JPS59156B2 - electronic equipment housing - Google Patents

Description

[Detailed description of the invention] The present invention relates to a housing for an electronic device.

The casing of a device that houses electronic circuit components inside is designed to hold the above-mentioned components and at the same time prevent the intrusion of electric and magnetic fields from the outside, and is usually made of a metal plate formed into the shape of a casing. etc. are used.

On the other hand, since devices such as power amplifiers use elements that generate a large amount of heat, it is necessary to release the generated heat to the outside. For this reason, heat radiation has conventionally been attempted by providing individual heat radiators, mainly of the type having a large number of block-shaped fins, and connecting heat generating elements to these heat radiators. However, in the case of the method of installing individual heat sinks as described above, in order to obtain the specified heat dissipation capacity, the heat dissipation surface of the heat sink, that is, the area of the fins, needs to be large, and as a result, the heat sink itself has to be large. The volume and weight of will increase.

This also means that the heat transfer path from the heating element to the heat radiating part inside the radiator increases.
As a result, thermal resistance increases, and the improvement in heat dissipation capacity tends to slow down relative to the rate of increase in the dimensions of the heatsink. Therefore, if it is necessary to dissipate a large amount of heat, a very large heat sink will be used. Furthermore, in the case of a thermosiphon type heat sink that uses a volatile liquid as a heat medium, it is necessary to provide a large number of fins to release heat into the air. However, the radiator occupies a large proportion of the space, making it inevitable that the equipment will become larger and the cost will rise accordingly. An object of the present invention is to improve the above-mentioned drawbacks caused by providing a separate heat radiator in an electronic device, and to provide a housing for an electronic device that has a high heat dissipation ability.

Next, a housing for an electronic device according to the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of the casing of an electronic device according to the present invention, and FIG. 2 is a front view of the wall of the casing shown in FIG.

The casing according to the present invention has at least one wall made of a metal plate or the like, and in both figures, the wall 1 is provided with a closed conduit 2; The heat block 3 made of metal such as aluminum is arranged to extend from the lower end thereof to the upper end joined to the support column 4 also made of metal such as aluminum. Further, a volatile liquid such as fluorocarbon is held inside the closed pipe line 2, and is configured to act as a heat medium, forming a so-called heat pipe. In addition to the closed conduit 2, slit-like fins 6 are formed on the wall 1 to increase the circulation of air inside and outside the casing and increase the heat dissipation area of the wall 1. A cross section of the wall portion in which these slit-like fins are formed is shown in FIG.
This slit-like fin has the functions of both a ventilation hole and a fin. To explain in detail the heat dissipation function of the electronic device casing according to the present invention, heat generated from a heat generating element such as a power transistor 5 disposed on the heat block 3 is conducted to the lower end of the wall portion 1 via the heat block 3.

Further, the lower end of the closed pipe line 2 is located here, and the fluorocarbon liquid inside absorbs heat, causing its temperature to rise. As a result, the fluorocarbon liquid vaporizes and becomes fluorocarbon vapor, and at this time absorbs a large amount of latent heat from the liquid portion. Further, the fluorocarbon vapor thus generated moves to the upper part of the closed pipe line 2 at high speed due to the pressure difference within the closed pipe line 2. However, here, since the closed pipe line 2 is cooled through the slit-like fins 6 formed in the wall portion 1, the freon vapor condenses on the inner wall of the closed pipe line 2.
Further, the support column 4 is also provided with a ventilation hole 4', which works together with the slit-like fins provided in the wall portion 1 to discharge the internal air, thereby enhancing the cooling effect of the closed pipe line 2.
When the fluorocarbon vapor condenses inside the closed pipe line 2, the heat of the fluorocarbon vapor is transferred to the inner wall of the closed pipe line 2. Through the above process, heat from the heating element is transferred to the outside, but the thermal resistance exhibited by the heat medium in this case is extremely small.

In addition, the fluorocarbon liquid condensed on the upper part of the closed pipe line 2 is removed from the wall part 1.
Since the upper part of the pipe is sloped at an angle of, for example, 5 to 10 degrees, the water flows along the inner wall of the closed conduit 2 according to gravity and returns to its lower end, and the above process is carried out in a circular manner. Furthermore, if a method is adopted in which a wick is provided on the inner surface of the closed pipe line 2, the condensed fluorocarbon liquid will travel through the wick and move to the end of the closed pipe line, so the wall part 1 does not necessarily have to be sloped. .

As described above, the casing of the electronic device according to the present invention functions not only as a container for the electronic device but also as a heat radiator, eliminating the need for a separate conventional heat radiator. The heat dissipation effect exhibited by the casing of this electronic device is firstly that its thermal resistance is a much smaller value, for example, a few hundredths of that of conventional conduction in metal, and that the heat dissipation portion is It has extremely high heat dissipation efficiency because it covers the entire side of the wall, so it has a very large surface area, and the slit-like fins allow air circulation and heat dissipation inside and outside the case. It's summery. In addition, because it does not take up space like conventional heat sinks, it is possible to downsize the device, and it also allows greater freedom in device design, which also makes it possible to reduce manufacturing costs. It is something.
In the above embodiment, the wall part 1 of the case is divided into two parts, left and right, and the two parts are connected by a support 4 near the center of the upper part, but the entire wall part of the case is made of a single metal plate or the like. It may be a structure that

Another embodiment of the invention is now illustrated in FIG.

This embodiment is characterized in that in addition to the wall 1, a second wall v is provided inside thereof. In this embodiment as well, the wall portions 1 and 1' are provided with a closed conduit 2 and a closed conduit 7, respectively, and although it is not clear in this figure, the wall portions 1 and 1' are provided with a closed conduit 2 and a closed conduit 7, respectively. ' are formed with slit-like fins, respectively. These closed pipelines 2, 2
' and the slit-like fins have the same function as in the previous embodiment. Further, the wall portions 1 and v are commonly connected to a heat block 3 to which a power transistor 5 and the like are connected, and a column 4 having a predetermined ventilation hole. Therefore, compared to the above-described embodiment in which only the wall portion 1 was provided, the structure has an increased heat dissipation area, and the slit-like fins facilitate air circulation, resulting in an improved heat dissipation capacity. be. In this embodiment, it is possible to increase the slope of the upper part of the second wall part v located on the inside. For example, the slope of the upper part of the wall part 1 is set to about 5 degrees, The slope of the upper part may be approximately 10 degrees.
In this case, the fluorocarbon liquid in the inner closed pipe line 7 is easily circulated by gravity, so that the heat transfer rate is high. A member that has a heat dissipation function in a closed pipe line provided on the wall has a high heat dissipation ability due to the action of a volatile liquid, for example, but this closed pipe line and the wall part with slit-like fins are not included in any part of the housing. It is possible to install SKYVE-IN on the surface of the wall, omitting ventilation holes in the wall.
It is also possible to form only a fin (fin), or to omit the fin and provide only a ventilation hole.

[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is a perspective view showing one embodiment of the casing of an electronic device according to the present invention, FIG. 2 is a front view of the wall of the casing shown in FIG. FIG. 4 is a longitudinal sectional view of a wall portion having slit-like fins, and FIG. 4 is a front view showing another embodiment of the casing of an electronic device according to the present invention.

Claims (1)

[Scope of Claims] 1. A casing that surrounds an electronic device including a heat generating element and has a mounting part for the heat generating element on its wall, which is thermally coupled to the mounting part of the heat generating element and is volatile. An electronic device characterized in that a closed pipe line for holding a working fluid in a circulating manner is provided in the wall part so as to extend upward from the mounting part, and a ventilation hole is provided in the wall part. Housing. 2. A casing that surrounds an electronic device including a heat generating element and has a mounting part for the heat generating element on its wall, which is thermally coupled to the mounting part of the heat generating element and capable of circulating a volatile working fluid. A casing for an electronic device, characterized in that a closed conduit for holding is provided on the wall portion so as to extend upward from the mounting portion, and the wall portion is provided with fins.