JPS5843270B2 - Heating element for printing - Google Patents
Heating element for printingInfo
- Publication number
- JPS5843270B2 JPS5843270B2 JP51059244A JP5924476A JPS5843270B2 JP S5843270 B2 JPS5843270 B2 JP S5843270B2 JP 51059244 A JP51059244 A JP 51059244A JP 5924476 A JP5924476 A JP 5924476A JP S5843270 B2 JPS5843270 B2 JP S5843270B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wear
- heating element
- resistant layer
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 title claims description 22
- 239000010410 layer Substances 0.000 claims description 50
- 239000012790 adhesive layer Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052735 hafnium Inorganic materials 0.000 claims description 4
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 239000010955 niobium Substances 0.000 claims description 4
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052845 zircon Inorganic materials 0.000 claims description 4
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 150000001247 metal acetylides Chemical class 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 229910004479 Ta2N Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electronic Switches (AREA)
- Non-Adjustable Resistors (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【発明の詳細な説明】
本発明は印字用発熱体素子に関し、感熱式ファクシミリ
装置等に用い、耐摩耗層と発熱体層との付着性良く、特
性の優れた素子を提供することを目的とする。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heating element for printing, and an object of the present invention is to provide an element that is used in a thermal facsimile machine, etc. and has excellent properties and has good adhesion between a wear-resistant layer and a heating element layer. do.
第１図に従来の印字用発熱体素子の要部断側面図を示す
。FIG. 1 shows a cross-sectional side view of essential parts of a conventional heating element for printing.
基板１の表面に発熱体層２を付し、この発熱体層２の表
面に一対の電極３，４を間隔をおいて設ける。A heating element layer 2 is attached to the surface of a substrate 1, and a pair of electrodes 3 and 4 are provided on the surface of this heating element layer 2 at intervals.
上記発熱体層２と上記一対の電極３．４を覆って耐摩耗
層５を設けである。A wear-resistant layer 5 is provided covering the heating element layer 2 and the pair of electrodes 3.4.
上記電極３，４に電流が流れるとこの電極３，４間の部
分の発熱体層２が発熱し、上記耐摩耗層５の表面に近接
して配置された感熱紙６の上記発熱部分と対向する部分
７が印字発色する。When a current flows through the electrodes 3 and 4, the heat generating layer 2 between the electrodes 3 and 4 generates heat, and faces the heat generating portion of the thermal paper 6 disposed close to the surface of the wear-resistant layer 5. The printed portion 7 is printed in color.
この素子の寿命を延すため、たとえばシリコンの炭化物
のような高硬度材料を上記耐摩耗層５に用いるが、この
種の高硬度材料はたとえば発熱体層２との付着性が悪く
、耐摩耗層としての働きを十分果さない欠点を有してい
た。In order to extend the life of this element, a high-hardness material such as silicon carbide is used for the wear-resistant layer 5, but this type of high-hardness material has poor adhesion to the heating element layer 2, and is wear-resistant. It had the disadvantage that it did not function well as a layer.
本発明はこの種の耐摩耗層の付着性を改善し、特性の優
れた印字用発熱体素子を提供するものであり、以下本発
明の一実施例を図面とともに説明する。The present invention improves the adhesion of this type of wear-resistant layer and provides a heating element for printing with excellent characteristics.One embodiment of the present invention will be described below with reference to the drawings.
第２図において第１図と同一個所には同一番号を付し説
明する。In FIG. 2, the same parts as in FIG. 1 are given the same numbers and will be explained.
本発明は第２図に示すように発熱体層２と耐摩耗層５と
の間に接着層８を設けたものである。In the present invention, as shown in FIG. 2, an adhesive layer 8 is provided between the heat generating layer 2 and the wear-resistant layer 5.
電極３，４は導電性薄膜で発熱体層２の表面に設けられ
ている。The electrodes 3 and 4 are conductive thin films provided on the surface of the heat generating layer 2.
なお電極３，４は発熱体層２の裏面、すなわち発熱体層
２と基板１との界面に設けてもよい。Note that the electrodes 3 and 4 may be provided on the back surface of the heat generating layer 2, that is, on the interface between the heat generating layer 2 and the substrate 1.
上記基板１にはたとえば厚さ０．５〜１間のグレーズド
アルミナを使用し、上記発熱体層２にはたとえば厚さ０
．１〜１μｍのＮｉ−Ｃｒ、Ｓｉ−； Ｃｒ 、Ｔａ
Ｎ、Ｔａ２Ｎ、ＴｉＮからなる抵抗薄膜を使用し、上記
電極３，４にはたとえば厚さ０．１〜１μｍのＡｕ／Ｃ
ｒの薄膜を使用し、上記耐摩耗層５にはたとえば厚さ３
〜１０μｍのシリコン炭化物膜を用いる。For example, glazed alumina with a thickness of 0.5 to 1 is used for the substrate 1, and the heating element layer 2 has a thickness of 0.5 to 1, for example.
．． 1-1 μm Ni-Cr, Si-; Cr, Ta
A resistive thin film made of N, Ta2N, and TiN is used, and the electrodes 3 and 4 are made of, for example, Au/C with a thickness of 0.1 to 1 μm.
For example, the wear-resistant layer 5 has a thickness of 3.
A ~10 μm silicon carbide film is used.
この耐摩耗層５としては上記シリコン炭化物膜以外にチ
タン、ジルコン、バナジウム、ニオブ、タンタル、ハフ
ニウム、クロム、モリブデン、タングステンのうちの一
つの炭化物、あるいはこれらの合金、たとえばチタン炭
化物とタングステン炭化物のような高硬度材料が有効で
あるが、耐摩耗層５の効果をより増大させるには、接着
層８をこの耐摩耗層５を構成している材料の酸化物で構
成することが特に有効であることを発明者らは見出した
。In addition to the silicon carbide film described above, this wear-resistant layer 5 may include a carbide of one of titanium, zircon, vanadium, niobium, tantalum, hafnium, chromium, molybdenum, and tungsten, or an alloy thereof, such as titanium carbide and tungsten carbide. Although a high hardness material is effective, in order to further increase the effect of the wear-resistant layer 5, it is particularly effective to configure the adhesive layer 8 with an oxide of the material constituting the wear-resistant layer 5. The inventors discovered that.
すなわち耐摩耗層５をたとえばシリコン、チタン、ジル
コン、バナジウム、ニオブ、タンタル、ハフニウム、ク
ロム、モリブデン、タングステンのうちの一つの炭化物
で構成する場合、接着層８としては、それぞれシリコン
、チタン、ジルコン、バナジウム、ニオブ、タンタル、
ハフニウム、クロム、モリブデン、タングステンの炭化
−酸化物を用いる。That is, when the wear-resistant layer 5 is made of one of silicon, titanium, zircon, vanadium, niobium, tantalum, hafnium, chromium, molybdenum, and tungsten, the adhesive layer 8 is made of silicon, titanium, zircon, or tungsten, respectively. vanadium, niobium, tantalum,
Carbide-oxides of hafnium, chromium, molybdenum, and tungsten are used.
通常、この種の素子の耐摩耗層を形成する場合、たとえ
ばスパッタリング蒸着法あるいは電子ビーム蒸着法を用
いる。Usually, when forming the wear-resistant layer of this type of element, for example, a sputtering vapor deposition method or an electron beam vapor deposition method is used.
この際、耐摩耗層はこの蒸着中に基板温度を高温に保た
ないと付着性が小さいので、付着性を高めるため、従来
はしばしば上記基板１を高温たとえば３００〜５００℃
に保って耐摩耗層５を形成したが、これでは十分な付着
性を得ることができなかった。At this time, the adhesion of the wear-resistant layer is low unless the substrate temperature is maintained at a high temperature during this vapor deposition, so in order to increase the adhesion, conventionally the substrate 1 is often heated to a high temperature, for example, 300 to 500°C.
Although the wear-resistant layer 5 was formed by keeping the temperature at
さらに上記基板１の表面には発熱体層２、電極３，４が
設けられているので、基板１を高温に保って耐摩耗層５
を付着させると、たとえば電極３，４が破損し、あるい
は電極物質と発熱体物質が反応し電極３，４あるいは発
熱体の特性が劣化する欠点があった。Furthermore, since a heating element layer 2 and electrodes 3 and 4 are provided on the surface of the substrate 1, the substrate 1 is kept at a high temperature and the wear-resistant layer 5 is
If the electrodes 3, 4 are attached, for example, the electrodes 3, 4 may be damaged, or the electrode material and the heating element may react, resulting in deterioration of the characteristics of the electrodes 3, 4 or the heating element.
しかし本発明では接着層８が効果的に作用し、基板１を
高温にしなくとも、たとえば２００℃以下さらには室温
においても上記耐摩耗層５が再現性良く強力に付着し、
その付着力のばらつきが少ないものである。However, in the present invention, the adhesive layer 8 acts effectively, and the wear-resistant layer 5 adheres strongly with good reproducibility even at temperatures below 200° C. or even at room temperature, without raising the substrate 1 to a high temperature.
There is little variation in the adhesion force.
この場合接着層８は耐摩耗層５の厚みの２．５〜２５φ
が最適である。In this case, the adhesive layer 8 has a thickness of 2.5 to 25 mm, which is the thickness of the wear-resistant layer 5.
is optimal.
すなわちたとえば厚さ４μｍの耐摩耗層５では接着層８
は０．１〜１μｍ程度の厚みが良い。That is, for example, in the wear-resistant layer 5 with a thickness of 4 μm, the adhesive layer 8
The thickness is preferably about 0.1 to 1 μm.
この理由は接着層８の厚みが２．５ ％以下では接着層
８の効果が少なく、また２５饅以上では耐摩耗層５の機
械的強度が低下するとともに発熱体層２から感熱紙６へ
の熱伝達を妨げてしまう。The reason for this is that when the thickness of the adhesive layer 8 is less than 2.5%, the effect of the adhesive layer 8 is small, and when the thickness is more than 2.5%, the mechanical strength of the abrasion resistant layer 5 decreases, and the thickness of the adhesive layer 8 decreases from the heat generating layer 2 to the thermal paper 6. This will impede heat transfer.
上記接着層８はたとえばスパッタリング蒸着法あるいは
電子ビーム蒸着法で形成するが、この場合も基板１の温
度は２００℃以下たとえば室温でよい。The adhesive layer 8 is formed by, for example, a sputtering vapor deposition method or an electron beam vapor deposition method, and in this case as well, the temperature of the substrate 1 may be 200° C. or less, for example, room temperature.
したがって本発明の素子では基板温度を高温にしなくて
も耐摩耗層５を強力に付着できる特徴がある。Therefore, the element of the present invention has the feature that the wear-resistant layer 5 can be strongly attached without raising the substrate temperature to a high temperature.
この接着層８の材料が耐摩耗層５の酸化物であることは
、酸化物であるから基板１あるいは発熱体層２等への強
力な付着を比較的低温における蒸着たとえば室温で可能
にし、また耐摩耗層と接着層との間の強力な付着力は接
着層８の組成、構造が耐摩耗層５の組成、構造に類似し
、また物理的特性たとえば熱的な特性も類似しているこ
とに起因している。The fact that the material of the adhesive layer 8 is the oxide of the wear-resistant layer 5 is that since it is an oxide, strong adhesion to the substrate 1 or the heating element layer 2, etc. can be achieved by vapor deposition at a relatively low temperature, for example, at room temperature. The strong adhesion between the wear-resistant layer and the adhesive layer is due to the fact that the composition and structure of the adhesive layer 8 are similar to those of the wear-resistant layer 5, and the physical properties, such as thermal properties, are also similar. This is caused by
以上のように本発明によれば、炭化物系の耐摩耗層にこ
れらの耐摩耗層の基板への付着力を高めた構造を特徴と
した印字用発熱素子であり、耐摩耗層の寿命が長ぐ特性
のばらつきが少なく、加工工程における様子の特性劣化
が少なく加工が容易である効果を有するものである。As described above, according to the present invention, a heating element for printing is characterized by a structure in which a carbide-based wear-resistant layer has a structure in which the adhesion of the wear-resistant layer to the substrate is increased, and the life of the wear-resistant layer is long. This has the effect that there is little variation in the properties during processing, there is little deterioration of the properties during the processing process, and the processing is easy.
第１図は従来の印字用発熱体素子の要部断側面図、第２
図は本発明の一実施例における印字用発熱体素子の要部
断側面図である。
１・・・・・・基板、２・・・・・・発熱体層、３，４
・・・・・・電極、５・・・・・・耐摩耗層、６・・・
・・・感熱紙、８・・・・・・接着層。Figure 1 is a cross-sectional side view of the main part of a conventional heating element for printing;
The figure is a sectional side view of a main part of a heating element for printing in an embodiment of the present invention. 1... Substrate, 2... Heat generating layer, 3, 4
... Electrode, 5 ... Wear-resistant layer, 6 ...
...Thermal paper, 8...Adhesive layer.
Claims (1)
あるいは裏面に電極を設け、上記発熱体層の表面に接着
層を設け、上記接着層の表面に耐摩耗層を設け、上記耐
摩耗層をシリコン、チタン、ジルコン、バナジウム、ニ
オブ、タンタル、ハフニウム、クロム、モリブデン、タ
ングステンのうちの一つの炭化物あるいはこれらのうち
の二つ以上の炭化物の合金で形成し、上記接着層を上記
耐摩耗層を構成している材料の酸化物で形成したことを
特徴とする印字用発熱体素子。 ２ 接着層の厚みを耐摩耗層の厚みの２．５〜２５多と
したことを特徴とする特許請求の範囲第１項記載の印字
用発熱体素子。[Claims] 1. A heating element layer is provided on the surface of the substrate, an electrode is provided on the front or back surface of the heating element layer, an adhesive layer is provided on the surface of the heating element layer, and a wear-resistant layer is provided on the surface of the adhesive layer. the wear-resistant layer is formed of a carbide of one of silicon, titanium, zircon, vanadium, niobium, tantalum, hafnium, chromium, molybdenum, and tungsten, or an alloy of two or more of these carbides; A heating element for printing, characterized in that the adhesive layer is formed of an oxide of the material constituting the wear-resistant layer. 2. The heating element for printing according to claim 1, wherein the thickness of the adhesive layer is 2.5 to 25 times greater than the thickness of the wear-resistant layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51059244A JPS5843270B2 (en) | 1976-05-21 | 1976-05-21 | Heating element for printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51059244A JPS5843270B2 (en) | 1976-05-21 | 1976-05-21 | Heating element for printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52142528A JPS52142528A (en) | 1977-11-28 |
| JPS5843270B2 true JPS5843270B2 (en) | 1983-09-26 |
Family
ID=13107769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51059244A Expired JPS5843270B2 (en) | 1976-05-21 | 1976-05-21 | Heating element for printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5843270B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS589570B2 (en) * | 1979-12-24 | 1983-02-22 | 富士通株式会社 | Thermal head manufacturing method |
| JPS6075047U (en) * | 1983-10-29 | 1985-05-25 | ローム株式会社 | thermal print head |
| JPH0626913B2 (en) * | 1987-04-24 | 1994-04-13 | ロ−ム株式会社 | Thermal head |
-
1976
- 1976-05-21 JP JP51059244A patent/JPS5843270B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52142528A (en) | 1977-11-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20010054598A1 (en) | Method of fabricating thermal head | |
| JPS5843270B2 (en) | Heating element for printing | |
| JPH0535074B2 (en) | ||
| JPS604077A (en) | Thermal head | |
| JPS6072750A (en) | Thermosensitive recording head | |
| JP3338273B2 (en) | Thermal head | |
| JP2750125B2 (en) | Substrate structure of thermal head | |
| JP2000343738A (en) | Thermal head and manufacture thereof | |
| JPS6143768B2 (en) | ||
| JP2004025771A (en) | Thermal head | |
| JPH0640526B2 (en) | Thermal head | |
| JPS609770A (en) | Thermal head | |
| JP2564555B2 (en) | Method for manufacturing thick film thermal head | |
| JPH0144510B2 (en) | ||
| JP2567252B2 (en) | Thin-film thermal head | |
| JPS61237492A (en) | Protective film formation for thermal print head | |
| JPH05177857A (en) | Abrasion resistant protective film | |
| JPS6293901A (en) | Thermal head and manufacture of the same | |
| JPS591276A (en) | Thermal head | |
| JP3313953B2 (en) | Thermal head | |
| JPS63202463A (en) | Thermal head | |
| JPS62252102A (en) | Resistive heating unit | |
| JPH0999574A (en) | Thermal head | |
| JPS60112459A (en) | Thermal print head | |
| JPH01256101A (en) | Thin film type thermal head |