JP7845285B2 - Multilayer circuit boards and antenna modules - Google Patents

Description

This invention relates to a multilayer substrate and an antenna module comprising a radiating conductor layer.

A known invention relating to conventional multilayer substrates is the antenna module described in Patent Document 1. This antenna module comprises a radiating conductor layer, a first feed point, and a second feed point. A first high-frequency signal is input to the radiating conductor layer via the first feed point. The radiating conductor layer radiates the first high-frequency signal. A second high-frequency signal is input to the radiating conductor layer via the second feed point. The radiating conductor layer radiates the second high-frequency signal. The polarization direction of the first high-frequency signal is different from the polarization direction of the second high-frequency signal.

Japanese Patent Publication No. 2021-83121

Incidentally, in the field of antenna modules described in Patent Document 1, there is a desire to reduce the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal, and to suppress the inclination of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal from the normal direction of the main surface of the radiating conductor layer.

Therefore, the object of the present invention is to provide a multilayer substrate and antenna module that can reduce the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal, and that can suppress the inclination of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal from the normal direction of the main surface of the radiating conductor layer.

A multilayer substrate according to one embodiment of the present invention is
A laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A first radiating conductor layer is provided on the laminate and has a first outer edge that includes a first straight line and a second straight line when viewed in the Z-axis direction,
A ground conductor layer provided in the laminate, located on the negative side of the Z-axis from the first radiating conductor layer, and overlapping with the first radiating conductor layer when viewed in the Z-axis direction,
A first wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a first power supply point located closest to the first straight line within the first outer edge, and intersects the first straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A second wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a second power supply point located closest to the second straight line within the first outer edge, and intersects the second straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
It is equipped with.

An antenna module according to one embodiment of the present invention is
First substrate and
A second substrate having flexibility,
It is equipped with,
The first substrate is,
A first laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A first radiating conductor layer is provided on the first laminate and has a first outer edge that includes a first straight line and a second straight line when viewed in the Z-axis direction,
A first wiring layer is provided on the first laminate, is located on the negative side of the Z-axis from the first radiating conductor layer, is electrically connected to the first radiating conductor layer at a first power supply point located closest to the first straight line within the first outer edge, and intersects the first straight line in such a way that it is not perpendicular when viewed in the Z-axis direction.
A second wiring layer is provided on the first laminate, is located on the negative side of the Z-axis from the first radiating conductor layer, is electrically connected to the first radiating conductor layer at a second power supply point located closest to the second straight line within the first outer edge, and intersects the second straight line in a manner that is not perpendicular to it when viewed in the Z-axis direction.
It includes,
The aforementioned second substrate is
A second laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A seventh wiring layer is provided on the second laminate and is electrically connected to the first wiring layer,
An eighth wiring layer is provided on the second laminate and is electrically connected to the second wiring layer,
A ground conductor layer is provided in the second laminate, is located on the negative side of the Z-axis relative to the seventh wiring layer and the eighth wiring layer, and overlaps with the first radiating conductor layer, the seventh wiring layer and the eighth wiring layer when viewed in the Z-axis direction,
It includes,
The length of the second substrate in the Z-axis direction is shorter than the length of the first substrate in the Z-axis direction.
The second substrate is located on the negative side of the Z-axis compared to the first substrate, and has a region that does not overlap with the first substrate when viewed in the Z-axis direction.

According to the present invention, the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal can be reduced, and the inclination of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal from the normal direction of the main surface of the radiating conductor layer can be suppressed.

Figure 1 is an exploded perspective view of the multilayer substrate 10. Figure 2 is a view of the multilayer substrate 10 from above. Figure 3 is a cross-sectional view of the multilayer substrate 10. Figure 4 is a cross-sectional view of the multilayer substrates 10 and 110. Figure 5 is a top view of the multilayer substrate 110. Figure 6 is a cross-sectional view of the multilayer substrate 110. Figure 7 is a top view of the multilayer substrate 10a. Figure 8 is a top view of the multilayer substrate 10b. Figure 9 is a top view of the multilayer substrate 10c. Figure 10 is a top view of the multilayer substrate 10d. Figure 11 is an exploded perspective view of the multilayer substrate 10e. Figure 12 is a top view of the multilayer substrate 10e. Figure 13 is a top view of the multilayer substrate 10f. Figure 14 is an exploded perspective view of a 10g multilayer substrate. Figure 15 is a cross-sectional view of a multilayer substrate 10g. Figure 16 is an exploded perspective view of the multilayer substrate 10h. Figure 17 is a cross-sectional view of the multilayer substrate 10h. Figure 18 is a top view of the multilayer substrate 10i. Figure 19 is a top view of the multilayer substrate 10j. Figure 20 is a top view of the multilayer substrate 10k. Figure 21 is a cross-sectional view of the antenna module 100. Figure 22 is an exploded perspective view of the multilayer substrate 210. Figure 23 is a cross-sectional view of the antenna module 100a.

(Embodiment)
[Structure of the multilayer substrate 10]
The structure of a multilayer substrate 10 according to one embodiment of the present invention will be described below with reference to the drawings. Figure 1 is an exploded perspective view of the multilayer substrate 10. Figure 2 is a top-down perspective view of the multilayer substrate 10. Figure 3 is a cross-sectional view of the multilayer substrate 10. Figure 3 is a cross-sectional view taken along line A-A in Figure 2.

In the following, the stacking direction of the laminate 12 is defined as the vertical direction. The vertical direction coincides with the Z-axis direction. The upward direction is the positive Z-axis direction. The downward direction is the negative Z-axis direction. When viewing the laminate 12 in the vertical direction, the two directions in which the edges of the laminate 12 extend are defined as the left-right direction and the front-back direction. The left-right direction is orthogonal to the vertical direction. The front-back direction is orthogonal to both the vertical and left-right directions. The left-right direction coincides with the X-axis direction. The rightward direction is the positive X-axis direction. The leftward direction is the negative X-axis direction. The front-back direction coincides with the Y-axis direction. The forward direction is the positive Y-axis direction. The back-back direction is the negative Y-axis direction. Therefore, the X-axis, Y-axis, and Z-axis are orthogonal to each other. Note that the definitions of directions in this specification are examples. Therefore, the direction in actual use of the multilayer substrate 10 does not need to coincide with the directions in this specification. Also, the vertical direction may be reversed in each drawing. Similarly, the left-right direction may be reversed in each drawing. The front-back direction may also be reversed in each drawing.

The multilayer substrate 10 is used, for example, in wireless communication terminals such as smartphones. As shown in Figure 1, the multilayer substrate 10 comprises a laminate 12, a first radiating conductor layer 16, a first wiring layer 20, a second wiring layer 22, external electrodes 24 and 26, a ground conductor layer 28, an annular ground conductor layer 30, and interlayer connecting conductors v1 to v8. Each of the first radiating conductor layer 16, the first wiring layer 20, the second wiring layer 22, the external electrodes 24 and 26, the ground conductor layer 28, the annular ground conductor layer 30, and the interlayer connecting conductors v1 to v8 is provided on the laminate 12.

The laminate 12 has a plate shape. As shown in Figure 1, the laminate 12 has a rectangular shape when viewed in the vertical direction. The laminate 12 has a structure in which insulating layers 14a to 14e and protective layers 15a and 15b are stacked in the vertical direction (Z-axis direction). The protective layer 15a, insulating layers 14a to 14e, and protective layer 15b are arranged in this order from top to bottom. The material of the insulating layers 14a to 14e is a thermoplastic resin such as polyimide or liquid crystal polymer. The laminate 12 is flexible. Protective layers 15a and 15b will be described later.

The first radiating conductor layer 16 radiates and/or receives the first high-frequency signal. In this embodiment, the first radiating conductor layer 16 is located on the upper main surface of the insulating layer 14a. As shown in Figure 1, the first radiating conductor layer 16 has a rectangular shape when viewed in the vertical direction. As shown in Figure 1, the first radiating conductor layer 16 has a rhombus shape when viewed in the vertical direction, with diagonals extending in the front-to-back and left-to-right directions.

Specifically, as shown in Figure 2, the first radiating conductor layer 16 has a first outer edge EE1 that includes the first straight line E1, the second straight line E2, and the straight lines E101 and E102 (the seventh and eighth straight lines) when viewed in the vertical direction (Z-axis direction). Furthermore, the first portion EP1 is the portion of the first outer edge EE1 excluding the first straight line E1 and the second straight line E2. That is, the first portion EP1 consists of the straight lines E101 and E102.

The first line E1 and line E102 are parallel to each other. The second line E2 and line E101 are parallel to each other. The second line E2 is perpendicular to the first line E1 when viewed in the vertical direction (Z-axis direction). Line E101 is perpendicular to line E102 when viewed in the vertical direction (Z-axis direction). The right rear end of the first line E1 (the positive end of the X-axis) is connected to the right front end of the second line E2 (the positive end of the X-axis). The left front end of the first line E1 is connected to the right front end of line E101. The left rear end of the second line E2 is connected to the right rear end of line E102. The left rear end of line E101 is connected to the left front end of line E102.

The lengths of the first line E1, the second line E2, and the lines E101 and E102 are equal. The lengths of the first line E1, the second line E2, and the lines E101 and E102 are, for example, half the wavelength of the first high-frequency signal.

As shown in Figures 1 and 3, the ground conductor layer 28 is located below the first radiating conductor layer 16 (on the negative side of the Z-axis). The ground conductor layer 28 is provided on the lower main surface of the insulator layer 14e. As shown in Figure 1, the ground conductor layer 28 has a rectangular shape when viewed in the vertical direction. The long side of the ground conductor layer 28 extends in the left-right direction. The short side of the ground conductor layer 28 extends in the front-back direction. When viewed in the vertical direction, the ground conductor layer 28 overlaps with the first radiating conductor layer 16. The ground conductor layer 28 is connected to the ground potential.

As shown in Figures 1 and 3, the annular ground conductor layer 30 is located above the ground conductor layer 28 (on the positive side of the Z-axis). In this embodiment, the vertical position of the annular ground conductor layer 30 is the same as the vertical position of the first radiating conductor layer 16. Therefore, the annular ground conductor layer 30 is located on the upper main surface of the insulator layer 14a.

Furthermore, the annular ground conductor layer 30 has a ring shape that surrounds the first radiating conductor layer 16 when viewed in the vertical direction (Z-axis direction). The outer and inner edges of the annular ground conductor layer 30 have a rectangular shape with two sides extending in the front-to-back direction and two sides extending in the left-to-right direction. The annular ground conductor layer 30 is connected to the ground potential.

Here, as shown in Figure 2, distances L1 to L4 are defined as described below. Distances L1 (first distance), L2 (second distance), L3 (third distance), and L4 (fourth distance) are equal to each other.
Distance L1: The distance from the center of the first straight line E1 to the annular ground conductor layer 30 in a direction perpendicular to the first straight line E1.
Distance L2: The distance from the center of the second straight line E2 to the annular ground conductor layer 30 in a direction perpendicular to the second straight line E2.
Distance L3: The distance from the center of line E101 (the seventh line) to the annular ground conductor layer 30 in a direction perpendicular to line E101 (the seventh line).
Distance L4: The distance from the center of the straight line E102 (the eighth straight line) to the annular ground conductor layer 30 in a direction perpendicular to the straight line E102 (the eighth straight line). As shown in Figure 1, the first wiring layer 20 is located below the first radiating conductor layer 16 (negative side of the Z axis) and above the ground conductor layer 28 (positive side of the Z axis). In this embodiment, the first wiring layer 20 is located on the upper main surface of the insulator layer 14d. The first wiring layer 20 has a linear shape that extends in the left-right direction when viewed in the vertical direction. The left end of the first wiring layer 20 overlaps with the first radiating conductor layer 16 when viewed in the vertical direction. The right end of the first wiring layer 20 does not overlap with the first radiating conductor layer 16 when viewed in the vertical direction. As a result, the first wiring layer 20 intersects the first straight line E1 in a way that is not perpendicular when viewed in the vertical direction (Z axis direction). In this embodiment, the angle θ1 formed by the first wiring layer 20 and the first straight line E1 is 45 degrees. However, the angle θ1 is not limited to 45 degrees; it can be greater than 0 degrees and less than 90 degrees. For example, the angle θ1 is 45 degrees ± 22.5 degrees.

Furthermore, as shown in Figure 2, when the first straight line E1 is moved in a direction perpendicular to it, viewed in the vertical direction (Z-axis direction), the region through which the first straight line E1 passes is defined as the first region A1. The first wiring layer 20 straddles the first region A1 and the region outside the first region A1, viewed in the vertical direction (Z-axis direction). The left end of the first wiring layer 20 is located in the first region A1, viewed in the vertical direction. The right end of the first wiring layer 20 is located outside the first region A1, viewed in the vertical direction.

The second wiring layer 22 is located below the first radiating conductor layer 16 (negative side of the Z-axis) and above the ground conductor layer 28 (positive side of the Z-axis). In this embodiment, the second wiring layer 22 is located on the upper main surface of the insulator layer 14d. Also, when viewed in the vertical direction, the second wiring layer 22 is located behind the first wiring layer 20. When viewed in the vertical direction, the second wiring layer 22 has a linear shape that extends in the left-right direction. Therefore, the second wiring layer 22 is parallel to the first wiring layer 20. The left end of the second wiring layer 22 overlaps with the first radiating conductor layer 16 when viewed in the vertical direction. The right end of the second wiring layer 22 does not overlap with the first radiating conductor layer 16 when viewed in the vertical direction. As a result, when viewed in the vertical direction (Z-axis direction), the second wiring layer 22 intersects the second straight line E2 in a way that is not perpendicular to it. In this embodiment, the angle θ2 formed by the second wiring layer 22 and the second straight line E2 is 45 degrees. However, the angle θ2 is not limited to 45 degrees; it can be greater than 0 degrees and less than 90 degrees. For example, the angle θ2 could be 45 degrees ± 22.5 degrees.

Furthermore, as shown in Figure 2, when the second line E2 is moved in a direction perpendicular to it, viewed in the vertical direction (Z-axis direction), the region through which the second line E2 passes is defined as the second region A2. The second wiring layer 22 straddles the second region A2 and the region outside the second region A2, viewed in the vertical direction (Z-axis direction). The left end of the second wiring layer 22 is located in the second region A2, viewed in the vertical direction. The right end of the second wiring layer 22 is located outside the second region A2, viewed in the vertical direction.

As shown in Figure 1, the external electrodes 24 and 26 are provided on the lower main surface of the insulating layer 14e. The external electrodes 24 and 26 are not in contact with the ground conductor layer 28. Therefore, the external electrodes 24 and 26 are located within the openings provided in the ground conductor layer 28.

External electrode 24 overlaps with the right edge of the first wiring layer 20 when viewed in the vertical direction. External electrode 26 overlaps with the right edge of the second wiring layer 22 when viewed in the vertical direction. A first high-frequency signal is input to or output from external electrode 24. A second high-frequency signal is input to or output from external electrode 26.

The interlayer connecting conductor v1 electrically connects the first radiating conductor layer 16 and the first wiring layer 20. More specifically, the interlayer connecting conductor v1 penetrates the insulating layers 14a to 14c in the vertical direction. The upper end of the interlayer connecting conductor v1 is in contact with the first radiating conductor layer 16 at the first power supply point P1. The first power supply point P1 is located closest to the first straight line E1 within the first outer edge EE1. In this embodiment, the first power supply point P1 is located closest to the midpoint of the first straight line E1 within the first straight line E1. The lower end of the interlayer connecting conductor v1 is in contact with the left end of the first wiring layer 20. As a result, the first wiring layer 20 is electrically connected to the first radiating conductor layer 16 at the first power supply point P1.

The interlayer connecting conductor v2 electrically connects the first radiating conductor layer 16 and the second wiring layer 22. More specifically, the interlayer connecting conductor v2 penetrates the insulating layers 14a to 14c in the vertical direction. The upper end of the interlayer connecting conductor v2 is in contact with the first radiating conductor layer 16 at the second feeding point P2. The second feeding point P2 is located closest to the second straight line E2 within the first outer edge EE1. In this embodiment, the second feeding point P2 is located closest to the midpoint of the second straight line E2 within the second straight line E2. The lower end of the interlayer connecting conductor v2 is in contact with the left end of the second wiring layer 22. As a result, the second wiring layer 22 is electrically connected to the first radiating conductor layer 16 at the second feeding point P2.

The interlayer connecting conductor v3 electrically connects the first wiring layer 20 and the external electrode 24. More specifically, the interlayer connecting conductor v3 penetrates the insulating layers 14d and 14e in the vertical direction. The upper end of the interlayer connecting conductor v3 is in contact with the right end of the first wiring layer 20. The lower end of the interlayer connecting conductor v3 is in contact with the external electrode 24.

The interlayer connecting conductor v4 electrically connects the second wiring layer 22 and the external electrode 26. More specifically, the interlayer connecting conductor v4 penetrates the insulating layers 14d and 14e in the vertical direction. The upper end of the interlayer connecting conductor v4 is in contact with the right end of the second wiring layer 22. The lower end of the interlayer connecting conductor v4 is in contact with the external electrode 26.

The interlayer connecting conductors v5 to v8 electrically connect the ground conductor layer 28 and the annular ground conductor layer 30. More specifically, the interlayer connecting conductors v5 to v8 penetrate the insulator layers 14a to 14e in the vertical direction. The upper ends of the interlayer connecting conductors v5 to v8 are in contact with the annular ground conductor layer 30. The lower ends of the interlayer connecting conductors v5 to v8 are in contact with the ground conductor layer 28.

The first radiating conductor layer 16, the first wiring layer 20, the second wiring layer 22, the external electrodes 24 and 26, the ground conductor layer 28, and the annular ground conductor layer 30 are formed by patterning metal foils attached to the upper and lower main surfaces of the insulator layers 14a to 14e. The metal foils are, for example, copper foils. The interlayer connecting conductors v1 to v8 are formed by filling through-holes that penetrate the insulator layers 14a to 14e vertically with conductive paste, and then solidifying the conductive paste by heating and pressurizing.

The protective layers 15a and 15b have a higher dielectric constant than the insulating layers 14a to 14e. Protective layer 15a covers the upper main surface of insulating layer 14a. Thus, protective layer 15a protects the first radiating conductor layer 16 and the annular ground conductor layer 30. Protective layer 15b covers the lower main surface of insulating layer 14e. Thus, protective layer 15b protects the ground conductor layer 28. However, protective layer 15b is provided with an opening H. As a result, the external electrodes 24 and 26 are exposed to the outside from the multilayer substrate 10 through the opening H.

In the multilayer substrate 10 described above, the first radiating conductor layer 16 and the ground conductor layer 28 function as patch antennas that radiate or receive the first and second high-frequency signals. However, the deflection direction of the first high-frequency signal differs from that of the second high-frequency signal. Specifically, the first feed point P1 is located near the first straight line E1. The second feed point P2 is located near the second straight line E2. The first straight line E1 is perpendicular to the second straight line E2. Therefore, the deflection direction of the first high-frequency signal is perpendicular to the deflection direction of the second high-frequency signal. Furthermore, the deflection direction during reception of the first and second high-frequency signals is the same as the deflection direction during transmission of the first and second high-frequency signals.

(effect)
The multilayer substrate 10 makes it possible to reduce the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal, and also suppresses the inclination of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal from the normal direction of the main surface of the radiating conductor layer. The following will be explained using a multilayer substrate 110 according to a comparative example. Figure 4 is a cross-sectional view of the multilayer substrates 10 and 110. Figure 4 is a cross-sectional view taken at B1-B1 in Figure 2, B2-B2 in Figure 2, and D-D in Figure 5. Figure 5 is a top view of the multilayer substrate 110. Figure 6 is a cross-sectional view taken at C-C in Figure 5.

The multilayer substrate 110 shown in Figure 5 differs from the multilayer substrate 10 in that the first wiring layer 20 is perpendicular to the first straight line E1. In the multilayer substrate 110, the first high-frequency signal is supplied to the first radiating conductor layer 16 via the first power supply point P1. This generates a standing wave in the first straight line E1, and the first high-frequency signal is radiated. At this time, electric field lines e11 are generated from the first straight line E1 to the ground conductor layer 28. The electric field lines e11 extend in a direction perpendicular to the first straight line E1 and downwards.

Similarly, the second high-frequency signal is supplied to the first radiating conductor layer 16 via the second feed point P2. This generates a standing wave in the second straight line E2, causing the second high-frequency signal to be radiated. At this time, electric field lines e12 are generated from the second straight line E2 to the ground conductor layer 28. The electric field lines e12 extend in a direction perpendicular to the second straight line E2 and downwards.

Incidentally, the first wiring layer 20 is perpendicular to the first straight line E1. Therefore, the first wiring layer 20 extends for a long distance in the direction perpendicular to the first straight line E1. As a result, the electric field lines e11 are easily blocked by the first wiring layer 20, as shown in Figure 6. When the electric field lines e11 are blocked by the first wiring layer 20 in this way, the radiation direction of the first high-frequency signal shifts from the vertical direction to the upper right direction.

Furthermore, the second wiring layer 22 is not perpendicular to the second straight line E2. Therefore, the second wiring layer 22 does not extend far in a direction perpendicular to the second straight line E2. As a result, the electric field lines e12 are less likely to be blocked by the second wiring layer 22, as shown in Figure 4. Thus, when the electric field lines e12 are less likely to be blocked by the second wiring layer 22, the radiation direction of the second high-frequency signal is less likely to be tilted from the vertical direction. Consequently, in the multilayer substrate 110, a difference arises between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal.

Therefore, in the multilayer substrate 10, the first wiring layer 20 intersects the first straight line E1 so as not to be perpendicular when viewed in the vertical direction (Z-axis direction). Furthermore, the second wiring layer 22 intersects the second straight line E2 so as not to be perpendicular when viewed in the vertical direction (Z-axis direction). As a result, the electric field lines e1 are less likely to be blocked by the first wiring layer 20, as shown in Figure 4. Furthermore, the electric field lines e2 are less likely to be blocked by the second wiring layer 22, as shown in Figure 4. As a result, the inclination of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal from the normal direction (vertical direction) of the main surface of the first radiating conductor layer 16 can be suppressed. Furthermore, since the inclination of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal from the vertical direction is suppressed, the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal becomes smaller. In this specification, the radiation direction of the high-frequency signal refers to the central axis of the radiation pattern of the high-frequency signal.

Furthermore, in the multilayer substrate 10, for the same reasons as described above, the tilting of the reception direction of the first high-frequency signal and the reception direction of the second high-frequency signal from the vertical direction is suppressed, thus reducing the difference between the reception pattern of the first high-frequency signal and the reception pattern of the second high-frequency signal.

According to the multilayer substrate 10, the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal can be reduced, and the inclination of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal from the normal direction of the main surface of the radiating electrode can be suppressed for the following reasons. More specifically, electric field lines e1 tend to occur in the first region A1. Electric field lines e2 tend to occur in the second region A2. Therefore, in the multilayer substrate 10, the first wiring layer 20 spans the first region A1 and the region outside the first region A1 when viewed in the vertical direction. Furthermore, the second wiring layer 22 spans the second region A2 and the region outside the second region A2 when viewed in the vertical direction. As a result, the length of the portion of the first wiring layer 20 located in the first region A1 is shortened. The length of the portion of the second wiring layer 22 located in the second region A2 is shortened. As a result, electric field lines e1 are less likely to be blocked by the first wiring layer 20. The electric field lines e2 are less likely to be blocked by the second wiring layer 22. As a result, the multilayer substrate 10 allows for a smaller difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal, and also suppresses the inclination of the radiation direction of the first and second high-frequency signals from the normal direction of the main surface of the radiating electrode.

In the multilayer substrate 10, distances L1, L2, L3, and L4 are equal to each other. This brings the capacitance between the first line E1 and the annular ground conductor layer 30, the capacitance between the second line E2 and the annular ground conductor layer 30, the capacitance between line E101 and the annular ground conductor layer 30, and the capacitance between line E102 and the annular ground conductor layer 30 closer together. As a result, the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal can be reduced, and the inclination of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal from the normal direction of the main surface of the radiating electrode can be suppressed.

(First variation)
The following describes a multilayer substrate 10a according to the first modified example. Figure 7 is a top view of the multilayer substrate 10a.

The multilayer substrate 10a differs from the multilayer substrate 10 in that it further comprises a second radiating conductor layer 216, a third wiring layer 220, and a fourth wiring layer 222.

The second radiating conductor layer 216, the third wiring layer 220, and the fourth wiring layer 222 each have the same structure as the first radiating conductor layer 16, the first wiring layer 20, and the second wiring layer 22. Specifically, the second radiating conductor layer 216 is provided in the laminate 12. The second radiating conductor layer 216 has a second outer edge EE2 that includes the third line E3, the fourth line E4, the line E103, and the line E104 when viewed in the vertical direction (Z-axis direction). The fourth line E4 intersects the third line E3 when viewed in the vertical direction (Z-axis direction). The fourth line E4 is perpendicular to the third line E3 when viewed in the vertical direction (Z-axis direction). Furthermore, the ground conductor layer 28 overlaps with the second radiating conductor layer 216 when viewed in the vertical direction (Z-axis direction).

The third wiring layer 220 is provided in the laminate 12. The third wiring layer 220 is located below the second radiating conductor layer 216 (negative side of the Z-axis) and above the ground conductor layer 28 (positive side of the Z-axis). The third wiring layer 220 is electrically connected to the second radiating conductor layer 216 at the third power supply point P3, which is located closest to the third straight line E3 within the second outer edge EE2. The third wiring layer 220 intersects the third straight line E3 so as not to be perpendicular when viewed in the vertical direction (Z-axis direction).

The fourth wiring layer 222 is provided in the laminate 12. The fourth wiring layer 222 is located below the second radiating conductor layer 216 (negative Z-axis) and above the ground conductor layer 28 (positive Z-axis). The fourth wiring layer 222 is electrically connected to the second radiating conductor layer 216 at the fourth power supply point P4, which is located closest to the fourth straight line E4 within the second outer edge EE2. The fourth wiring layer 222 intersects the fourth straight line E4 in a manner that is not perpendicular when viewed in the vertical direction (Z-axis direction).

The second radiating conductor layer 216 is located to the right (positive side of the X-axis) of the first radiating conductor layer 16. Furthermore, the first line E1 and the second line E2 are located to the right (positive side of the X-axis) of the first portion EP1 of the first outer edge EE1, excluding the first and second lines E1 and E2. The third line E3 and the fourth line E4 are located to the left (negative side of the X-axis) of the second portion EP2 of the second outer edge EE2, excluding the third and fourth lines E3 and E4. The other structures of the multilayer substrate 10a are the same as those of the multilayer substrate 10, so their description is omitted. The multilayer substrate 10a can achieve the same effects and advantages as the multilayer substrate 10.

In the multilayer substrate 10a, mutual coupling between the first radiating conductor layer 16 and the second radiating conductor layer 216 is suppressed, thus suppressing a decrease in the gain of the first radiating conductor layer 16 and the second radiating conductor layer 216. More specifically, in the first radiating conductor layer 16, the electric field strength is high in the lines E101 and E102. In the second radiating conductor layer 216, the electric field strength is high in the lines E103 and E104. Therefore, the lines E101 and E102 are easily electrically coupled with the third wiring layer 220 and the fourth wiring layer 222. The lines E103 and E104 are easily electrically coupled with the first wiring layer 20 and the second wiring layer 22. Thus, in the multilayer substrate 10a, the first line E1 and the second line E2 are located to the right of the first portion EP1 of the first outer edge EE1, excluding the first line E1 and the second line E2. The third line E3 and the fourth line E4 are located to the left of the second portion EP2 of the second outer edge EE2, excluding the third line E3 and the fourth line E4. As a result, lines E101 and E102 are located far from the third wiring layer 220 and the fourth wiring layer 222. Lines E103 and E104 are located far from the first wiring layer 20 and the second wiring layer 22. Therefore, mutual coupling between the first radiating conductor layer 16 and the second radiating conductor layer 216 is suppressed, thus suppressing the decrease in gain of the first radiating conductor layer 16 and the second radiating conductor layer 216.

(Second variation)
The following describes a second modified example of the multilayer substrate 10b. Figure 8 is a top view of the multilayer substrate 10b.

The multilayer substrate 10b differs from the multilayer substrate 10a in that it further comprises a third radiating conductor layer 316, a fifth wiring layer 320, and a sixth wiring layer 322.

The third radiating conductor layer 316 is provided in the laminate 12. The third radiating conductor layer 316 has a third outer edge EE3 that includes the fifth line E5, the sixth line E6, the line E105, and the line E106 when viewed in the vertical direction (Z-axis direction). The sixth line E6 intersects the fifth line E5 when viewed in the vertical direction (Z-axis direction). The sixth line E6 is perpendicular to the fifth line E5 when viewed in the vertical direction (Z-axis direction). Furthermore, the ground conductor layer 28 overlaps with the third radiating conductor layer 316 when viewed in the vertical direction (Z-axis direction).

The fifth wiring layer 320 is provided in the laminate 12. The third wiring layer 220 is located below the third radiating conductor layer 316 (negative side of the Z-axis) and above the ground conductor layer 28 (positive side of the Z-axis). The fifth wiring layer 320 is electrically connected to the third radiating conductor layer 316 at the fifth power supply point P5, which is located closest to the fifth straight line E5 within the third outer edge EE3. The fifth wiring layer 320 intersects the fifth straight line E5 so as not to be perpendicular when viewed in the vertical direction (Z-axis direction).

The sixth wiring layer 322 is provided in the laminate 12. The sixth wiring layer 322 is located below the third radiating conductor layer 316 (negative Z-axis) and above the ground conductor layer 28 (positive Z-axis). The sixth wiring layer 322 is electrically connected to the third radiating conductor layer 316 at the sixth power supply point P6, which is located closest to the sixth straight line E6 within the third outer edge EE3. The sixth wiring layer 322 intersects the sixth straight line E6 in a manner that is not perpendicular when viewed in the vertical direction (Z-axis direction).

The third radiating conductor layer 316 is located to the right (positive side of the X-axis) of the second radiating conductor layer 216. Furthermore, the fifth line E5 and the sixth line E6 are located to the right (positive side of the X-axis) of the third portion EP3 of the third outer edge EE3, excluding the fifth line E5 and the sixth line E6. The other structures of the multilayer substrate 10b are the same as those of the multilayer substrate 10a, so their description is omitted. The multilayer substrate 10b can achieve the same effects and advantages as the multilayer substrate 10a.

Furthermore, with the multilayer substrate 10b, the third wiring layer 220 and the fourth wiring layer 222 separate from the fifth wiring layer 320 and the sixth wiring layer 322. As a result, bonding between the second radiating conductor layer 216 and the third radiating conductor layer 316 is suppressed.

(Third variation)
The following describes a third modified example of the multilayer substrate 10c. Figure 9 is a top view of the multilayer substrate 10c.

The multilayer substrate 10c differs from the multilayer substrate 10b in the positions of the first radiating conductor layer 16, the second radiating conductor layer 216, and the third radiating conductor layer 316. More specifically, the second radiating conductor layer 216 is located to the right (positive side of the X-axis) of the first radiating conductor layer 16. The third radiating conductor layer 316 is located to the right (positive side of the X-axis) of the second radiating conductor layer 216. The first line E1, the third line E3, and the fifth line E5 are parallel to the left-right direction (X-axis). The second line E2, the fourth line E4, and the sixth line E6 overlap each other when viewed in the left-right direction (X-axis direction). The right end of the first line E1 (positive end of the X-axis) is connected to the front end of the second line E2 (positive end of the Y-axis). The right end of the third line E3 (positive end of the X-axis) is connected to the front end of the fourth line E4 (positive end of the Y-axis). The right end of the fifth line E5 (the positive end on the X-axis) is connected to the front end of the sixth line E6 (the positive end on the Y-axis). The other structures of the multilayer substrate 10c are the same as those of the multilayer substrate 10b, so their explanation is omitted.

The multilayer substrate 10c can bring the degree of coupling between the first radiating conductor layer 16 and the second radiating conductor layer 216 and the degree of coupling between the second radiating conductor layer 216 and the third radiating conductor layer 316 closer together. More specifically, in the first radiating conductor layer 16, the electric field strength is higher along lines E101 and E102. In the second radiating conductor layer 216, the electric field strength is higher along lines E103 and E104. In the third radiating conductor layer 316, the electric field strength is higher along lines E105 and E106. Therefore, the second line E2 and line E103 are opposite each other. The fourth line E4 and line E105 are opposite each other. This makes it possible to bring the degree of coupling between the first radiating conductor layer 16 and the second radiating conductor layer 216 and the degree of coupling between the second radiating conductor layer 216 and the third radiating conductor layer 316 closer together. As a result, the tilt of the high-frequency signals radiated from the entirety of the first radiating conductor layer 16, the second radiating conductor layer 216, and the third radiating conductor layer 316 from the normal direction of the main surface of the radiating conductor layers can be suppressed.

(Fourth variation)
The following describes a multilayer substrate 10d according to a fourth modified example. Figure 10 is a top view of the multilayer substrate 10d.

The multilayer substrate 10d differs from the multilayer substrate 10b in the positions of the first radiating conductor layer 16, the second radiating conductor layer 216, and the third radiating conductor layer 316. More specifically, the second radiating conductor layer 216 is located to the right (positive side of the X-axis) of the first radiating conductor layer 16. The third radiating conductor layer 316 is located to the right (positive side of the X-axis) of the second radiating conductor layer 216.

The first line E1 and the second line E2 are located to the left (negative side of the X-axis) of the first portion EP1, which is the first outer edge EE1 excluding the first and second lines E1 and E2. The third line E3 and the fourth line E4 are located behind (negative side of the Y-axis) of the second portion EP2, which is the second outer edge EE2 excluding the third and fourth lines E3 and E4. The fifth line E5 and the sixth line E6 are located to the left (negative side of the X-axis) of the third portion EP3, which is the third outer edge EE3 excluding the fifth and sixth lines E5 and E6. The other structures of the multilayer substrate 10d are the same as those of the multilayer substrate 10b, so their description is omitted.

(Fifth variation)
The following describes a multilayer substrate 10e according to the fifth modified example. Figure 11 is an exploded perspective view of the multilayer substrate 10e. Figure 12 is a top view of the multilayer substrate 10e.

The multilayer substrate 10e differs from the multilayer substrate 10 in that it further comprises a second radiating conductor layer 216, a third wiring layer 220, and a fourth wiring layer 222. The second radiating conductor layer 216 is provided on the laminate 12. The second radiating conductor layer 216 is located below the first radiating conductor layer 16 (on the negative side of the Z-axis). The second radiating conductor layer 216 overlaps with the first radiating conductor layer 16 when viewed in the vertical direction (Z-axis direction). The second radiating conductor layer 216 has a second outer edge EE2 that includes the third straight line E3 and the fourth straight line E4 when viewed in the vertical direction (Z-axis direction).

The right end of the third line E3 (the positive end of the X-axis) connects to the right end of the fourth line E4 (the positive end of the X-axis). The third line E3 is parallel to the first line E1. The fourth line E4 is parallel to the second line E2.

The third wiring layer 220 is provided in the laminate 12. The third wiring layer 220 is located below the second radiating conductor layer 216 (negative side of the Z-axis) and above the ground conductor layer 28 (positive side of the Z-axis). The third wiring layer 220 is electrically connected to the second radiating conductor layer 216 at the third power supply point P3, which is located closest to the third straight line E3 within the second outer edge EE2. The third wiring layer 220 intersects the third straight line E3 in a manner that is not perpendicular when viewed in the vertical direction (Z-axis direction).

The fourth wiring layer 222 is provided in the laminate 12. The fourth wiring layer 222 is located below the second radiating conductor layer 216 (negative Z-axis) and above the ground conductor layer 28 (positive Z-axis). The fourth wiring layer 222 is electrically connected to the second radiating conductor layer 216 at the fourth power supply point P4, which is located closest to the fourth straight line E4 within the second outer edge EE2. The fourth wiring layer 222 intersects the fourth straight line E4 in a manner that is not perpendicular when viewed in the vertical direction (Z-axis direction).

Furthermore, the first wiring layer 20 intersects the first line E1 and the third line E3 in a manner that is not perpendicular when viewed in the vertical direction (Z-axis direction). The second wiring layer 22 intersects the second line E2 and the fourth line E4 in a manner that is not perpendicular when viewed in the vertical direction (Z-axis direction). The other structures of the multilayer substrate 10e are the same as those of the multilayer substrate 10, so their explanation is omitted. The multilayer substrate 10e can achieve the same effects and advantages as the multilayer substrate 10.

According to the multilayer substrate 10e, mutual coupling between the first radiating conductor layer 16 and the second radiating conductor layer 216 is suppressed, thereby suppressing the decrease in gain of the first radiating conductor layer 16 and the second radiating conductor layer 216. More specifically, in the first radiating conductor layer 16, the electric field strength is high along lines E101 and E102. In the second radiating conductor layer 216, the electric field strength is high along lines E103 and E104. Therefore, lines E101 and E102 are easily electrically coupled with the third wiring layer 220 and the fourth wiring layer 222. Lines E103 and E104 are easily electrically coupled with the first wiring layer 20 and the second wiring layer 22.

Therefore, in the multilayer substrate 10e, the first line E1 is parallel to the third line E3. The second line E2 is parallel to the fourth line E4. The right end of the first line E1 is connected to the right end of the second line E2. The right end of the third line E3 is connected to the right end of the fourth line E4. As a result, the first wiring layer 20 and the second wiring layer 22 are not located near lines E103 and E104. The third wiring layer 220 and the fourth wiring layer 222 are not located near lines E101 and E102. As a result, coupling between the first radiating conductor layer 16 and the second radiating conductor layer 216 is suppressed, and thus the decrease in gain of the first radiating conductor layer 16 and the second radiating conductor layer 216 is suppressed.

Furthermore, the first wiring layer 20 and the second wiring layer 22 of the second radiating conductor layer 216 are led out so as to move away from the straight lines E101 and E102 where the intensity of the electric field generated by the first radiating conductor layer 16 is high. This suppresses coupling between the first radiating conductor layer 16 and the second radiating conductor layer 216, thereby reducing the gain reduction of both layers.

(Sixth variation)
The following describes a multilayer substrate 10f according to the sixth modified example. Figure 13 is a top view of the multilayer substrate 10f.

The multilayer substrate 10f differs from the multilayer substrate 10c in the arrangement of the second radiating conductor layer 216. More specifically, the rear end (negative end of the Y-axis) of the third straight line E3 is connected to the left end (negative end of the X-axis) of the fourth straight line E4. The other structural features of the multilayer substrate 10f are the same as those of the multilayer substrate 10c, so their description is omitted.

(Seventh variation)
The following describes a multilayer substrate 10g according to the seventh modified example. Figure 14 is an exploded perspective view of the multilayer substrate 10g. Figure 15 is a cross-sectional view of the multilayer substrate 10g.

The multilayer substrate 10g differs from the multilayer substrate 10 in that it has a rigid portion A3 and a flexible portion A4, and further comprises a first ground conductor layer 128 and interlayer connecting conductors v9 to v12.

The rigid portion A3 is the part whose length in the vertical direction (Z-axis direction) is longer than the length of the flexible portion A4 in the vertical direction (Z-axis direction), as shown in Figures 14 and 15. In this modified example, the rigid portion A3 overlaps with the protective layer 15a when viewed in the vertical direction (Z-axis direction). The flexible portion A4 is the part whose length in the vertical direction (Z-axis direction) is shorter than the length of the rigid portion A3 in the vertical direction (Z-axis direction). In this modified example, the flexible portion A4 is located to the right of the rigid portion A3. The first wiring layer 20 straddles the rigid portion A3 and the flexible portion A4. The second wiring layer 22 straddles the rigid portion A3 and the flexible portion A4. The ground conductor layer 28 straddles the rigid portion A3 and the flexible portion A4. In the rigid portion A3, no ground conductor is provided between the annular ground conductor layer 30 and the ground conductor layer 28. External electrodes 24 and 26 and the opening H are provided in the flexible portion A4. The other structures of the rigid portion A3 are the same as those of the multilayer substrate 10, so their description is omitted. The structure of the flexible portion A4 is described in detail below.

In the flexible portion A4, the laminate 12 has a structure in which insulating layers 14c to 14e and protective layers 15b and 15c are stacked in the vertical direction (Z-axis direction). The protective layer 15c, insulating layers 14c to 14e, and protective layer 15b are arranged in this order from top to bottom.

The first ground conductor layer 128 is provided on the upper main surface of the insulator layer 14c. The first ground conductor layer 128 has a rectangular shape when viewed in the vertical direction. The longer side of the first ground conductor layer 128 extends in the left-right direction. The shorter side of the first ground conductor layer 128 extends in the front-back direction. When viewed in the vertical direction, the first ground conductor layer 128 overlaps with the first wiring layer 20 and the second wiring layer 22. The first ground conductor layer 128 is connected to the ground potential.

The interlayer connecting conductors v9 to v12 electrically connect the first ground conductor layer 128 and the ground conductor layer 28. More specifically, the interlayer connecting conductors v9 to v12 penetrate the insulating layers 14c to 14e in the vertical direction. The upper ends of the interlayer connecting conductors v9 to v12 are in contact with the first ground conductor layer 128. The lower ends of the interlayer connecting conductors v9 to v12 are in contact with the ground conductor layer 28.

The first ground conductor layer 128 is formed by patterning a metal foil attached to the upper main surface of the insulator layer 14c. The metal foil is, for example, copper foil. The interlayer connecting conductors v9 to v12 are formed by filling through-holes that penetrate the insulator layers 14c to 14e vertically with conductive paste, and then solidifying the conductive paste by heating and pressurizing it.

The protective layer 15c has a higher dielectric constant than the insulating layers 14a to 14e. In the flexible portion A4, the protective layer 15c covers the upper main surface of the insulating layer 14c. Thus, the protective layer 15c protects the first ground conductor layer 128.

The structures of the external electrodes 24 and 26 and the aperture H are the same as those of the multilayer substrate 10, so their explanation is omitted. Furthermore, the other structures of the multilayer substrate 10g are the same as those of the multilayer substrate 10, so their explanation is omitted.

The multilayer substrate 10g can achieve the same effects and benefits as the multilayer substrate 10.

(a) The multilayer substrate 10g facilitates bending. More specifically, the multilayer substrate 10g has a rigid portion A3 and a flexible portion A4. The length of the flexible portion A4 in the vertical direction (Z-axis direction) is shorter than the length of the rigid portion A3 in the vertical direction (Z-axis direction). Therefore, the flexible portion A4 is more easily deformed than the rigid portion A3. That is, the flexible portion A4 is easily bent. As a result, the multilayer substrate 10g can be easily bent. Consequently, bending of the multilayer substrate 10g becomes easier.

(b) With the multilayer substrate 10g, the length of the rigid portion A3 in the vertical direction (Z-axis direction) can be shortened. More specifically, in the rigid portion A3, the first wiring layer 20 and the second wiring layer 22 are located below the annular ground conductor layer 30 and above the ground conductor layer 28. Therefore, the annular ground conductor layer 30 and the ground conductor layer 28 suppress noise from entering the interior of the first wiring layer 20 and the second wiring layer 22, respectively.

(c) In the case of the multilayer substrate 10g, the capacitance generated between the first radiating conductor layer 16 and the ground conductor can be suppressed compared to the case where a ground conductor is provided between the annular ground conductor layer 30 and the ground conductor layer 28.

(Variation 8)
The following describes the multilayer substrate 10h according to the eighth modified example. Figure 16 is an exploded perspective view of the multilayer substrate 10h. Figure 17 is a cross-sectional view of the multilayer substrate 10h.

The multilayer substrate 10h differs from the multilayer substrate 10 in that it has a rigid portion A3 and a flexible portion A4, further comprises a seventh wiring layer 120, an eighth wiring layer 122, a first ground conductor layer 128, and interlayer connecting conductors v9 to v12, v15, and v16, and also comprises an interlayer connecting conductor v13 and an interlayer connecting conductor v14.

The rigid portion A3 is the part whose length in the vertical direction (Z-axis direction) is longer than the length of the flexible portion A4 in the vertical direction (Z-axis direction), as shown in Figures 16 and 17. In this modified example, the rigid portion A3 overlaps with the protective layer 15a when viewed in the vertical direction (Z-axis direction). The flexible portion A4 is the part whose length in the vertical direction (Z-axis direction) is shorter than the length of the rigid portion A3 in the vertical direction (Z-axis direction). In this modified example, the flexible portion A4 is located to the right of the rigid portion A3. First, the structure of the rigid portion A3 will be described in detail. Next, the structure of the flexible portion A4 will be described in detail.

In rigid section A3, the laminate 12 has a structure in which insulating layers 14a to 14f and protective layers 15a and 15b are stacked in the vertical direction (Z-axis direction). The protective layer 15a, insulating layers 14a to 14f, and protective layer 15b are arranged in this order from top to bottom. The material of insulating layer 14f is a thermoplastic resin such as polyimide or liquid crystal polymer. The laminate 12 is flexible.

In this modified example, the first wiring layer 20 and the second wiring layer 22 are located on the upper main surface of the insulator layer 14b. The interlayer connecting conductors v1 and v2 penetrate the insulator layer 14a in the vertical direction. The ground conductor layer 28 is provided on the lower main surface of the insulator layer 14f. The protective layer 15b covers the lower main surface of the insulator layer 14f. Thus, the protective layer 15b protects the ground conductor layer 28.

The seventh wiring layer 120 is provided on the laminate 12. The seventh wiring layer 120 is located below the first wiring layer 20 (negative Z-axis) and above the ground conductor layer 28 (positive Z-axis). In this modified example, the seventh wiring layer 120 is located on the upper main surface of the insulator layer 14e. Furthermore, the seventh wiring layer 120 has a linear shape that extends horizontally when viewed vertically. The seventh wiring layer 120 straddles the rigid portion A3 and the flexible portion A4. Also, the seventh wiring layer 120 does not overlap with the first radiating conductor layer 16 when viewed vertically.

The eighth wiring layer 122 is provided on the laminate 12. The eighth wiring layer 122 is located below the second wiring layer 22 (negative Z-axis) and above the ground conductor layer 28 (positive Z-axis). In this modified example, the eighth wiring layer 122 is located on the upper main surface of the insulator layer 14e. Furthermore, the eighth wiring layer 122 is located behind the seventh wiring layer 120 when viewed in the vertical direction. The eighth wiring layer 122 has a linear shape extending in the left-right direction when viewed in the vertical direction. The eighth wiring layer 122 straddles the rigid portion A3 and the flexible portion A4. Also, the eighth wiring layer 122 does not overlap with the first radiating conductor layer 16 when viewed in the vertical direction.

The interlayer connecting conductor v13 electrically connects the first wiring layer 20 and the seventh wiring layer 120. More specifically, the interlayer connecting conductor v13 penetrates the insulating layers 14b to 14d in the vertical direction. The upper end of the interlayer connecting conductor v13 is in contact with the right end of the first wiring layer 20. The lower end of the interlayer connecting conductor v13 is in contact with the left end of the seventh wiring layer 120. Thus, the seventh wiring layer 120 is electrically connected to the first wiring layer 20.

The interlayer connecting conductor v14 electrically connects the second wiring layer 22 and the eighth wiring layer 122. More specifically, the interlayer connecting conductor v14 penetrates the insulating layers 14b to 14d in the vertical direction. The upper end of the interlayer connecting conductor v14 is in contact with the right end of the second wiring layer 22. The lower end of the interlayer connecting conductor v14 is in contact with the left end of the eighth wiring layer 122. Thus, the eighth wiring layer 122 is electrically connected to the second wiring layer 22.

The interlayer connecting conductors v13 and v14 are formed by filling through-holes that penetrate vertically through the insulating layers 14b to 14d with conductive paste, and then solidifying the conductive paste by heating and pressurizing it.

The ground conductor layer 28 spans both the rigid portion A3 and the flexible portion A4. The external electrodes 24 and 26 and the opening H are provided in the flexible portion A4. The other structures of the rigid portion A3 are the same as those of the multilayer substrate 10, so their description is omitted. The structure of the flexible portion A4 will be described in detail below.

In the flexible portion A4, the laminate 12 has a structure in which insulating layers 14d to 14f and protective layers 15b and 15c are stacked in the vertical direction (Z-axis direction). The protective layer 15c, insulating layers 14d to 14f, and protective layer 15b are arranged in this order from top to bottom.

In the flexible portion A4, the first ground conductor layer 128 is provided on the upper main surface of the insulator layer 14d. Viewed vertically, the first ground conductor layer 128 overlaps with the seventh wiring layer 120 and the eighth wiring layer 122. The other structures of the first ground conductor layer 128 are the same as those of the multilayer substrate 10g, so their description is omitted.

In the flexible section A4, the interlayer connecting conductors v9 to v12 penetrate the insulating layers 14d to 14f in the vertical direction. The other structures of the interlayer connecting conductors v9 to v12 are the same as those of the multilayer substrate 10g, so their explanation is omitted.

The interlayer connecting conductor v15 electrically connects the seventh wiring layer 120 and the external electrode 24. More specifically, the interlayer connecting conductor v15 penetrates the insulating layers 14e and 14f in the vertical direction. The upper end of the interlayer connecting conductor v15 is in contact with the right end of the seventh wiring layer 120. The lower end of the interlayer connecting conductor v15 is in contact with the external electrode 24.

The interlayer connecting conductor v16 electrically connects the eighth wiring layer 122 and the external electrode 26. More specifically, the interlayer connecting conductor v16 penetrates the insulating layers 14e and 14f in the vertical direction. The upper end of the interlayer connecting conductor v16 is in contact with the right end of the eighth wiring layer 122. The lower end of the interlayer connecting conductor v16 is in contact with the external electrode 26.

The interlayer connecting conductors v15 and v16 are formed by filling through-holes that penetrate the insulating layers 14e and 14f in the vertical direction with conductive paste, and then solidifying the conductive paste by heating and pressurizing it.

The protective layer 15c has a higher dielectric constant than the insulating layers 14a to 14e. In the flexible portion A4, the protective layer 15c covers the upper main surface of the insulating layer 14d. Thus, the protective layer 15c protects the first ground conductor layer 128.

The external electrodes 24 and 26 are provided on the lower main surface of the insulating layer 14f. The other structures of the external electrodes 24 and 26 are the same as those of the multilayer substrate 10, so their description is omitted.

The structure of opening H is the same as that of the multilayer substrate 10, so its explanation is omitted. Furthermore, the other structures of the multilayer substrate 10h are the same as those of the multilayer substrate 10, so their explanation is omitted.

The multilayer substrate 10h can achieve the same effects as the multilayer substrate 10. Furthermore, the multilayer substrate 10h can achieve the effects described in (a) to (c).

(d) With the multilayer substrate 10h, by adjusting the length (width) of the first wiring layer 20 and the second wiring layer 22 in directions perpendicular to the vertical direction, the characteristic impedance can be matched at a position close to the first radiating conductor layer 16. This makes it possible to supply reflected waves to the first radiating conductor layer 16 while reducing losses.

(9th variation)
The following describes the multilayer substrate 10i according to the ninth modified example. Figure 18 is a top view of the multilayer substrate 10i.

The multilayer substrate 10i differs from the multilayer substrate 10 in that the first wiring layer 20 and the second wiring layer 22 include matching PMCs. In this modified example, the length of the matching PMCs of the first wiring layer 20 in the front-to-back direction is longer than the length of the portion of the first wiring layer 20 other than the matching PMCs. Similarly, the length of the matching PMCs of the second wiring layer 22 in the front-to-back direction is longer than the length of the portion of the second wiring layer 22 other than the matching PMCs. The matching PMCs do not overlap with the first radiating conductor layer 16 when viewed in the vertical direction (Z-axis direction).

The multilayer substrate 10i can achieve the same effects as the multilayer substrate 10. Furthermore, with the multilayer substrate 10i, coupling between the matching PMC and the first radiating conductor layer 16 is suppressed. More specifically, by positioning the matching PMC close to the first radiating conductor layer 16, reflected waves can be supplied to the first radiating conductor layer 16 while reducing losses; therefore, it is preferable to provide the matching PMC in the first wiring layer 20 and the second wiring layer 22. Here, the matching PMC does not overlap with the first radiating conductor layer 16 when viewed in the vertical direction (Z-axis direction). Therefore, the matching PMC can be positioned far from the first radiating conductor layer 16. As a result, with the multilayer substrate 10i, coupling between the matching PMC and the first radiating conductor layer 16 is suppressed.

(Tenth variation)
The following describes a multilayer substrate 10j according to the tenth modified example. Figure 19 is a top view of the multilayer substrate 10j.

The multilayer substrate 10j differs from the multilayer substrate 10 in that the first wiring layer 20 and the second wiring layer 22 include a stub portion ST. In this modified example, the stub portion ST is an open stub that is not connected to ground potential. The stub portion ST has a linear shape extending in the front-to-back direction when viewed in the vertical direction. The stub portion ST does not overlap with the first radiating conductor layer 16 when viewed in the vertical direction (Z-axis direction).

The multilayer substrate 10j can achieve the same effects as the multilayer substrate 10. Furthermore, with the multilayer substrate 10j, coupling between the stub portion ST and the first radiating conductor layer 16 is suppressed. More specifically, by positioning the stub portion ST close to the first radiating conductor layer 16, reflected waves can be supplied to the first radiating conductor layer 16 while reducing losses; therefore, it is preferable to provide the stub portion ST on the first wiring layer 20 and the second wiring layer 22. Here, the stub portion ST does not overlap with the first radiating conductor layer 16 when viewed in the vertical direction (Z-axis direction). Therefore, the stub portion ST can be positioned far from the first radiating conductor layer 16. As a result, with the multilayer substrate 10i, coupling between the stub portion ST and the first radiating conductor layer 16 is suppressed.

(11th variation)
The following describes the multilayer substrate 10k according to the 11th modified example. Figure 20 is a top view of the multilayer substrate 10k.

The multilayer substrate 10k differs from the multilayer substrate 10h in that the seventh wiring layer 120 is perpendicular to the first straight line E1 when viewed in the vertical direction (Z-axis direction). The other structural features of the multilayer substrate 10k are the same as those of the multilayer substrate 10h, so their explanation is omitted.

The multilayer substrate 10k can achieve the same effects as the multilayer substrate 10h. Furthermore, with the multilayer substrate 10k, the distance between the seventh wiring layer 120 and the first radiating conductor layer 16 is greater than the distance between the first wiring layer 20 and the first radiating conductor layer 16. Therefore, if the first wiring layer 20 intersects the first straight line E1 in a direction that is not perpendicular to it when viewed in the vertical direction (Z-axis direction), and the second wiring layer 22 intersects the second straight line E2 in a direction that is not perpendicular to it when viewed in the vertical direction (Z-axis direction), then the seventh wiring layer 120 may be perpendicular to the first straight line E1 when viewed in the vertical direction (Z-axis direction).

(e) The multilayer substrate 10k improves the degree of freedom in wiring layout. More specifically, the seventh wiring layer 120 may be perpendicular to the first line E1 when viewed in the vertical direction (Z-axis direction). Furthermore, the eighth wiring layer 122 may be perpendicular to the second line E2 when viewed in the vertical direction (Z-axis direction).

(12th variation)
The following describes an antenna module 100 according to the twelfth modified example. Figure 21 is a cross-sectional view of the antenna module 100. Figure 22 is an exploded perspective view of the multilayer substrate 210.

The antenna module 100 is used, for example, in wireless communication terminals such as smartphones. The antenna module 100 comprises a multilayer substrate 10 and a multilayer substrate 210.

As shown in Figure 21, the multilayer substrate 210 is located below the multilayer substrate 10 (on the negative side of the Z-axis). The multilayer substrate 210 has a region AR1 that overlaps with the multilayer substrate 10 when viewed in the vertical direction (Z-axis direction), and a region AR2 that does not overlap with the multilayer substrate 10 when viewed in the vertical direction (Z-axis direction). The structure of the multilayer substrate 210 will be described in detail below.

The multilayer substrate 210 comprises a laminate 112, a seventh wiring layer 120, an eighth wiring layer 122, external electrodes 124-127, a first ground conductor layer 128, a second ground conductor layer 129, and interlayer connecting conductors v9-v12, v15-v18. Each of the seventh wiring layer 120, the eighth wiring layer 122, the external electrodes 124-127, the first ground conductor layer 128, the second ground conductor layer 129, and the interlayer connecting conductors v9-v12, v15-v18 is provided on the laminate 112, as shown in Figure 22. The multilayer substrate 10 corresponds to the "first substrate" of the present invention. The multilayer substrate 210 corresponds to the "second substrate" of the present invention. The laminate 12 corresponds to the "first laminate" of the present invention. The laminate 112 corresponds to the "second laminate" of the present invention.

The laminate 112 has a plate shape. When viewed in the vertical direction, the laminate 112 has a rectangular shape. The laminate 112 has a structure in which insulating layers 114a to 114c and protective layers 115a and 115b are stacked in the vertical direction (Z-axis direction). The vertical length of the laminate 112 is shorter than the vertical length of the laminate 12. Therefore, the vertical length (Z-axis direction) of the multilayer substrate 210 is shorter than the vertical length (Z-axis direction) of the multilayer substrate 10. The protective layer 115a, insulating layers 114a to 114c, and protective layer 115b are arranged in this order from top to bottom. The material of the insulating layers 114a to 114c is a thermoplastic resin such as polyimide or liquid crystal polymer. The laminate 112 is flexible. The multilayer substrate 210 is flexible. Protective layers 115a and 115b will be described later.

The first ground conductor layer 128 is provided on the upper main surface of the insulator layer 14a. The first ground conductor layer 128 has a rectangular shape when viewed in the vertical direction. The longer side of the first ground conductor layer 128 extends in the left-right direction. The shorter side of the first ground conductor layer 128 extends in the front-back direction. When viewed in the vertical direction, the first ground conductor layer 128 overlaps with the seventh wiring layer 120 and the eighth wiring layer 122. The first ground conductor layer 128 is connected to the ground potential.

The external electrodes 124 and 126 are provided on the upper main surface of the insulating layer 114a. The external electrodes 124 and 126 are not in contact with the first ground conductor layer 128. Therefore, the external electrodes 124 and 126 are located within the opening provided in the first ground conductor layer 128. Furthermore, external electrode 124 overlaps with the left end of the seventh wiring layer 120 when viewed in the vertical direction. Also, external electrode 126 overlaps with the left end of the eighth wiring layer 122 when viewed in the vertical direction.

The seventh wiring layer 120 is located below the first ground conductor layer 128 and above the second ground conductor layer 129. In this modified example, the seventh wiring layer 120 is located on the upper main surface of the insulator layer 114b. The seventh wiring layer 120 has a linear shape that extends horizontally when viewed vertically. As shown in Figure 21, in the antenna module 100, the left end of the seventh wiring layer 120 overlaps with the first wiring layer 20 when viewed vertically. The right end of the seventh wiring layer 120 does not overlap with the first wiring layer 20. The seventh wiring layer 120 does not overlap with the first radiating conductor layer 16 when viewed vertically. Furthermore, the distance between the seventh wiring layer 120 and the first radiating conductor layer 16 is greater than the distance between the first wiring layer 20 and the first radiating conductor layer 16.

As shown in Figure 22, the eighth wiring layer 122 is located below the first ground conductor layer 128 and above the second ground conductor layer 129. In this modified example, the eighth wiring layer 122 is located on the upper main surface of the insulator layer 114b. Also, when viewed in the vertical direction, the eighth wiring layer 122 is located behind the seventh wiring layer 120. When viewed in the vertical direction, the eighth wiring layer 122 has a linear shape that extends in the left-right direction. As shown in Figure 21, in the antenna module 100, the left end of the eighth wiring layer 122 overlaps with the second wiring layer 22 when viewed in the vertical direction. In the antenna module 100, the right end of the eighth wiring layer 122 does not overlap with the second wiring layer 22. When viewed in the vertical direction, the eighth wiring layer 122 does not overlap with the first radiating conductor layer 16. Furthermore, the distance between the eighth wiring layer 122 and the first radiating conductor layer 16 is greater than the distance between the second wiring layer 22 and the first radiating conductor layer 16.

As shown in Figure 22, the second ground conductor layer 129 is provided on the lower main surface of the insulator layer 114c. Therefore, the second ground conductor layer 129 is located below (on the negative side of the Z-axis) the seventh wiring layer 120 and the eighth wiring layer 122. The second ground conductor layer 129 has a rectangular shape when viewed in the vertical direction. The long side of the second ground conductor layer 129 extends in the left-right direction. The short side of the second ground conductor layer 129 extends in the front-back direction. When viewed in the vertical direction (Z-axis direction), the second ground conductor layer 129 overlaps with the seventh wiring layer 120 and the eighth wiring layer 122. Also, as shown in Figure 21, when viewed in the vertical direction (Z-axis direction), the second ground conductor layer 129 overlaps with the first radiating conductor layer 16. That is, the second ground conductor layer 129 straddles a region AR1 that overlaps with the multilayer substrate 10 and a region AR2 that does not overlap with the multilayer substrate 10. The second ground conductor layer 129 is connected to the ground potential. Note that the second ground conductor layer 129 corresponds to the "ground conductor layer" of the present invention.

The external electrodes 125 and 127 are provided on the lower main surface of the insulating layer 114c. The external electrodes 125 and 127 are not in contact with the second ground conductor layer 129. Therefore, the external electrodes 125 and 127 are located within the opening provided in the second ground conductor layer 129. Furthermore, external electrode 125 overlaps with the right end of the seventh wiring layer 120 when viewed in the vertical direction. Also, external electrode 127 overlaps with the right end of the eighth wiring layer 122 when viewed in the vertical direction.

The interlayer connecting conductors v9 to v12 electrically connect the first ground conductor layer 128 and the second ground conductor layer 129. More specifically, the interlayer connecting conductors v9 to v12 penetrate the insulating layers 114a to 114c in the vertical direction. The upper ends of the interlayer connecting conductors v9 to v12 are in contact with the first ground conductor layer 128. The lower ends of the interlayer connecting conductors v9 to v12 are in contact with the second ground conductor layer 129.

The interlayer connecting conductor v15 electrically connects the external electrode 124 and the seventh wiring layer 120. More specifically, the interlayer connecting conductor v15 penetrates the insulator layer 114a in the vertical direction. The upper end of the interlayer connecting conductor v15 is in contact with the external electrode 124. The lower end of the interlayer connecting conductor v15 is in contact with the left end of the seventh wiring layer 120.

The interlayer connecting conductor v16 electrically connects the external electrode 126 and the eighth wiring layer 122. More specifically, the interlayer connecting conductor v16 penetrates the insulator layer 114a in the vertical direction. The upper end of the interlayer connecting conductor v16 is in contact with the external electrode 126. The lower end of the interlayer connecting conductor v16 is in contact with the left end of the eighth wiring layer 122.

The interlayer connecting conductor v17 electrically connects the seventh wiring layer 120 and the external electrode 125. More specifically, the interlayer connecting conductor v17 penetrates the insulating layers 114b and 114c in the vertical direction. The upper end of the interlayer connecting conductor v17 is in contact with the right end of the seventh wiring layer 120. The lower end of the interlayer connecting conductor v15 is in contact with the external electrode 125.

The interlayer connecting conductor v18 electrically connects the eighth wiring layer 122 and the external electrode 127. More specifically, the interlayer connecting conductor v18 penetrates the insulating layers 114b and 114c in the vertical direction. The upper end of the interlayer connecting conductor v18 is in contact with the right end of the eighth wiring layer 122. The lower end of the interlayer connecting conductor v18 is in contact with the external electrode 127.

The protective layers 115a and 115b have a higher dielectric constant than the insulating layers 114a to 114c. Protective layer 115a covers the upper main surface of insulating layer 114a. Thus, protective layer 115a protects the first ground conductor layer 128. However, protective layer 115b has an opening h1. As a result, external electrodes 124 and 126 are exposed to the outside from the multilayer substrate 210 through the opening h1. Furthermore, protective layer 115b covers the lower main surface of insulating layer 114c. Thus, protective layer 115b protects the second ground conductor layer 129. However, protective layer 115b has an opening h2. As a result, external electrodes 125 and 127 are exposed to the outside from the multilayer substrate 210 through the opening h2.

The multilayer substrate 210 is mounted on the multilayer substrate 10. Specifically, the external electrode 124 is fixed to the external electrode 24 by solder S. This electrically connects the seventh wiring layer 120 to the first wiring layer 20. Therefore, the first high-frequency signal is input to or output to the external electrode 125. Furthermore, the external electrode 126 is fixed to the external electrode 26 by solder S. This electrically connects the eighth wiring layer 122 to the second wiring layer 22. Therefore, the second high-frequency signal is input to or output to the external electrode 127.

The antenna module 100 can achieve the same effects as the multilayer substrate 10. Furthermore, the antenna module 100 can achieve the effects described in (d) and (e).

(f) The antenna module 100 facilitates bending. More specifically, the multilayer substrate 210 has a region AR1 that overlaps with the multilayer substrate 10 when viewed in the vertical direction (Z-axis direction), and a region AR2 that does not overlap with the multilayer substrate 10 when viewed in the vertical direction (Z-axis direction). Furthermore, the length of the multilayer substrate 210 in the vertical direction (Z-axis direction) is shorter than the length of the multilayer substrate 10 in the vertical direction (Z-axis direction). Therefore, region AR2 of the multilayer substrate 210 is more easily deformed than the multilayer substrate 10. That is, region AR2 of the multilayer substrate 210 is easily bent. This allows the antenna module 100 to be easily bent. As a result, bending of the antenna module 100 becomes easier.

(13th variation)
The following describes an antenna module 100a according to the 13th modified example. Figure 23 is a cross-sectional view of the antenna module 100a.

Antenna module 100a differs from antenna module 100 in that it includes multilayer substrates 10l and 210a. Multilayer substrate 10l differs from multilayer substrate 10 in that it does not include a ground conductor layer 28 and interlayer connecting conductors v5 to v8.

As shown in Figure 23, the multilayer substrate 210a differs from the multilayer substrate 210 in that the first ground conductor layer 128 is located only in region AR2 when viewed in the vertical direction. The first ground conductor layer 128 does not overlap with the first radiating conductor layer 16 when viewed in the vertical direction. In this modified example, the first ground conductor layer 128 is not located in region AR1 when viewed in the vertical direction. In this modified example, the other structures of the antenna module 100a are the same as those of antenna module 100, so their description is omitted. In the antenna module 100a described above, the first radiating conductor layer 16 and the second ground conductor layer 129 function as a patch antenna that radiates or receives the first and second high-frequency signals.

Antenna module 100a can achieve the same effects as antenna module 100.

(g) With the antenna module 100a, the length of region AR1 in the vertical direction (Z-axis direction) can be shortened. More specifically, there is no first ground conductor layer 128 facing the first radiating conductor layer 16. The capacitance generated between the first radiating conductor layer 16 and the ground conductor is dominated by the capacitance generated between the first radiating conductor layer 16 and the second ground conductor layer 129. Therefore, when forming the desired capacitance, the length of region AR1 in the vertical direction (Z-axis direction) can be shortened.

(Other embodiments)
The multilayer substrate according to the present invention is not limited to multilayer substrates 10, 10a to 10k, but can be modified within the scope of its gist. Furthermore, the structures of the multilayer substrates 10, 10a to 10k may be arbitrarily combined.

The antenna module according to the present invention is not limited to antenna modules 100 and 100a, but can be modified within the scope of its essence. Furthermore, the structures of antenna modules 100 and 100a may be combined in any way. Also, antenna module 100 may include multilayer substrates 10a to 10l.

Note that the annular ground conductor layer 30 is not a mandatory component.

Furthermore, the first wiring layer 20 and the second wiring layer 22 do not necessarily have to be parallel. The third wiring layer 220 and the fourth wiring layer 222 do not necessarily have to be parallel. The fifth wiring layer 320 and the sixth wiring layer 322 do not necessarily have to be parallel.

Furthermore, in the multilayer substrate 10a, the first line E1 and the second line E2 may be located to the left (negative side of the X-axis) of the first portion EP1 of the first outer edge EE1 excluding the first line E1 and the second line E2, and the third line E3 and the fourth line E4 may be located to the right (positive side of the X-axis) of the second portion EP2 of the second outer edge EE2 excluding the third line E3 and the fourth line E4.

The second line E2 only needs to intersect the first line E1 when viewed vertically; it does not need to be perpendicular to the first line E1. The fourth line E4 only needs to intersect the third line E3 when viewed vertically; it does not need to be perpendicular to the third line E3. The sixth line E6 only needs to intersect the fifth line E5 when viewed vertically; it does not need to be perpendicular to the fifth line E5.

Note that the first straight line E1 and the second straight line E2 do not need to intersect when viewed in the vertical direction.

Furthermore, the first power supply point P1 may be located as close as possible to a point on the first straight line E1 other than the midpoint of the first straight line E1.

Furthermore, the second power supply point P2 may be located as close as possible to a point on the second straight line E2 other than the midpoint of the second straight line E2.

Furthermore, the third power supply point P3 may be located as close as possible to a point on the third straight line E3 other than the midpoint of the third straight line E3.

Furthermore, the fourth power supply point P4 may be located as close as possible to a point on the fourth straight line E4 other than the midpoint of the fourth straight line E4.

Furthermore, the fifth power supply point P5 may be located as close as possible to a point on the fifth straight line E5 other than the midpoint of the fifth straight line E5.

Furthermore, the sixth power supply point P6 may be located as close as possible to a point on the sixth straight line E6 other than the midpoint of the sixth straight line E6.

Furthermore, the rigid portion A3 does not necessarily need to overlap with the protective layer 15a when viewed in the vertical direction (Z-axis direction).

Note that the first ground conductor layer 128 is not a mandatory component.

Furthermore, the seventh wiring layer 120 and the eighth wiring layer 122 may overlap the first radiating conductor layer 16 when viewed in the vertical direction. However, by increasing the distance between the seventh wiring layer 120 and the eighth wiring layer 122 and the first radiating conductor layer 16, coupling between the seventh wiring layer 120 and the eighth wiring layer 122 and the first radiating conductor layer 16 is suppressed. Therefore, it is preferable that the seventh wiring layer 120 and the eighth wiring layer 122 do not overlap the first radiating conductor layer 16 when viewed in the vertical direction.

Furthermore, the matching PMC may be included in the seventh wiring layer 120 and the eighth wiring layer 122.

Furthermore, even if a matching PMC is provided separately from the first wiring layer 20, the second wiring layer 22, the seventh wiring layer 120, and the eighth wiring layer 122, the matching PMC only needs to not overlap with the first radiating conductor layer 16 when viewed in the vertical direction. In this case, the matching PMC may be formed, for example, by electronic components such as chip capacitors that constitute a matching circuit for matching characteristic impedances.

Furthermore, the stub portion ST may be included in the seventh wiring layer 120 and the eighth wiring layer 122. Also, the stub portion ST may be a short stub connected to ground potential.

The present invention has the following structure:

(1)
A laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A first radiating conductor layer is provided on the laminate and has a first outer edge that includes a first straight line and a second straight line when viewed in the Z-axis direction,
A ground conductor layer provided in the laminate, located on the negative side of the Z-axis from the first radiating conductor layer, and overlapping with the first radiating conductor layer when viewed in the Z-axis direction,
A first wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a first power supply point located closest to the first straight line within the first outer edge, and intersects the first straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A second wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a second power supply point located closest to the second straight line within the first outer edge, and intersects the second straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
It is equipped with
Multilayer board.

(2)
When viewed in the Z-axis direction, the region through which the first line passes when the first line is moved in a direction perpendicular to the first line is defined as the first region.
The first wiring layer spans the first region and the region outside the first region when viewed in the Z-axis direction.
When viewed in the Z-axis direction, the region through which the second line passes when the second line is moved in a direction perpendicular to the second line is defined as the second region.
The second wiring layer spans the second region and the region outside the second region when viewed in the Z-axis direction.
(1) The multilayer substrate described in (1).

(3)
A second radiating conductor layer is provided in the laminate and has a second outer edge that includes a third straight line and a fourth straight line when viewed in the Z-axis direction,
A third wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second radiating conductor layer at a third power supply point located closest to the third straight line within the second outer edge, and intersects the third straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A fourth wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second radiating conductor layer at a fourth power supply point located closest to the fourth straight line within the second outer edge, and intersects the fourth straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
It also has the following features:
The ground conductor layer overlaps with the second radiating conductor layer when viewed in the Z-axis direction.
A multilayer substrate as described in (1) or (2).

(4)
The second radiating conductor layer is located on the positive side of the X-axis of the first radiating conductor layer.
The X-axis is perpendicular to the Z-axis,
The first line and the second line are located on the positive side of the X-axis of the first outer edge, excluding the first line and the second line.
The third and fourth lines are located on the negative side of the X-axis, compared to the second portion of the second outer edge excluding the third and fourth lines.
(3) The multilayer substrate described in (3).

(5)
A third radiating conductor layer is provided in the laminate and has a third outer edge that includes a fifth straight line and a sixth straight line when viewed in the Z-axis direction,
A fifth wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the third radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the third radiating conductor layer at a fifth power supply point located closest to the fifth straight line within the third outer edge, and intersects the fifth straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A sixth wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the third radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the third radiating conductor layer at a sixth power supply point located closest to the sixth straight line within the third outer edge, and intersects the sixth straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
It also has the following features:
The ground conductor layer overlaps with the third radiating conductor layer when viewed in the Z-axis direction.
A multilayer substrate as described in (3) or (4).

(6)
The second radiating conductor layer is located on the positive side of the X-axis of the first radiating conductor layer.
The third radiating conductor layer is located on the positive side of the X-axis of the second radiating conductor layer,
The X-axis is perpendicular to the Z-axis,
The first line and the second line are located on the positive side of the X-axis of the first outer edge, excluding the first line and the second line.
The third and fourth lines are located on the negative side of the X-axis, compared to the second portion of the second outer edge excluding the third and fourth lines.
The fifth and sixth lines are located on the positive side of the X-axis of the third outer edge, excluding the fifth and sixth lines.
(5) The multilayer substrate described in (5).

(7)
The second radiating conductor layer is located on the positive side of the X-axis of the first radiating conductor layer.
The X-axis is perpendicular to the Z-axis,
The Y-axis is perpendicular to the X-axis and the Z-axis.
The third radiating conductor layer is located on the positive side of the X-axis of the second radiating conductor layer,
The first line, the third line, and the fifth line are parallel to the X-axis,
The second line, the fourth line, and the sixth line overlap each other when viewed in the X-axis direction.
The positive end of the first straight line on the X-axis is connected to the positive end of the second straight line on the Y-axis.
The positive end of the third line on the X-axis is connected to the positive end of the fourth line on the Y-axis.
The positive end of the X-axis of the fifth straight line is connected to the positive end of the Y-axis of the sixth straight line.
(5) The multilayer substrate described in (5).

(8)
The second radiating conductor layer is located on the positive side of the X-axis of the first radiating conductor layer.
The X-axis is perpendicular to the Z-axis,
The Y-axis is perpendicular to the X-axis and the Z-axis.
The third radiating conductor layer is located on the positive side of the X-axis of the second radiating conductor layer,
The first line, the fourth line, and the fifth line are parallel to the X-axis,
The second line, the third line, and the sixth line overlap each other when viewed in the X-axis direction.
The positive end of the first straight line on the X-axis is connected to the positive end of the second straight line on the Y-axis.
The negative end of the Y-axis of the third line is connected to the negative end of the X-axis of the fourth line.
The positive end of the X-axis of the fifth straight line is connected to the positive end of the Y-axis of the sixth straight line.
(5) The multilayer substrate described in (5).

(9)
The second radiating conductor layer is located on the positive side of the X-axis of the first radiating conductor layer.
The X-axis is perpendicular to the Z-axis,
The Y-axis is perpendicular to the X-axis and the Z-axis.
The third radiating conductor layer is located on the positive side of the X-axis of the second radiating conductor layer,
The first line and the second line are located on the negative side of the X-axis, compared to the first portion of the first outer edge excluding the first line and the second line.
The third and fourth lines are located on the negative side of the Y-axis, compared to the second portion of the second outer edge excluding the third and fourth lines.
The fifth and sixth lines are located on the negative side of the X-axis, relative to the third portion of the third outer edge excluding the fifth and sixth lines.
(5) The multilayer substrate described in (5).

(10)
The aforementioned multilayer substrate is
A second radiating conductor layer is provided in the laminate, is located on the negative side of the Z-axis from the first radiating conductor layer, overlaps with the first radiating conductor layer when viewed in the Z-axis direction, and has a second outer edge that includes the third and fourth straight lines when viewed in the Z-axis direction,
A third wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second radiating conductor layer at a third power supply point located closest to the third straight line within the second outer edge, and intersects the third straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A fourth wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second radiating conductor layer at a fourth power supply point located closest to the fourth straight line within the second outer edge, and intersects the fourth straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
It also has the following features:
The ground conductor layer overlaps with the second radiating conductor layer when viewed in the Z-axis direction.
The first line is parallel to the third line,
The aforementioned second line is parallel to the aforementioned fourth line,
The X-axis is perpendicular to the Z-axis,
The positive end of the first straight line on the X-axis is connected to the positive end of the second straight line on the X-axis.
The positive end of the third line on the X-axis is connected to the positive end of the fourth line on the X-axis.
The first wiring layer intersects the first and third lines in such a way that they are not perpendicular when viewed in the Z-axis direction.
The second wiring layer intersects the second and fourth lines in such a way that they are not perpendicular when viewed in the Z-axis direction.
A multilayer substrate as described in (1) or (2).

(11)
The aforementioned multilayer substrate is
An annular ground conductor layer provided in the laminate and located on the positive side of the Z-axis relative to the ground conductor layer,
Furthermore, it is equipped with
The annular ground conductor layer has an annular shape that surrounds the first radiating conductor layer when viewed in the Z-axis direction.
A multilayer substrate as described in any of (1) to (10).

(12)
The first radiating conductor layer includes the first straight line, the second straight line, the seventh straight line, and the eighth straight line when viewed in the Z-axis direction, and has a rectangular shape when viewed in the Z-axis direction.
In a direction perpendicular to the first straight line, the distance from the center of the first straight line to the annular ground conductor layer is defined as the first distance.
In a direction perpendicular to the second straight line, the distance from the center of the second straight line to the annular ground conductor layer is defined as the second distance.
In a direction perpendicular to the seventh straight line, the distance from the center of the seventh straight line to the annular ground conductor layer is defined as the third distance.
In a direction perpendicular to the eighth straight line, the distance from the center of the eighth straight line to the annular ground conductor layer is defined as the fourth distance.
The first distance, the second distance, the third distance, and the fourth distance are equal to each other.
(11) The multilayer substrate described in (11).

(13)
The first wiring layer and the second wiring layer include matching sections.
The matching portion does not overlap with the first radiating conductor layer when viewed in the Z-axis direction.
A multilayer substrate as described in any of (1) to (12).

(14)
The first wiring layer and the second wiring layer include a stub portion.
The stub portion, when viewed in the Z-axis direction, does not overlap with the first radiating conductor layer.
A multilayer substrate as described in any of (1) to (12).

(15)
The aforementioned multilayer substrate is
Rigid part and
Flexible part,
It has,
The length of the flexible portion in the Z-axis direction is shorter than the length of the rigid portion in the Z-axis direction.
A multilayer substrate as described in any of (1) to (14).

(16)
The aforementioned multilayer substrate is
An annular ground conductor layer provided in the laminate and located on the positive side of the Z-axis relative to the ground conductor layer,
Furthermore, it is equipped with
The annular ground conductor layer has an annular shape that surrounds the first radiating conductor layer when viewed in the Z-axis direction.
In the rigid portion, no ground conductor is provided between the annular ground conductor layer and the ground conductor layer.
(15) The multilayer substrate described in (15).

(17)
A seventh wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first wiring layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first wiring layer,
An eighth wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second wiring layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second wiring layer,
It also has,
A multilayer substrate as described in (15) or (16).

(18)
The seventh wiring layer and the eighth wiring layer do not overlap with the first radiating conductor layer when viewed in the Z-axis direction.
(17) The multilayer substrate described in (17).

(19)
First circuit board and
A second substrate having flexibility,
It is equipped with,
The first substrate is,
A first laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A first radiating conductor layer is provided on the first laminate and has a first outer edge that includes a first straight line and a second straight line when viewed in the Z-axis direction,
A first wiring layer is provided on the first laminate, is located on the negative side of the Z-axis from the first radiating conductor layer, is electrically connected to the first radiating conductor layer at a first power supply point located closest to the first straight line within the first outer edge, and intersects the first straight line in such a way that it is not perpendicular when viewed in the Z-axis direction.
A second wiring layer is provided on the first laminate, is located on the negative side of the Z-axis from the first radiating conductor layer, is electrically connected to the first radiating conductor layer at a second power supply point located closest to the second straight line within the first outer edge, and intersects the second straight line in a manner that is not perpendicular to it when viewed in the Z-axis direction.
It includes,
The aforementioned second substrate is
A second laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A seventh wiring layer is provided on the second laminate and is electrically connected to the first wiring layer,
An eighth wiring layer is provided on the second laminate and is electrically connected to the second wiring layer,
A ground conductor layer is provided in the second laminate, is located on the negative side of the Z-axis relative to the seventh wiring layer and the eighth wiring layer, and overlaps with the first radiating conductor layer, the seventh wiring layer and the eighth wiring layer when viewed in the Z-axis direction,
It includes,
The length of the second substrate in the Z-axis direction is shorter than the length of the first substrate in the Z-axis direction.
The second substrate is located on the negative side of the Z-axis compared to the first substrate, and has a region that does not overlap with the first substrate when viewed in the Z-axis direction.
Antenna module.

10, 10a-10j, 210, 210a: Multilayer substrate 12, 112: Laminate 14a-14f, 114a-114c: Insulator layer 15a-15c, 115a, 115b: Protective layer 16: First radiating conductor layer 20: First wiring layer 22: Second wiring layer 24, 26, 124-127: External electrode 28: Ground conductor layer 30: Annular ground conductor layer 100, 100a: Antenna module 120: Seventh wiring layer 122: Eighth wiring layer 128: First ground conductor layer 129: Second ground conductor layer 216: Second radiating conductor layer 220: Third wiring layer 222: Fourth Wiring layer 316: Third radiating conductor layer 320: Fifth wiring layer 322: Sixth wiring layer A1: First region A2: Second region A3: Rigid portion A4: Flexible portion E1: First straight line E2: Second straight line E3: Third straight line E4: Fourth straight line E5: Fifth straight line E6: Sixth straight line EE1: First outer edge EE2: Second outer edge EE3: Third outer edge EP1: First portion EP2: Second portion EP3: Third portion H, h1, h2: Opening P1: First power supply point P2: Second power supply point P3: Third power supply point P4: Fourth power supply point P5: Fifth power supply point P6: Sixth power supply point S: Solder ST: Stub portion v1 to v18: Interlayer connecting conductor

Claims (25)

A laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A first radiating conductor layer is provided on the laminate and has a first outer edge that includes a first straight line and a second straight line when viewed in the Z-axis direction,
A ground conductor layer provided in the laminate, located on the negative side of the Z-axis from the first radiating conductor layer, and overlapping with the first radiating conductor layer when viewed in the Z-axis direction,
A first wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a first power supply point located closest to the first straight line within the first outer edge, and intersects the first straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A second wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a second power supply point located closest to the second straight line within the first outer edge, and intersects the second straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
It is equipped with,
When viewed in the Z-axis direction, the region through which the first line passes when the first line is moved in a direction perpendicular to the first line is defined as the first region.
The first wiring layer spans the first region and the region outside the first region when viewed in the Z-axis direction.
When viewed in the Z-axis direction, the region through which the second line passes when the second line is moved in a direction perpendicular to the second line is defined as the second region.
The second wiring layer spans the second region and the region outside the second region when viewed in the Z-axis direction.
Multilayer board. A second radiating conductor layer is provided in the laminate and has a second outer edge that includes a third straight line and a fourth straight line when viewed in the Z-axis direction,
A third wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second radiating conductor layer at a third power supply point located closest to the third straight line within the second outer edge, and intersects the third straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A fourth wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second radiating conductor layer at a fourth power supply point located closest to the fourth straight line within the second outer edge, and intersects the fourth straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
It also has the following features:
The ground conductor layer overlaps with the second radiating conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to claim 1 . The second radiating conductor layer is located on the positive side of the X-axis of the first radiating conductor layer.
The X-axis is perpendicular to the Z-axis,
The first line and the second line are located on the positive side of the X-axis of the first outer edge, excluding the first line and the second line.
The third and fourth lines are located on the negative side of the X-axis, compared to the second portion of the second outer edge excluding the third and fourth lines.
The multilayer substrate according to claim 2 . A third radiating conductor layer is provided in the laminate and has a third outer edge that includes a fifth straight line and a sixth straight line when viewed in the Z-axis direction,
A fifth wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the third radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the third radiating conductor layer at a fifth power supply point located closest to the fifth straight line within the third outer edge, and intersects the fifth straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A sixth wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the third radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the third radiating conductor layer at a sixth power supply point located closest to the sixth straight line within the third outer edge, and intersects the sixth straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
It also has the following features:
The ground conductor layer overlaps with the third radiating conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to claim 2 . A laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A first radiating conductor layer is provided on the laminate and has a first outer edge that includes a first straight line and a second straight line when viewed in the Z-axis direction,
A ground conductor layer provided in the laminate, located on the negative side of the Z-axis from the first radiating conductor layer, and overlapping with the first radiating conductor layer when viewed in the Z-axis direction,
A first wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a first power supply point located closest to the first straight line within the first outer edge, and intersects the first straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A second wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a second power supply point located closest to the second straight line within the first outer edge, and intersects the second straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A second radiating conductor layer is provided in the laminate and has a second outer edge that includes a third straight line and a fourth straight line when viewed in the Z-axis direction,
A third wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second radiating conductor layer at a third power supply point located closest to the third straight line within the second outer edge, and intersects the third straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A fourth wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second radiating conductor layer at a fourth power supply point located closest to the fourth straight line within the second outer edge, and intersects the fourth straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A third radiating conductor layer is provided in the laminate and has a third outer edge that includes a fifth straight line and a sixth straight line when viewed in the Z-axis direction,
A fifth wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the third radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the third radiating conductor layer at a fifth power supply point located closest to the fifth straight line within the third outer edge, and intersects the fifth straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A sixth wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the third radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the third radiating conductor layer at a sixth power supply point located closest to the sixth straight line within the third outer edge, and intersects the sixth straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
It is equipped with,
The ground conductor layer overlaps with the second radiating conductor layer and the third radiating conductor layer, respectively, when viewed in the Z-axis direction.
Multilayer board. The second radiating conductor layer is located on the positive side of the X-axis of the first radiating conductor layer.
The third radiating conductor layer is located on the positive side of the X-axis of the second radiating conductor layer,
The X-axis is perpendicular to the Z-axis,
The first line and the second line are located on the positive side of the X-axis of the first outer edge, excluding the first line and the second line.
The third and fourth lines are located on the negative side of the X-axis, compared to the second portion of the second outer edge excluding the third and fourth lines.
The fifth and sixth lines are located on the positive side of the X-axis of the third outer edge, excluding the fifth and sixth lines.
A multilayer substrate according to claim 4 or claim 5. The second radiating conductor layer is located on the positive side of the X-axis of the first radiating conductor layer.
The X-axis is perpendicular to the Z-axis,
The Y-axis is perpendicular to the X-axis and the Z-axis.
The third radiating conductor layer is located on the positive side of the X-axis of the second radiating conductor layer,
The first line, the third line, and the fifth line are parallel to the X-axis,
The second line, the fourth line, and the sixth line overlap each other when viewed in the X-axis direction.
The positive end of the first straight line on the X-axis is connected to the positive end of the second straight line on the Y-axis.
The positive end of the third line on the X-axis is connected to the positive end of the fourth line on the Y-axis.
The positive end of the X-axis of the fifth straight line is connected to the positive end of the Y-axis of the sixth straight line.
A multilayer substrate according to claim 4 or claim 5. The second radiating conductor layer is located on the positive side of the X-axis of the first radiating conductor layer.
The X-axis is perpendicular to the Z-axis,
The Y-axis is perpendicular to the X-axis and the Z-axis.
The third radiating conductor layer is located on the positive side of the X-axis of the second radiating conductor layer,
The first line, the fourth line, and the fifth line are parallel to the X-axis,
The second line, the third line, and the sixth line overlap each other when viewed in the X-axis direction.
The positive end of the first straight line on the X-axis is connected to the positive end of the second straight line on the Y-axis.
The negative end of the Y-axis of the third line is connected to the negative end of the X-axis of the fourth line.
The positive end of the X-axis of the fifth straight line is connected to the positive end of the Y-axis of the sixth straight line.
A multilayer substrate according to claim 4 or claim 5. The second radiating conductor layer is located on the positive side of the X-axis of the first radiating conductor layer.
The X-axis is perpendicular to the Z-axis,
The Y-axis is perpendicular to the X-axis and the Z-axis.
The third radiating conductor layer is located on the positive side of the X-axis of the second radiating conductor layer,
The first line and the second line are located on the negative side of the X-axis, compared to the first portion of the first outer edge excluding the first line and the second line.
The third and fourth lines are located on the negative side of the Y-axis, compared to the second portion of the second outer edge excluding the third and fourth lines.
The fifth and sixth lines are located on the negative side of the X-axis, relative to the third portion of the third outer edge excluding the fifth and sixth lines.
A multilayer substrate according to claim 4 or claim 5. The aforementioned multilayer substrate is
A second radiating conductor layer is provided in the laminate, is located on the negative side of the Z-axis from the first radiating conductor layer, overlaps with the first radiating conductor layer when viewed in the Z-axis direction, and has a second outer edge that includes the third and fourth straight lines when viewed in the Z-axis direction,
A third wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second radiating conductor layer at a third power supply point located closest to the third straight line within the second outer edge, and intersects the third straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A fourth wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second radiating conductor layer at a fourth power supply point located closest to the fourth straight line within the second outer edge, and intersects the fourth straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
It also has the following features:
The ground conductor layer overlaps with the second radiating conductor layer when viewed in the Z-axis direction.
The first line is parallel to the third line,
The aforementioned second line is parallel to the aforementioned fourth line,
The X-axis is perpendicular to the Z-axis,
The positive end of the first straight line on the X-axis is connected to the positive end of the second straight line on the X-axis.
The positive end of the third line on the X-axis is connected to the positive end of the fourth line on the X-axis.
The first wiring layer intersects the first and third lines in such a way that they are not perpendicular when viewed in the Z-axis direction.
The second wiring layer intersects the second and fourth lines in such a way that they are not perpendicular when viewed in the Z-axis direction.
The multilayer substrate according to claim 1 . The aforementioned multilayer substrate is
An annular ground conductor layer provided in the laminate and located on the positive side of the Z-axis relative to the ground conductor layer,
Furthermore, it is equipped with
The annular ground conductor layer has an annular shape that surrounds the first radiating conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to claim 1 . A laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A first radiating conductor layer is provided on the laminate and has a first outer edge that includes a first straight line and a second straight line when viewed in the Z-axis direction,
A ground conductor layer provided in the laminate, located on the negative side of the Z-axis from the first radiating conductor layer, and overlapping with the first radiating conductor layer when viewed in the Z-axis direction,
A first wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a first power supply point located closest to the first straight line within the first outer edge, and intersects the first straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A second wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a second power supply point located closest to the second straight line within the first outer edge, and intersects the second straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
An annular ground conductor layer provided in the laminate and located on the positive side of the Z-axis relative to the ground conductor layer,
It is equipped with,
The annular ground conductor layer has an annular shape that surrounds the first radiating conductor layer when viewed in the Z-axis direction.
Multilayer board. The first radiating conductor layer includes the first straight line, the second straight line, the seventh straight line, and the eighth straight line when viewed in the Z-axis direction, and has a rectangular shape when viewed in the Z-axis direction.
In a direction perpendicular to the first straight line, the distance from the center of the first straight line to the annular ground conductor layer is defined as the first distance.
In a direction perpendicular to the second straight line, the distance from the center of the second straight line to the annular ground conductor layer is defined as the second distance.
In a direction perpendicular to the seventh straight line, the distance from the center of the seventh straight line to the annular ground conductor layer is defined as the third distance.
In a direction perpendicular to the eighth straight line, the distance from the center of the eighth straight line to the annular ground conductor layer is defined as the fourth distance.
The first distance, the second distance, the third distance, and the fourth distance are equal to each other.
A multilayer substrate according to claim 11 or claim 12 . The first wiring layer and the second wiring layer include matching sections.
The matching portion does not overlap with the first radiating conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to claim 1 . The first wiring layer and the second wiring layer include a stub portion.
The stub portion, when viewed in the Z-axis direction, does not overlap with the first radiating conductor layer.
The multilayer substrate according to claim 1 . The aforementioned multilayer substrate is
Rigid part and
Flexible part,
It has,
The length of the flexible portion in the Z-axis direction is shorter than the length of the rigid portion in the Z-axis direction.
The multilayer substrate according to claim 1 . The aforementioned multilayer substrate is
An annular ground conductor layer provided in the laminate and located on the positive side of the Z-axis relative to the ground conductor layer,
Furthermore, it is equipped with
The annular ground conductor layer has an annular shape that surrounds the first radiating conductor layer when viewed in the Z-axis direction.
In the rigid portion, no ground conductor is provided between the annular ground conductor layer and the ground conductor layer.
The multilayer substrate according to claim 16 . A seventh wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first wiring layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first wiring layer,
An eighth wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second wiring layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second wiring layer,
It also has,
The multilayer substrate according to claim 16 . The seventh wiring layer and the eighth wiring layer do not overlap with the first radiating conductor layer when viewed in the Z-axis direction.
The multilayer substrate according to claim 18 . A laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A first radiating conductor layer is provided on the laminate and has a first outer edge that includes a first straight line and a second straight line when viewed in the Z-axis direction,
A ground conductor layer provided in the laminate, located on the negative side of the Z-axis from the first radiating conductor layer, and overlapping with the first radiating conductor layer when viewed in the Z-axis direction,
A first wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a first power supply point located closest to the first straight line within the first outer edge, and intersects the first straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A second wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a second power supply point located closest to the second straight line within the first outer edge, and intersects the second straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A second radiating conductor layer is provided in the laminate and has a second outer edge that includes a third straight line and a fourth straight line when viewed in the Z-axis direction,
A third wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second radiating conductor layer at a third power supply point located closest to the third straight line within the second outer edge, and intersects the third straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A fourth wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second radiating conductor layer at a fourth power supply point located closest to the fourth straight line within the second outer edge, and intersects the fourth straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
It is equipped with,
The ground conductor layer overlaps with the second radiating conductor layer when viewed in the Z-axis direction.
The second radiating conductor layer is located on the positive side of the X-axis of the first radiating conductor layer.
The X-axis is perpendicular to the Z-axis,
The first line and the second line are located on the positive side of the X-axis of the first outer edge, excluding the first line and the second line.
The third and fourth lines are located on the negative side of the X-axis, compared to the second portion of the second outer edge excluding the third and fourth lines.
Multilayer board. A laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A first radiating conductor layer is provided on the laminate and has a first outer edge that includes a first straight line and a second straight line when viewed in the Z-axis direction,
A ground conductor layer provided in the laminate, located on the negative side of the Z-axis from the first radiating conductor layer, and overlapping with the first radiating conductor layer when viewed in the Z-axis direction,
A first wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a first power supply point located closest to the first straight line within the first outer edge, and intersects the first straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A second wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a second power supply point located closest to the second straight line within the first outer edge, and intersects the second straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A second radiating conductor layer is provided in the laminate, is located on the negative side of the Z-axis from the first radiating conductor layer, overlaps with the first radiating conductor layer when viewed in the Z-axis direction, and has a second outer edge that includes the third and fourth straight lines when viewed in the Z-axis direction,
A third wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second radiating conductor layer at a third power supply point located closest to the third straight line within the second outer edge, and intersects the third straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A fourth wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the second radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the second radiating conductor layer at a fourth power supply point located closest to the fourth straight line within the second outer edge, and intersects the fourth straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
It is equipped with,
The ground conductor layer overlaps with the second radiating conductor layer when viewed in the Z-axis direction.
The first line is parallel to the third line,
The aforementioned second line is parallel to the aforementioned fourth line,
The X-axis is perpendicular to the Z-axis,
The positive end of the first straight line on the X-axis is connected to the positive end of the second straight line on the X-axis.
The positive end of the third line on the X-axis is connected to the positive end of the fourth line on the X-axis.
The first wiring layer intersects the first and third lines in such a way that they are not perpendicular when viewed in the Z-axis direction.
The second wiring layer intersects the second and fourth lines in such a way that they are not perpendicular when viewed in the Z-axis direction.
Multilayer board. A laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A first radiating conductor layer is provided on the laminate and has a first outer edge that includes a first straight line and a second straight line when viewed in the Z-axis direction,
A ground conductor layer provided in the laminate, located on the negative side of the Z-axis from the first radiating conductor layer, and overlapping with the first radiating conductor layer when viewed in the Z-axis direction,
A first wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a first power supply point located closest to the first straight line within the first outer edge, and intersects the first straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A second wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a second power supply point located closest to the second straight line within the first outer edge, and intersects the second straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
It is equipped with,
The first wiring layer and the second wiring layer include matching sections.
The matching portion does not overlap with the first radiating conductor layer when viewed in the Z-axis direction.
Multilayer board. A laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A first radiating conductor layer is provided on the laminate and has a first outer edge that includes a first straight line and a second straight line when viewed in the Z-axis direction,
A ground conductor layer provided in the laminate, located on the negative side of the Z-axis from the first radiating conductor layer, and overlapping with the first radiating conductor layer when viewed in the Z-axis direction,
A first wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a first power supply point located closest to the first straight line within the first outer edge, and intersects the first straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A second wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a second power supply point located closest to the second straight line within the first outer edge, and intersects the second straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
It is equipped with,
The first wiring layer and the second wiring layer include a stub portion.
The stub portion, when viewed in the Z-axis direction, does not overlap with the first radiating conductor layer.
Multilayer board. A laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A first radiating conductor layer is provided on the laminate and has a first outer edge that includes a first straight line and a second straight line when viewed in the Z-axis direction,
A ground conductor layer provided in the laminate, located on the negative side of the Z-axis from the first radiating conductor layer, and overlapping with the first radiating conductor layer when viewed in the Z-axis direction,
A first wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a first power supply point located closest to the first straight line within the first outer edge, and intersects the first straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
A second wiring layer is provided in the laminate, and is located on the negative side of the Z-axis from the first radiating conductor layer and on the positive side of the Z-axis from the ground conductor layer, and is electrically connected to the first radiating conductor layer at a second power supply point located closest to the second straight line within the first outer edge, and intersects the second straight line in such a way that it is not perpendicular when viewed in the Z-axis direction,
An annular ground conductor layer provided in the laminate and located on the positive side of the Z-axis relative to the ground conductor layer,
It is equipped with,
Rigid part and
Flexible part,
It has,
The length of the flexible portion in the Z-axis direction is shorter than the length of the rigid portion in the Z-axis direction.
The annular ground conductor layer has an annular shape that surrounds the first radiating conductor layer when viewed in the Z-axis direction.
In the rigid portion, no ground conductor is provided between the annular ground conductor layer and the ground conductor layer.
Multilayer board. First substrate and
A second substrate having flexibility,
It is equipped with,
The first substrate is,
A first laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A first radiating conductor layer is provided on the first laminate and has a first outer edge that includes a first straight line and a second straight line when viewed in the Z-axis direction,
A first wiring layer is provided on the first laminate, is located on the negative side of the Z-axis from the first radiating conductor layer, is electrically connected to the first radiating conductor layer at a first power supply point located closest to the first straight line within the first outer edge, and intersects the first straight line in such a way that it is not perpendicular when viewed in the Z-axis direction.
A second wiring layer is provided on the first laminate, is located on the negative side of the Z-axis from the first radiating conductor layer, is electrically connected to the first radiating conductor layer at a second power supply point located closest to the second straight line within the first outer edge, and intersects the second straight line in a manner that is not perpendicular to it when viewed in the Z-axis direction.
It includes,
The aforementioned second substrate is
A second laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction,
A seventh wiring layer is provided on the second laminate and is electrically connected to the first wiring layer,
An eighth wiring layer is provided on the second laminate and is electrically connected to the second wiring layer,
A ground conductor layer is provided in the second laminate, is located on the negative side of the Z-axis relative to the seventh wiring layer and the eighth wiring layer, and overlaps with the first radiating conductor layer, the seventh wiring layer and the eighth wiring layer when viewed in the Z-axis direction,
It includes,
The length of the second substrate in the Z-axis direction is shorter than the length of the first substrate in the Z-axis direction.
The second substrate is located on the negative side of the Z-axis compared to the first substrate, and has a region that does not overlap with the first substrate when viewed in the Z-axis direction.
Antenna module.