JPS5950259B2 - Resin composition for plating - Google Patents
Resin composition for platingInfo
- Publication number
- JPS5950259B2 JPS5950259B2 JP16090280A JP16090280A JPS5950259B2 JP S5950259 B2 JPS5950259 B2 JP S5950259B2 JP 16090280 A JP16090280 A JP 16090280A JP 16090280 A JP16090280 A JP 16090280A JP S5950259 B2 JPS5950259 B2 JP S5950259B2
- Authority
- JP
- Japan
- Prior art keywords
- sulfide
- plating
- weight
- parts
- sulfur
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 title claims description 22
- 239000011342 resin composition Substances 0.000 title claims description 7
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 13
- 229910052717 sulfur Inorganic materials 0.000 claims description 13
- 239000011593 sulfur Substances 0.000 claims description 13
- 229920005992 thermoplastic resin Polymers 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 6
- 229910052976 metal sulfide Inorganic materials 0.000 claims description 6
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 6
- 239000006229 carbon black Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- MBMLMWLHJBBADN-UHFFFAOYSA-N Ferrous sulfide Chemical compound [Fe]=S MBMLMWLHJBBADN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WWNBZGLDODTKEM-UHFFFAOYSA-N sulfanylidenenickel Chemical compound [Ni]=S WWNBZGLDODTKEM-UHFFFAOYSA-N 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 2
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- SPBDXSGPUHCETR-JFUDTMANSA-N 8883yp2r6d Chemical compound O1[C@@H](C)[C@H](O)[C@@H](OC)C[C@@H]1O[C@@H]1[C@@H](OC)C[C@H](O[C@@H]2C(=C/C[C@@H]3C[C@@H](C[C@@]4(O[C@@H]([C@@H](C)CC4)C(C)C)O3)OC(=O)[C@@H]3C=C(C)[C@@H](O)[C@H]4OC\C([C@@]34O)=C/C=C/[C@@H]2C)/C)O[C@H]1C.C1C[C@H](C)[C@@H]([C@@H](C)CC)O[C@@]21O[C@H](C\C=C(C)\[C@@H](O[C@@H]1O[C@@H](C)[C@H](O[C@@H]3O[C@@H](C)[C@H](O)[C@@H](OC)C3)[C@@H](OC)C1)[C@@H](C)\C=C\C=C/1[C@]3([C@H](C(=O)O4)C=C(C)[C@@H](O)[C@H]3OC\1)O)C[C@H]4C2 SPBDXSGPUHCETR-JFUDTMANSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- XEIPQVVAVOUIOP-UHFFFAOYSA-N [Au]=S Chemical compound [Au]=S XEIPQVVAVOUIOP-UHFFFAOYSA-N 0.000 description 1
- KSECJOPEZIAKMU-UHFFFAOYSA-N [S--].[S--].[S--].[S--].[S--].[V+5].[V+5] Chemical compound [S--].[S--].[S--].[S--].[S--].[V+5].[V+5] KSECJOPEZIAKMU-UHFFFAOYSA-N 0.000 description 1
- 229910052946 acanthite Inorganic materials 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- UYJXRRSPUVSSMN-UHFFFAOYSA-P ammonium sulfide Chemical compound [NH4+].[NH4+].[S-2] UYJXRRSPUVSSMN-UHFFFAOYSA-P 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 description 1
- CJDPJFRMHVXWPT-UHFFFAOYSA-N barium sulfide Chemical compound [S-2].[Ba+2] CJDPJFRMHVXWPT-UHFFFAOYSA-N 0.000 description 1
- FQDSYGKTHDFFCM-UHFFFAOYSA-N beryllium sulfide Chemical compound S=[Be] FQDSYGKTHDFFCM-UHFFFAOYSA-N 0.000 description 1
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- NNLOHLDVJGPUFR-UHFFFAOYSA-L calcium;3,4,5,6-tetrahydroxy-2-oxohexanoate Chemical compound [Ca+2].OCC(O)C(O)C(O)C(=O)C([O-])=O.OCC(O)C(O)C(O)C(=O)C([O-])=O NNLOHLDVJGPUFR-UHFFFAOYSA-L 0.000 description 1
- 239000006231 channel black Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- DBULDCSVZCUQIR-UHFFFAOYSA-N chromium(3+);trisulfide Chemical compound [S-2].[S-2].[S-2].[Cr+3].[Cr+3] DBULDCSVZCUQIR-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 229910052981 lead sulfide Inorganic materials 0.000 description 1
- 229940056932 lead sulfide Drugs 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- QENHCSSJTJWZAL-UHFFFAOYSA-N magnesium sulfide Chemical compound [Mg+2].[S-2] QENHCSSJTJWZAL-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- XUARKZBEFFVFRG-UHFFFAOYSA-N silver sulfide Chemical compound [S-2].[Ag+].[Ag+] XUARKZBEFFVFRG-UHFFFAOYSA-N 0.000 description 1
- 229940056910 silver sulfide Drugs 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- ZEGFMFQPWDMMEP-UHFFFAOYSA-N strontium;sulfide Chemical compound [S-2].[Sr+2] ZEGFMFQPWDMMEP-UHFFFAOYSA-N 0.000 description 1
- ZVTQDOIPKNCMAR-UHFFFAOYSA-N sulfanylidene(sulfanylideneboranylsulfanyl)borane Chemical compound S=BSB=S ZVTQDOIPKNCMAR-UHFFFAOYSA-N 0.000 description 1
- YPMOSINXXHVZIL-UHFFFAOYSA-N sulfanylideneantimony Chemical compound [Sb]=S YPMOSINXXHVZIL-UHFFFAOYSA-N 0.000 description 1
- CADICXFYUNYKGD-UHFFFAOYSA-N sulfanylidenemanganese Chemical compound [Mn]=S CADICXFYUNYKGD-UHFFFAOYSA-N 0.000 description 1
- NRUVOKMCGYWODZ-UHFFFAOYSA-N sulfanylidenepalladium Chemical compound [Pd]=S NRUVOKMCGYWODZ-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- XPDICGYEJXYUDW-UHFFFAOYSA-N tetraarsenic tetrasulfide Chemical compound S1[As]2S[As]3[As]1S[As]2S3 XPDICGYEJXYUDW-UHFFFAOYSA-N 0.000 description 1
- AFNRRBXCCXDRPS-UHFFFAOYSA-N tin(ii) sulfide Chemical compound [Sn]=S AFNRRBXCCXDRPS-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
本発明は成形物に化学メッキを施すことなく直接電気メ
ッキを施すことのできるメッキ用樹脂組成物に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plating resin composition that allows electroplating to be applied directly to molded articles without chemical plating.
従来よりゴムを主体としたベースにカーボンブラック更
に硫黄等を添加して導電性を与えて直接電気メッキを施
す方法が行われていたが、どうしてもゴムが主本のため
剛性に乏しく又硫黄を使用しているためメッキ金属との
密着力を増大するためには空気中又はある環境条件下で
の数日間の熟成が必要であり、熟成中又は貯蔵中に硫黄
のブルーミングが生じる等々問題があつた。Traditionally, carbon black and sulfur, etc. were added to a rubber-based base to give it conductivity, and direct electroplating was performed, but since it is mainly made of rubber, it lacks rigidity, and sulfur is used. Therefore, in order to increase the adhesion to the plated metal, it is necessary to age it in the air or under certain environmental conditions for several days, which causes problems such as sulfur blooming during aging or storage. .
更にゴムが主体のため成形物にヒゲ又はピンホールが生
じやすくこの成形物にメッキを施してもその欠点がその
まゝ表われるという問題もあつた。本発明はこれらの問
題点を解決すると共に更にメッキの密着力を増大せしめ
たものである。Furthermore, since the molded product is mainly made of rubber, scratches or pinholes are likely to occur in the molded product, and even if the molded product is plated, these defects will continue to appear. The present invention solves these problems and further increases the adhesion of plating.
即ち本発明は熱可塑性樹脂100重量部に対して、熱可
塑性ポリウレタン1〜30重量部、カーボンブラック1
5〜70重量部、硫黄0.05〜7重量部及び金属粉末
又は金属硫化物1〜20重量部配合することを特徴とす
る直接電気メッキ可能な樹脂組成物を提供することにあ
る。本発明における熱可塑性樹脂とはポリエチレン、ポ
リプロピレン、エチレンプロピレン共重合体、エチレン
プロピレンジエン三元共重合体、エチレン酢酸ビニル共
重合体、ポリ塩化ビニル、ポリスチレン、ポリアセター
ル、6、6−6、6−10、6−12、11、12等の
ポリアミド、ポリフェニレンサルファイド(PPS)、
ポリフェニレンオキサイド(PPO)、ポリブチレンテ
レフタレート(PBT)、ポリエチレンテレフタレート
(PET)、ABS、AS)ポリメチルペンテン、スチ
レンブタジエンスチレン共重合体(SBS)、ポリカー
ボネート等が含まれる。That is, the present invention uses 1 to 30 parts by weight of thermoplastic polyurethane and 1 part by weight of carbon black to 100 parts by weight of thermoplastic resin.
The object of the present invention is to provide a resin composition capable of direct electroplating, which contains 5 to 70 parts by weight of sulfur, 0.05 to 7 parts by weight of sulfur, and 1 to 20 parts by weight of metal powder or metal sulfide. Thermoplastic resins in the present invention include polyethylene, polypropylene, ethylene propylene copolymer, ethylene propylene diene terpolymer, ethylene vinyl acetate copolymer, polyvinyl chloride, polystyrene, polyacetal, 6, 6-6, 6- Polyamides such as 10, 6-12, 11, 12, polyphenylene sulfide (PPS),
These include polyphenylene oxide (PPO), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), ABS, AS) polymethylpentene, styrene-butadiene-styrene copolymer (SBS), polycarbonate, and the like.
カーボンブラックとしてはアセチレンブラック、フアー
ネスブラツク、チャンネルブラック、ケツチエンブラツ
ク等が使用される。As carbon black, acetylene black, furnace black, channel black, butcher black, etc. are used.
金属粉末としてはニッケル、鉄、亜鉛、クロム、銅、ア
ルミニウム等、金属硫化物としては硫化亜鉛、硫化アン
チモン、硫化アンモニウム、硫化金、硫化銀、硫化クロ
ム、硫化鉛、硫化ストロンチウム、硫化錫、硫化チタン
、硫化鉄、硫化銅、硫化ニッケル、硫化バナジウム、硫
化パラジウム、硫J 化バリウム、硫化カドニウム、硫
化ビスマス、硫化砒素、硫化硼素、硫化ベリリウム、硫
化マグネシウム、硫化マンガン、等が使用される。Metal powders include nickel, iron, zinc, chromium, copper, aluminum, etc. Metal sulfides include zinc sulfide, antimony sulfide, ammonium sulfide, gold sulfide, silver sulfide, chromium sulfide, lead sulfide, strontium sulfide, tin sulfide, and sulfide. Titanium, iron sulfide, copper sulfide, nickel sulfide, vanadium sulfide, palladium sulfide, barium sulfide, cadmium sulfide, bismuth sulfide, arsenic sulfide, boron sulfide, beryllium sulfide, magnesium sulfide, manganese sulfide, etc. are used.
本発明において配合されるカーボンブラックは熱可塑性
樹脂に導電性を附与し量は多いほど導電ク 性は向上す
るが熱可塑性樹脂100重量部に対して70重量部を越
えると流動性が悪くなり成形が困難となるばかりでなく
耐衝撃性やメツキの外観も悪くなる。The carbon black blended in the present invention imparts electrical conductivity to the thermoplastic resin, and the larger the amount, the better the electrical conductivity, but if it exceeds 70 parts by weight per 100 parts by weight of the thermoplastic resin, fluidity deteriorates. Not only is molding difficult, but the impact resistance and appearance of plating are also deteriorated.
又15重量部未満の配合では導電性が向上されず電気メ
ツキができなくなる。熱可塑性ポリウレタンはアジペー
トタイプ、エーテルタイプ、ラクトンタイプ等があり、
耐衝撃性を向上させると共にメツキの密着力をも向上さ
せる。しかし熱可塑性ポリウレタンの配合量が熱可塑性
樹脂100重量部に対して30重量部を越えると曲げ強
度が低下すると共にメツキの外確が悪くなる。又1重量
部より少ないとメツキの密着強度が低くなる。次に硫黄
の添加はメツキの密着強度を向上させるためには不可欠
のものであるが成形材料の製造過程又は成形中に臭気が
あり、作業中好ましくなく、更にメツキ工程前に成形さ
れ成形品として保管しておくと成形品表面に硫黄がブル
ーミングしてきてその後メツキするとメツキ外観が著し
く悪くなるという欠点があつた。しかし本発明者らの研
究により金属粉末又は金属硫化物を混合併用することに
より作業中の臭気性はなくなり硫黄のブルーミングの発
生日数も長くなることを見出した。即ち熱可塑性樹脂1
00重量部に対して硫黄0.05〜 7重量部及び金属
又は金属硫化物1〜20重量部を併用混合することによ
り目的のメツキの密着強度が得られると共に作業中臭気
もなくブルーミングの発生日数も長くなることが判明し
た。本発明の目的は無電解メツキ(化学メツキ)工程を
完全に省略し、直接電気メツキ可能な熱可塑性樹脂組成
物であり、該組成物にて成形された成 .形品にストラ
イクニツケルメツキを施した場合メツキつき回り時間が
5分/D77l″以内で2.0k9/c:m以上のメツ
キ密着強度を有し、メツキの外観においてピンホール等
がなく良好であることである。If the amount is less than 15 parts by weight, the conductivity will not be improved and electroplating will not be possible. Thermoplastic polyurethane comes in adipate type, ether type, lactone type, etc.
It not only improves impact resistance but also improves the adhesion of plating. However, if the blending amount of thermoplastic polyurethane exceeds 30 parts by weight per 100 parts by weight of the thermoplastic resin, the bending strength will decrease and the plating accuracy will deteriorate. If the amount is less than 1 part by weight, the adhesion strength of the plating will be low. Next, the addition of sulfur is essential for improving the adhesion strength of plating, but it produces an odor during the manufacturing process of the molding material or during molding, making it undesirable during work. When stored, sulfur blooms on the surface of the molded product, and when it is subsequently plated, the appearance of the plated product deteriorates significantly. However, the inventors of the present invention have found through research that the combined use of metal powder or metal sulfide eliminates the odor during work and lengthens the number of days in which sulfur blooming occurs. That is, thermoplastic resin 1
By mixing 0.05 to 7 parts by weight of sulfur and 1 to 20 parts by weight of metal or metal sulfide to 0.00 parts by weight, the desired plating adhesion strength can be obtained, and there is no odor during work, and the number of days when blooming occurs can be reduced. It turned out to be longer. The object of the present invention is to completely omit the electroless plating (chemical plating) step and to provide a thermoplastic resin composition that can be directly electroplated, and to provide a thermoplastic resin composition that can be directly electroplated. When strike nickel plating is applied to a shaped product, the plating adhesion strength is 2.0k9/c:m or more within 5 minutes/D77l'', and the appearance of the plating is good with no pinholes etc. That's true.
その他の目的としては本発明の組成物は射出成形、△押
出成形等が可能な流動性を有し、作業中臭気がなく、成
形品等の貯蔵において硫黄がブルーミングしにくく、発
生日数が1ケ月以上はあること、更に機械強度において
実用に耐えることである。本発明は前記目的を全て満足
するメツキ用樹脂 4組成物を提供することになる。本
発明は必要により該組成物の他に安定剤、滑剤、老化防
止剤、ZnO,MgO,Mg(0H)2,A1(0H)
3,CaC03タルク、ガラスセンイ等の他の充填材、
Sb2O3,ZnBO3、塩化パラフイン、ヘキサブロ
ムベンゼン、デカプロモジフエニルオキシド等の難燃剤
等の他の添加物を配合してもよい。以下実施例にて詳細
に説明する。Other purposes include that the composition of the present invention has fluidity that allows injection molding, △ extrusion molding, etc., has no odor during operation, is resistant to sulfur blooming during storage of molded products, etc., and has a generation time of 1 month. In addition to the above, it also has mechanical strength that can withstand practical use. The present invention provides a plating resin composition 4 that satisfies all of the above objectives. The present invention may optionally contain stabilizers, lubricants, anti-aging agents, ZnO, MgO, Mg(0H)2, A1(0H) in addition to the composition.
3. Other fillers such as CaC03 talc and glass fiber,
Other additives such as flame retardants such as Sb2O3, ZnBO3, chlorinated paraffin, hexabromobenzene, and decabromodiphenyl oxide may also be blended. This will be explained in detail in Examples below.
実施例 1
熱可塑性樹脂としてポリプロピレン(住友化学工業(株
)製、住友ノーブレン、W53l)、熱可塑性ポリウレ
タンとしてエーテルタイプの武田薬品工業(株)製タケ
ラツクT−1350カーポンプラツクとして米国カボツ
ト社製、VulcanXC−7 2、金属硫化物として
硫化ニツケル(NiS)、更に硫黄を第1表に示すよウ
な配合とした。Example 1 The thermoplastic resin was polypropylene (manufactured by Sumitomo Chemical Co., Ltd., Sumitomo Noblen, W53l), and the thermoplastic polyurethane was ether type Takerak T-1350 manufactured by Takeda Pharmaceutical Company Limited, manufactured by Kabot Corporation in the United States as Carpon Plug. VulcanXC-7 2, nickel sulfide (NiS) as a metal sulfide, and sulfur were mixed as shown in Table 1.
これらの組成物はブレンダ一にて5分開攪拌混合し、2
軸連続押出機(65m/m)で混練押出しコンパウンド
ペレツトを得た。These compositions were mixed with stirring in a blender for 5 minutes, and
Kneading and extrusion compound pellets were obtained using a continuous shaft extruder (65 m/m).
このペレツトを110℃、3時間乾燥し、50z射出成
形機で各組成物に対して最適成形条件で3mm厚、10
0m露φ、表面積約1.6dw1’の円板を成形し、各
種試験及び以下のメツキ条件で直接電気メツキを施し特
性を評価した。メツキ条件(ストライクニツケル;ワツ
ト浴)以後硫酸銅浴又は各種メツキ浴槽へ入れる。The pellets were dried at 110°C for 3 hours and molded into 3 mm thick, 10
A disk with a diameter of 0 m and a surface area of about 1.6 dw1' was molded, and its characteristics were evaluated by performing various tests and directly electroplating under the following plating conditions. After plating conditions (strike nickel; Watt bath), place in copper sulfate bath or various plating baths.
特性としては流動性としてメルトインデツクス(MI)
、作業性として臭気性、貯蔵性としてブルーミングの発
生日数、耐衝撃性としてアイゾツト衝撃強さ、曲げ強度
、メツキの密着強度としてピーリングテスト、メツキの
外観としてピツト数、ストライクニツケルメツキのつき
回り時間を各々測定し、第1表の如く結果が得られた。
総合評価として○印は本発明を満足するもの、×印は本
発明を満足しないものであり、本発明品は皆目的を達成
した。実施例 2
熱可塑性樹脂として宇部興業(株)製ナイロン6−10
13B1ポリプラスチツクス社製ポリアセタールージユ
ラコンM9O、住友化学工業(株)製ポリプロピレン一
住友ノーブレンW−531、カーボンブラツクとして米
国カボツト社製VulcanXCー72、金属系として
は硫化亜鉛、硫化鉄、銅粉末、アルミニウム粉末、及び
硫黄を用して第2表の如く配合し実施例1と同様に検討
を行い第2表の結果が得られた。The characteristic is melt index (MI) as fluidity.
, Odor as workability, number of days of blooming as storage property, Izotsu impact strength and bending strength as impact resistance, peeling test as adhesion strength of plating, number of pits as appearance of plating, and throw time of strike nickel plating. Each was measured and the results shown in Table 1 were obtained.
As a comprehensive evaluation, ○ marks are those that satisfy the present invention, × marks are those that do not satisfy the present invention, and all the products of the present invention achieved their objectives. Example 2 Nylon 6-10 manufactured by Ube Kogyo Co., Ltd. as a thermoplastic resin
13B1 Polyacetal Yuracon M9O manufactured by Polyplastics, Polypropylene Sumitomo Noblen W-531 manufactured by Sumitomo Chemical Co., Ltd., Vulcan XC-72 manufactured by Kabot Corporation of America as carbon black, zinc sulfide, iron sulfide, copper powder as metals. , aluminum powder, and sulfur were mixed as shown in Table 2 and examined in the same manner as in Example 1, and the results shown in Table 2 were obtained.
本発明品は全て目的を満足している。All of the products of the present invention satisfy the objectives.
なお熱可塑性ポリウレタンとして大日本インキ化学工業
(株)性、エーテル系のパンデツクスT−6085〔ウ
レタン(1)〕及びアジペート系のT−5180〔ウレ
タン(2))を使用した。As the thermoplastic polyurethane, ether-based Pandex T-6085 [urethane (1)] and adipate-based T-5180 [urethane (2)] manufactured by Dainippon Ink and Chemicals Co., Ltd. were used.
Claims (1)
レタン1〜30重量部、カーボンブラック15〜70重
量部、硫黄0.05〜7重量部及び金属粉末又は金属硫
化物1〜20重量部配合してなることを特徴とするメッ
キ用樹脂組成物。1 1 to 30 parts by weight of thermoplastic polyurethane, 15 to 70 parts by weight of carbon black, 0.05 to 7 parts by weight of sulfur, and 1 to 20 parts by weight of metal powder or metal sulfide are blended with 100 parts by weight of thermoplastic resin. A plating resin composition characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16090280A JPS5950259B2 (en) | 1980-11-17 | 1980-11-17 | Resin composition for plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16090280A JPS5950259B2 (en) | 1980-11-17 | 1980-11-17 | Resin composition for plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5785994A JPS5785994A (en) | 1982-05-28 |
| JPS5950259B2 true JPS5950259B2 (en) | 1984-12-07 |
Family
ID=15724810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16090280A Expired JPS5950259B2 (en) | 1980-11-17 | 1980-11-17 | Resin composition for plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5950259B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5945336A (en) * | 1982-09-07 | 1984-03-14 | Toshiba Chem Corp | Synthetic resin molding material for shielding electromagnetic wave |
| US4466912A (en) * | 1982-09-30 | 1984-08-21 | Mobay Chemical Corporation | Conductive thermoplastic compositions |
| JPH07107129B2 (en) * | 1987-10-30 | 1995-11-15 | 東レ株式会社 | Polyphenylene sulfide resin composition |
| US5336303A (en) * | 1991-05-15 | 1994-08-09 | C-Innovations, Inc. | Electrochemically active paint for cathodic protection of engineering structures |
| DE19528191A1 (en) | 1995-08-01 | 1997-02-06 | Basf Ag | Impact-resistant thermoplastic molding compounds |
| US5854330A (en) * | 1996-03-07 | 1998-12-29 | Minnesota Mining And Manufacturing Company | Capstan comprising polyacetal-based polymer composition for magnetic tape cartridge |
| CN1160409C (en) * | 1999-07-29 | 2004-08-04 | 上海杰事杰新材料股份有限公司 | High-flowability, impact-resistant and electrically conductive temary acrylonitrile-butadiene-styrene copolymer and its preparing process |
-
1980
- 1980-11-17 JP JP16090280A patent/JPS5950259B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5785994A (en) | 1982-05-28 |
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