JPS6028632B2 - polishing jig - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a polishing jig used for polishing fluoroscopic specimens and reflective specimens for physical property research, and polishing mating surfaces of semiconductors.

In general, when polishing mating surfaces of semiconductors or polishing samples for physical property research, the polished surfaces must be smooth, have no shoulder sag, have good parallelism, and must not generate excessive external force or heat during polishing.
In particular, when creating a fluoroscopic specimen, it is essential to be able to polish the specimen to 50 peaks or less, but in conventional polishing, the specimen cannot be placed on the polishing disk without the use of any kind of pick-up tool. Because the polishing was done by hand to the desired thickness by pressing without any friction, it was difficult to obtain a smooth polished surface with no shoulder sagging and good parallelism, and it also caused mental and physical fatigue for the workers. In addition, it is unacceptable that the fine polishing shoulders may scatter into the eyes, nostrils, etc., causing unexpected accidents. In particular, advanced polishing techniques are required to create polished flakes of 50 mm or less. Therefore, there has long been a desire among workers to realize a polishing odor control system that can satisfy the above-mentioned essential conditions while maintaining the safety of polishing operations. In view of the above-mentioned circumstances, the present invention was devised based on a completely new idea, and the present invention applies a certain processing pressure to the polished sample at the center of the polishing jig base whose lower end surface is formed horizontally. A weight cylindrical body is inserted therethrough so as to be slidable and rotatable in the vertical direction, and an annular dam is formed in the lower part of the weight cylindrical body parallel to the lower end surface of the polishing picker base. In this polishing jig, a polishing sample is attached to a polishing sample attachment surface, and the polishing jig is polished by placing it on a polishing plate that rotates horizontally or vibrates at high speed. A support village that removably supports the auxiliary weight cylinder is erected in the section.
By attaching and detaching the auxiliary weight cylindrical body, polishing is performed while maintaining the optimum processing pressure and polishing parallelism according to the physical properties of the polishing sample, regardless of the hardness of the polishing sample. It does not require any polishing techniques, and while maintaining the safety of the polishing work, the polished surface exhibits smoothness and parallelism without shoulder sagging, and the polishing process is easy without adversely affecting the composition. The object of the present invention is to provide a polishing jig that can perform polishing easily and accurately. The structure of the present invention will be described with reference to an embodiment shown in the drawings. A weight cylindrical body 2 that applies a constant processing pressure to the polishing sample a is mounted on the axis of the base 1 so as to be able to slide vertically and freely rotate through a penetration hole lb, and the lower end surface of the weight cylindrical body 2 A polishing sample adhering plate 5 having a polishing sample adhering surface 4 formed by protruding an annular dam 3 on the periphery of the lower surface is integrally formed therein, and the polishing sample adhering surface 4 and the polishing tool base 1 are integrally formed. The lower end surface la of the polishing jig base 1 is formed parallel to the lower end surface la of the polishing jig base 1, and the abrasive material suitable for the polishing material adhering surface 4 and cooling water inflow passages lc, lc... . . . are engraved radially, and furthermore, on the upper surface axis of the weight cylinder 2, auxiliary weight cylinders 6, 6, 6,
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In addition, in the above example, the polishing sample a was attached to the polishing sample attachment surface 4 without the polishing sample attachment surface 4 being in a mirror-like state.
The surface tension may allow the polishing sample to be attached without using any adhesive, and the annular dam 3 may be formed by removing the polishing sample attachment surface 4 area by cutting, corrosion processing, etc. ``Furthermore, although any method of overlaying the 4 areas of the surface to which the polished sample is attached may be used, such as plating, etc., overlays such as plating are easier to reshape, and the dam 3 can be easily and accurately prepared. It is obvious that this can be done.

Next, the operation of the present invention constructed as described above will be explained. After pasting the polishing sample a, which has been cut into thin pieces with a cutter in advance, on the polishing sample attachment surface 4, the weight cylinder 2 is vertically slid onto the sea bream core part of the polishing base 1 through the through hole lb. The polishing tool base 1 is movably and rotatably equipped with the weight cylinder 2.
If a polishing solution made by mixing finely powdered abrasive material with water is sprinkled in a thin film and placed on a polishing plate b that rotates horizontally or vibrates at high speed, the surface 4 of the polished sample The adhered polishing sample a is subjected to a constant processing pressure uniformly over the entire surface to be polished from a weight cylinder 2, which is mounted on the axis of the polishing odor-picking substrate 1 so that it can vibrate vertically and freely rotate. , the polishing parallelism is reliably maintained between the polishing sample attachment surface 4 and the polishing plate b surface, and furthermore, the annular dam 3 protruding around the polishing sample attachment surface 4 acts to prevent detachment. , polishing jig base 1
Inflow passages lc, lc suitable for the polishing sample attachment surface 4 carved radially on the lower end surface la of the...
Polishing solution is constantly replenished from the dam 3 to prevent unnecessary heat generation during polishing, and during the polishing process, the annular dam 3 reliably defines the processed thickness of the sample a, and the polishing process is Since the odor substrate 1 reliably prevents the polishing shoulder from scattering, it is possible to apply a constant processing pressure to the polishing sample a while maintaining the safety of the polishing work without requiring highly skilled polishing techniques at all times. Accurate polishing parallelism ensures smoothness of the polished surface and parallelism without shoulder sagging.
Moreover, polishing can be performed without adversely affecting the composition. By the way, in the above-mentioned polishing process, when the weight cylinder is light in weight compared to the hardness of the polishing sample a, the auxiliary weight cylinders 6, 6 are attached to the upper surface of the weight cylinder 2 via the support punch 7. By layering a plurality of . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. In short, the present invention has a weight cylindrical body that applies a constant processing pressure to a polished sample, which is rotatably mounted on the axis of a polishing pick-up base whose lower end surface is formed horizontally by moving it vertically. , a polishing sample adhering plate having a polishing sample adhering surface formed by protruding an annular dam on the lower surface is integrally formed on the lower end surface of the weight cylinder, and the polishing sample adhering surface and the polishing treatment The polishing odor is formed such that the lower end surface of the odor base is parallel to the lower end surface of the polishing jig base, and inflow passages for abrasive material and cooling water to be conveyed to the surface to which the polishing sample is attached are carved radially on the lower end surface of the polishing jig base. In this method, a support village for removably supporting an auxiliary weight cylinder is erected on the upper axis of the weight cylinder, and the machining pressure is always optimal according to the physical properties of the polished sample by attaching and detaching the auxiliary weight cylinder. Because it is configured to polish while maintaining accurate polishing parallelism, the processing pressure that adapts to the physical properties of the polished sample can be applied regardless of the hardness of the polished sample and without the need for highly skilled polishing techniques. The polished surface exhibits smoothness and parallelism without shoulder sagging due to accurate parallelism, and can be polished without adversely affecting the composition. In particular, it is suitable for fluoroscopic specimens with 50 peaks or less. It has extremely useful novel effects such as being able to be manufactured easily and accurately.

[Brief explanation of the drawing]

The drawings show an embodiment of the polishing tool according to the present invention, in which FIG. 1 is an overall vertical cross-section, and FIG. 2 is a top and bottom view of the same. In the figure, 1 is a polishing jig base, la is its lower end surface, lc is its inflow passage, 2 is a weight cylinder, 3 is an annular dam, 4 is a polishing sample sticking surface, 5 is a polishing sample sticking plate, 7 is a support punch, a is a polished sample, and b is a polishing disk. Figure 1 Figure 2

Claims (1)

[Claims] 1. A weight cylindrical body that applies a certain processing pressure to a polishing sample is vertically slidably and freely rotatably inserted through the axial center of a polishing jig base whose lower end surface is formed horizontally, and the weight cylindrical body is A polishing sample adhering plate having a polishing sample adhering surface formed by protruding an annular dam on the lower surface is integrally formed on the lower end surface, and the polishing sample adhering surface and the lower end surface of the polishing jig base are connected to each other. In the polishing jig, the weight cylinder is formed in a parallel shape, and the lower end surface of the polishing jig base is radially carved with inflow passages for abrasive material and cooling water that communicate with the surface to which the polishing sample is attached. A support rod that removably supports an auxiliary weight cylinder is installed at the upper axis of the body, and by attaching and detaching the auxiliary weight cylinder, the optimum processing pressure and accurate polishing parallelism are always achieved according to the physical properties of the polished sample. A polishing jig characterized in that it is configured to perform polishing while maintaining the degree of polishing.