JPS5921173B2 - Connection terminal of semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention particularly relates to terminals of a semiconductor device which are formed into a long and thin structure and have a large number of terminal groups formed in two rows along the long sides thereof;
The present invention relates to a connection terminal of a semiconductor device for connecting each conductor part of a separately provided circuit in a one-to-one correspondence.

In recent years, semiconductor devices are often manufactured in an integrated manner, and as a result, the number of connection points on a semiconductor chip, ie, the number of terminal conductors for leading to the outside, tends to increase.

As has been known in the art, connecting a large number of external lead-out terminals on such a semiconductor chip to other circuits reliably poses a huge problem in terms of manufacturing time, operator skill, and cost. In particular, the present invention relates to a rectangular integrated semiconductor device, and two
The target is a semiconductor device that has terminals for leading out to the outside in a row, such as a diode array of a thermal head, and an external circuit, for example, arranged in a straight line, corresponding to each of the external terminals of such a semiconductor device. It is an object of the present invention to provide a connecting terminal for a semiconductor device, which does not require a long time or the skill of an operator to connect the connecting terminal to a resistor string circuit, and can greatly reduce costs.

The present invention will be explained below with reference to the drawings.

As described above, the present invention is particularly effective for semiconductor devices in which a large number of semiconductor elements such as diodes and transistors are arranged and integrated in a linear manner on a common substrate. As an example, a circuit in which eight diodes are arranged in a straight line is shown.

In the figure, a region 1 surrounded by a dotted line is an integrated portion, and a diode 2 is formed inside the region 1, and external terminal portions 3 and 3' are formed to be exposed. In addition, 4,
4' is a portion to be a connection terminal of the present invention. FIG. 2 is a perspective view showing a semiconductor device in which the circuit shown in FIG. They are arranged in two rows. FIG. 3 is a diagram showing a state in which the connection terminal of the semiconductor device of the present invention is attached to the semiconductor device shown in FIG. On top, at right angles to this, conductor foil 7 for multiple connections.
are formed in parallel to protrude from both edges of the insulating film 6, and one of the protruding ends of the conductor foil 7 is simultaneously thermocompressed and bonded to the external terminal portions 3, 3' of the semiconductor device. They are firmly connected using methods such as soldering. Therefore, the other end of the conductor foil 7 can be further connected to another circuit network. However, it is difficult to handle and manufacture the connection terminals of a semiconductor device as shown in FIG. 3 individually. That is, the spacing between the conductive foils 7 of such connection terminals is on the order of 100 microns, and the distance between the conductive foils 7
The width of the conductive foil 7 is approximately several tens of microns, and since such a row of conductor foils 7 naturally requires a photo-etching process and a mechanized handling method, a high degree of handling precision is required. FIG. 4 shows a structure in which connection terminals of the semiconductor device of the present invention are obtained continuously, in which each strip-shaped insulating film 6 having a row of narrow conductor foils 7 formed on its surface is formed into a strip-like structure. None, and both ends of the insulating film 6 are continuously connected by a support 8 made of a conductor strip of a constant width.

The spacing between the rows of conductor foils 7 formed on the two insulating films 6 is made equal to the spacing between the rows of external terminals of the semiconductor device, and every other space between the rows of conductor foils 7 has a semiconductor device. is inserted, and the external terminal portions on both sides of the semiconductor device are connected.

In the process after this connection is made, the strip-shaped insulating film 6
is cut at both ends (indicated by dashed lines in the figure), resulting in the shape shown in FIG. FIG. 5 shows a case in which a continuous connection terminal support 8 as shown in FIG. 4 is fixed to a transfer support 8', and a transfer sprocket hole 9 is formed in this transfer support 8'. This makes intermittent driving and winding of the connection terminal extremely easy. FIG. 6 shows another embodiment of a continuous connection terminal for a semiconductor device. In this embodiment, a strip-shaped organic insulating film 6' having mechanical strength and heat resistance such as polyimide or polyester is used.
On the top, a plurality of narrow conductor foils 7 for connection are formed parallel to each other and perpendicular to the strip-shaped insulating film 6', with both ends of the conductor foils 7 protruding from both sides of the strip-shaped insulating film 6'. Furthermore, a conductor foil 7 is provided at a predetermined position of the strip-shaped insulating film 6' for the purpose of protecting the protruding portion of the conductor foil 7.
A conductor protection portion 10 having a larger protrusion amount is formed.

Therefore, when such a continuous connection terminal is handled for connection of an external terminal portion of a semiconductor device, the sensitive tip of the conductive foil 7 will not be damaged during mechanical handling. As a method of manufacturing a continuous connection terminal for a semiconductor device as shown in FIG. 6, a copper foil is adhered to a strip-shaped organic insulating film 6' having a predetermined width, and the copper foil portion is photoetched. A continuous connection terminal with a shape of After this continuous terminal and the external terminal portion of the semiconductor device are connected by a connecting machine, the semiconductor device shown in FIG. is completed. In order to make this connection operation easier, it is convenient to use a shape as shown in FIG. 7.

In the figure, two strips of insulating film 6' are arranged at equal intervals, and the spacing is set so that the spacing between each strip of conductor foil 7 is equal to the spacing between the external terminals of the semiconductor device. Further, a wide conductor protection part 10 is formed across two strips of insulating film 6'.
0 also has the effect of maintaining the distance between the two strips of insulating film 6'. Each conductor protection portion 10 is integrally formed with a support 8, and the support 8 has a shape in which a sprocket hole 9 for transfer is provided. Note that the strip-shaped insulating film 62
It is also possible to make it integrally with the conductor protection part 10 and the support body 8. As explained above, the connection terminal for a semiconductor device of the present invention works particularly effectively on a semiconductor device in which external terminal portions are formed in a row, and the connection terminal has a simple shape. There is no need for attachment, the manufacturing time is shortened, and there is no need for special skills on the part of the operator.

Furthermore, since each insulating film is supported by connecting only its ends, cutting for separation can be performed extremely easily and quickly.

[Brief explanation of the drawing]

1 and 2 are a circuit diagram and a perspective view of a semiconductor device having terminal portions on both sides, and FIG. 4 to 7 are diagrams showing other embodiments of the semiconductor device of the present invention. 3... External terminal section, 5... Semiconductor substrate, 6, 6'... Band-shaped insulating film, 7...
...Conductor foil, 8...Support, 9...Sprocket hole, 10...Conductor protection part.

Claims (1)

[Claims] 1. At right angles to each of the plurality of strip-shaped insulating films,
A plurality of conductor foils for connection are formed in parallel with both ends thereof protruding, external terminals of a semiconductor device are connected to the ends of the conductor foils, and the plurality of strip-shaped insulating films are parallel to each other at a predetermined length. A connecting terminal for a semiconductor device, characterized in that only each end thereof is supported and connected by a support body. 2. The connection terminal for a semiconductor device according to claim 1, wherein the strip-shaped insulating film is made of an organic resin film. 3. A connection terminal for a semiconductor device according to claim 1 or 2, characterized in that a conductor protection portion is formed on the strip-shaped insulating film, parallel to the conductor foil and longer than the conductor foil. . 4. The semiconductor device according to claim 1, 2, or 3, wherein a plurality of conductor protection parts each having a predetermined length are connected to each other by being supported by a support body at each end thereof. connection terminal. 5. The connection terminal for a semiconductor device according to claim 4 or 5, wherein the support has a sprocket hole for transfer.