JPS5814506B2 - aluminum - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to precision etching of aluminum.

Traditionally, nameplates, nameplates, etc. are made by anodizing aluminum, then applying a photographic emulsion, exposing and developing to create a resist film, or printing resist ink.
The pattern was created by baking to solidify and then dissolving and removing the alumite film using a hot alkaline solution.

When deep etching was attempted using this method, the alumite film and aluminum were etched at the same time, and side etching was severe, making it impossible to produce a highly accurate product.

In addition, resist films generally have good acid resistance, but poor alkali resistance and cannot withstand long periods of etching, resulting in peeling and
Dissolution occurred and the resist portion was also easily etched, often resulting in defective products.

This invention makes precision etching of aluminum possible by skillfully applying the property that alumite dissolves in alkali but not acid, and the property that aluminum dissolves in acid.

Next, the steps will be described. First, aluminum is subjected to ordinary alumite, a photographic photosensitive film is applied to the surface of the aluminum, and after exposure and development, the aluminum is immersed in a heated alkaline solution to remove the alumite film.

The process up to this point is the same as the manufacturing method for name plates and the like.

Next, when immersed in acid at a constant temperature, the aluminum dissolves.

In this case, since the resist film and the alumite film exhibit acid resistance, side etching of the film surface is eliminated and precise processing becomes possible.

The acid used is preferably an acid containing chlorine ions.

Furthermore, electrolytic etching may be used in combination, and an inhibitor may also be added.

For etching, a conventional etching method such as a dipping method, a spray method, a blowing method such as a paddle method, or an electrolytic etching method can be used.

For even more precision, use a powderless method.

Next, a few examples will be shown.

Example 1 Aluminum plate (100μ) coated with a 10μ anodic oxide film
XIOOX0.5mm) on a photographic photosensitive liquid (product name T.P.
．． R. After applying 4 dragon circles (manufactured by Tokyo Ohka Kogyo ■), 1 circle with a diameter of 4 dragons
Place the negative with 00 black images on the board and expose it (5
After development, use caustic soda (5%, 60°C).
) solution for 30 seconds, then hydrochloric acid (10%, 40°C
) Spray etching with solution for 20 minutes resulted in 0.
Etching to a depth of 3 mm was achieved, and side etching remained at 0.02 mm.

Example 2 Using the same sample as in Example 1, the same process was performed until the anodic oxide film was removed, and ferric chloride (400 g/) and hydrochloric acid (5
%) and nitric acid (5%) in an aqueous solution kept at 30°C.
When immersed for 0 minutes, etching was performed to a depth of 30.17 mm, and side etching was 0.02 mm.

Example 3 A resist (product name Dynachem No. 2005, manufactured by Dynachem ■) was applied to an aluminum foil (100XIOOX 0.05mm) coated with a 20μ oxalic acid anodic oxide film using a board on which a circle other than 1mm in diameter was printed by screen printing. ), and after baking and solidification, caustic soda (5%, 40
°C) After immersing in the solution for 1 minute and dissolving and removing the alumite film, it was heated to 10 A at room temperature using a bath containing 1 solution of sodium chloride IN 1 solution of 4N ammonium chloride and 1 solution of cupric chloride 1/8N. When electrolytically etched with /, the aluminum circle was completely penetrated in 2 minutes.

The side etching in this case was 0.01 mm or less.

Claims (1)

[Claims] 1 Apply a resist pattern of any shape to the anodized aluminum and aluminum alloy surface, etch the non-resist part with alkali, dissolve and remove the anodic oxide film, and then etch the aluminum and aluminum alloy with acid. Method.