JPH0338759B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a method for pre-soldering components, and particularly to a method for pre-soldering studs used when attaching electronic components to a board.

The above-mentioned stud is used as a pedestal when an electronic component such as a resistor is fastened to a through-hole on a board with a screw.This stud has a flat head where the washer at the tip of the lead of the electronic component contacts. The screw thread is cut to pass through the planar head and the pillar, and the lead of the electronic component is inserted into the pillar. By inserting screws into the threads, leads of electronic components are attached to the through holes of the board.

In this case, the stud is referred to as a component.

b. Background of the Technology Figure 1 is a diagram for explaining the conventional method of inserting components into through-holes on a board and soldering them, Figures 2 and 3 are diagrams showing preliminary soldering.
1 is the component, 2 is the ring solder, 3 is the board, 4 is the through hole, 5 is the head of component 1, 6 is the column part of component 1, and 7 is the state of ring solder 2 after preliminary soldering. show.

As shown in Figure 1, when soldering component 1 to board 3, solder ring 2 is placed between board 3 and component 1, and soldering is performed by applying heat to ring solder 2. was going there.

c. Prior Art and Problems By the way, it has been proposed to automate the insertion of the component 1 and ring solder 2 into the through hole 4. However, when the component 1 and the ring solder 2 are each independent as shown in FIG. 1, they must be individually attached to the through hole 4, which requires a lot of man-hours.

Therefore, it is possible to pre-solder the ring solder 2 to the component 1, but if you insert the ring solder 2 from the pillar part 6 as shown in Figure 2 and apply heat using flux, etc., the flux At the same time, the melted solder spreads on the head 5 due to the action of
The melted solder spreads even to the side surface of the column part 6. Therefore, the solder is in a state as shown in 7 in FIG.

When trying to insert the pre-soldered component 1 as shown in FIG. 3 into the through-hole 4, it is difficult to insert it because the diameter of the column 6 is large at the top.

d. Purpose of the Invention Therefore, the present invention proposes a method in which the solder spreads uniformly on the head and does not rise on the side surface of the column when performing preliminary soldering.

eStructure of the Invention Therefore, the present invention provides a method for pre-soldering a component constituted by a head and a column provided on one side of the head and having a smaller diameter than the head, comprising: At least the column has an uncoated flux surface, the edge of the surface of the head on which the column is provided is chamfered, and the chamfered surface faces upward so that it can be inserted through the column. We also propose a method for pre-soldering parts, characterized in that a ring-shaped solder having a smaller diameter than the head is brought into direct contact with the chamfered surface and the ring-shaped solder is heated.

f Embodiment of the Invention FIGS. 4 and 5 are diagrams for explaining a method for pre-soldering parts, which is an embodiment of the present invention, in which 11 is a part, 12 is a pillar part of the part 11, and 13 is a part. The head of the component 11, the chamfered portion of the head 13 of 14, the ring solder 15, and the state of the ring-shaped solder 15 after heating is shown.

The peripheral part 14 of the head 13 of the part 11 is chamfered. A ring solder 15 is inserted into this component 11, and heat is applied without using flux or the like. Then, the ring solder 15 melts and the solder flows toward the outer circumference of the head 13 due to the slope of the chamfered portion 14, so that the solder does not concentrate at the joint between the head 13 and the column 12. . Furthermore, since no flux or the like is used, solder does not spread to the side surfaces of the pillar portions 12. Therefore, head 1
Uniform pre-soldering can be performed for 3. Furthermore, since the bonding area between the solder 16 and the head 13 is larger than that without chamfering, the bonding force between the solder 16 and the head 13 will not be insufficient.

g Effects of the Invention According to the present invention, it is possible to spread solder uniformly over the head of the component when performing preliminary soldering.

[Brief explanation of the drawing]

FIG. 1 is a diagram for explaining the conventional method of inserting components into through-holes on a board and soldering them, and FIGS. 2 and 3 are diagrams showing preliminary soldering.
1 is the component, 2 is the ring solder, 3 is the board, 4 is the through hole, 5 is the head of component 1, 6 is the column part of component 1, and 7 is the state of ring solder 2 after preliminary soldering. show. 4 and 5 are diagrams for explaining a preliminary soldering method for parts according to an embodiment of the present invention, in which 11 is a part, 12 is a column part of part 11, and 13 is a head part of part 11. , 14 shows the chamfered portion of the head 13, 15 shows the ring solder, and 16 shows the state of the ring-shaped solder 15 after applying heat.

Claims (1)

[Claims] 1. A method of pre-soldering a component constituted by a head and a column provided on one side of the head and having a smaller diameter than the head, the method comprising: The column has an uncoated flux surface, and the edge of the surface of the head on which the column is provided is chamfered, with the chamfered surface facing upward, and the column can be inserted from the column. A method for pre-soldering parts, the method comprising heating a ring-shaped solder having a smaller diameter than the chamfered surface by directly contacting the chamfered surface.