JPS5921174B2 - How to manufacture carrier tape - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a method for manufacturing a carrier tape.

Conventionally, a method is often used in which a semiconductor device is mounted on a substrate such as alumina ceramic using a carrier tape on which lead fingers corresponding to the electrode pattern of the semiconductor device are continuously formed. This makes it suitable for mass production.

However, in this case, manufacturing the carrier tape requires large-scale equipment, which increases the cost for small-scale production.In addition, manufacturing the carrier tape with bonding protrusions on the lead fingers requires equipment, There was a problem with yield.

The present invention is intended to solve the above-mentioned problems, and an object of the present invention is to provide a method for manufacturing a carrier tape that can be produced in small quantities at low cost and that can easily form protrusions on lead fingers. It is said that Embodiments of the invention will now be described with reference to the drawings.

In FIG. 1, reference numeral 1 denotes a matrix sheet, on which a large number of carrier units 2 are formed in a matrix shape. As shown in detail in FIG. 2, the carrier unit 2 has lead fingers 5 corresponding to the electrode pattern of the semiconductor element in a frame 4 made of a highly conductive metal foil such as copper provided on a polyimide film insulating film 3. It is formed by integrally protruding in a cantilevered manner. lead finger 5
is made of the same material as the frame 4. A first alignment hole 6 is provided in the frame 4 to pass through the polyimide film 3, and the tip of the lead finger 5 fits into the opening T of the polyimide film 3.
protrudes inward. In this way, the carrier units 2 are formed at a high density, but the density can be further increased by making the frame 4' common between each carrier unit row, as shown in FIG.

The matrix sheet having the above-mentioned structure is easy to handle because it is in sheet form, and can be easily manufactured using a conventional thin film manufacturing apparatus.

FIG. 4 shows a bonding tape 8 for forming a carrier tape by mounting a carrier unit formed on this matrix sheet.

In the figure, 9 is a hole that engages with the tape feeding sprocket, 1
0 is the second hole corresponding to the alignment hole 6 of the matrix sheet.
The alignment hole 11 is a bonding opening corresponding to the opening 7 of the polyimide film 3. Carrier tape formation is performed as follows.

That is, first, the matrix sheet 1 is cut using a press or the like at the position shown by the chain line in FIG. 1 or FIG. 3, and four consecutive carrier units 2 are taken out. Like tape 8
A carrier tape 12 is formed by adhering it removably (to enable reuse of the tape) with double-sided tape or the like to the back side of the sprocket. The positional accuracy of the carrier unit 2 relative to the hole 9 can be easily achieved. At this time, the openings 7 and 11 coincide. A semiconductor element can be mounted on the carrier tape 12 thus formed using a conventional tape bonding apparatus.

Bonding is performed using the opening 11. Although not shown in the drawings, bonding of the semiconductor element in this case is carried out by using a tractor that engages with a hole 9 of the tape 8 on the carrier tape 1.
2 can be moved continuously. In the above description, an example of a carrier unit for a semiconductor element with a bonding protrusion has been described, but the present invention can also be applied to a semiconductor element without a protrusion. In that case, a protrusion for semiconductor element bonding is formed on the lead finger by plating or the like. As described above, according to the present invention,
The required number of carrier units are cut out from a matrix sheet that is in the form of an easy-to-handle sheet and from which lead fingers can be easily formed by conventional thin film manufacturing, etc., and the carrier units are used for bonding using the first and second alignment holes. Since the carrier tape is constructed by accurately positioning and adhering to the tape, it is possible to produce a wide variety of products in small quantities at low cost, and it is also easy to form bonding protrusions on the lead fingers.

Further, if the tape and the carrier unit are bonded by a removable method, the tape can be reused.

[Brief explanation of the drawing]

The drawings show an embodiment of the method for manufacturing a tape carrier according to the present invention, in which Fig. 1 is a schematic plan view of a matrix sheet, Fig. 2 is a plan view of a carrier unit, and Fig. 3 shows another example of forming a carrier unit. 4 is a plan view of the tape, FIG. 5 is a plan view of the carrier tape, and FIG. 6 is a side view of the same. In the figure, 1 is a matrix sheet, 2 is a carrier unit, 3 is a polyimide film (insulator film), 5 is a lead finger, 6 and 10 are first and second alignment holes, 7 and 11 are openings, and 8 is a tape, 9 is a hole, and 12 is a carrier tape.

Claims (1)

[Claims] 1 A lead finger corresponding to the electrode pattern of a semiconductor element is provided on an insulating film 3 having an opening 7 through which the tip of the lead finger protrudes, and a first alignment hole 6 is provided around the opening 7. A predetermined number of carrier units are cut out from a matrix sheet formed by consecutively forming a matrix of a large number of carrier units having
alignment hole 10 and an opening 11 corresponding to the opening 7
and a first and a second tape for tape bonding.
A method for producing a carrier tape, which comprises positioning and bonding by aligning positioning holes 6 and 10 of the carrier tape.