JPS5943067B2 - Photocurable coating composition - Google Patents
Photocurable coating compositionInfo
- Publication number
- JPS5943067B2 JPS5943067B2 JP17147679A JP17147679A JPS5943067B2 JP S5943067 B2 JPS5943067 B2 JP S5943067B2 JP 17147679 A JP17147679 A JP 17147679A JP 17147679 A JP17147679 A JP 17147679A JP S5943067 B2 JPS5943067 B2 JP S5943067B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- acid
- unsaturated polyester
- glycol
- diene polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008199 coating composition Substances 0.000 title description 5
- 229920000642 polymer Polymers 0.000 claims description 18
- 150000001993 dienes Chemical class 0.000 claims description 13
- 229920006305 unsaturated polyester Polymers 0.000 claims description 11
- 125000000524 functional group Chemical group 0.000 claims description 7
- 239000000178 monomer Substances 0.000 claims description 5
- 239000003504 photosensitizing agent Substances 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- 150000007519 polyprotic acids Polymers 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 16
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 239000005062 Polybutadiene Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 229920002857 polybutadiene Polymers 0.000 description 7
- -1 diene compound Chemical class 0.000 description 6
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920006337 unsaturated polyester resin Polymers 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000005984 hydrogenation reaction Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- PAOHAQSLJSMLAT-UHFFFAOYSA-N 1-butylperoxybutane Chemical group CCCCOOCCCC PAOHAQSLJSMLAT-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- PRBHEGAFLDMLAL-UHFFFAOYSA-N 1,5-Hexadiene Natural products CC=CCC=C PRBHEGAFLDMLAL-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- ZTEHOZMYMCEYRM-UHFFFAOYSA-N 1-chlorodecane Chemical compound CCCCCCCCCCCl ZTEHOZMYMCEYRM-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 description 1
- AXYQEGMSGMXGGK-UHFFFAOYSA-N 2-phenoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(=O)C(C=1C=CC=CC=1)OC1=CC=CC=C1 AXYQEGMSGMXGGK-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- XQOAKYYZMDCSIA-UHFFFAOYSA-N O1OO1 Chemical class O1OO1 XQOAKYYZMDCSIA-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910000564 Raney nickel Inorganic materials 0.000 description 1
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- IYABWNGZIDDRAK-UHFFFAOYSA-N allene Chemical compound C=C=C IYABWNGZIDDRAK-UHFFFAOYSA-N 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- QNRMTGGDHLBXQZ-UHFFFAOYSA-N buta-1,2-diene Chemical compound CC=C=C QNRMTGGDHLBXQZ-UHFFFAOYSA-N 0.000 description 1
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000009918 complex formation Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical compound C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- QVTWBMUAJHVAIJ-UHFFFAOYSA-N hexane-1,4-diol Chemical compound CCC(O)CCCO QVTWBMUAJHVAIJ-UHFFFAOYSA-N 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 230000026045 iodination Effects 0.000 description 1
- 238000006192 iodination reaction Methods 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 125000005609 naphthenate group Chemical group 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- QYZLKGVUSQXAMU-UHFFFAOYSA-N penta-1,4-diene Chemical compound C=CCC=C QYZLKGVUSQXAMU-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical group 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Polymerisation Methods In General (AREA)
- Polyesters Or Polycarbonates (AREA)
Description
【発明の詳細な説明】
本発明は密着性、電気絶縁性、耐熱性、耐食性などのす
ぐれた光硬化性被覆組成物に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a photocurable coating composition with excellent adhesion, electrical insulation, heat resistance, corrosion resistance, etc.
従来、光硬化性組成物には主として、エポキシアクリレ
ート、エポキシメタクリレート、ポリエステルアクリレ
ートなどのアクリレート類、通常の不飽和ポリエステル
などを主成分として用いられている。しかし、該アクリ
レート類は特に金属との密着性などが劣り実用面で限定
された用途に向けられている。本発明はこの欠点を改善
するものであり、上記アクリレート類及び通常のポリエ
ステルに比べて特に電気絶縁性のすぐれた塗膜が得られ
る光硬化性被覆組成物を提供するものである。すなわち
、本発明は、
(^ エステル結合をつくり得る少なくとも1個の末端
官能基を有するジエンポリマーの水添物100〜50重
量%、(2)エステル結合をつくり得る少なくとも1個
の末端官能基を有する未水添ジエンポリマー0〜50重
量%および
(C)不飽和多塩基酸
より合成される不飽和ポリエステル(I)、ビニル単量
体(■)並びに光増感剤圃を含有してなる光硬化性被覆
組成物に関する。Conventionally, photocurable compositions mainly contain acrylates such as epoxy acrylate, epoxy methacrylate, and polyester acrylate, and ordinary unsaturated polyesters. However, these acrylates have poor adhesion to metals, and are used for limited practical purposes. The present invention aims to improve this drawback, and provides a photocurable coating composition that provides a coating film with particularly excellent electrical insulation properties compared to the above-mentioned acrylates and ordinary polyesters. That is, the present invention provides (^) 100 to 50% by weight of a hydrogenated diene polymer having at least one terminal functional group capable of forming an ester bond; (2) a hydrogenated product having at least one terminal functional group capable of forming an ester bond; 0 to 50% by weight of an unhydrogenated diene polymer and (C) an unsaturated polyester synthesized from an unsaturated polybasic acid (I), a vinyl monomer (■), and a photosensitizer field. The present invention relates to curable coating compositions.
本発明は上記不飽和ポリエステル(I)を使用すること
に特徴があり、これにより他の光硬化性樹脂組成物と比
較して、密着性、耐熱性、電気絶縁性が優れると共に、
光硬化させることにより耐食性に優れたものとなる。The present invention is characterized by the use of the unsaturated polyester (I), which provides excellent adhesion, heat resistance, and electrical insulation properties compared to other photocurable resin compositions, and
By photo-curing, it becomes excellent in corrosion resistance.
このようなために、上記不飽和ポリエステル(I)は(
2)成分として、末端にエステル結合を結成し得る官能
基を有する水添ジエンポリマーを使用する。水添ジエン
ポリマーの水添率は、90〜100%が好ましく、その
使用量は、(2)および(m成分の総量に対して100
〜50重量%である。50重量%未満では、耐熱劣化性
、耐候性が劣る。For this reason, the unsaturated polyester (I) is (
2) As a component, a hydrogenated diene polymer having a functional group capable of forming an ester bond at its terminal is used. The hydrogenation rate of the hydrogenated diene polymer is preferably 90 to 100%, and the amount used is 100% to the total amount of components (2) and (m).
~50% by weight. If it is less than 50% by weight, heat deterioration resistance and weather resistance will be poor.
([成分は、本発明に係る組成物が優れた乾燥性を有す
るために必要であり、特に(2)成分の水添ジエンポリ
マーの水添率が100%のときは、(Ajと(B)成分
を併用するのが好ましい。本発明に用いる(2)成分と
して水添ジエンポリマーは分子量の小さいものを使用し
た場合には高い伸び率を有するものが得にくく、通常は
1、000〜4、000の範囲であれば目的とする組成
物が得られる。ジエンポリマとしては例えばプロパンジ
エン、1,2−ブタジエン、1,3−ブタジエン、1,
3−ペンタジエン、1,4−ペンタジエン、1,5−ヘ
キサジエンなどから選ばれるモノマを少なくとも1種重
合させて得られるポリマである。([component is necessary for the composition according to the present invention to have excellent drying properties, and especially when the hydrogenation rate of the hydrogenated diene polymer of component (2) is 100%, (Aj and (B It is preferable to use component (2) in combination.If the hydrogenated diene polymer used in the present invention has a small molecular weight, it is difficult to obtain a product with a high elongation rate, and it is usually 1,000 to 4 , 000 range, the desired composition can be obtained. Examples of diene polymers include propane diene, 1,2-butadiene, 1,3-butadiene, 1,
It is a polymer obtained by polymerizing at least one monomer selected from 3-pentadiene, 1,4-pentadiene, 1,5-hexadiene, etc.
特にポリブタジエンは最も入手し易く本発明の目的を達
成するものとして挙げられる。ジエンポリマは末端にエ
ステル結合を形成し得る少なくとも1個の官能基を有す
るものを使用するが、一般にはヒドロキシル基あるいは
カルボキシル基である。ジエンポリマーを合成し、これ
に官能基を導入するには、先ずジエン化合物をナトリウ
ム、リチウムなどの金属触媒の存在下で重合させてリピ
ングポリマ一をつくる。ついで、該リピングポリマ一に
エポキシ化合物などを反応させて末端に水酸基を有する
もの、二酸化炭素を反応させて末端にカルボキシル基を
有するものを合成する。ここで、末端とはリピングポリ
マ一の一端でも両端でもよい。このようにして得られた
未水添ジエンポリマーは(B)成分として使用し得る。
さらに、このポリマーを水添することにより、水添ジエ
ンポリマーとすることができる。水添法としては、メタ
ノール、エタノール、シクロヘキサン、ベンゼン、テト
ラヒドロフラン等の有機溶剤を使用し、ラネーニツケル
触媒、漆原触媒、安定化ニツケル触媒の存在下で反応温
度50〜300℃、水素圧50〜500k9/dの条件
で還元反応を行なう方法がある。又、本発明に用いる不
飽和多塩基酸〔(O成分〕としてはマレイン酸、無水マ
レイン酸、フマル酸イタコン酸などが挙げられる。In particular, polybutadiene is cited as being the most readily available and achieving the object of the present invention. The diene polymer used has at least one functional group capable of forming an ester bond at its terminal, and it is generally a hydroxyl group or a carboxyl group. To synthesize a diene polymer and introduce a functional group into it, a lipping polymer is first produced by polymerizing a diene compound in the presence of a metal catalyst such as sodium or lithium. Next, the lipping polymer is reacted with an epoxy compound to synthesize a product having a hydroxyl group at the end, and a product having a carboxyl group at the end by reacting with carbon dioxide. Here, the terminus may be one end or both ends of the ripping polymer. The unhydrogenated diene polymer thus obtained can be used as component (B).
Furthermore, by hydrogenating this polymer, a hydrogenated diene polymer can be obtained. The hydrogenation method uses organic solvents such as methanol, ethanol, cyclohexane, benzene, and tetrahydrofuran in the presence of a Raney nickel catalyst, Urushihara catalyst, and stabilized nickel catalyst at a reaction temperature of 50 to 300°C and a hydrogen pressure of 50 to 500 k9/ There is a method of carrying out the reduction reaction under the conditions of d. Further, examples of the unsaturated polybasic acid (O component) used in the present invention include maleic acid, maleic anhydride, fumaric acid and itaconic acid.
本発明において不飽和多塩基酸とより不飽和ポリエステ
ル樹脂を製造する際に、グリコール化合物として、エチ
レングリコール、ジエチレングリコール、1,2−プロ
ピレングリコール、ジプロピレングリコール、1,3−
ブチレングリコール、2,3−ブチレングリコール、ビ
スフエノールジオキシエチルエーテル、ネオペンチルグ
リコール、1,4−ブテングリコール、1,4−ヘキサ
ンジオールなどがあり、また、飽和酸としては例えばア
ジピン酸、セバチン酸、フタル酸、無水フタル酸、イソ
フタル酸、テレフタル酸、3,6−エンドメチレンテト
ラヒドロ無水フタル酸、テトラヒドロフタル酸などを一
部併用してもよい。不飽和ポリエステル樹脂を製造する
場合に、縮合反応を促進するために触媒を用いることも
でき、その種類及び使用量は特に制限されるものではな
い。In the present invention, when producing an unsaturated polyester resin from an unsaturated polybasic acid, the glycol compounds used include ethylene glycol, diethylene glycol, 1,2-propylene glycol, dipropylene glycol, 1,3-
Examples include butylene glycol, 2,3-butylene glycol, bisphenol dioxyethyl ether, neopentyl glycol, 1,4-butene glycol, 1,4-hexanediol, and examples of saturated acids include adipic acid and sebacic acid. , phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, 3,6-endomethylenetetrahydrophthalic anhydride, tetrahydrophthalic acid, etc. may be partially used in combination. When producing an unsaturated polyester resin, a catalyst can be used to promote the condensation reaction, and the type and amount used are not particularly limited.
通常の不飽和ポリエステルの製造法によりおこなうこと
ができる。本発明に用いるビニル単量体()の例として
は、スチレン、ビニルトルエン、α−メチルスチレン、
ジビニルベンゼン、ジアリルフタレート、アクリル酸エ
スデル類又はメタクリル酸エステル類(2−ヒドロキシ
エチルアクリレート、1,6−ヘキサンジオールジアク
リレート、トリメチロールプロパントリアクリレート、
ポリエチレングリコールジアクリレートなど)などを単
独で又は2種以上組み合わせて使用される。This can be carried out by a conventional method for producing unsaturated polyester. Examples of the vinyl monomer () used in the present invention include styrene, vinyltoluene, α-methylstyrene,
Divinylbenzene, diallyl phthalate, acrylic acid esters or methacrylic acid esters (2-hydroxyethyl acrylate, 1,6-hexanediol diacrylate, trimethylolpropane triacrylate,
(polyethylene glycol diacrylate, etc.) may be used alone or in combination of two or more.
反応性単量体は不飽和ポリエステル(1)に対して0.
5〜5重量倍、特に0.5〜2重量倍の範囲で使用され
るのが好ましい。0.5重量倍未満では、得られる光硬
化性樹脂組成物の粘度が高くはる傾向にあり、5重量倍
を越えると最終的に得られる塗膜がもろくなる。The amount of reactive monomer is 0.0% relative to the unsaturated polyester (1).
It is preferably used in an amount of 5 to 5 times by weight, particularly 0.5 to 2 times by weight. If it is less than 0.5 times by weight, the resulting photocurable resin composition tends to have a high viscosity, and if it exceeds 5 times by weight, the final coating film obtained becomes brittle.
又、本発明に用いる光増感剤(自)としてはベンゾイン
、ベンゾインエチルエーテル、ペンゾーンイソフロビュ
ーセル、ベンゾインフエニルエーテル、などのベンゾイ
ンアルキルエーテル類、ベンゾチオエーテル類、ベンゾ
フエノン、アセトフエノン、2−エチルアントラキノン
、塩化デシルなどが使用できる。光増感剤(111)の
使用量は、全重合性成分に対して、0.5〜10重量%
、特に1〜5重量%が好ましい。In addition, as the photosensitizer used in the present invention, benzoin, benzoin ethyl ether, penzone isoflobucel, benzoin phenyl ether, benzoin alkyl ethers, benzothioethers, benzophenone, acetophenone, 2- Ethyl anthraquinone, decyl chloride, etc. can be used. The amount of photosensitizer (111) used is 0.5 to 10% by weight based on the total polymerizable components.
, particularly preferably 1 to 5% by weight.
0.5重量%未満では硬化速度が遅くなり、10重量%
を越えると造膜しにくくなる傾向にある。If it is less than 0.5% by weight, the curing speed will be slow;
If it exceeds 100%, it tends to become difficult to form a film.
なお、本発明に係る光硬化性樹脂組成物にラジカル開始
剤を添加することができる。これにより、例えば該組成
物を複雑な形成の被塗物などに適用するなどし、そのた
めに、光の未透過ないし不充分な透過の部分があるとし
ても、そのような部分の硬化を促進することができる。
ただし、このときは加熱硬化される。ラジカル開始剤の
添加量は、全重合性成分に対して0.5〜5重量%、特
に1〜3重量%が好ましい。5重量%を越えると、貯蔵
中に、組成物がゲル化する危険性がある。Note that a radical initiator can be added to the photocurable resin composition according to the present invention. This allows, for example, when the composition is applied to a workpiece with a complex formation, etc., and therefore, even if there are areas where light does not pass through or is insufficiently transmitted, it is possible to accelerate the curing of such areas. be able to.
However, in this case, it is cured by heating. The amount of the radical initiator added is preferably 0.5 to 5% by weight, particularly 1 to 3% by weight based on the total polymerizable components. If it exceeds 5% by weight, there is a risk that the composition will gel during storage.
ラジカル開始剤としてはベンゾイルパーオキサイド、ア
セチルパーオキサイドなどのアシルパーオキサイド、タ
ーシヤリブチルパーオキサイド、キユメンヒドロパーオ
キサイドなどのヒドロパーオキサイド、メチルエチルケ
トンパーオキサイド、シクロヘキサノンパーオキサイド
などのケトンパーオキサイド、ジターシヤリブチルパー
オキサイド、ジクミルパーオキサイドなどのオキシパー
オキサイドなどが用いられる。また、ラジカル開始剤を
使用する場合、硬化促残剤としては鉄、コバルト、鉛、
マンガン、ニツケル、スズ、亜鉛など金属のナフテン酸
塩、オクテン酸塩等を併用することができる。使用量は
0.5〜5重量%、特に1〜3重量%が好ましい。本発
明は上記以外の他の材料を混合してもよい。Examples of radical initiators include acyl peroxides such as benzoyl peroxide and acetyl peroxide, hydroperoxides such as tertiary butyl peroxide and kyumene hydroperoxide, ketone peroxides such as methyl ethyl ketone peroxide and cyclohexanone peroxide, and tertiary peroxides. Oxyperoxides such as butyl peroxide and dicumyl peroxide are used. In addition, when using a radical initiator, iron, cobalt, lead,
Naphthenates, octenoates, etc. of metals such as manganese, nickel, tin, and zinc can be used in combination. The amount used is preferably 0.5 to 5% by weight, particularly 1 to 3% by weight. In the present invention, materials other than those mentioned above may be mixed.
このような材料としては水酸化アルミニウム、炭酸カル
シウム、二酸化ケイ素、アルミナ、ガラス繊維、有機繊
維などの充填剤、補強材などがある。次に本発明の実施
例を示す。実施例 1
分子量2,000のポリブタジエングリコール(1・2
−ビニル90%,1・4−トランス10%)1009を
11のオートクレーブ中に入れ、水素圧120kg/C
rill反応温度150℃の条件で還元反応を行ない、
沃素価9のポリブタジエングリコールの水添物を合成す
る。Such materials include fillers and reinforcing materials such as aluminum hydroxide, calcium carbonate, silicon dioxide, alumina, glass fibers, and organic fibers. Next, examples of the present invention will be shown. Example 1 Polybutadiene glycol with a molecular weight of 2,000 (1.2
- 90% vinyl, 10% 1,4-trans) 1009 was placed in a 11 autoclave, and the hydrogen pressure was 120 kg/C.
The reduction reaction was carried out at a rill reaction temperature of 150°C,
A hydrogenated polybutadiene glycol having an iodine value of 9 is synthesized.
デインシユタルクトラツプを付した11の三つロフラス
コにこの水添ポリブタジエングリコール909、分子量
2,000の未水添ポリブタジエングリコール(1・2
−ビニル90%,1・4−トランス10%)209、無
水マレイン酸459とを窒素気流下210℃で反応させ
、不飽和ポリエステルを得た。This hydrogenated polybutadiene glycol 909 and unhydrogenated polybutadiene glycol (1.2
-vinyl 90%, 1,4-trans 10%) 209 and maleic anhydride 459 were reacted at 210°C under a nitrogen stream to obtain an unsaturated polyester.
次に上記不飽和ポリエステル509をエチレン50f1
に溶解し、不飽和ポリエステル樹脂液を得た。次にこの
不飽和ポリエステル樹脂液100f!に対してベンゾイ
ンエチルエーテル39を加えて光硬化性樹脂組成物を得
た。Next, the above unsaturated polyester 509 was added to ethylene 50f1
An unsaturated polyester resin liquid was obtained. Next, this unsaturated polyester resin liquid 100f! A photocurable resin composition was obtained by adding benzoin ethyl ether 39 to the solution.
これをリン酸亜鉛処理鋼板(0.8×70X150m7
1t)にバーコータ≠28(硬化塗膜厚、35〜40μ
)で塗装し、2kWの水銀灯を用い、照射距離10儂で
光照射し、硬化塗膜特性を測定した。その結果を表1に
示す。実施例 2実施例1と同じ装置を用いて末端にカ
ルボキシル基を有する未水添ポリブタジエン(1・2−
トランス92.5%,1・4−トランス7.5%,分子
量19501沃素化395)30f1同じカルボキシル
基を有する未水添ポリブタジエンの水添物709、無水
マレイン酸9.5f1及びエチレングリコール10.5
9を窒素気流中、200℃で8時間反応させて不飽和ポ
リエステルを合成した。This is zinc phosphate treated steel plate (0.8 x 70 x 150 m7
1t) and bar coater ≠ 28 (cured coating thickness, 35-40μ
) and irradiated with light using a 2 kW mercury lamp at an irradiation distance of 10 degrees, and the properties of the cured coating film were measured. The results are shown in Table 1. Example 2 Using the same equipment as in Example 1, unhydrogenated polybutadiene (1,2-
Trans 92.5%, 1,4-trans 7.5%, molecular weight 19501 Iodination 395) 30f1 Hydrogenated product of unhydrogenated polybutadiene having the same carboxyl group 709, maleic anhydride 9.5f1 and ethylene glycol 10.5
9 was reacted at 200° C. for 8 hours in a nitrogen stream to synthesize an unsaturated polyester.
次に上記不飽和ポリエステル509をスチレン509に
溶解し、樹脂液を得た。以下実施例1と同じ処法により
、光照射後の硬化特性を測定した。結果を表1に示す。
比較例 1米国シエル化学製エポキシ樹脂エピコート8
28(エポキシ当量192)5709、メタクリル酸2
609、ベンジルジメチルアミン39、ハイドロキノン
0.069を仕込み、105℃で6時間反応させたこの
時の酸価は2であつた。Next, the unsaturated polyester 509 was dissolved in styrene 509 to obtain a resin liquid. The curing characteristics after light irradiation were measured using the same treatment method as in Example 1. The results are shown in Table 1.
Comparative example 1 Epoxy resin Epicoat 8 manufactured by Shell Chemical, USA
28 (epoxy equivalent weight 192) 5709, methacrylic acid 2
609, benzyldimethylamine, 39, and hydroquinone, 0.069, and reacted at 105° C. for 6 hours, the acid value was 2.
これに無水マレイン酸159を入れ同温度で3時間反応
させ、反応生成物の酸価は13であつた。この樹脂液6
09にスチレン409を加えて樹脂液を得た。以下実施
例1と同処法により光照射後の硬化特性を測定した。結
果を表1に示す。比較例 2
実施例1と同じ装置を用いて、無水マレイン酸29.4
9、ジプロピレングリコール134g及びアジピン酸1
029を加え、220℃で酸価20まで反応させた。Maleic anhydride 159 was added to this and reacted at the same temperature for 3 hours, and the acid value of the reaction product was 13. This resin liquid 6
Styrene 409 was added to 09 to obtain a resin liquid. The curing characteristics after light irradiation were measured using the same treatment method as in Example 1. The results are shown in Table 1. Comparative Example 2 Using the same equipment as in Example 1, maleic anhydride 29.4
9. 134 g of dipropylene glycol and 1 adipic acid
029 was added, and the reaction was carried out at 220°C until the acid value reached 20.
この反応生成物609にスチレン409を加えて樹脂液
を得た。この樹脂液1009に対して光増感剤としてベ
ンゾインエチルエーテル39を加え、以下実施例1と同
処法により光照射後の硬化塗膜特性を測定した。結果を
表1に示す。比較例 3
実施例1で得た不飽和ポリエステル樹脂液1009にベ
ンゾイルパーオキサイド19およびナフテン酸コバルト
0.39を配合し、実施例1と同じ鋼板に硬化塗膜が3
5〜40μになるように塗布して、120℃で3時間硬
化させた。Styrene 409 was added to this reaction product 609 to obtain a resin liquid. Benzoin ethyl ether 39 was added as a photosensitizer to this resin liquid 1009, and the properties of the cured coating film after light irradiation were measured using the same treatment method as in Example 1. The results are shown in Table 1. Comparative Example 3 19 benzoyl peroxide and 0.39 cobalt naphthenate were blended into the unsaturated polyester resin liquid 1009 obtained in Example 1, and a cured coating film of 3 was formed on the same steel plate as in Example 1.
It was applied to a thickness of 5 to 40 μm and cured at 120° C. for 3 hours.
硬化塗膜の特性を表1に示す。本発明に係る光硬化性被
覆組成物は、密着性、電気絶縁性、耐熱性等に優れると
共に防錆性にも優れる。Table 1 shows the properties of the cured coating. The photocurable coating composition according to the present invention has excellent adhesion, electrical insulation, heat resistance, etc., and also has excellent rust prevention properties.
Claims (1)
末端官能基を有するジエンポリマーの水添物100〜5
0重量%、(B)エステル結合をつくり得る少なくとも
1個の末端官能基を有する未水添ジエンポリマー0〜5
0重量%および (C)不飽和多塩基酸 より合成される不飽和ポリエステル( I )、ビニル単
量体(II)並びに光増感剤(III)を含有してなる光硬
化性被覆組成物。[Claims] 1 (A) Hydrogenated diene polymer having at least one terminal functional group capable of forming an ester bond 100-5
0% by weight, (B) unhydrogenated diene polymer 0-5 having at least one terminal functional group capable of forming an ester bond;
0% by weight and (C) an unsaturated polyester synthesized from an unsaturated polybasic acid (I), a vinyl monomer (II), and a photosensitizer (III).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17147679A JPS5943067B2 (en) | 1979-12-29 | 1979-12-29 | Photocurable coating composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17147679A JPS5943067B2 (en) | 1979-12-29 | 1979-12-29 | Photocurable coating composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5695922A JPS5695922A (en) | 1981-08-03 |
| JPS5943067B2 true JPS5943067B2 (en) | 1984-10-19 |
Family
ID=15923804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17147679A Expired JPS5943067B2 (en) | 1979-12-29 | 1979-12-29 | Photocurable coating composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5943067B2 (en) |
-
1979
- 1979-12-29 JP JP17147679A patent/JPS5943067B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5695922A (en) | 1981-08-03 |
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