measurement step is completed.

This surface height distribution measurement method measures each surface height distribution on both the outbound path from the first position to the second position and the inbound path from the second position to the first position, thereby shortening the measurement time.

In another aspect, in the above-described surface height distribution measurement method, the displacement meter includes a first displacement meter that measures a first distance to one surface of the measurement object, and a second displacement meter that measures a second distance to the other surface of the measurement object that faces the one surface, and the first measurement step measures the surface height distributions of the one surface and the other surface as the first surface height distribution, and the second measurement step measures the surface height distributions of the one surface and the other surface as the second surface height distribution.

This surface height distribution measurement method includes first and second displacement meters that are connected to the object to be measured, allowing the surface height distributions of one surface and the other surface of the object to be measured simultaneously.

In another aspect, in the above-described surface height distribution measurement method, the center around which the measurement object at the first position is rotated by a predetermined angle in the circumferential direction, the center around which the measurement object at the second position is rotated by a predetermined angle in the circumferential direction, and the center of the disk-shaped measurement object are aligned on a straight line.

This provides a surface height distribution measurement method for measuring the surface height distribution when the centers are aligned in a straight line.

In another aspect, in the above-mentioned surface height distribution measurement method, the displacement meter is positioned so as to pass through the center of the disk-shaped measurement object.

This provides a surface distribution measurement method in which the displacement meter is positioned at a position that passes through the center of the disk-shaped measurement object.

A surface height distribution measuring device according to another aspect of the present invention is a device for measuring the surface height distribution of a disk-shaped measurement object, and includes a displacement meter that measures the distance to the surface of the measurement object, a first rotating unit that is disposed at a first position and rotates the measurement object by a predetermined angle in the circumferential direction, a second rotating unit that is disposed at a second position different from the first position and rotates the measurement object by the predetermined angle in the circumferential direction, and a moving unit that moves the measurement object and the displacement meter relatively between the first and second positions.

Such a surface height distribution measuring device measures each surface height distribution on both the outbound path from the first position to the second position and the inbound path from the second position to the first position, thereby shortening the measurement time.

In another aspect, in the above-mentioned surface height distribution measuring device, the displacement meter includes a first displacement meter that measures a first distance to one surface of the measurement object, and a second displacement meter that measures a second distance to the other surface of the measurement object that faces the one surface.

This surface height distribution measurement method includes first and second displacement meters that are connected to the object to be measured, allowing the surface height distributions of one surface and the other surface of the object to be measured simultaneously.

In another aspect, in the above-mentioned surface height distribution measuring device, the center around which the measurement object at the first position is rotated by a predetermined angle in the circumferential direction, the center around which the measurement object at the second position is rotated by a predetermined angle in the circumferential direction, and the center of the disk-shaped measurement object are aligned on a straight line.

This makes it possible to provide a surface height distribution measuring device that measures the surface height distribution when the centers are aligned in a straight line.

In another aspect, in the above-mentioned surface height distribution measuring device, the displacement meter is provided at a position that passes through the center of the disk-shaped measurement object.

This allows for the provision of a surface distribution measuring device in which the displacement meter is positioned so as to pass through the center of the disk-shaped measurement object.

The surface height distribution measurement method and surface height distribution measurement device of the present invention can shorten measurement time.

1A and 1B are diagrams for explaining the structural configuration of a surface height distribution measuring device according to an embodiment. FIG. 2 is a block diagram showing the electrical configuration of the surface height distribution measuring device. 4 is a flowchart showing the operation of the surface height distribution measuring device. 5A to 5C are diagrams for explaining the operation of the surface height distribution measuring device.

One or more embodiments of the present invention will be described below with reference to the drawings. However, the scope of the invention is not limited to the disclosed embodiments. Components with the same reference numerals in each drawing are identical components, and their description will be omitted where appropriate. In this specification, generic reference numerals are used without subscripts to refer to components, and subscripted reference numerals are used to refer to individual components.

Figure 1 is a diagram illustrating the structural configuration of a surface height distribution measuring device in an embodiment. Figure 1A is a front view, Figure 1B is a side view, and Figure 1C is a top view. Figure 2 is a block diagram showing the electrical configuration of the surface height distribution measuring device.

As shown in Figures 1 and 2, the surface height distribution measuring device 1000 in this embodiment includes, for example, first and second lifting and rotating units 1A and 1B, first and second displacement gauges 2A and 2B, a support movement unit 3, a control processing unit 4, an input unit 5, an output unit 6, an interface unit (IF unit) 7, and a memory unit 8.

The first and second lifting and rotating units 1A and 1B are each electrically connected to the control processing unit 4 and, under the control of the control processing unit 4, lift and lower the disk-shaped measurement object WA and rotate the measurement object WA circumferentially by a predetermined angle. The first lifting and rotating unit 1A is positioned at a predetermined first position P1, and the second lifting and rotating unit 1B is positioned at a predetermined second position P2 different from the first position P1. Because the first lifting and rotating unit 1A and the second lifting and rotating unit 1B have the same structure, the following description will mainly focus on the first lifting and rotating unit 1A. By listing the reference numerals in the configuration of the first lifting and rotating unit 1A that correspond to the reference numerals in the configuration of the second lifting and rotating unit 1B in parentheses after the reference numerals in the configuration of the first lifting and rotating unit 1A, the description of the second lifting and rotating unit 1B will be omitted.

More specifically, the first lifting and rotating unit 1A (1B) comprises a rotating unit 1-1A (1-1B) and a lifting and rotating unit 1-2A (1-2B). The rotating unit 1-1A (1-1B) comprises a rotating member and a rotation mechanism electrically connected to the control processing unit 4 and configured to rotate the rotating member in the circumferential direction in accordance with the control of the control processing unit 4. By rotating the rotating member in the circumferential direction with the rotation mechanism, the measurement object WA placed on the upper surface of the rotating member is rotated in the circumferential direction. The rotation mechanism comprises, for example, a stepping motor and a transmission mechanism connected to the output shaft of the stepping motor, connecting its outer circumferential surface to the inner circumferential surface of the cylindrical member, and transmitting the rotational force of the stepping motor to the rotating member. The lifting unit 1-2A (1-2B) includes a guide member that guides the rotating unit 1-1A (1-1B), and a lifting mechanism that is electrically connected to the control processing unit 4 and that lifts and lowers the rotating unit 1-1A (1-1B) according to the control of the control processing unit 4, and that includes, for example, an electromagnetic cylinder. By lifting and lowering the rotating unit 1-1A (1-1B) using the lifting mechanism, the measurement object WA placed on the upper surface of the rotating member is lifted and lowered.

The first and second lifting and rotating units 1A, 1B are disposed at predetermined first and second positions P1, P2, respectively, on the upper surface of the first support unit 11, which is a plate-like member extending in one direction. The first support unit 11 is connected and fixed at both ends to a pair of first and second legs 12-1, 12-2, which are plate-like members erected on, for example, a base plate BP. Therefore, the first leg 12-1, first support unit 11, and second leg 12-2 are connected in this order, and as shown in Figure 2B, they form a roughly downward-facing U-shape in side view.

For ease of explanation, as shown in Figure 1, an xyz Cartesian coordinate system is set up and used as appropriate, with the direction in which the support part 11 extends as the x-axis (x-direction, front-to-back direction), the width direction of the support part 11, which is perpendicular to the extension direction, as the y-axis (y-direction, left-to-right direction), and the direction perpendicular to both the x- and y-directions as the z-axis (z-direction, height direction).

The first position P1 is a position at the center of the measurement object WA where the measurement object WA can be raised and lowered and rotated after the first and second displacement gauges 2A and 2B have finished scanning the measurement object WA along a straight line passing through the center of the measurement object WA on the return path from the second position P2 to the first position P1. For example, the first position P1 is a position on one side of the x-direction relative to the positions of the first and second displacement gauges 2A and 2B, and away from the positions of the first and second displacement gauges 2A and 2B by a distance greater than the diameter of the measurement object WA. Similarly, the second position P2 is a position at the center of the measurement object WA where the measurement object WA can be raised and lowered and rotated after the first and second displacement gauges 2A and 2B have finished scanning the measurement object WA along a straight line passing through the center of the measurement object WA on the outward path from the first position P1 to the second position P2. For example, the second position P2 is a position on the other side of the x-direction relative to the positions of the first and second displacement gauges 2A and 2B, and is farther away from the positions of the first and second displacement gauges 2A and 2B than the diameter of the measurement object WA.

The measurement object WA can be any disc-shaped component, such as a wafer (e.g., silicon wafer) used in semiconductor manufacturing or an aluminum or glass magnetic disk substrate used in hard disks.

The first and second displacement gauges 2A and 2B are each electrically connected to the control processing unit 4 and are devices that measure the distance to the surface of the measurement object WA under the control of the control processing unit 4. Examples include capacitance displacement gauges, eddy current displacement gauges, laser displacement gauges, and confocal displacement gauges. The first displacement gauge 2A and the second displacement gauge 2B are arranged facing each other with a predetermined gap (first gap) between them to allow the measurement object WA to pass through. With this arrangement, the first displacement gauge 2A measures a first distance to one surface of the measurement object WA, and the second displacement gauge 2B measures a second distance to one surface of the measurement object WA. The first and second displacement gauges 2A and 2B each output their measurement results to the control processing unit 4.

The first displacement gauge 2A is disposed at one end (location) on the underside of the first support arm 22-1, a plate-like member extending in one direction (x direction), and the second displacement gauge 2B is disposed at one end (location) on the upper surface of the second support arm 22-2, a plate-like member extending in one direction (x direction) and whose width in the y direction is wider than the outer diameter of the second lift-and-rotate unit 1B. The other ends of the first and second support arms 22-1 and 22-2 are each connected and fixed to a second support 21, a columnar member erected on the base plate BP, on the outer side in the x direction of the second leg 12-2 (or on the outer side in the x direction of the first leg 12-1), so that the first displacement gauge 2A and the second displacement gauge 2B face each other with the first distance in between. Therefore, the first and second support arm portions 22-1 and 22-2 are spaced apart in the z direction, and the first support arm portion 22-1, the second support arm portion 22-2, and the second support portion 21 are generally F-shaped in side view, as shown in Figure 2B. A through opening is formed in the second support arm portion 22-2 at a location corresponding to the location of the second lifting and rotating portion 1B, allowing the second lifting and rotating portion 1B to move in and out of the second support arm portion 22-2 in the z direction.

The first displacement meter 2A and the second displacement meter 2B may also be held by other means so that they pass through the center of the measurement object WA.

The support movement unit 3 is electrically connected to the control processing unit 4 and, under the control of the control processing unit 4, supports the measurement object WA and moves the measurement object WA and the first and second displacement gauges 2A, 2B relatively between the first and second positions P1, P2 so that the first and second displacement gauges 2A, 2B pass through the center of the measurement object WA. In this embodiment, as described above, the first and second displacement gauges 2A, 2B are fixedly disposed by the first and second support arm units 22-1, 22-2 and the second support unit 21, and the support movement unit 3 supporting the measurement object WA moves so that the measurement object WA moves relative to the first and second displacement gauges 2A, 2B. Note that the surface height distribution measuring device 1000 may also be configured so that the first and second displacement gauges 2A, 2B move relative to the fixedly disposed measurement object WA.

More specifically, the support movement unit 3 comprises three first through third support pins 31-1 through 31-3, a pair of third and fourth support units 32-1 and 32-2, a connecting unit 33, and a movement unit 34. The first through third support pins 31-1 through 31-3 are each needle-shaped or thin columnar members, and support the measurement object WA from its underside at their respective tips, which are one end in the z direction (three-point support). The first support pin 31-1 stands upright at its base end, which is the other end in the z direction, from one end face in the z direction of the third support unit 32-1, which is a plate-shaped member. The second support pin 31-2 stands upright at its base end, which is the other end in the z direction, from one end face in the z direction of the fourth support portion 32-2, which is a plate-like member, and similarly, the third support pin 31-3 stands upright at its base end, which is the other end in the z direction, from one end face in the z direction of the fourth support portion 32-2, which is a plate-like member, and the second support pin 31-2 and the third support pin 31-3 are arranged at a predetermined interval (second interval) from each other in the x direction. The connecting portion 33 is a plate-like member that is wider in the y direction than the first support portion 11, and is connected and fixed at both ends in the y direction to the other end faces in the z direction of the third and fourth support portions 32-1 and 32-2, respectively, so as to stand upright. The third support portion 32-1 and the fourth support portion 32-2 are disposed on the outside of the first support portion 11 at a predetermined interval (third interval) in the y direction, and the third support portion 32-1, the connecting portion 33, and the fourth support portion 32-2 are sequentially connected in this order, forming a generally upward U-shape in front view, as shown in FIG. 2A. The first support portion 11 is disposed inside the U-shape formed by the third support portion 32-1, the connecting portion 33, and the fourth support portion 32-2. The first through third support pins 31-1 to 31-3 are disposed on the third and fourth support portions 32-1 and 32-2 so as to be located at the vertices of a triangle. The moving unit 34 is electrically connected to the control processing unit 4 and is a device for moving the first to third support pins 31-1 to 31-3 supported by the third and fourth support units 32-1, 32-2 and the connecting unit 33 in accordance with the control of the control processing unit 4 so that the center of the measurement object WA supported by the first to third support pins 31-1 to 31-3 can move along the x direction at least between the first position P1 and the second position P2. The moving unit 34 includes, for example, a box-shaped housing 34-1 and a pedestal 34-2 extending in the x direction from the inside of the first leg 12-1 to the inside of the second leg 12-2. The pedestal 34-1 is configured with a rack extending in the x direction. The housing 34-1 is fixedly connected to the connecting unit 33 on its upper surface and is configured with a pinion for linear movement on the rack and an actuator such as a servo motor for rotating the pinion inside. The moving unit 34 is configured to linearly move the housing 34-1 and connecting unit 33 relative to the pedestal 34-1 via the rack and pinion. Movement of this connecting unit 33 moves the measurement object WA supported by the first through third support pins 31-1 to 31-3 along the x direction.

The number of support pins 31 may be more than three. Furthermore, the shape of the support pins 31 may be a shape other than a needle-shaped member or a thin column-shaped member.

The first leg 12-1, first support 11, and second leg 12-2, on which the first and second lifting and rotating units 1A and 1B are arranged, and the first support arm 22-1, second support arm 22-2, and second support 21, on which the first and second displacement gauges 2A and 2B are arranged, are arranged so that the center of the first lifting and rotating unit 1A (first position P1), the centers of the first and second displacement gauges 2A and 2B, and the center of the second lifting and rotating unit 1B (second position P2) are aligned in this order on a straight line along the x direction. The moving unit 3 is positioned relative to the first leg 12-1, first support unit 11, and second leg 12-2 and the first support arm 22-1, second support arm 22-2, and second support unit 21 arranged as described above so that when the measurement object WA is placed on the first lifting and rotating unit 1A (or the second lifting and rotating unit 1B) with the center of the first lifting and rotating unit 1A (or the center of the second lifting and rotating unit 1B) aligned with the center of the measurement object WA and the placed measurement object WA is supported by the first through third support pins 31-1 through 31-3, the center of the measurement object WA supported by the first through third support pins 31-1 through 31-3 moves on a straight line passing through the center of the first lifting and rotating unit 1A (first position P1) and the center of the second lifting and rotating unit 1B (second position P2).

The input unit 5 is electrically connected to the control processing unit 4 and is a device that inputs various commands, such as a command to start measurement, and various data required to operate the surface height distribution measuring device 1000, such as the name of the measurement object WA and a specified angle, to the surface height distribution measuring device 1000. It may be, for example, multiple input switches assigned with specified functions, a keyboard, or a mouse. The output unit 6 is electrically connected to the control processing unit 4 and is a device that outputs commands, data, calculation results, etc. input from the input unit 5 under the control of the control processing unit 4. It may be, for example, a display device such as a CRT display, LCD (liquid crystal display), or organic EL display, or a printing device such as a printer.

The input unit 5 and output unit 6 may be configured as a touch panel. In this touch panel configuration, the input unit 5 is a position input device, such as a resistive or capacitive type, that detects and inputs an operation position, and the output unit 6 is a display device. In this touch panel, a position input device is provided on the display surface of the display device, and one or more input content candidates that can be input are displayed on the display device. When the user touches the display position showing the input content they want to input, the position is detected by the position input device, and the display content displayed at the detected position is input to the surface height distribution measuring device 1000 as the user's operation input content. Such a touch panel makes it easy for the user to intuitively understand input operations, providing a surface height distribution measuring device 1000 that is easy for the user to use.

The IF unit 7 is electrically connected to the control processing unit 4 and is a circuit that, for example, inputs and outputs data to and from external devices under the control of the control processing unit 4. For example, it may be an interface circuit for the RS-232C serial communication method, an interface circuit using the Bluetooth (registered trademark) standard, or an interface circuit using the USB standard. The IF unit 7 may also be a communications interface circuit that transmits and receives communications signals to and from external devices, such as a data communications card or a communications interface circuit conforming to the IEEE 802.11 standard.

The memory unit 8 is electrically connected to the control processing unit 4 and is a circuit that stores various specified programs and various specified data in accordance with the control of the control processing unit 4.

The various predetermined programs include, for example, a control processing program, which in turn includes, for example, a control program and a measurement control program. The control program controls each of the sections 1A, 1B, 2A, 2B, 3, 5-8 of the surface height distribution measuring device 1000 according to the function of each section. The measurement control program is a program that controls the measurement of the measurement object WA.

The various specified data include, for example, the name of the measurement target WA, the specified angle, the specified sampling interval, and the measurement results, which are data necessary to execute each of these programs.

Such a storage unit 8 may include, for example, a non-volatile storage element such as ROM (Read Only Memory) or a rewritable non-volatile storage element such as EEPROM (Electrically Erasable Programmable Read Only Memory). The storage unit 8 also includes RAM (Random Access Memory), which serves as the working memory of the control processing unit 4 and stores data generated during execution of the specified program. The storage unit 8 may also be configured with a hard disk drive or solid state drive (SSD) with a relatively large storage capacity.

The control processing unit 4 is a circuit that controls each of the units 1A, 1B, 2A, 2B, 3, 5-8 of the surface height distribution measuring device 1000 according to the function of each unit, and measures the surface height distribution of the measurement object. The control processing unit 4 is configured, for example, to include a CPU (Central Processing Unit) and its peripheral circuits. By executing the control processing program, the control processing unit 4 is functionally configured to include a control unit 41 and a measurement control unit 42.

The control unit 41 controls each of the units 1A, 1B, 2A, 2B, 3, 5-8 of the surface height distribution measuring device 1000 according to the function of each unit, and is responsible for overall control of the surface height distribution measuring device 1000.

The measurement control unit 42 controls the measurement of the measurement object WA. More specifically, the measurement control unit 42 controls the first lifting and rotating unit 1A to rotate the measurement object WA by a predetermined angle in the circumferential direction, controls the first lifting and rotating unit 1A and the support moving unit 3 to support the measurement object WA from the first lifting and rotating unit 1A to the support moving unit 3, controls the support moving unit 3 and the first and second displacement gauges 2A, 2B to measure a first distance to the one surface of the measurement object WA and a second distance to the other surface of the measurement object WA at predetermined sampling intervals while the measurement object WA is moved by the support moving unit 3 from the first position P1 to the second position P2, and controls the support moving unit 3 to support the measurement object WA from the support moving unit 3 to the second lifting and rotating unit 1B. The second lifting and rotating unit 1B is controlled to rotate the measurement object WA in the circumferential direction by the predetermined angle, the second lifting and rotating unit 1B and the support moving unit 3 are controlled to support the measurement object WA from the second lifting and rotating unit 1B, the support moving unit 3 and the first and second displacement gauges 2A, 2B are controlled to measure the first and second distances at the predetermined sampling intervals while the measurement object WA is moved from the second position P2 to the first position P1 by the support moving unit 3, and the support moving unit 3 and the first lifting and rotating unit 1A are controlled to support the measurement object WA from the support moving unit 3.

The thickness of the measurement object WA can be calculated using the following method. The distance between the placement positions of the first displacement gauge 2A and the second displacement gauge 2B is determined in advance, and the thickness can be calculated from the distance from the first displacement gauge 2A to the surface of the measurement object WA and the distance from the second displacement gauge 2B to the back surface of the measurement object WA ((thickness of measurement object WA) = (distance between the placement positions of the first displacement gauge 2A and the second displacement gauge 2B) - ((first distance to the surface of the WA measured by the first displacement gauge 2A) + (first distance to the surface of the WA measured by the second displacement gauge 2B)).

The control processing unit 4, input unit 5, output unit 6, IF unit 7, and memory unit 8 in this surface height distribution measuring device 1000 can be configured, for example, by a desktop or notebook computer.

Next, the operation of this embodiment will be described. Figure 3 is a flowchart showing the operation of the surface height distribution measuring device. Figure 4 is a diagram explaining the operation of the surface height distribution measuring device.

When the surface height distribution measuring device 1000 configured as described above is powered on, it initializes the necessary components and begins operation. The control processing unit 4 functionally configures a control unit 41 and a measurement control unit 42 by executing the control processing program.

In Figures 2 and 3, when the measurement object WA is placed on the first lifting and rotating unit 1A with its centers aligned, for example by a user or a robot arm (not shown), and a command to start measurement is given, the surface height distribution measuring device 1000 controls the first lifting and rotating unit 1A using the measurement control unit 42 of the control processing unit 4 to rotate the measurement object WA circumferentially by a predetermined angle (S1, 1. Rotation of measurement object WA).

Next, the surface height distribution measuring device 1000 controls the first lifting and rotating unit 1A and the support moving unit 3 via the measurement control unit 42 so that the measurement object WA is supported by the support moving unit 3 by lifting and lowering from the first lifting and rotating unit 1A (S2).

Next, the surface height distribution measuring device 1000 uses the measurement control unit 42 to control the support movement unit 3 and the first and second displacement gauges 2A and 2B to measure a first distance to the one surface of the measurement object WA and a second distance to the other surface of the measurement object WA at a predetermined sampling interval while moving the measurement object WA from the first position P1 to the second position P2 using the support movement unit 3 (S3, 2. Measurement of the measurement object WA). The measurement results of the first displacement gauge 2A, namely, the surface height distribution of one surface of the measurement object WA (the first A surface height distribution (each height at each measurement point at a predetermined sampling interval)) and the measurement results of the second displacement gauge 2B, namely, the surface height distribution of the other surface of the measurement object WA (the first B surface height distribution (each height at each measurement point at a predetermined sampling interval)) are stored in the memory unit 8 in association with the measurement order n (or the cumulative rotation angle from the initial position (= (one rotation angle) × (number of measurements n))).

Next, the surface height distribution measuring device 1000 controls the support and movement unit 3 and the second lift and rotation unit 1B via the measurement control unit 42 so that the measurement object WA is supported by the second lift and rotation unit 1B from the support and movement unit 3 by raising and lowering (S4, measurement of 3.n line completed).

Next, the surface height distribution measuring device 1000 controls the second lifting and rotating unit 1B via the measurement control unit 42 to rotate the measurement object WA in the circumferential direction by the specified angle (S5, 4. Rotation of measurement object WA to the next line).

Next, the surface height distribution measuring device 1000 controls the second lifting and rotating unit 1B and the support moving unit 3 via the measurement control unit 42 so that the measurement object WA is supported by the support moving unit 3 by lifting from the second lifting and rotating unit 1B (S6).

The surface height distribution measuring device 1000 then uses the measurement control unit 42 to control the support and movement unit 3 and the first and second displacement gauges 2A and 2B to measure the first and second distances at the predetermined sampling intervals while moving the measurement object WA from the second position P2 to the first position P1 using the support and movement unit 3 (S7, 5. Measurement of measurement object WA). The measurement results of the first displacement gauge 2A, which are the surface height distribution on one surface of the measurement object WA (2A surface height distribution), and the measurement results of the second displacement gauge 2B, which are the surface height distribution on the other surface of the measurement object WA (2B surface height distribution), are stored in the memory unit 8 in association with the measurement order n (or the cumulative rotation angle from the initial position).

Next, the surface height distribution measuring device 1000 controls the support and movement unit 3 and the first lifting and rotation unit 1A via the measurement control unit 42 to raise and lower the measurement object WA from the support and movement unit 3 to the first lifting and rotation unit 1A (S8, 6. Measurement of (n+1) line completed).

The surface height distribution measuring device 1000 then determines, via the measurement control unit 42, whether or not the measurement has ended (S9). If the result of this determination is that the measurement has ended (Yes), the surface height distribution measuring device 1000 outputs each measurement result to the output unit 6 (S10) and ends this process. On the other hand, if the result of the determination is that the measurement has not ended (No), the surface height distribution measuring device 1000 returns to process S1. The determination of whether the measurement has ended is made based on whether or not measurements have been performed a required number of times, which is calculated by dividing 360 degrees by the angle of one rotation. (If the required number of measurements is an even number, the end of the measurement is determined when the required number of measurements has been performed; if the required number of measurements is an odd number, the end of the measurement is determined when (the required number of measurements + 1) has been performed.)

The measurement control unit 42 may output each measurement result to an external device via the IF unit 7 as necessary. Also, in the above description, step S1 may be omitted for the first measurement immediately after the start of measurement.

As described above, the surface height distribution measuring device 1000 in this embodiment and the surface height distribution measuring method implemented therein measure each surface height distribution on both the outbound path from the first position P1 to the second position P2 and the inbound path from the second position P2 to the first position P1, thereby shortening the measurement time.

The surface height distribution measuring device 1000 and surface height distribution measuring method described above include first and second displacement meters 2A and 2B that face each other across the measurement object WA, and therefore can simultaneously measure the surface height distributions of one surface and the other surface of the measurement object WA.

In order to express the present invention, the present invention has been appropriately and sufficiently described above through embodiments with reference to the drawings. However, it should be recognized that those skilled in the art could easily modify and/or improve the above-described embodiments. Therefore, unless modifications or improvements made by those skilled in the art deviate from the scope of the claims set forth in the claims, such modifications or improvements are deemed to be encompassed within the scope of the claims.

1000 Surface height distribution measuring device 1A First lifting and rotating unit 1B Second lifting and rotating unit 2A First displacement meter 2B Second displacement meter 3 Support moving unit 4 Control processing unit 8 Memory unit 42 Measurement control unit

Claims (8)

A surface height distribution measuring method for measuring a surface height distribution of a disk-shaped measurement target, comprising:
a first measurement step of measuring a first surface height distribution on a first straight line of the object to be measured by using a displacement meter that measures a distance to the surface of the object to be measured while moving the object to be measured relatively to the displacement meter between the first position and the second position at first and second positions that are different from each other;
a first rotation step of rotating the measurement object at the second position by a predetermined angle in a circumferential direction after the first measurement step is completed;
a second measurement step of measuring a second surface height distribution on a second straight line of the measurement object by using the displacement meter while moving the displacement meter and the measurement object relatively between the second position and the first position;
and a second rotation step of rotating the measurement object at the first position by a predetermined angle in a circumferential direction after the second measurement step is completed.
Surface height distribution measurement method. the displacement meter includes a first displacement meter that measures a first distance to one surface of the measurement object, and a second displacement meter that measures a second distance to another surface of the measurement object that is opposite to the one surface,
the first measuring step measures the surface height distributions of the one surface and the other surface as the first surface height distributions;
the second measuring step measures the surface height distributions of the one surface and the other surface as the second surface height distributions;
The surface height distribution measuring method according to claim 1 . a center around which the measurement object at the first position is rotated by a predetermined angle in a circumferential direction, a center around which the measurement object at the second position is rotated by a predetermined angle in a circumferential direction, and a center of the disk-shaped measurement object are aligned on a straight line;
The surface height distribution measuring method according to claim 1 . The displacement meter is disposed at a position passing through the center of the disk-shaped measurement object.
The surface height distribution measuring method according to claim 3 . A surface height distribution measuring device for measuring a surface height distribution of a disk-shaped measurement target, comprising:
a displacement meter for measuring a distance to the surface of the measurement object;
a first rotating unit disposed at a first position and configured to rotate the measurement object by a predetermined angle in a circumferential direction;
a second rotating unit that is disposed at a second position different from the first position and rotates the measurement object in a circumferential direction by the predetermined angle;
a moving unit that moves the measurement object and the displacement meter relatively between the first and second positions,
Surface height distribution measuring device. the displacement meter includes a first displacement meter that measures a first distance to one surface of the measurement object, and a second displacement meter that measures a second distance to another surface of the measurement object that is opposite to the one surface,
The surface height distribution measuring device according to claim 5 . a center for rotating the measurement object at the first position by a predetermined angle in a circumferential direction, a center for rotating the measurement object at the second position by a predetermined angle in a circumferential direction, and a center of the disk-shaped measurement object are arranged to be aligned on a straight line.
The surface height distribution measuring device according to claim 5 . The displacement meter is provided at a position passing through the center of the disk-shaped measurement object.
The surface height distribution measuring device according to claim 7 .