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JPS5941845B2 - How to carve a pattern - Google Patents
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JPS5941845B2 - How to carve a pattern - Google Patents

How to carve a pattern

Info

Publication number
JPS5941845B2
JPS5941845B2 JP51146725A JP14672576A JPS5941845B2 JP S5941845 B2 JPS5941845 B2 JP S5941845B2 JP 51146725 A JP51146725 A JP 51146725A JP 14672576 A JP14672576 A JP 14672576A JP S5941845 B2 JPS5941845 B2 JP S5941845B2
Authority
JP
Japan
Prior art keywords
elongation
pattern
base material
resin
sandblasting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51146725A
Other languages
Japanese (ja)
Other versions
JPS5371164A (en
Inventor
武蔵 左納
晴夫 井上
秋弘 古田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP51146725A priority Critical patent/JPS5941845B2/en
Publication of JPS5371164A publication Critical patent/JPS5371164A/en
Publication of JPS5941845B2 publication Critical patent/JPS5941845B2/en
Expired legal-status Critical Current

Links

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  • Application Of Or Painting With Fluid Materials (AREA)

Description

【発明の詳細な説明】 本発明は、サンドブラストによつて図柄に応じて基材表
面を浸蝕して模様を彫る方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of carving a pattern by eroding the surface of a base material according to the pattern by sandblasting.

アルシニウム、亜鉛、鉄等の金属、ポリメチルメタクリ
レート、ポリスチレン、ポリ塩化ビニル、尿素−フオル
マリン樹脂、フェノール樹脂等の合成樹脂、ガラス、石
、木材等で成る成形物(以下基材と称する)の表面を浸
蝕して模様を彫ることは、これら基材を装飾用途に用い
る場合に度々行われているところである。
The surface of a molded product (hereinafter referred to as the base material) made of metals such as arsinium, zinc, and iron, synthetic resins such as polymethyl methacrylate, polystyrene, polyvinyl chloride, urea-formalin resin, and phenol resin, glass, stone, wood, etc. Erosion and engraving of patterns is often carried out when these base materials are used for decorative purposes.

その方法として、本発明者らはすでに基材上に光硬化性
樹脂を配置せしめ、図柄を通して活性光を照射した後、
非硬化部樹脂を除去し、次いでサンドブラストによつて
基材表面を浸蝕して基材に模様をつける方法を提案した
。この方法は従来の手彫り、薬品によるエッチング、切
り抜き型を貼りつけてサンドブラストする方法等に比べ
作業能率、作業環境等の点で非常に優れている。この方
法は、すでに述べたような広い範囲の基材への模様づけ
に適しているが、基材に深い模様を彫る場合には光硬化
性樹脂がサンドブラストにより浸蝕されにくいもの、あ
るいは比較的長時間サンドブラストに耐えるものでなけ
ればならない。
As a method, the present inventors have already placed a photocurable resin on a base material, irradiated active light through the pattern, and then
We proposed a method in which the uncured resin is removed, and then the surface of the substrate is eroded by sandblasting to create a pattern on the substrate. This method is extremely superior in terms of work efficiency and work environment compared to conventional methods such as hand engraving, chemical etching, and sandblasting by pasting cut-out molds. This method is suitable for patterning a wide range of base materials as mentioned above, but when carving deep patterns on the base material, the photocurable resin must be resistant to erosion by sandblasting or relatively long. Must be able to withstand time sandblasting.

すなわち、通常の光硬化性樹脂を用いると、サンドブラ
ストにより樹脂が浸蝕されるため、彫る深さに応じ樹脂
層を厚くすることが必要である。この場合、樹脂層の厚
さが5mmより厚くなつてくると、樹脂層の光硬化に必
要な時間が長くなり、又光源より斜めに入射する光線の
ため、図柄に対していわゆる゛太り″が起り問題となつ
てくる。本発明者らは、かかる問題点を解決し、サンド
ブラストにより浸蝕されにくい樹脂を用いることにより
基材に深い模様をも彫ることができる方法について鋭意
検討した結果、活性光の照射により、伸び100%以上
で、100%伸び時の引張り応力が1〜500に9/一
となる光架橋性樹脂を用いるのが良いことがわかり、本
発明に到つた。すなわち、本発明は活性光の照射により
伸び100%以上で、伸び100%時の引張り応力が1
〜500に9/一の弾性体となる光架橋性樹脂組成物を
基材上に配置せしめ、図柄を通して活性光を照射した後
、非架橋部樹脂を除去し、ついでサンドブラストによつ
て基材表面を浸蝕して基材に模様を彫る方法である。本
発明において用いる光架橋性樹脂組成物は光照射により
伸び100%以上で、伸び100%時の引張り応力が1
〜500k9/CIiの弾性体となるものである。
That is, when a normal photocurable resin is used, the resin is eroded by sandblasting, so it is necessary to increase the thickness of the resin layer depending on the depth of engraving. In this case, when the thickness of the resin layer becomes thicker than 5 mm, the time required for photocuring the resin layer becomes longer, and the light rays are incident obliquely from the light source, so the pattern becomes thicker. The inventors of the present invention have worked hard to find a way to solve this problem and to carve deep patterns on the base material by using a resin that is not easily eroded by sandblasting. It was found that it is better to use a photocrosslinkable resin that has an elongation of 100% or more and a tensile stress of 1 to 500: 9/1 when irradiated with elongates by 100% or more when irradiated with active light, and the tensile stress at 100% elongation is 1.
A photocrosslinkable resin composition that becomes an elastic body of ~500 to 9/1 is placed on a base material, and after irradiating active light through the pattern, the non-crosslinked resin is removed, and then the base material surface is sandblasted. This is a method of carving patterns into the base material by eroding it. The photocrosslinkable resin composition used in the present invention has an elongation of 100% or more upon irradiation with light, and a tensile stress of 1 at 100% elongation.
It becomes an elastic body of ~500k9/CIi.

このうち伸び100%時の引張り応力が50〜400k
9/Cdとなるものが特に好ましい(ここでいう伸び1
00%時の引張り応力とは、伸び100%時の荷重を伸
びO%時の断面積で割つたものである。)。このような
樹脂組成物としては、例えば未加硫ゴムと光重合性単量
体と光増感剤を主成分とする樹脂組成物で、光照射によ
り既述の引張り弾性率、伸びを有する弾性体となるもの
があげられる。
Of these, the tensile stress at 100% elongation is 50 to 400k.
9/Cd is particularly preferable (elongation 1
The tensile stress at 00% is the load at 100% elongation divided by the cross-sectional area at 0% elongation. ). Such a resin composition is, for example, a resin composition whose main components are unvulcanized rubber, a photopolymerizable monomer, and a photosensitizer, and when irradiated with light, it has elasticity with the above-mentioned tensile modulus and elongation. I can give you something that will become your body.

又、感光性フレキソ版材用ゴム版用として用いられてい
る樹脂組成物で、光照射により既述の引張り弾性率、伸
びを有する弾性体となるものも用いることができる。前
記の光架橋性樹脂組成物の成分として用いられる未加硫
ゴムとしては、例えば、ポリクロロプレン、クロロプレ
ンと他のビニル単量体の共重合物、アクリル酸エステル
と塩素又は臭素含有ビニル単量体の共重合物、ポリエピ
クロルヒドリン、エピクロルヒドリンとエポキシ含有化
合物の共重合物等を用い、光重合性単量体としては例え
ば、2−ヒドロキシエチル(メタ)アクリレート、2−
エトキシエチル(メタ)アクリレート、エチレングリコ
ールジ(メタ)アクリレート、ジエチレングリコールジ
(メタ)アクリレート、トリエチレングリコールジ(メ
タ)アクリレート、ビスフエノールAジグリシジルエー
テルジ(メタ)アクリレート、レゾルシンジグリシジル
エーテルジ(メタ)アクリレート等のアクリル酸エステ
ル又はメタクリル酸エステル類を、増感剤としては例え
ば、ベンゾイン、ベンゾインメチルエーテル、ベンゾイ
ンエチルエーテル、ベンゾインイソプロピルエーテル、
ベンゾインブチルエーテル、ベンゾイソイソブチルエー
テ等のベンゾイン類、ベンゾフエノン、4−メチルベン
ゾフエノン、4,4′−ジメチルベンゾフエノン等のベ
ンゾフエノン類等を用いる。光重合性単量体の割合は、
未加硫ゴムと光重合性単量体の合計を100重量部とし
て5〜50重量部、又光増感剤の割合はこれに対し0.
5〜5重量部の範囲で用いる。この他に必要に応じ熱重
合禁止剤、充填剤等を加える。熱重合禁止剤としては、
2,6−ジ一t−ブチルp−クレゾール、ハイドロキノ
ン、ハイドロキノンモノメチルエーテル等を0.05〜
0.5重量部用いる。本発明において基材に模様を彫る
方法は、例えば次のように行う。まず基材−ヒに彫る模
様の深さに応じて0.1〜5mmの感光性樹脂層を配す
る。
Also, resin compositions used for rubber plates for photosensitive flexographic printing plates that become elastic bodies having the above-mentioned tensile modulus and elongation when irradiated with light can also be used. Examples of the unvulcanized rubber used as a component of the photocrosslinkable resin composition include polychloroprene, a copolymer of chloroprene and other vinyl monomers, and an acrylic ester and a chlorine- or bromine-containing vinyl monomer. A copolymer of 2-hydroxyethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-
Ethoxyethyl (meth)acrylate, Ethylene glycol di(meth)acrylate, Diethylene glycol di(meth)acrylate, Triethylene glycol di(meth)acrylate, Bisphenol A diglycidyl ether di(meth)acrylate, Resorcin diglycidyl ether di(meth)acrylate ) Acrylic esters or methacrylic esters such as acrylates are used as sensitizers such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether,
Benzoins such as benzoin butyl ether and benzoisoisobutyl ether, benzophenones such as benzophenone, 4-methylbenzophenone, and 4,4'-dimethylbenzophenone, and the like are used. The proportion of photopolymerizable monomer is
The total amount of unvulcanized rubber and photopolymerizable monomer is 100 parts by weight, and the ratio of the photosensitizer is 0.5 to 50 parts by weight.
It is used in a range of 5 to 5 parts by weight. In addition, thermal polymerization inhibitors, fillers, etc. are added as necessary. As a thermal polymerization inhibitor,
2,6-di-t-butyl p-cresol, hydroquinone, hydroquinone monomethyl ether, etc. from 0.05 to
Use 0.5 parts by weight. In the present invention, a method for carving a pattern on a base material is performed, for example, as follows. First, a photosensitive resin layer with a thickness of 0.1 to 5 mm is placed on a base material, depending on the depth of the pattern to be carved.

その方法は固体状のものではあらかじめ0.1〜5mm
のシートを作成し、これを基材に貼りつけることによつ
て行う。この場合必要ならば接着剤を用いる。樹脂が液
状のものでは、例えば基材上に彫る深さに応じて厚さ0
.1〜5mmのスペーサーを配し、樹脂を流し、その上
から10〜20μの透明フイルム(ポリエステル、ポリ
プロピレン、セロハン等)をかぶせ、その上からローラ
ー等をスペーサーに押しつけながら移動することによつ
て行える。次いで、この樹脂層の上に所定の図格のホト
マスクを重ねて密着させ(液状の場合は10〜20μの
透明のフイルムを介して)、活性光線を照射する。活性
光源としては、高圧水銀灯、紫外線螢光灯、カーボンア
ーク灯、太陽光線などを用いる。照射条件は、光架橋に
より伸びが100%以上で、伸び100%時の引張り応
力が1〜500k9/C7l、好ましくは50〜400
kg/〜となるように選ぶ。照射が終れば光の通らなか
つた部分(未架橋部分)を除去する。その方法としては
、固体状のものは溶剤で、液状のものは溶剤又は紙、布
等によるふき取りで行うことができる。かくして基材上
に、本発明の樹脂で模様をつけたものをサンドブラスト
により浸蝕する。
The method is to use a solid material with a thickness of 0.1 to 5 mm in advance.
This is done by creating a sheet and attaching it to the base material. In this case, use adhesive if necessary. If the resin is liquid, the thickness may vary depending on the depth of engraving on the base material, for example.
.. This can be done by placing a 1-5mm spacer, pouring the resin, covering it with a 10-20μ transparent film (polyester, polypropylene, cellophane, etc.), and pressing a roller, etc. against the spacer while moving. . Next, a photomask of a predetermined pattern is placed on top of this resin layer and brought into close contact (in the case of a liquid, through a transparent film of 10 to 20 μm), and actinic rays are irradiated. As the active light source, a high-pressure mercury lamp, an ultraviolet fluorescent lamp, a carbon arc lamp, sunlight, etc. are used. The irradiation conditions are such that the elongation is 100% or more due to photocrosslinking, and the tensile stress at 100% elongation is 1 to 500 k9/C7l, preferably 50 to 400.
kg/~. Once the irradiation is complete, the areas through which light does not pass (uncrosslinked areas) are removed. This can be done by using a solvent for solid products, and by wiping with a solvent, paper, cloth, etc. for liquid products. The resin of the present invention is thus patterned on the substrate and eroded by sandblasting.

この場合のブラスト条件は樹脂層厚さによつて変つてく
るが、30〜500メツシユのアランダムやカーボラン
ダム等を1〜50CTrLの距離から1〜8kg/への
圧力の空気と共に吹きつけることによつて行われる。ブ
ラスト後、樹脂層を剥離することによつて模様の彫られ
た基材が得られる。本発明の力法を用いると、樹脂が光
架橋により弾性体となるためにサンドブラストによつて
浸蝕、摩粍されにくく比較的長始間サンドブラストに耐
えることができる。
The blasting conditions in this case vary depending on the resin layer thickness, but 30 to 500 meshes of alundum, carborundum, etc. are sprayed with air at a pressure of 1 to 8 kg from a distance of 1 to 50 CTrL. It is done by folding. After blasting, a patterned substrate is obtained by peeling off the resin layer. When the force method of the present invention is used, since the resin becomes an elastic body through photo-crosslinking, it is less likely to be eroded or abraded by sandblasting and can withstand sandblasting for a relatively long period of time.

その結果、基材に鮮明な深い模様を彫ることも可能とな
つた。本発明の方法はこれらの点を生かして各種基材に
模様を彫るのに広く用いることができる。
As a result, it has become possible to engrave clear and deep patterns on the base material. The method of the present invention can be widely used to carve patterns on various base materials by taking advantage of these points.

次に実施例により具体的に説明する。実施例1および比
較例1 次表に示す組成物の厚さ1mmの層を50mmの石石板
上に配し、紫外線螢光灯(20W×10本)を10分間
照射後、サンドブラストによる貫通試験を行い、次の結
果を得た。
Next, a concrete explanation will be given using examples. Example 1 and Comparative Example 1 A 1 mm thick layer of the composition shown in the following table was placed on a 50 mm stone slab, and after being irradiated with ultraviolet fluorescent lamps (20 W x 10) for 10 minutes, a penetration test was conducted by sandblasting. and obtained the following results.

実施例 2 実施例1の樹脂組成物Aをプレス成形して、厚さ1.0
mmのシートを得た。
Example 2 The resin composition A of Example 1 was press-molded to a thickness of 1.0
A sheet of mm was obtained.

これを厚さ50mmの石板上に貼り合わせた。この上に
ホトマスクを重ね、その上から紫外線螢光灯(20W×
10本)を10分間照射した。その後、トリクレンを用
いて紫外線の照射を受けなかつた部分を洗い出すと、ホ
トマスクの図柄に対応した模様を有する樹脂層が得られ
た。これらに30メツシユのカーボランダムを6k9/
C!iの圧力の空気と共に吹きつけサンドブラストした
。ブラスト後、樹脂層を剥離すると図柄に対応した模様
の彫られた石板が得られた。実施例 3実施例1の樹脂
組成物Aをプレス成形して、厚さ0.7mmのシートを
得た。
This was pasted onto a stone plate with a thickness of 50 mm. Layer a photomask on top of this, and then apply an ultraviolet fluorescent lamp (20W x
10 tubes) were irradiated for 10 minutes. Thereafter, the portions that were not irradiated with ultraviolet rays were washed out using trichlene, and a resin layer having a pattern corresponding to the pattern of the photomask was obtained. Add 30 mesh of carborundum to these at 6k9/
C! It was sandblasted by blowing with air at a pressure of i. After blasting, the resin layer was peeled off to obtain a stone plate carved with a pattern corresponding to the design. Example 3 The resin composition A of Example 1 was press-molded to obtain a sheet with a thickness of 0.7 mm.

Claims (1)

【特許請求の範囲】 1 活性光の照射により伸び100%以上で、伸び10
0%時の引張り応力が1〜500kg/cm^2の弾性
体となる光架橋性樹脂組成物を基材上に配置せしめ、図
柄を通して活性光を照射した後、非架橋部樹脂を除去し
、ついでサンドブラストによつて基材表面を浸蝕して基
材に模様を彫る方法。 2 光架橋性樹脂組成物が未加硫ゴム、光重合性単量体
、光増感剤を含み、活性光の照射により伸び100%以
上で、伸び100%時の引張り応力が1〜500kg/
cm^2の弾性体となる特許請求の範囲第1項記載の方
法。
[Claims] 1. Elongation of 100% or more by irradiation with actinic light, elongation of 10
A photocrosslinkable resin composition that becomes an elastic body with a tensile stress of 1 to 500 kg/cm^2 at 0% is placed on a base material, and after irradiating active light through the pattern, the non-crosslinked resin is removed, Then, the surface of the base material is eroded by sandblasting to carve a pattern on the base material. 2. The photocrosslinkable resin composition contains an unvulcanized rubber, a photopolymerizable monomer, and a photosensitizer, and has an elongation of 100% or more upon irradiation with actinic light, and a tensile stress of 1 to 500 kg/1 at the time of 100% elongation.
2. The method according to claim 1, wherein the elastic body has a diameter of cm^2.
JP51146725A 1976-12-06 1976-12-06 How to carve a pattern Expired JPS5941845B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51146725A JPS5941845B2 (en) 1976-12-06 1976-12-06 How to carve a pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51146725A JPS5941845B2 (en) 1976-12-06 1976-12-06 How to carve a pattern

Publications (2)

Publication Number Publication Date
JPS5371164A JPS5371164A (en) 1978-06-24
JPS5941845B2 true JPS5941845B2 (en) 1984-10-11

Family

ID=15414143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51146725A Expired JPS5941845B2 (en) 1976-12-06 1976-12-06 How to carve a pattern

Country Status (1)

Country Link
JP (1) JPS5941845B2 (en)

Also Published As

Publication number Publication date
JPS5371164A (en) 1978-06-24

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