JPS5937159B2 - Processing head in laser processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a processing head in a laser processing device, and more specifically, the nozzle shape of the processing head for irradiating and injecting a laser beam and assist gas is such that the upper area is wide and the lower area is wide. The present invention relates to a processing head formed into a so-called Laval tubular shape, which is narrow and has a continuous curved surface so that the lower end part widens toward the bottom and has a wider area.

Assist gas injection nozzles in conventional laser processing equipment have been narrowly narrowed and injected at high speed in order to efficiently concentrate the assist gas at the processing point.

In other words, the workpiece generated by laser processing
In order to remove molten matter and evaporated matter, the total energy is the same when the assist gas is supplied by the same pump. The removal effect at this time is thought to be influenced more by the dynamic pressure of the assist gas itself than by the static pressure of the assist gas itself, so in order to convert the static pressure of the total energy into dynamic pressure, the tip of the nozzle is I was narrowing it down.

However, when the nozzle shape is a straight nozzle, it cannot be accelerated to a certain speed or higher (for example, the speed of sound or higher), and therefore it has been difficult to improve the cutting speed.

This invention effectively solves these conventional problems.The purpose of this invention is to change the shape of the nozzle of the processing head to a shape that allows assist gas to be injected at supersonic speed, thereby reducing the cutting speed during laser processing. The present invention provides a processing head for an improved laser processing device.

In order to achieve the above object, the present invention sets the area of the assist gas inlet of the nozzle of the processing head to be Al, the area of the assist gas ejection port to A2, and appropriately positions the assist gas inlet and the ejection port. The gist is that the shape of the nozzle is formed into a continuous curved shape such that A3<A1, A2, where the area of is As.

A preferred embodiment of the present invention will be described below with reference to the accompanying drawings.

FIGS. 1 and 2 show a front view and a plan view of an NC-controlled laser processing apparatus 1 embodying the present invention, and this laser processing apparatus 1 mainly includes a laser processing machine 3 and a carbon dioxide laser. It consists of the laser oscillator 5 used, a power supply T for the laser oscillator 5, and a cooling system (not shown) for cooling the oscillation mixed gas in the laser oscillator 5, and is mounted on the laser processing machine 3. The workpiece w (workpiece W) thus placed is positioned by NC control.

The laser processing machine 3 includes a plurality of reflecting mirrors 13a and 13b that irradiate a workpiece w placed on a processing table 11 with a laser beam 9 oscillated from a laser oscillator 5.
, 13c are attached in a freely adjustable manner.

The laser beam 9 is condensed and irradiated onto the workpiece W by a condensing lens 15a provided in the processing head 15.

A positioning device 17 for gripping a plate-shaped work w is provided on one side in the longitudinal direction of the processing table 11, and the positioning device 17 holds a work Wf (not shown).
A Y-direction reference stopper is provided, and an X-axis carriage 21 that moves in the front-rear direction in FIG. 2 along an X-axis guide rail 19 is attached.

The X-axis guide rail 19 is a Y-axis (not shown) installed in the longitudinal direction (left-right direction in FIG. 2) of the processing table 11.
It is laid on a Y-axis carriage 23 that moves along an axis guide rail.

Note that the X-axis guide rail 19 and the Y-axis guide rail (not shown) are laid orthogonally, and the X-axis carriage 21 guided by the X-axis guide rail 19 is driven by a servo motor 25, and The Y-axis carriage 23 guided by the axis guide rail is driven by a servo motor (not shown).

Further, 27 is a moving table provided integrally with the Y-axis carriage 23, and on this moving table 27,
A plurality of free stroke bearings 29 that support the work w are rotatably embedded.

Further, a reference stopper 31 in the X-axis direction is provided on one side of the moving table 27.
is provided so as to be able to appear and retract from the surface (pass line) through which the workpiece W passes.

Further, a dust collector 33 is installed below the processing table 11 to suck up slag, gas, etc. generated by laser processing. It is connected to the. The embodiment of the present invention relates to an improvement of the nozzle 35 attached to the tip of the processing head 15, and the shape etc. of this nozzle 35 will be explained in detail below with reference to FIG. 3.

The nozzle 35 attached to the tip of the processing head 15 serves as both a laser beam nozzle and an assist gas nozzle, as shown in FIG. 3, and is formed as follows.

That is, the area of the assist gas inlet 37 of the nozzle 35 is A1.
If the area of the assist gas outlet 39 is A2, and the area of the bench lily-shaped portion between the inlet 37 and the outlet 39 is A3, then the shape of the nozzle 35 is A3 - A.
It is formed into a continuous curved shape so that it is 1 x A3.

This shape of the nozzle 35 is what is called a Laval tubular supersonic nozzle, and it is possible to increase the flow velocity of the assist gas G injected from the tip of the nozzle 35 to 1 or more.

Further, the area of the A3 portion of the nozzle 35 is formed so that at least the laser beam 9 and the assist gas G do not interfere with each other.

Since this invention is described in the claims, during laser processing, assist gas can be injected from the nozzle attached to the tip of the processing head at a flow rate of 1 or higher, and therefore the laser cutting speed can be increased. It has the effect of dramatically improving the

It should be noted that the present invention is not limited to the above-mentioned embodiments, but can be implemented in other embodiments, and the numbers attached to the claims do not limit the technical scope.

[Brief explanation of the drawing]

1 and 2 are a front view and a plan view of a laser processing apparatus embodying the present invention, and FIG. 3 is an enlarged longitudinal sectional view of a nozzle portion of a processing head. (Explanation of main symbols shown in the drawings), 11...
...Processing table, W...Work, 15...
...Processing head, 35...Nozzle, 9...
...Laser beam, 37...Assist gas inlet, 39...Assist gas outlet.

Claims (1)

[Claims] 1 A laser processing apparatus 1 that performs laser processing by irradiating a workpiece W placed on a processing table 11 with a laser beam 9 from a nozzle 35 of a processing head 15, in which an assist gas of the nozzle 35 of the processing head 15 is used. The area of the inlet 37 is A_1, and the area of the assist gas outlet 39 is A_1.
_2, and the area of the appropriate position between the assist gas inlet 37 and the jet port 39 is A_3, and the nozzle 35 is characterized by being formed into a continuous curved shape such that A_3<A_1, A_2. A processing head in a laser processing device.