JPS5937598B2 - semiconductor equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a header for semiconductor electronic circuits, particularly suitable for the construction of hybrid integrated circuits or display devices.

In headers for electronic circuits, which have a conductive pattern on an insulating substrate and mount active elements such as transistors and light emitting diodes, and passive elements such as resistors and capacitors to form display devices, etc., the flow of adhesive brazing material can be controlled. always vc
It has been considered a problem.

For example, in a header for a display device, if one of the light emitting diodes is soldered to one of the conductive surfaces of the conductive pattern,
A problem has arisen in which the adhesive solder overflows from the adhesive surface, making it virtually impossible to attempt to connect the two in series by bonding one of the electrodes of another light emitting diode to the conductive surface. The conventional means of controlling the flow of brazing material are to strictly control the amount of brazing material, heating temperature, and time. Although it has been considered to apply a low flow prevention material to create a so-called ``dam'', this remains a mere proposal and has yet to become an effective solution. Visual contrast is important. Therefore, a means to improve this visual contrast is an important issue, but since the conductive pattern itself provided on the surface of the substrate material is not a dark body,
It is difficult to say that the visual contrast between the light emitting diode in the light emitting state and the surrounding area is still sufficient. SUMMARY OF THE INVENTION It is an object of the present invention to provide a structure for a header for electronic circuits that solves the problem of improving visual contrast in display devices.

According to the present invention, there is provided an insulating substrate, a first conductive pattern disposed on the insulating substrate and having a semiconductor display element attached thereto, and a first conductive pattern disposed on the insulating substrate and having one end connected to the semiconductor display element. a second conductive pattern to which the other end of the bonding line connected to the electrode of the display element is connected; and a position where the other end of the bonding line is connected to the semiconductor display element; and a visually dark insulator layer extending below the lines. According to the present invention, since a visually dark insulating layer is provided near the semiconductor display element, the visual contrast when the semiconductor display element emits light can be significantly improved, making it suitable as a header for a display device. It is something. Furthermore, the insulating layer can also have the effect of damming up the brazing material, which eliminates the problem that the brazing material overflows from the semiconductor display element section and covers the bonding section, making it impossible to perform bonding. Furthermore, by forming the insulating layer so as to overlap the conductive pattern, a protective effect can be achieved to prevent the conductive pattern from peeling off. Hereinafter, the present invention will be explained in more detail using the drawings.

FIG. 1 is a plan view of a display device assembled on a conventional electronic circuit header.

In the conventional electronic circuit header 1, the conductive pattern λ is formed on the surface of the insulating substrate 1 with the entire conductive surface 3 exposed, so that the light emitting diodes LEDl, LED2, LEDn follow the display light emission'' turn. When it is necessary to connect two light emitting diodes in series, the electrodes of the other light emitting diodes are connected to the same conductive surface to which one light emitting diode is bonded.
Connected using ponding.

At this time, if the amount of brazing material, heating temperature, time, etc. are not appropriate, the brazing material often overflows from the bonding surface and flows over the conductive surface, wetting the area to be bonded. Therefore, unless bonding conditions such as the amount of brazing material, heating temperature, and time are strictly controlled, subsequent bonding will be impossible. However, production control that completely satisfies these bonding conditions is difficult, and a decrease in yield cannot be avoided. Fig. 2 is a diagram illustrating the state in which the brazing material overflows to the conductive surface of the bonding joint, and 5 shows the brazing material overflowing from the bonding surface of the light emitting diode LEDL or LED2 onto the respective conductive surface 3. This indicates that bonding connection cannot be made from the electrode to the conductive surface to which the LED 1 is bonded. Furthermore, all of the conductive surfaces 3 of conventional headers for electronic circuits are exposed 9, and the exposed conductive surfaces themselves are not optically dark bodies but are rather close to bright bodies, and moreover, the area around the light emitting diode The visual contrast around the particularly important light emitters is not necessarily good because the light emitters are relatively densely concentrated. In the conventional header for electronic circuits that has been used in display devices and the like, the conductive pattern formed on the surface of the insulating substrate is placed in a state where the conductive surface is completely exposed. The flow of adhesive brazing material cannot be controlled sufficiently.

Also, conductive surfaces cannot be reliably protected. Alternatively, it has many undesirable problems in terms of manufacturing technology, reliability, and added value of the product, such as not being able to satisfy the visual contrast of the display device. According to the present invention, these problems can be easily solved. FIG. 3 is a diagram showing an embodiment of the present invention applied to a header for a display device.

In the display device header 1 according to the present invention, the upper surface of the ceramic insulating substrate 1 is an insulating member V made of a black ceramic material that is almost the same as the substrate material, and the light emitting diodes LED1 and LED2 are connected to the conductive surface of the conductive pattern 2. ...L
Thickness: 0.0 over almost the entire surface, except only for the part 9 where the ED is to be bonded and the part 10 which is to be bonded.
1~0.3m77! covered in layers.

Therefore, only the portion 9 where the light emitting diode is to be bonded and the portion 10 where each diode is to be bonded using the bonding metal thin wire 4 are exposed, and the entire surface of the insulating substrate including the conductive surface between these two portions is exposed. Since it is coated with a thin ceramic layer V formed integrally with the substrate 1 and having substantially the same quality as the substrate 1, the flow of the adhesive brazing material from the adhesive surface 9 of the light emitting diode to the part 10 to be bonded during assembly is limited during this time. In addition, the conductive surface is protected by a ceramic material of the same quality that is thermally, chemically, and mechanically strong and has approximately the same coefficient of thermal expansion as the substrate material, so peeling of the conductive surface is prevented. It is also possible to prevent the cracking phenomenon or the cracking phenomenon of the protective material itself, and almost all problems in terms of manufacturing technology and reliability are solved. In addition, most of the conductive pattern 2 is covered with black ceramic material and is not exposed like in conventional patterns, so the visual contrast between the light emitting surface and the surrounding area can be significantly improved, increasing the added value of the product. I like people who contribute to this. The electronic circuit header 1 according to the present invention is made by applying a required conductive pattern 2 to a sintered or unsintered ceramic insulating substrate 1, and then forming a paste-like ceramic material whose main component is unsintered ceramic powder having substantially the same quality as the substrate 1. is applied to the entire surface of the substrate, excluding only the conductive surface of the part where the semiconductor element is to be bonded and the part to be bonded, and baked at a sintering temperature to coat the ceramic material of the substrate, the paste-like ceramic material, and the conductive surface of the conductive pattern. It can be manufactured by integrating and sintering.

In this case, printing technology is effective as a means of applying the paste ceramic material, and its sintered size is 0.01 except in special cases.
~0.3m77! It is appropriate to choose. For example, a specific example of a header for a display device is as follows. A predetermined conductive pattern 2 is printed on an unsintered ceramic insulating substrate 1 (for example, Al2O3 green tape) with a thickness of 1.5 ml using tungsten paste, and then Fe-Ni-Mn or a patent application pattern is printed on it using tungsten paste. Showa 47
A paste-like ceramic material mainly composed of Al2O3 powder containing a small amount of a coloring agent such as a molybdate or a tungstate described in the specification of No. 30997 was applied to each of the parts to which the light emitting diode was to be bonded and the parts to be bonded. If the entire surface of the insulating substrate, excluding the conductive surface, is printed to a thickness of approximately 40 μm, and the ceramic sintering and metallization of the conductive pattern are completed in a wet hydrogen gas atmosphere at 1600 to 1700°C, the conductive pattern 2 A header for an electronic circuit according to the present invention suitable for a display device is obtained, which is covered with a thin black ceramic material layer except for the conductive surface of the part to which the light emitting diode is to be bonded and the part to be bonded. FIG. 4 and FIG. 5 are diagrams for explaining that the insulating layer member V according to the present invention is effective in preventing short-circuit accidents caused by contact between the semiconductor element 6 and the bonding thin metal wire 4.

In this case, FIG. 4 shows that an insulating layer member V made of a ceramic material of substantially the same quality as the ceramic insulating substrate 1 has a portion to which a semiconductor element 6 is to be bonded and a portion to be bonded, as well as passive elements such as a resistor 12 or a capacitor. It is formed integrally with and coated on the insulating substrate 1 except for each conductive surface of the portion to be formed.

At this time, if the height of the insulating layer member V is set to the height of the semiconductor element 6 as shown in FIG. 5, it is more effective in preventing short circuit accidents due to contact between the semiconductor element 6 and the bonding thin metal wire 4. . As described in detail above, according to the header for electronic circuits of the present invention, the gap between the part to which the semiconductor element is to be bonded and the part to be bonded is made of ceramic insulation of substantially the same quality as the substrate material integrated with the ceramic insulating substrate. Since the material is coated in layers, the flow of brazing material from the bonding surface of the semiconductor element to the bonding surface can be completely prevented when assembling electronic circuits, making manufacturing management easier and dramatically improving yield. Since the conductive surface is covered and protected with a ceramic material that is substantially the same as the substrate material, it is possible to prevent peeling of the conductive surface and cracking of the protective material itself, thereby significantly improving reliability.

Furthermore, since the coated ceramic material can be easily blackened, the visual contrast of the display device is significantly improved. Moreover, since the ceramic coating is made to be at the same height as the semiconductor display device, even if the bonding line hangs down, it will not come into contact with the display device. Furthermore, it is clear that the practice of the present invention does not limit the use of the protective material of the resin 13 in the molding process of the transparent epoxy resin shown in FIG. It does not interfere with the installation work. As with the conductive surfaces of the parts to which semiconductor elements are to be bonded and the parts to be bonded, it is sufficient to avoid applying paste-like ceramic material to these conductive surfaces that require brazing, which may cause problems in the manufacturing process. This can easily be done.

[Brief explanation of drawings]

Fig. 1 is a plan view of a display device assembled on a conventional header for electronic circuits, and Fig. 2 is a diagram illustrating a state in which brazing material overflows to the conductive surface to be bonded of the conventional header for electronic circuits. , FIG. 3 shows an embodiment of the invention applied to a header for a display device, FIG. It is a figure explaining that it is effective in preventing a short circuit accident. 1... Ceramic insulating substrate, LED...
・Light emitting diode, 2... Conductive pattern, 8.
... Solder material, 3 ... Conductive surface of conductive pattern, 9 ... Conductive surface to which the light emitting diode is to be bonded, 4 ... Thin metal wire for bonding, 10 ...
... Conductive surface to be bonded, 5 ... Overflow port material, 6 ... Semiconductor element, 12 ...
Thin film resistor, 7... Precoat material, 13...
... Thin film resistor) protective resin, 14... External lead wire.

Claims (1)

[Claims] 1 an insulating substrate, a first conductive pattern disposed on the insulating substrate and having a semiconductor display element attached thereto, and a first conductive pattern disposed on the insulating substrate and having one end connected to an electrode of the semiconductor display element; a second conductive pattern to which the other end of the bonding line is connected, and a position where the other end of the bonding line is connected to the semiconductor display element, and extending below the bonding line. 1. A semiconductor device comprising: a visually dark insulating layer;