JPS5811501B2 - tungsten material - Google Patents
tungsten materialInfo
- Publication number
- JPS5811501B2 JPS5811501B2 JP54102070A JP10207079A JPS5811501B2 JP S5811501 B2 JPS5811501 B2 JP S5811501B2 JP 54102070 A JP54102070 A JP 54102070A JP 10207079 A JP10207079 A JP 10207079A JP S5811501 B2 JPS5811501 B2 JP S5811501B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- tungsten
- added
- recrystallization temperature
- sag
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 title claims description 13
- 239000000463 material Substances 0.000 title claims description 10
- 229910052721 tungsten Inorganic materials 0.000 title claims description 10
- 239000010937 tungsten Substances 0.000 title claims description 9
- 238000001953 recrystallisation Methods 0.000 claims description 14
- 239000002019 doping agent Substances 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- 239000004111 Potassium silicate Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- XAYGUHUYDMLJJV-UHFFFAOYSA-Z decaazanium;dioxido(dioxo)tungsten;hydron;trioxotungsten Chemical compound [H+].[H+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].[NH4+].O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O XAYGUHUYDMLJJV-UHFFFAOYSA-Z 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000009527 percussion Methods 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
Landscapes
- Manufacture And Refinement Of Metals (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
Description
【発明の詳細な説明】
本発明は主として管球用フィラメント材料として用いら
れるタングステン材料の改良に関するもので、その目的
は比較的低温度で再結晶をするタングステン材料を提供
する事にある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in tungsten materials used primarily as filament materials for tubes, and its purpose is to provide tungsten materials that recrystallize at relatively low temperatures.
一般にこれら管球用フィラメントとして用いられるタン
グステン材料は、純タングステンにドープ剤としてAl
2O3、K2O15i02を単独又は複合で0.01w
t%〜1.Owt%添加する事により得られる。Generally, the tungsten material used for these tube filaments is pure tungsten with Al added as a doping agent.
2O3, K2O15i02 alone or in combination 0.01w
t%~1. It can be obtained by adding Owt%.
これらドープ剤添加の目的は、ワイヤの高温での耐垂下
性(ノンサグ性)の向上にある。The purpose of adding these dopants is to improve the droop resistance (non-sag property) of the wire at high temperatures.
通常タングステンワイヤは、金属粉末をプレス成形し、
これを通電加熱により焼結し、得られた焼結体を転打、
線引きする事により得られる。Tungsten wire is usually made by press-molding metal powder.
This is sintered by electrical heating, and the resulting sintered body is rolled and rolled.
Obtained by drawing a line.
こうして得られたワイヤはコイル状に巻かれた後、水素
中あるいは真空中で加熱して型付けを行なういわゆるフ
ォーミング工程を経てフィラメントとなる。The wire thus obtained is wound into a coil and then subjected to a so-called forming process in which it is heated in hydrogen or vacuum to form a filament.
これら型付けの為の熱処理は通常1500℃〜1600
℃以上の再結晶温度近くの高温で行なわれるが、この際
の作業性等を考慮すれば出来るだけ低い温度で十分な型
付けの行なわれる材質のワイヤが望ましい。The heat treatment for these moldings is usually 1500℃~1600℃.
The process is carried out at a high temperature close to the recrystallization temperature of .degree.
この点では出来るだけ再結晶温度の低いワイヤが好まし
く、再結晶温度の低〜ワイヤにおい゛は比較的低い温度
でのフォーミングが可能である。From this point of view, a wire with a recrystallization temperature as low as possible is preferable, and forming is possible at a relatively low temperature for a wire with a low recrystallization temperature.
しかしながら一般には低温で再結晶を起こすワイヤはノ
ンサグ性が劣化する等の欠点を有する。However, wires that undergo recrystallization at low temperatures generally have drawbacks such as deterioration in non-sag properties.
例えばドープ剤を含まない純タングステンワイヤの0.
39mmφにおける再結晶温度は1500〜1600℃
と通常のドープタングステンワイヤの再結晶温度210
0〜2200℃に比べ大巾に低下するが、このようなワ
イヤにおいてはサグ値が異常に大きくフィラメント用材
料としては使用不可能である。For example, pure tungsten wire containing no dopants has a 0.
Recrystallization temperature at 39mmφ is 1500-1600℃
and the recrystallization temperature of normal doped tungsten wire 210
Although the sag value is significantly lower than that at 0 to 2200°C, such a wire has an abnormally large sag value and cannot be used as a filament material.
本発明は上記欠点を改良する目的で、タングステン粉末
に添加するドープ剤を種々検討の結果完成されたもので
ある。The present invention was completed as a result of various studies on dopants to be added to tungsten powder in order to improve the above-mentioned drawbacks.
本発明の特徴とするところは、通常のドープ剤であるA
l2O3、K2O15jO2を単独又は複合で0.01
wt%〜1.Owt%添加し、更にTiを0.003w
t%〜0.03wt%含有させた事により、比較的低温
度で再結晶を起こししかも再結晶後の組織も良(インタ
ロックした比較的長大な結晶構造を有するサグ件の良好
なタングステン材料を提供する事である。The feature of the present invention is that A, which is a common dopant,
l2O3, K2O15jO2 alone or in combination 0.01
wt%~1. Added Owt% and further added 0.003w of Ti.
By containing t% to 0.03wt%, recrystallization occurs at a relatively low temperature and the structure after recrystallization is also good. It is to provide.
次に本発明の内容を実施形態に従ってさらに説明する。Next, the content of the present invention will be further explained according to embodiments.
通常の精練工程を経て得られるパラタングステン酸アン
モニウム結晶を、400℃〜550℃の温度勾配を有す
る電気炉で水素中にて還元して得た青色酸化物に、ケイ
酸カリウムと硝酸カリウムの水溶液をAl2O3、K2
O1SiO2としてそれぞれ0.03%、0.2%、0
.4%になるようドープした。An aqueous solution of potassium silicate and potassium nitrate is added to the blue oxide obtained by reducing ammonium paratungstate crystals obtained through a normal scouring process in hydrogen in an electric furnace with a temperature gradient of 400°C to 550°C. Al2O3, K2
0.03%, 0.2%, 0 as O1SiO2, respectively
.. It was doped to 4%.
ドープした青色酸化物は、更に水素中600℃〜850
℃の温度勾配を有する電気炉で還元しタングステン金属
粉末を得た。The doped blue oxide is further heated in hydrogen at 600°C to 850°C.
Tungsten metal powder was obtained by reduction in an electric furnace with a temperature gradient of °C.
この粉末は更に弗酸にて洗浄し余分なドープ剤その他不
純物を溶解除去した。This powder was further washed with hydrofluoric acid to dissolve and remove excess dopant and other impurities.
こうして得たタングステン粉末に、金属Ti粉末(35
0メツシユ以下)を0.003wt%から0.05wt
%まで各割合で混合して試料とし、Ti添加量とワイヤ
ー特性の関係をみた。Metallic Ti powder (35
0 mesh) from 0.003wt% to 0.05wt
The relationship between the amount of Ti added and the wire properties was examined using samples mixed at various ratios up to %.
上記Tiをドープした粉末は、更にプレス成形し通常の
方法で通電焼結した。The Ti-doped powder was further press-molded and electrically sintered using a conventional method.
焼結体は通常行なわれている転打、線引き加工を行ない
所定の寸法に線引きした。The sintered body was subjected to conventional rolling and wire drawing processes to obtain a wire of a predetermined size.
Q、39mmφでのTiドープ量とサグ値及び再結晶温
度との関係を第1図、第2図に示す。The relationship between the Ti doping amount, sag value, and recrystallization temperature at Q, 39 mmφ is shown in FIGS. 1 and 2.
サグ値の測定方法は、ワイヤをヘヤピン型に折り曲げ両
端の間隔を12mmとし錘りをかけて、溶断電流の65
%の電流でフォーミング後、錘りを取り更に溶断電流の
80%の電流で通電加熱する。The method of measuring the sag value is to bend the wire into a hairpin shape, set the distance between both ends to 12 mm, and apply a weight to the wire.
After forming with a current of 80% of the fusing current, the weight is removed and heating is carried out with a current of 80% of the fusing current.
この時の変形量を第4図におけるA−B間の開きでもっ
てサグ値とする。The amount of deformation at this time is defined as the sag value by the difference between A and B in FIG.
第1図より明らかな様に、ワイヤの再結晶温度はTiド
ープ量に比例し低下する。As is clear from FIG. 1, the recrystallization temperature of the wire decreases in proportion to the Ti doping amount.
TiO,05wt%ドープではTi無添加のワイヤに比
較し約500℃の低下が見られた。When doped with TiO and 05 wt%, a decrease of about 500° C. was observed compared to the wire without Ti addition.
又第2図よりサグ値については、Tiドープ量0.03
wt%以上では劣化が著しくなるが、0.03wt%以
下においてはサグ値の劣化はそれほど大きくなくフィラ
メント材料としての使用にさしつかえない。Also, from Figure 2, regarding the sag value, the Ti doping amount is 0.03.
At more than 0.03 wt%, the deterioration becomes significant, but at less than 0.03 wt%, the deterioration of the sag value is not so great that it can be used as a filament material.
これら本発明の効果は、WとTiの合金化或いはTiの
脱酸効果によるものと考えられる。These effects of the present invention are considered to be due to the alloying of W and Ti or the deoxidizing effect of Ti.
以上第1図、第2図より明らかな様にTi添加量0.0
03wt%以下では、再結晶温度はほとんど低下せず又
、0.03wt%以上ではサグの劣下が著しく実際の使
用に耐えない。As is clear from Figures 1 and 2 above, the amount of Ti added is 0.0.
If it is less than 0.03 wt%, the recrystallization temperature will hardly decrease, and if it is more than 0.03 wt%, the sag will be significantly degraded and cannot be used in actual use.
よって本発明におけるTi添加量は0.003wt%〜
0.03wt%と規定した。Therefore, the amount of Ti added in the present invention is from 0.003 wt% to
It was defined as 0.03 wt%.
以上の事実より明らかな様に、Ti添加量0.003w
t%〜0.03wt%の範囲内において、本発明の目的
であるサグの劣下を防ぎながら再結晶温度を下げるとい
う目的が充分達せられた。As is clear from the above facts, the amount of Ti added is 0.003w.
Within the range of t% to 0.03wt%, the object of the present invention, which is to lower the recrystallization temperature while preventing deterioration of sag, was sufficiently achieved.
又、本発明のタングステン材料は、転打線引き加工工程
における加工性も通常のドープタングステン材料に比較
して良好であり製造歩留りの向上の効果もある。Further, the tungsten material of the present invention has better workability in the rolling percussion wire drawing process than ordinary doped tungsten materials, and has the effect of improving manufacturing yield.
第1図は0.39mmφでのTi添加量と再結晶温度と
の関係を示す。
第2図は0.39mmφにおけるTi添加量とサグ値と
の関係を示す。
第3図は、サグ値の測定方法を説明した図で、通電加熱
前のワイヤの形を、同じく第4図は通電加熱後のワイヤ
の形を示したものである。FIG. 1 shows the relationship between the amount of Ti added and the recrystallization temperature at a diameter of 0.39 mm. FIG. 2 shows the relationship between the amount of Ti added and the sag value at a diameter of 0.39 mm. FIG. 3 is a diagram explaining the method of measuring the sag value, and shows the shape of the wire before heating with electricity, and FIG. 4 shows the shape of the wire after heating with electricity.
Claims (1)
2、を単独又は複合で、0.01wt%〜1.Owt%
添加し更にTiを0.003wt%〜0.03wt%含
有させた事により再結晶温度を低下せしめたタングステ
ン材料。1 General dopants Al2O3, K2O1SiO
2, alone or in combination, from 0.01 wt% to 1. Owt%
A tungsten material whose recrystallization temperature is lowered by adding 0.003 wt% to 0.03 wt% of Ti.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54102070A JPS5811501B2 (en) | 1979-08-09 | 1979-08-09 | tungsten material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54102070A JPS5811501B2 (en) | 1979-08-09 | 1979-08-09 | tungsten material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5625902A JPS5625902A (en) | 1981-03-12 |
| JPS5811501B2 true JPS5811501B2 (en) | 1983-03-03 |
Family
ID=14317497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54102070A Expired JPS5811501B2 (en) | 1979-08-09 | 1979-08-09 | tungsten material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5811501B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4749993B2 (en) * | 2006-11-10 | 2011-08-17 | 株式会社アライドマテリアル | Tungsten alloy |
-
1979
- 1979-08-09 JP JP54102070A patent/JPS5811501B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5625902A (en) | 1981-03-12 |
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