JPS6028633B2 - polishing jig - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a polishing tool used for polishing fluoroscopic specimens and reflective specimens for physical property research, and polishing mating surfaces of semiconductors, etc. This is for reliably polishing brittle polishing samples that require appropriate selection of weight and fine adjustment of processing pressure.

Generally, when polishing the mating surfaces of semiconductors or polishing samples for physical property research, the polished surfaces must be smooth, have no shoulder sag, have good parallelism, and must not generate excessive external force or heat during polishing.
In particular, when creating a fluoroscopic specimen, it is considered essential that it can be polished to 50A or less, but in such conventional polishing, it is not necessary to use any jig or the like to place the polished sample on a polishing disk. Because polishing was done by hand pressing and polishing to the desired thickness, very brittle polished samples were damaged by excessive processing pressure during polishing.
It is difficult to obtain a polished surface with good parallelism and smoothness without shoulder sag, and it causes great mental and physical fatigue for the worker.Furthermore, fine polished shoulders may scatter into the eyes, nostrils, etc. We cannot afford to cause unforeseen accidents, and in particular, the production of polished flakes of 50 mm or less requires advanced polishing techniques.
For this reason, workers perform polishing work by selecting an appropriate auxiliary weight and finely adjusting the machining pressure. When polishing brittle polishing materials, the necessary auxiliary weights are often lost, which hinders the polishing work.

In view of the above-mentioned circumstances, the present invention has been devised based on a completely new idea, in which a constant processing pressure is applied to the polished sample at the axial center of the polishing jig base whose lower end surface is formed horizontally. A hollow weight cylindrical body to be applied is mounted so as to be slidable and rotatable in the vertical direction, and an annular dam is formed in the lower part of the weight cylindrical body parallel to the lower end surface of the polishing picker base. A polishing sample adhering plate with a polishing sample adhering surface made of
By using the hollow part of the weight cylinder as a storage part for the auxiliary weight, when performing polishing work, the auxiliary weight can be appropriately selected to apply the processing pressure most suitable for the degree of brittleness of the polishing material, and the polishing surface can be Although the polishing process can be easily and easily performed to achieve smoothness and parallelism without shoulder sag, after the polishing work is completed, the auxiliary weight is stored in the hollow part of the weight cylinder and both The object of the present invention is to provide a polishing jig that can be stored in one piece, thereby allowing the next polishing operation to be carried out efficiently without any hindrance. The structure of the present invention will be described with reference to an embodiment shown in the drawings. Reference numeral 1 denotes a polishing jig base, the lower end surface la of the polishing jig base is formed horizontally, and the polishing paint base 1 A hollow weight cylinder 2 that applies a constant processing pressure to the polishing sample a is installed in the rattan core part of the weight cylinder 2 so as to be able to slide vertically and freely rotate through the penetration hole lb. A polishing sample adhering plate 5 having an abrasive sample adhering surface 4 formed by protruding an annular dam 3 on the periphery of the lower surface is removably attached to the lower end surface via a screw portion 5a. 5 is configured so that the polishing sample adhering surface 4 becomes parallel to the lower end surface la of the polishing jig base 1, and the weight cylinder 2 is placed in the hollow part 2a of the weight cylinder 2. When storing, use auxiliary weights 6, 6...
... can be stored.

Further, on the lower end surface la of the polishing odor-picking base 1, an abrasive material suitable for the polishing sample attachment surface 4 and a cooling water inflow passage lc,
lc... are engraved in a radial manner, and a support punch 7 having several layers of auxiliary weights 6, 6, . Next, the operation of the present invention configured as described above will be explained.

Now, when polishing the brittle polishing sample a, first,
Remove the polishing sample attachment plate 5 from the weight cylinder 2, take out the auxiliary weights 6, 6, and then attach the polishing sample attachment plate 5 again.
is attached to the weight cylinder 2. Next, the polishing sample a, which has been cut into thin pieces using a cutting machine, is pasted on the polishing sample attachment surface 4, and then the polishing odor control substrate 1, which has been fitted with the weight cylinder 2, is coated with a finely powdered abrasive material. By dispersing a polishing solution prepared by mixing Perilla in water in a thin film and placing it on a polishing plate b that rotates horizontally or vibrates at high speed, the polishing sample a stuck to the polishing sample sticking surface 4 can be removed. receives a certain processing pressure uniformly over the entire surface to be polished from a weight cylinder 2 mounted on the groove core of the polishing odor control substrate 1 so as to be able to slide vertically and freely rotate, and at the same time apply a certain processing pressure uniformly to the entire surface to be polished. 4 and the surface b of the polishing plate, the annular dam 3 protruding around the surface 4 to which the polishing sample is adhered serves to prevent detachment, and the polishing jig base 1 The polishing solution is constantly replenished from the inflow passages lc, lc, which are radially carved on the lower end surface la of the polishing sample adhesion surface 4, and unnecessary heat generation is suppressed during polishing. Moreover, the processed thickness of the polishing sample a is reliably regulated by the annular dam 3, and polishing is performed while the polishing jig base 1 reliably prevents the polishing shoulder from scattering. In this case, the auxiliary weights 6, 6 and 6 taken out from the hollow part 2a of the weight cylinder 2 are
... is placed on the upper surface of the weight cylinder 2 via the support punch 7, and by selecting the appropriate amount and finely adjusting the processing pressure, the processing pressure of the polished sample a is constantly adjusted to the point where the sample a is weak. Since it is possible to set a constant processing pressure that best suits the polishing level, the polishing work can be performed accurately. After the polishing work is completed, the auxiliary weights 6, 6, etc. can be stored in the hollow part 2a of the weight cylinder 2, so when storing the weight cylinder 2,
Unlike the conventional method, there is no slippage that causes the auxiliary weights 6, 6, etc. to be lost, and therefore, there is no problem with the next polishing operation. In short, the present invention has a hollow weight cylinder that applies a constant processing pressure to the polishing material, which is slidable and rotatable in the vertical direction, in the core of the polishing tool base whose lower end surface is formed horizontally. A polishing sample adhering plate having a polishing sample adhering surface formed by protruding an annular dam on the lower surface is removably attached to the lower open end of the weight cylinder, and the abrasive sample adhering plate When the polishing sample is attached, the surface to which the polishing sample is attached is parallel to the lower end surface of the polishing tool base, and the hollow part of the weight cylinder is configured as a storage part for the auxiliary weight. By appropriately selecting auxiliary weights and uniformly applying the processing pressure that best suits the degree of brittleness of the polished sample, the polishing process that provides smoothness and parallelism without shoulder sag on the polished surface can be easily and accurately performed. Not permission to do,
After the polishing work is completed, the auxiliary weight can be stored in the hollow part of the weight joint and both can be stored together, so there is no need to lose sight of the auxiliary weight while it is being stored, as is the case with secondary weights. This provides an extremely useful new effect that allows the polishing work to be carried out efficiently without any problems.

[Brief explanation of drawings]

The drawings show an embodiment of the polishing jig according to the present invention, in which FIG. 1 is an overall vertical cross-section, and FIG. 2 is a top and bottom view of the same. In the figure, 1 is the polishing jig base, la is its lower end surface, lc is its inlet passage, 2 is the weight cylinder, 2a is the hollow part, 3 is an annular dam, 4 is the polishing sample sticking surface, and 5 is the polishing jig base. Polished kenka pasting board,
6 is an auxiliary weight, a is a polished sample, and b is a polishing plate. Figure 1 Figure 2

Claims (1)

[Claims] 1. A hollow weight cylinder that applies a certain processing pressure to the polishing material is attached to the axis of the polishing jig base whose lower end surface is formed horizontally so as to be slidable and rotatable in the vertical direction. A polishing sample adhering plate having a polishing sample adhering surface formed by an annular dam protruding from the lower surface is removably attached to the lower open end of the cylindrical body.
The polishing sample sticking surface is configured to be parallel to the lower end surface of the polishing jig base when the polishing sample sticking plate is attached, and
A polishing jig characterized in that the hollow part of the weight cylinder is used as a storage part for an auxiliary weight.