JPS6037193B2 - Manufacturing method for synthetic resin lace manufacturing mold and embossing plate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a mold and embossing plate for manufacturing a synthetic resin lace having unevenness of different levels.

Manufacturing methods for synthetic resin lace are generally divided into the following three types.

■ A method of printing a lace pattern on release paper and then peeling it off.

■ A method of embossing a synthetic resin sheet with an embossing plate and then slicing the recesses.

■ A method of filling an intaglio mold with PVC paste, scraping off unnecessary parts with a doctor, and then solidifying the paste and peeling it off.

Among these methods, it is difficult to obtain a lace having unevenness of different stages.

By providing recesses with different levels of depth on the embossing plate (2) and the mold (2), it is possible to obtain a lace having unevenness with different levels. As a method for providing the recessed portions, there is a method in which the lace pattern is indented by etching, and then the recessed portions or convex portions are partially corroded using a brush or the like. However, in this method, the corrosion caused by brushing is carried out manually, so the workability is poor and it is difficult to remanufacture exactly the same plate. Another method is to use the conventional method of gravure plate making, but in this method, the desired depth cannot be obtained because the carbon tissue cannot withstand deep etching of more than 100 ridges. There is also a method of engraving, but it has many disadvantages such as being expensive and taking time to create. The present invention has been made in view of these drawbacks. After forming a desired pattern made of conductive resin on a metal substrate, the entire surface of the metal substrate is plated with metal, and then a pattern matching the above pattern is formed. By intaglio-engraving a pattern and a pattern other than the above-mentioned pattern at the same time using a photolithographic method, the indentation is made to the surface of the conductive resin in areas where the conductive resin is present, and to the deeper part in areas where the conductive resin is not present. The purpose is to simultaneously form concave portions with different depths.

Next, the present invention will be explained in detail. Conductive resin is one that has sufficient electrical conductivity to perform metal electroplating, and has a conductivity of 0.
It is a resin to which metal particles, metal oxides, graphite, or carbon of about 0.01 to 0.11 are added, and the dry film exhibits conductivity because the additives are in contact with each other. As the resin, epoxy, polyvinyl alcohol, polypynylacetate, polyvinyl cinnamate, etc. are used. Commercially available products include Dotite (manufactured by Fujikura Kasei) and DuPont conductive paint. First, as shown in FIG. 1, a conductive resin pattern 2 is formed on a metal substrate 1 using these conductive resins.

There are several ways to form a pattern. One is silk screen method or offset printing method.
Alternatively, printing may be performed using a direct printing method or the like. The other method is to form a pattern by a photographic method using a photosensitive resin such as polyvinyl alcohol or polyvinyl cinnamate. Of course, you can also draw by hand. Next, as shown in FIG. 2, the metal substrate 1 having the pattern 2 made of the conductive resin thus created is immersed in a plating solution to perform plating, and the plated metal layer 3 form. At this time, at the beginning, more plating metal is deposited on the metal substrate surface where the electric field is strong, but the conductive resin surface is gradually covered, and the thickness eventually becomes uniform.

Next, polishing is performed as necessary. Next, as shown in Figure 3, using a positive that has a pattern that matches pattern 2 formed with conductive resin and a pattern that is drawn on areas other than the pattern that corresponds to the pattern formed with conductive resin, After registering the pattern in good synchronization with the dew-conducting resin pattern on the base, it is baked and developed, and then etched by etching.

The intaglio engraving at this time is performed until at least the intaglio engravings of the pattern drawn on the portions other than the portions corresponding to the pattern 2 formed of the conductive resin reach the initial metal substrate 1. Thereafter, if necessary, the resin at the inner bottom of the concave hole is removed by dissolving or swelling, and chrome plating is applied. The metal substrate 1 may be made of any metal, such as copper, iron, zinc, nickel, etc., as long as it can corrode rapidly and does not cause significant side etching. Copper is the plating metal,
Any metal that can be plated, such as iron, zinc, or nickel, can be used as long as it corrodes quickly and does not have significant side etching.

The photosensitive agent may be any photosensitive liquid used in photolithography as long as it can withstand corrosion up to several hundred microns.

According to the method of the present invention as described above, since the pattern 2 layer formed of conductive resin is interposed between the metal substrate 1 and the metal layer 3, the pattern is engraved in synchronization with the resin layer 2. Since the resin layer is present in the engraved portion, the engraved portion is no longer deeply engraved.

On the other hand, the portions where the resin layer 2 is not interposed are more deeply engraved, as shown in FIG.
It is possible to form shallow and deep indentations like this in just one round of corrosion. In addition, since the intaglio is engraved using a normal photolithography method, it can not only be manufactured in a short time and at low cost, but also because it does not rely on manual labor to prevent corrosion, it is possible to remanufacture almost the same mold/embossing plate again. It's easy. Moreover, this mold/embossing plate can be used not only as a molding material when manufacturing synthetic resin lace but also as an embossing plate. <Example 1) A positive a with a full lace pattern as shown in FIG. 4 was prepared.

Next, pattern b of the part where you want to make the depth shallow on the 5 willow steel plate.
(Fig. 5) was silk screen printed using epoxy paint.

This epoxy paint contains 5 parts of resin and 5 parts of carbon powder.
Includes Ikarito.

Next, using the steel plate as a cathode, 25% copper was applied in a sulfuric acid steel plating bath.
A smooth plated surface was obtained by 0-butsu plating.

Next, apply a polyvinyl alcohol-based photosensitive liquid on top of it, and align the register by closely applying the above-mentioned positive a to a predetermined position.
An image was obtained by exposure and development, and the handle portions of positive A except for pattern B were corroded with a ferric chloride solution until the depth reached a depth of 500 mm. This metal concave plate was subjected to sandblasting and chrome plating to be used as a mold and embossing plate for manufacturing synthetic resin lace.

Example 2〉Positive d with full lace pattern as shown in Fig. 4
I created an exploded positive b (Fig. 5) of the part of the handle whose depth I wanted to reduce.

At this time, the disassembled positive was made somewhat thicker than that part of the full pattern.
A photosensitive solution containing a mixture of 7 parts of polyvinyl alcohol photosensitizer and 3 parts of carbon powder was applied to a copper plate with a thickness of 5 bars, and the above positive b was adhered, exposed, and developed to obtain a conductive resin image. .

Next, using the steel plate as a cathode, 250 μm of copper was plated using a copper sulfate plating method to obtain a smooth plated surface.

Next, a polyvinyl alcohol-based photosensitive liquid is applied thereon, the positive A is brought into close contact with a predetermined position, the registration is adjusted, and an image is obtained by exposure and development. Corrosion was performed with ferric chloride solution until the depth was reached.

This metal intaglio plate was subjected to sandblasting and chrome plating to become a mold and embossing plate for manufacturing synthetic resin lace.

Brief explanation of the drawings Figure 1 shows a state in which a pattern 2 of conductive resin is formed on a metal substrate 1, Figure 2 shows a state in which a plated metal layer is formed on the pattern, and Figure 3 shows a state in which an indentation due to corrosion is formed. A cross-sectional view of each state is shown.

Fig. 4 shows a plan view of the entire design of the sheath, and Fig. 5 shows a plan view of the part of the inner mold of the sheath handle where it is desired to make the indentation shallower. 1
...Metal substrate, 2...Pattern formed with conductive resin, 3...Plated metal layer, 4...
Shallow engraved part, 5...Deep engraved part.

Figure 1 Figure 2 Figure 3 Figure 4 Figure 5

Claims (1)

[Claims] 1 After forming a desired pattern made of conductive resin on a metal substrate, the entire surface of the metal substrate is plated with metal, and then a pattern having a pattern matching the above pattern and a pattern other than the above pattern is photoengraved. By making indentations using a mechanical method, in the areas where conductive resin is present, the indentations are made up to the conductive resin surface, and in the areas where conductive resin is not present, the indentations are made deeper, simultaneously forming recesses of different depths. A method for manufacturing a mold and embossing plate for manufacturing synthetic resin lace, which is characterized by: