JPS59155B2 - electronic equipment housing - Google Patents

Description

[Detailed description of the invention] The present invention relates to a housing for an electronic device.

The casing of a device that houses electronic circuit components inside is designed to hold the above-mentioned components and at the same time prevent the intrusion of electric and magnetic fields from the outside, and is usually made of a metal plate formed into the casing. etc. are used.

On the other hand, since devices such as power amplifiers use elements that generate a large amount of heat, it is necessary to release the generated heat to the outside. For this reason, heat radiation has conventionally been attempted by providing individual heat radiators, mainly of the type having a large number of block-shaped fins, and connecting heat generating elements to these heat radiators. However, in the case of the method of installing individual heat sinks as described above, in order to obtain the specified heat dissipation capacity, the area of the heat dissipation surface of the heat sink, that is, the area of the fins, must be large, and as a result, the heat dissipation The volume and weight of the vessel itself increases.

This also means that the heat transfer path from the heating element to the heat radiating part inside the radiator increases.
As a result, thermal resistance increases, and the improvement in heat dissipation capacity tends to slow down relative to the rate of increase in the dimensions of the heatsink. Therefore, if it is necessary to dissipate a large amount of heat, a very large heat sink will be used. Furthermore, in the case of a thermosiphon type heat sink that uses a volatile liquid as a heat medium, it is necessary to provide a large number of fins to release heat into the air. However, the radiator occupies a large proportion of the space, making it inevitable that the equipment will become larger and the cost will rise accordingly. An object of the present invention is to improve the above-mentioned drawbacks caused by providing a separate heat radiator in an electronic device, and to provide a housing for an electronic device that has a high heat dissipation ability.

Next, a housing for an electronic device according to the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of the casing of an electronic device according to the present invention, and FIG. 2 is a front view of the wall of the casing shown in FIG.

The casing according to the present invention has at least one wall made of a metal plate or the like, and in both figures, the wall 1 is provided with a closed conduit 2; The heat block 3 made of metal such as aluminum is arranged to extend from the lower end thereof to the upper end thereof joined to the joining member 4 also made of metal such as aluminum. Further, a volatile liquid such as fluorocarbon is held inside the closed pipe line 2, and is configured to act as a heat medium, forming a so-called heat pipe. That is, heat generated from a heat generating element such as a power transistor 5 disposed on the heat block 3 is conducted to the lower end of the wall portion 1 via the heat block 3.

Further, the lower end of the closed pipe line 2 is located here, and the fluorocarbon liquid inside absorbs heat, causing its temperature to rise. As a result, the fluorocarbon liquid vaporizes and becomes fluorocarbon vapor, and at this time absorbs a large amount of latent heat from the liquid portion. Further, the fluorocarbon vapor thus generated moves to the upper part of the closed pipe line 2 at high speed due to the pressure difference within the closed pipe line 2. However, here, since the closed pipe line 2 is cooled by outside air through the wall part 1, the fluorocarbon vapor condenses on the inner wall of the closed pipe line 2, but in order to enhance this cooling effect, the connecting member 4 is passed through. Pores 1 are provided to allow internal air to be discharged. During this condensation, the freon vapor transfers internal heat to the inner wall of the closed pipe line 2. Therefore, through the above process, heat from the heating element is transferred to the outside, but the heat medium exhibits very little thermal resistance in this case. Furthermore, since the upper part of the wall 1 is sloped at an angle of, for example, 5 to 10 degrees, the fluorocarbon liquid condensed on the upper part of the closed pipe line 2 flows along the inner wall of the closed pipe line 2 according to gravity and reaches its lower end. The above process is carried out in a circular manner. Furthermore, if a method is adopted in which a wick is provided on the inner surface of the closed pipe line 2, the condensed fluorocarbon liquid will travel through the wick and move to the end of the closed pipe line, so the wall part 1 does not necessarily have to be sloped. .

As described above, the casing of the electronic device according to the present invention functions not only as a container for the electronic device but also as a heat radiator, eliminating the need for a separate conventional heat radiator. The heat dissipation effect exhibited by the casing of this electronic device is firstly that its thermal resistance is a much smaller value, for example, a few hundredths of that of conventional conduction in metal, and that the heat dissipation portion is It is extremely effective because it covers the entire side surface of the wall and has a very large area. In addition, since it does not take up space like a conventional radiator, it is possible to downsize the device, and there is a greater degree of freedom in designing the structure of the device, which makes it possible to reduce manufacturing costs. It is something that has become familiar. Another embodiment of the invention is now illustrated in FIG.

This embodiment is characterized in that in addition to the wall 1, a second wall v is provided inside thereof. In this embodiment as well, the wall portions 1 and 1' are provided with a closed conduit 2 and a closed conduit 7, respectively, so that they operate in the same manner as in the previous embodiment. Further, the wall portion 1 and the wall portion v are commonly connected to a heat block 3 to which a power transistor 5 and the like are connected, and a connecting member 4 having a predetermined ventilation hole. Therefore, compared to the above-mentioned embodiment in which only the wall portion 1 is provided, the structure has a reduced thermal resistance and an increased heat dissipation area, resulting in an improved heat dissipation ability. In addition, in this embodiment, the second
The slope of the upper part of the wall part 1' can be increased, but for example, if the slope of the upper part of the wall part 1 is about 5 degrees, and the slope of the upper part of the inner second wall part v is about 10 degrees. good. In this case, the fluorocarbon liquid in the inner closed pipe line 7 is easily circulated by gravity, so that the heat transfer rate is high. Further, FIG. 4 and FIG. 5 illustrate another embodiment of the electronic device casing according to the present invention, but in the case of this embodiment, it is different from the first embodiment or the second embodiment. A feature is that slit-like fins 6 are provided in addition to each part of the housing.

The slit-like fins 6 are provided on a surface of the wall 1 or the wall 1 and the wall v on which the closed pipe 2 or the closed pipe 2 and the closed pipe z are not provided.
This is intended to increase the area of the wall portion 15 and to allow air to circulate inside and outside of the wall portion 15, thereby increasing the efficiency of releasing heat from the wall portion into the air. As described above, the casing of the electronic device according to the present invention has a high heat dissipation ability due to the action of a member having a heat dissipation function in a closed pipe provided in the wall, such as a volatile liquid. The surface where the part is provided is not only the side and top surface of the case as in the case of the above embodiment, but also the back surface, and can be provided at any position.
YVEFIN) type fins can also be formed.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of the casing of an electronic device according to the present invention, FIG. 2 is a front view of a wall of the casing shown in FIG. 1, and FIG. 3 is a perspective view of an electronic device according to the present invention. FIG. 4 is a perspective view showing another embodiment of the electronic device casing according to the present invention, and FIG. 5 is a front view of the wall of another embodiment of the electronic device casing according to the present invention. FIG. 3 is a longitudinal cross-sectional view of a wall portion including a slit-like fin portion of FIG. Explanation of symbols of main parts, 1...Wall part, V...
...Second wall part, 2...Closed pipe line, 7...
...Second closed pipe line, 3...Heat block, 4
...Connecting member, 4ζ...Vent hole, 5...
...Power transistor, 6...Slit-like fin.

Claims (1)

[Claims] 1 A casing that surrounds an electronic device including a heat generating element and has a mounting part for the heat generating element, which is thermally coupled to the mounting part of the heat generating element to hold a volatile working fluid in a manner that allows circulation of the volatile working fluid, 1. A casing for an electronic device, comprising: a plurality of wall members each having a closed conduit extending upward from the bottom; and a coupling member coupling the plurality of wall members and having a ventilation hole.