JPS5951736B2 - Manufacturing method of solid electrolytic capacitor - Google Patents
Manufacturing method of solid electrolytic capacitorInfo
- Publication number
- JPS5951736B2 JPS5951736B2 JP2168279A JP2168279A JPS5951736B2 JP S5951736 B2 JPS5951736 B2 JP S5951736B2 JP 2168279 A JP2168279 A JP 2168279A JP 2168279 A JP2168279 A JP 2168279A JP S5951736 B2 JPS5951736 B2 JP S5951736B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor element
- resin material
- anode lead
- solid electrolytic
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 title claims description 41
- 239000007787 solid Substances 0.000 title claims description 7
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 239000006185 dispersion Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 15
- 239000002904 solvent Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 freon Chemical compound 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000012254 powdered material Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
本発明は主としてチップ形の固体電解コンデンサの製造
方法の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention primarily relates to improvements in the manufacturing method of chip-type solid electrolytic capacitors.
一般に、この種の固体電解コンデンサは例えば第１図に
示すように、タンタル、ニオブ、アルミニウムなどのよ
うに弁作用を有する金属粉末を、それに弁作用を有する
金属線を陽極リードＡとして植立した状態で直方体に加
圧成形し焼結してコンデンサエレメントＢを形成し、こ
のコンデンサニレメン）Ｂの周面に酸化層、半導体層、
電極引出し層Ｃを介して半田層りを形成すると共に、陽
極リードＡの突出端に外部リード部材Ｅを溶接し、然る
後、陽極リードＡと外部リード部材Ｅとの溶接部を含む
コンテ゛ンサエレメント面を樹脂材Ｆにて被覆して構成
されている。Generally, this type of solid electrolytic capacitor is made of a metal powder having a valve action, such as tantalum, niobium, or aluminum, and a metal wire having a valve action planted thereon as an anode lead A, as shown in Fig. 1. In this state, a capacitor element B is formed by pressure forming into a rectangular parallelepiped and sintering, and an oxide layer, a semiconductor layer,
A solder layer is formed through the electrode lead layer C, and an external lead member E is welded to the protruding end of the anode lead A. After that, a capacitor element including a welded portion between the anode lead A and the external lead member E is formed. The surface is covered with a resin material F.
ところで、陽極リードＡの導出側におけるコンデンサエ
レメント面の外装は液状の樹脂材を筆。By the way, the exterior of the capacitor element surface on the output side of the anode lead A is coated with liquid resin.
スポイトなどを利用して塗布している関係で、作業能率
が極めて悪い上、コンデンサエレメント面への塗布量が
不均一となるために、コンテ゛ンサエレメント面或いは
陽極リードＡと外部リード部材Ｅとの溶接部を充分に被
覆できないことがある。Since the coating is applied using a dropper, etc., the work efficiency is extremely low and the amount of coating on the capacitor element surface is uneven. It may not be possible to cover the area sufficiently.
特に前者の場合には陽極リードＡの導出側におけるコン
デンサエレメント面は側周面などのように電極引出し層
Ｃ５半田層りにて被覆されておらず、酸化層、半導体層
が露呈していることがあることもあって、耐湿性が著し
く損なわれるし、又、後者の場合には外部リード部材Ｅ
に外力が作用すると、それと陽極リードＡとの溶接部が
はずれ易くなり、取扱いに細心の注意を要するために、
作業性が著しく損なわれるという欠点がある。In particular, in the former case, the capacitor element surface on the output side of the anode lead A is not covered with the electrode lead layer C5 solder layer like the side peripheral surface, and the oxide layer and semiconductor layer are exposed. In the latter case, the external lead member E
If an external force is applied to the anode lead A, the weld between it and the anode lead A will easily come off, requiring extreme care when handling.
The disadvantage is that workability is significantly impaired.
本発明はこのような点に鑑み、陽極リードの導出側にお
けるコンデンサエレメント面を樹脂材にて、簡単な方法
によって確実に被覆しうる固体電解コンデンサの製造方
法を提供するもので、以下その製造方法について第２図
〜第７図を参照して説明する。In view of these points, the present invention provides a method for manufacturing a solid electrolytic capacitor that can reliably cover the surface of the capacitor element on the output side of the anode lead with a resin material by a simple method. This will be explained with reference to FIGS. 2 to 7.
まず、第２図に示すように、弁作用を有する金属粉末を
柱状例えば直方体に加圧成形し焼結してコンデンサエレ
メント１を形成すると共に、予め弁作用を有する金属線
を陽極リード２として植立する。First, as shown in FIG. 2, a metal powder having a valve action is pressure-formed into a columnar shape, for example, a rectangular parallelepiped, and sintered to form a capacitor element 1, and a metal wire having a valve action is implanted in advance as an anode lead 2. stand up
そして、このコンデンサエレメント１の周面に酸化層、
半導体層、電極引出し層３．手半田４を順次形成する。Then, an oxide layer is formed on the circumferential surface of this capacitor element 1.
Semiconductor layer, electrode lead layer 3. Manual solder 4 is sequentially formed.
次に第３図に示すように、コンデンサエレメント１より
導出された陽極リード２の突出部２ａを、帯状のホルダ
ー５より一定のピッチ間隔にて延びる外部リード部材６
の屈曲端部６ａに溶接する。Next, as shown in FIG. 3, the protrusion 2a of the anode lead 2 led out from the capacitor element 1 is attached to an external lead member 6 extending from a band-shaped holder 5 at a constant pitch.
Weld to the bent end 6a of.
そして、粉末状の樹脂材７を、それを溶解させない溶剤
に分散させてなる分散液７′に、ホルダー５に支持され
たコンデンサエレメント１を、外部リード部材６の屈曲
端部６ａが浸漬されるように浸漬し引上げる。Then, the capacitor element 1 supported by the holder 5 and the bent end portion 6a of the external lead member 6 are immersed in a dispersion liquid 7' made by dispersing the powdered resin material 7 in a solvent that does not dissolve it. Dip it in the same way and pull it out.
この状態において、コンデンサエレメント１の全周面に
は樹脂材７が付着している。In this state, the resin material 7 is attached to the entire circumferential surface of the capacitor element 1.
次に第４図に示すように、ホルダー５に支持されたコン
デンサエレメント１を、樹脂材７を溶解させずに分散さ
せる溶剤８に、陽極リード２の導出側におけるコンデン
サエレメント面が浸漬されないように浸漬する。Next, as shown in FIG. 4, the capacitor element 1 supported by the holder 5 is placed in a solvent 8 that disperses the resin material 7 without dissolving it, so that the surface of the capacitor element on the outlet side of the anode lead 2 is not immersed. Soak.
すると、コンデンサエレメント１の側周面に付着してい
る樹脂材７は溶剤８に分散して除去される。Then, the resin material 7 adhering to the side peripheral surface of the capacitor element 1 is dispersed in the solvent 8 and removed.
そして、コンデンサエレメント１を溶剤８より引上げる
と、第５図に示す状態となる。When the capacitor element 1 is pulled up from the solvent 8, it will be in the state shown in FIG.
次に同図に示すように、陽極リード２の導出側における
コンデンサエレメント面に付着している樹脂材７を加熱
処理によって硬化させる。Next, as shown in the figure, the resin material 7 adhering to the surface of the capacitor element on the outlet side of the anode lead 2 is hardened by heat treatment.
然る後、外部リード部材６をＸ−Ｘ部分より切断して第
６図〜第７図に示す固体電解コンデンサを得る。Thereafter, the external lead member 6 is cut from the section XX to obtain the solid electrolytic capacitor shown in FIGS. 6 and 7.
このようにコンデンサエレメント１における陽極リード
２の導出側の頂面には粉末状の樹脂材７が被着されてい
るのであるが、樹脂材７の分散液７′を浸漬法によって
被着している関係で、それの被着量を均一化できる上、
所望量被着させることができる。In this way, the powdered resin material 7 is applied to the top surface of the output side of the anode lead 2 in the capacitor element 1, and the dispersion 7' of the resin material 7 is applied by dipping. Because of this, the amount of coating can be made uniform, and
A desired amount can be deposited.
これがために、樹脂材７によってコンデンサエレメント
１の頂面を確実に被覆でき、耐湿性を改善できる。Therefore, the top surface of the capacitor element 1 can be reliably covered with the resin material 7, and moisture resistance can be improved.
特に、陽極リード２と外部リード部材６との溶接部をも
樹脂材７にて被覆するよに構成すれば、耐湿性は勿論の
こと、外部リード部材６に作用する外力による溶接はず
れを皆無にできる上、陽極リード２とコンデンサエレメ
ント１における金属粉末との接続境界部分における酸化
層の損傷を低減でき漏洩電流特性を改善できる。In particular, if the welded part between the anode lead 2 and the external lead member 6 is also covered with the resin material 7, not only will it be moisture resistant, but there will be no weld dislocation due to external force acting on the external lead member 6. In addition, damage to the oxide layer at the connection boundary between the anode lead 2 and the metal powder in the capacitor element 1 can be reduced, and leakage current characteristics can be improved.
又、コンデンサエレメント１：の所望部分に被着する樹
脂材７は粉末状のものを溶剤に溶解させずに分散させ才
用いられる関係で、不所望部分に付着している樹脂材７
を、分散液７′の溶剤と同一ないし類似の性質を有する
溶剤に浸漬するだけで簡単に除去でき、作業性を著しく
改善できる。Furthermore, since the resin material 7 that adheres to the desired portions of the capacitor element 1 is used by dispersing the powdered material without dissolving it in a solvent, the resin material 7 that adheres to the undesired portions of the capacitor element 1:
can be easily removed by simply immersing it in a solvent having the same or similar properties as the solvent of the dispersion liquid 7', and workability can be significantly improved.
しかし乍ら、樹脂材が溶剤に溶解すると、不所望部分に
付着している樹脂材の除去が困難となる。However, if the resin material is dissolved in the solvent, it becomes difficult to remove the resin material adhering to undesired areas.
次に具体的実施例について説明する。Next, specific examples will be described.
まず、株すンニレジン製の粉末状のエポキシ樹脂（商品
名ＮＢＰ−２０７）５０ｇを等量のイソプロピルアルコ
ールに分散させてなる分散液にコンデンサエレメントを
浸漬し引上げる。First, a capacitor element is immersed in a dispersion prepared by dispersing 50 g of a powdered epoxy resin (trade name: NBP-207) manufactured by Sunni Resin Co., Ltd. in an equal amount of isopropyl alcohol, and then pulled up.
そして、このコンデンサエレメントをイソプロピルアル
コールに浸漬し不所望部分のエポキシ樹脂を除去する。Then, this capacitor element is immersed in isopropyl alcohol to remove unwanted portions of the epoxy resin.
然る後、１３０℃で１時間加熱しエポキシ樹脂を硬化さ
せる。Thereafter, the epoxy resin was cured by heating at 130° C. for 1 hour.
この実施例によれば、コンデンサエレメントの所望部分
を簡単かつ確実に被覆できるので作業性、特性を改善で
きる上、特に洗浄工程において、樹脂がイソプロピルア
ルコールより比重が大きいために、コンデンサエレメン
トをイソプロピルアルコールに浸漬しているだけで不所
望部分の樹脂が分散し沈降する関係で、洗浄効果を向上
できる。According to this embodiment, the desired portion of the capacitor element can be coated easily and reliably, improving workability and characteristics. In addition, especially in the cleaning process, since the resin has a higher specific gravity than isopropyl alcohol, the capacitor element is coated with isopropyl alcohol. The cleaning effect can be improved because the resin in undesired areas is dispersed and precipitated simply by immersing it in the water.
尚、本発明は何ら上記実施例にのみ制約されることなく
、例えば粉末状の樹脂材を溶解することなく分散させる
溶剤としてはイソプロピルアルコールの他、フレオン、
四塩化炭素、水とメタノールを等量混合させたものなど
を用いることもできるし、樹脂材もエポキシ樹脂の他、
シリコーン樹脂などを用いることもで゛きる。It should be noted that the present invention is not limited to the above-mentioned embodiments; for example, as a solvent for dispersing a powdered resin material without dissolving it, in addition to isopropyl alcohol, freon,
Carbon tetrachloride, a mixture of equal amounts of water and methanol, etc. can also be used, and resin materials include epoxy resin, etc.
It is also possible to use silicone resin or the like.
以上のように本発明によれば、陽極リードの導出側にお
けるコンデンサエレメント面を粉末状の樹脂材にて簡単
かつ確実に被覆することができ、作業性、特性を改善で
きる。As described above, according to the present invention, the surface of the capacitor element on the output side of the anode lead can be easily and reliably coated with a powdered resin material, and workability and characteristics can be improved.
第１図は従来例の側断面図、第２図〜第７図は本発明方
法を説明するための図であって、第２図はカンデンサエ
レメントに電極引出し層、半田層を形成した状態を示す
側断面図、第３図はコンデンサエレメントを分散液に浸
漬している状態を示す側断面図、第４図はコンデンサエ
レメントの不所望部分に付着している樹脂材を除去して
いる状態を示す側断面図、第５図は不所望樹脂材の除去
状態を示す側断面図、第６図は完成状態の固体電解コン
デンサの側断面図、第７図は第６図のＹ−Ｙ断面図であ
るるFIG. 1 is a side sectional view of a conventional example, FIGS. 2 to 7 are diagrams for explaining the method of the present invention, and FIG. 2 shows a state in which an electrode lead layer and a solder layer are formed on a capacitor element. Fig. 3 is a side sectional view showing the capacitor element being immersed in the dispersion liquid, Fig. 4 is the state in which the resin material adhering to undesired parts of the capacitor element is being removed. FIG. 5 is a side sectional view showing a state in which the undesired resin material has been removed. FIG. 6 is a side sectional view of the solid electrolytic capacitor in a completed state. FIG. 7 is a Y-Y cross section of FIG. 6. It is a diagram
Claims (1)
ると共に、予めそれより弁作用を有する金属線を陽極リ
ードとして導出してなるコンデンサエレメントの周面に
半田層を形成する工程と、コンデンサエレメントを粉末
状の樹脂材を分散させてなる分散液に、陽極リードの導
出側を上方にして完全に浸漬して引上げる工程と、陽極
リードの導出側におけるコンデンサエレメント面を除く
部分に付着している樹脂材を除去する工程と、コンデン
サエレメントに付着している樹脂材を加熱硬化させる工
程とを具備したことを特徴とする固体電解コンデンサの
製造方法。1. A step of press-forming and sintering a metal powder having a valve action into a columnar shape, and forming a solder layer on the circumferential surface of a capacitor element from which a metal wire having a valve action is previously led out as an anode lead; The process of completely immersing the capacitor element in a dispersion liquid made by dispersing powdered resin material with the output side of the anode lead facing upwards and pulling it up, and the process of removing the capacitor element from the surface of the anode lead on the output side of the anode lead. 1. A method for manufacturing a solid electrolytic capacitor, comprising the steps of: removing a resin material adhering to a capacitor element; and heating and curing a resin material adhering to a capacitor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2168279A JPS5951736B2 (en) | 1979-02-26 | 1979-02-26 | Manufacturing method of solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2168279A JPS5951736B2 (en) | 1979-02-26 | 1979-02-26 | Manufacturing method of solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55115324A JPS55115324A (en) | 1980-09-05 |
| JPS5951736B2 true JPS5951736B2 (en) | 1984-12-15 |
Family
ID=12061822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2168279A Expired JPS5951736B2 (en) | 1979-02-26 | 1979-02-26 | Manufacturing method of solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5951736B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4488204A (en) * | 1983-11-01 | 1984-12-11 | Union Carbide Corporation | Device for use in making encapsulated chip capacitor assemblies |
-
1979
- 1979-02-26 JP JP2168279A patent/JPS5951736B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55115324A (en) | 1980-09-05 |
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