JPS59157B2 - electronic equipment housing - Google Patents

Description

[Detailed description of the invention] The present invention relates to a housing for an electronic device.

The casing of a device that houses electronic circuit components inside is designed to hold the above-mentioned components and at the same time block the intermediary of electric and magnetic fields from the outside, and is usually made of a metal plate formed into a cylindrical shape. etc. are used.

Since devices such as power amplifiers use elements that generate a large amount of heat, it is necessary to release the generated heat to the outside. For this reason, heat radiation has conventionally been attempted by providing individual heat radiators, mainly of the type having a large number of block-shaped fins, and connecting heat generating elements to these heat radiators. However, in the case of the method of installing individual heat sinks as described above, in order to obtain the specified heat dissipation capacity, the area of the heat dissipation surface of the heat sink, that is, the area of the fins, must be large, and as a result, the heat dissipation The volume and weight of the vessel itself increases.

This also means that the heat transfer path from the heating element to the heat radiating part inside the radiator increases.
As a result, thermal resistance increases, and the improvement in heat dissipation capacity tends to slow down relative to the rate of increase in the dimensions of the heatsink. Therefore, if it is necessary to dissipate a large amount of heat, a very large heat sink will be used. Furthermore, in the case of a thermosiphon type heat sink that uses a volatile liquid as a heat medium, it is necessary to provide a large number of fins to release heat into the air. However, the radiator occupies a large proportion of the space, making it inevitable that the equipment will become larger and the cost will rise accordingly. An object of the present invention is to improve the above-mentioned drawbacks caused by providing a separate heat radiator in an electronic device, and to provide a housing for an electronic device that has a high heat dissipation ability.

The electronic device casing according to the present invention will be explained in detail with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of the casing of an electronic device according to the present invention, and FIG. 2 is a front view of the wall of the casing shown in FIG.

The casing according to the present invention has a wall portion made of a metal plate or the like, and as is particularly clear in FIG. 2, the first wall portion 1
The second wall part 1' has a double structure, and the lower end part is commonly connected to a heat block made of metal such as aluminum, and the upper end part is commonly connected to a column 4 made of metal such as aluminum. ing. A closed conduit 2 and a closed conduit z are provided in the first wall 1 and the second wall, respectively, and extend from the lower end to the upper end of the wall 1 and the second wall. A volatile liquid such as chlorofluorocarbon is held inside the closed pipes 2 and z, and is configured to act as a heat medium, forming a so-called heat pipe. That is, heat generated from a heat generating element such as a power transistor 5 disposed on the heat block 3 is conducted to the lower end of the wall portion 1 via the heat block 3.

Further, the lower ends of the closed pipes 2 and 7 are located here, and the fluorocarbon liquid inside absorbs heat and its temperature rises. As a result, the fluorocarbon liquid vaporizes and becomes fluorocarbon vapor, and at this time absorbs a large amount of latent heat from the liquid portion. Further, the fluorocarbon vapor thus generated moves at high speed to the upper part of the closed pipes 2 and 2' due to the pressure difference within the closed pipes 2 and 2'. However, since the closed pipe lines 2 and 2' are cooled by outside air through the walls 1 and 1', the fluorocarbon vapor condenses on the inner walls of the closed pipe lines 2 and 2'. In order to enhance the effect, the support column 4 is provided with a ventilation hole 4' to discharge the air inside. During this condensation, the freon vapor transfers internal heat to the inner walls of the closed pipes 2 and 2'. Therefore, through the above process, heat from the heating element is transferred to the outside, but the heat medium exhibits very little thermal resistance in this case. In addition, the Freon liquid condensed on the upper part of the closed pipes 2 and 2' is deposited on the upper part of the wall parts 1 and 1', for example, from 5 degrees to 1.
Due to the 0 degree inclination, the closed pipe 2 follows gravity.
and 2' to the lower end thereof, and the above process is carried out in a circular manner. In this embodiment, walls 1 and 1'
Since the heat block 3 has a double structure, the area for discharging heat from the heat block 3 is large, and the occupied space is small.

In addition, the slopes at the top of the walls 1 and 1' are preferably about 5 degrees and 10 degrees, respectively, and in this case, the fluorocarbon liquid in the closed pipe 2' of the inner wall v can be easily circulated by gravity. Therefore, it is characterized by a faster heat transfer rate. In addition, there is a WIC on the inner surface of the closed pipes 2 and 2'.
If the method of providing K) is adopted, the condensed fluorocarbon liquid will travel within this wick and move to the ends of the closed pipes 2 and 7, so the walls 1 and 1' do not necessarily have to be sloped.
As described above, the casing of the electronic device according to the present invention functions not only as a container for the electronic device but also as a heat radiator, eliminating the need for a separate conventional heat radiator.

First of all, the heat dissipation effect of the housing of this electronic device is such that its thermal resistance is, for example, several hundred times smaller than that of conventional conduction in metal.
The heat dissipation part covers the entire side surface of the wall, and since the wall is provided at least twice, the area is very large. For this reason, it has an extremely large heat dissipation effect. In addition, since it does not take up space like conventional heat sinks, it is possible to downsize the device, and there is a greater degree of freedom in designing the structure of the device, which makes it possible to reduce manufacturing costs. It is something that has become familiar. In the above embodiment, the walls 1 and 1' of the housing are
shows a structure in which the housing is divided into two left and right halves and connected by a support 4 near the center of the upper part, but even if the structure is such that the respective walls 1 and 1' of the housing are constructed from a single metal plate, etc. good. Another embodiment of the invention is now illustrated in FIG.
This embodiment is characterized in that slit-like fins 6 are provided on the walls 1 and 1'.

The cross section of the wall where the slit-like fins 6 are provided is the fourth
As shown in the figure, the slit-shaped fins increase the heat dissipation area of the wall 7 and also allow air to circulate between the inside and outside of the casing, so an improvement in heat dissipation efficiency can be expected. As described above, the casing of the electronic device according to the present invention has a high heat dissipation ability due to the action of a member having a heat dissipation function in a closed pipe provided in the wall, such as a volatile liquid. The surfaces on which the parts are provided are not limited to the side and top surfaces of the casing as in the case of the above-mentioned embodiments, but can also be provided at any arbitrary position, including the back surface. It is also possible to form fins of the SKYVEFIN type.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of the casing of an electronic device according to the present invention, FIG. 2 is a front view of a wall of the casing shown in FIG. 1, and FIG. 3 is a perspective view of an electronic device according to the present invention. FIG. 4 is a perspective view showing another embodiment of the casing of FIG. Explanation of symbols of main parts, 1...Wall part, V...
...Second wall part, 2...Closed pipe line, 2'...
...Second closed pipe line, 3...Heat block,
4... Support column, 4'... Ventilation hole, 5...
...Power transistor, 6...Slit-like fin.

Claims (1)

[Claims] 1 A casing that surrounds an electronic device including a heat generating element and has a mounting part for the heat generating element on its wall, which is thermally coupled to the mounting part of the heat generating element and capable of circulating a volatile working fluid. A closed pipe line for holding is provided on the wall part so as to extend upward from the mounting part, and the wall part has at least two
An electronic device housing characterized by a heavy structure.