JPS5935181B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device in which a semiconductor integrated circuit having a beam lead or bump structure is mounted on a substrate.

Conventionally, integration of required circuits in a hybrid integrated circuit device is performed in the following steps. First, the circuit connections of semiconductor components, capacitors, resistors, etc. used in the circuit are confirmed, and at this stage the planar arrangement of the circuit is performed. In this planar arrangement, the area that can be used as superimposed wiring is limited to the lower part of the mounted component. For this reason, conventionally, the following three configuration methods have been considered for configuring a hybrid integrated circuit device of this circuit. 1 Cut the part where overlapping wiring is required, take out both cut parts as external terminals, and connect them externally.

2. Cut the parts where overlapping wiring is required, form internal terminal electrodes at both cut parts, and interconnect the internal terminal electrodes using jumper wires or the like.

3 The conductor structure of a film substrate having a thin film or thick film conductor used in a hybrid integrated circuit is two or more layers, and an insulating layer with a hole partially formed between each conductor film is provided, and the portion where the hole is partially formed is Connections are made between each conductor layer and superimposed wiring is performed.

The first configuration method increases the number of external terminals of the hybrid integrated circuit. For this reason, there are drawbacks such as an increase in the external dimensions of the hybrid integrated circuit device constituting the circuit, problems in mounting, and an increase in price. In the second configuration method, the number of external terminals of the hybrid integrated circuit device constituting the circuit is sufficient for the circuit configuration. However, in the second configuration method, jumper wires necessary for interconnection at several locations or more are inserted, which has the disadvantage that assembly of the hybrid integrated circuit device becomes complicated. The third construction method requires multiple layers of conductor layers and insulating layers for the hybrid integrated circuit membrane substrate of the circuit, which has the disadvantage that manufacturing of the membrane substrate is complicated.

Conventional methods for configuring hybrid integrated circuit devices have the above-mentioned drawbacks. I have been using this construction method.

SUMMARY OF THE INVENTION An object of the present invention is to improve the drawbacks of the conventional hybrid integrated circuit device described above, to reduce the size of the membrane substrate for the integrated circuit, and to provide a hybrid integrated circuit device that is easy to assemble.

A hybrid integrated circuit device according to the present invention is a hybrid integrated circuit device in which a semiconductor element in which terminals including at least one electrically unrelated empty terminal are formed substantially on the same plane is mounted on a substrate. At least one of the vacant terminals is provided on the substrate and connected to a wiring conductor running under the semiconductor element.

Alternatively, the hybrid integrated circuit device according to the invention comprises at least one
In this article, a semiconductor integrated circuit element having a beam lead or bump structure having empty terminals of L is connected to a mutual wiring conductor in a film substrate constituting a hybrid integrated circuit, and at least one of the empty terminals is 6, and the lower part of the semiconductor integrated circuit is used as a wiring area. According to the present invention, by using the empty terminals in the six semiconductor elements, it is possible to connect the empty terminals on the bottom surface of this element without changing the arrangement of the terminals, that is, with the standardized terminal arrangement shape unchanged. Since it is possible to provide wiring conductors for mutual wiring, it is possible to miniaturize the hybrid integrated circuit, and due to the presence of the empty terminals, the mounting strength of the semiconductor element is improved.6 The heat dissipation of the semiconductor element is also improved. It is something that can be done.

The details of the present invention will be explained below using the drawings.

FIG. 1 shows an example of a general input/output balanced amplifier circuit. The amplifier circuit 1 is an ideal input/output balanced amplifier circuit, and has a feedback amplifier circuit configuration with the feedback path 2. Terminal 11 and terminal 1
2 represents the first and second input terminals, respectively, and 6 terminals 13 and 14 represent the first and second output terminals, respectively. Terminal 15 and terminal 16 each represent a power supply voltage application terminal. When there is only one type of power supply voltage, connect terminal 15 to the positive power supply and ground terminal 16, or ground terminal 15. Connect terminal 16 to the negative power supply.
When there are two types of power supply voltages, terminal 15 is connected to the first power supply and terminal 16 is connected to the second power supply. The external gain of this input/output balanced amplifier circuit example is RS/Bs. In this way, since the external gain is determined by the ratio between the resistor RS and the resistor RF in the feedback path 2, it is preferable to use a hybrid integrated circuit configuration when integrating the circuit. If the feedback path resistance R in the semiconductor integrated circuit device
When S and resistance RF are included, the external gain is uniquely determined,
This results in a lack of versatility, and the resistors RS and R
When a diffused resistor is used for F, the accuracy of external gain also becomes a problem. To configure such an input/output balanced amplifier circuit as a conventional hybrid integrated circuit device, the amplifier circuit 1 is a beam lead structure semiconductor integrated circuit and the feedback path 2 is a film integrated circuit.
The hybrid integrated circuit device is assembled into the hybrid integrated circuit device, and the terminal arrangement of the beam lead structure semiconductor integrated circuit is as follows.
The example shown in the figure is common. Terminal 21 and terminal 22 represent the first and second input terminals, respectively, of the ideal input/output balanced amplifier circuit, and terminal 23 and terminal 24 represent the first and second output terminals, respectively. Terminal 25 and terminal 26 are first and second power supply voltage terminals. FIG. 3 shows the configuration of a hybrid integrated circuit device in which the beam lead structure semiconductor integrated circuit shown in FIG. 2 and the feedback path 2 are combined.

The terminal numbers in FIG. 3 correspond to the terminal numbers in FIGS. 1 and 2, respectively. It is clear that FIG. 3 includes overlapping wiring at two locations. In order to avoid such overlapping wiring, terminals 23 and 25 of the beam lead structure semiconductor integrated circuit in FIG. 2 are replaced, and terminals 24 and 2 are replaced.
6 should be replaced. However, such a terminal arrangement is electrically and thermally unfavorable because the input terminal 21 and the output terminal 23 are close to each other, and the other input terminal 22 and the other output terminal 24 are also close to each other. Next, FIG. 4 shows an example of a hybrid integrated circuit device according to the present invention which avoids double wiring and is electrically and thermally preferable. FIG. 4 shows the beam lead structure semiconductor integrated circuit shown in FIG. 2 modified according to the present invention by adding empty terminals 41 and 42, and in order to avoid overlapping wiring, film conductors 14 and 13 are integrated into the beam lead structure semiconductor integrated circuit. It is formed so as to be on the bottom surface of the circuit 1'. In FIG. 4, the shaded area represents the membrane conductor formed on the membrane substrate, and the area shaded by six broken lines represents the membrane conductor for interconnection formed under the beam lead structure semiconductor integrated circuit V. The terminal numbers in FIG. 4 correspond to those in FIG. 3, respectively. FIG. 5 is a sectional view taken along the Y-Y' plane of FIG. 4, and shows that the beam lead structure semiconductor integrated circuit 1' and the film conductor on the film substrate are insulated. As described above, when the input/output balanced amplifier circuit example of FIG. 1 is made into a hybrid integrated circuit device, heavy wiring can be eliminated by the mounting configuration using empty terminals according to the present invention, and the effect is remarkable. A second embodiment is shown in Figures 6a and b.

FIG. 6a shows a beam lead structure semiconductor integrated circuit, and FIG. 6b shows its equivalent circuit.

Terminal 64 and terminal 68 represent empty terminals. Terminal 67 represents the substrate terminal of this integrated circuit. FIG. 7 shows an example of the configuration of a hybrid integrated circuit device constituted by the integrated circuit shown in FIG. 6a and a membrane substrate. In Figure 7, terminal 6
1 to terminal 68 and terminal 6V to terminal 68' respectively correspond to the composite circuit of FIG. 6a. Terminal 71 and terminal 72 are first and second input terminals, respectively, and terminal 73 and terminal 74 are first and second output terminals, respectively. Terminal 75 and terminal 76 are power supply voltage terminals. 77 is a constant current source.

In FIG. 7, broken lines indicate wiring by membrane conductors using the lower part of the composite circuit, as in the first embodiment. It is clear from the second embodiment that providing at least one vacant terminal in the beam lead structure semiconductor circuit is very effective in eliminating overlapping wiring in a hybrid integrated circuit device. As described in detail above, by using the present invention, it is possible to provide a hybrid integrated circuit device that is electrically and thermally stable and easy to assemble without using zipper wires. In the above description, the case where a beam-lead type semiconductor integrated circuit element is mounted has been described, but it goes without saying that the present invention can be applied to semiconductor elements other than the beam-lead type, for example, bump type semiconductor elements in the same manner.

[Brief explanation of drawings]

Figure 1 is a configuration diagram showing a conventional integrated circuit element. Figure 2 is a plan view of its external appearance. Figure 3. 4 and 5 are explanatory diagrams of the first embodiment of the present invention, FIGS. 6A and 6B are respectively a plan view and a circuit diagram of an integrated circuit to be mounted used in the second embodiment, and FIG. The figure is a configuration diagram of a hybrid integrated circuit according to a second embodiment of the present invention.

Claims (1)

[Claims] 1. In a hybrid integrated circuit device in which a semiconductor element in which terminals including at least one vacant terminal are formed on substantially the same surface is mounted on a substrate, at least one of the vacant terminals is provided on the substrate, and A hybrid integrated circuit device, wherein the hybrid integrated circuit device is connected to a wiring conductor running under the semiconductor element.