JPS582609B2 - Testing methods for semiconductor products - Google Patents
Testing methods for semiconductor productsInfo
- Publication number
- JPS582609B2 JPS582609B2 JP51000988A JP98876A JPS582609B2 JP S582609 B2 JPS582609 B2 JP S582609B2 JP 51000988 A JP51000988 A JP 51000988A JP 98876 A JP98876 A JP 98876A JP S582609 B2 JPS582609 B2 JP S582609B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor products
- semiconductor product
- package
- semiconductor
- testing methods
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Description
【発明の詳細な説明】
この発明は、加速度試験、振動試験中の半導体製品のパ
ッケージの破損を防止した半導体製品の試験方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for testing semiconductor products that prevents damage to packages of semiconductor products during acceleration tests and vibration tests.
半導体製品の加速度試験、振動試験を行う場合、従来第
１図に示すような方法が行われている。When performing acceleration tests and vibration tests on semiconductor products, the method shown in FIG. 1 has conventionally been used.
すなわち、半導体製品１を取付治具２に取付け、矢印Ａ
のように遠心力を加えている。That is, the semiconductor product 1 is mounted on the mounting jig 2, and the arrow A
A centrifugal force is applied as in
このように取付治具２に半導体製品１を固定した状態で
試験を行うと、ガラスの蓋を用いているＦＡＭＯＳのパ
ッケージなどのような外部からの衝撃に弱いものでは、
その試験の目的としている以外のひずみ、曲げなどの力
が加わり、パッケージの破損が生じる。If a test is conducted with the semiconductor product 1 fixed to the mounting jig 2 in this way, it will be difficult to find a product that is vulnerable to external shocks, such as a FAMOS package that uses a glass lid.
If stress, bending, or other forces other than those intended for the test are applied, the package will be damaged.
そして、第１図のような蓋３の部分が突出している場合
には、パッケージの両端吉取付治具２との間にギャップ
４があるため遠心力が加わると蓋３の部分が支点となり
、パッケージに曲げの力が加わり破損せしめるのである
。If the lid 3 protrudes as shown in Figure 1, there is a gap 4 between the package and the mounting jig 2 at both ends, so when centrifugal force is applied, the lid 3 becomes a fulcrum. Bending force is applied to the package, causing it to break.
この発明は上記の点にかんがみなされたもので、加速度
試験、振動試験を行うときにパッケージが破損しないよ
うにしたものである。This invention was made in consideration of the above points, and is designed to prevent the package from being damaged when performing acceleration tests and vibration tests.
以下この発明について説明する。This invention will be explained below.
第２図はこの発明による半導体製品１の試験前の状態を
示すもので、図のように半導体製品１全体を樹脂５でお
おい固める。FIG. 2 shows the state of the semiconductor product 1 according to the present invention before testing. As shown in the figure, the entire semiconductor product 1 is covered with resin 5 and hardened.
その後、第３図に示すように取付治具２に取付けて、第
１図と同じように加速度試１験、振動試験を加える。Thereafter, it was attached to the mounting jig 2 as shown in FIG. 3, and one acceleration test and vibration test were applied in the same manner as in FIG.
このように樹脂５で半導体製品１をかためておけば、取
付治具３と半導体製品１との間には第１図のようなギャ
ップ４が存在しないため、パッケージに曲げなどの力が
加わることがない。If the semiconductor product 1 is hardened with the resin 5 in this way, there will be no gap 4 between the mounting jig 3 and the semiconductor product 1 as shown in Fig. 1, so that bending or other forces will be applied to the package. Never.
しかし、パッケージ内部にはこの試験の目的としている
力が加わるので、従来の試験方法と同じ結果が得られる
。However, since the force that is the purpose of this test is applied inside the package, the same results as conventional testing methods can be obtained.
また、試験が終った後は、樹脂５を溶かして取り除き、
電気的に動作確認を行う。Also, after the test is finished, the resin 5 is melted and removed.
Check electrical operation.
かように、この発明によれは加速度試験、振動試験中の
半導体製品の破損を簡単に防止できる利点がある。As described above, the present invention has the advantage of easily preventing damage to semiconductor products during acceleration tests and vibration tests.
第１図は従来の半導体製品の試験方法を説明するための
図、第２図はこの発明による半導体製品の試験前の状態
を示す斜視図、第３図はこの発明による半導体製品の試
験方法の一実施例を示す図である。
図中、１は半導体製品、２は取付治具、５は樹脂である
。
なお、図中の同一符号は同一または相当部分を示す。FIG. 1 is a diagram for explaining a conventional semiconductor product testing method, FIG. 2 is a perspective view showing a state of a semiconductor product according to the present invention before testing, and FIG. 3 is a diagram illustrating a semiconductor product testing method according to the present invention. It is a figure showing one example. In the figure, 1 is a semiconductor product, 2 is a mounting jig, and 5 is a resin. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
、前記半導体製品全体を樹脂でおおい固めてパッケージ
の破損を防止してから所要の試験を行うことを特徴とす
る半導体製品の試験方法。1. A method for testing semiconductor products, which is characterized in that when conducting an acceleration test or a vibration test on a semiconductor product, the entire semiconductor product is covered and hardened with resin to prevent damage to the package, and then the required tests are performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51000988A JPS582609B2 (en) | 1976-01-06 | 1976-01-06 | Testing methods for semiconductor products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51000988A JPS582609B2 (en) | 1976-01-06 | 1976-01-06 | Testing methods for semiconductor products |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5284977A JPS5284977A (en) | 1977-07-14 |
| JPS582609B2 true JPS582609B2 (en) | 1983-01-18 |
Family
ID=11488968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51000988A Expired JPS582609B2 (en) | 1976-01-06 | 1976-01-06 | Testing methods for semiconductor products |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS582609B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54138462A (en) * | 1978-04-19 | 1979-10-26 | Hitachi Ltd | Screening method of hollow package type electronic parts |
-
1976
- 1976-01-06 JP JP51000988A patent/JPS582609B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5284977A (en) | 1977-07-14 |
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