JPS6037967B2 - thin film magnetic head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thin film magnetic head, and aims to stabilize the manufacturing process and improve the walking accuracy.

Figures 1 and 2 show a typical example of the structure of a conventional single-turn coil type thin film magnetic head, and to explain it according to the manufacturing process order, first, a non-magnetic substrate 1 made of non-magnetic ferrite, etc. A first magnetic layer 2 made of permalloy or the like is deposited on the substrate by a method such as vapor deposition or sputtering, and formed into a desired pattern by etching.

Thereon, an insulating layer 3 of Si02 or the like is uniformly formed by vapor deposition or the like.

Next, a conductor layer 4 made of Cu, A, etc. is formed on the insulator layer 3 by vapor deposition or the like, and a desired pattern is formed by etching. 4 is formed on the entire surface of the substrate 1 including 4.

Next, a portion of both the insulator layers 3 and 5 is removed by etching to form a window 6, and a second magnetic layer 7 is provided in a desired shape to cover the window 6. Thereafter, the insulating substrate 1 is cut along the line AA and polished. The first and second magnetic layers 2 and 7 are each directly connected by the window 6,
Furthermore, gap portions 8 are provided on both sides of the polished surface to form a magnetic head core. The insulator layers 3 and 5 provide electrical insulation between the conductor layer 4 and the first and second magnetic layers 2 and 7, and their thickness determines the depth of the gap 8. By the way, as shown in FIG. 2, it is necessary to provide a tapered part 2a around the lower layer of the stacked layers, such as the first magnetic layer 2.

That is, if the step is steep without providing the taper part 2a,
This is because the thickness of the layer laminated thereon becomes thinner at the stepped portions, leading to wire breakage and significant deterioration of characteristics.
However, for the tapered part 2a, when forming the conductor layer 4 in a desired pattern on the first magnetic layer 2 via the insulating layer 3, the steps shown in FIGS. As shown in FIG. 2, the conductive layer 4 is excessively etched in the width direction (so-called side etching) on the tapered portion 2a of the first magnetic layer 2, resulting in a disadvantage that the characteristics and yield are significantly deteriorated. This is because when a resist (not shown) is provided on the conductor layer 4 and the conductor layer 4 is etched, the adhesion between the resist and the conductor layer 4 is poor on the tapered portion 2a, and the resist is It is thought that it will float up. The present invention has been made in view of the above-mentioned points, and is an attempt to solve the problem by providing a sufficient area margin for side etching in a part of the guide layer.

4 and 5 show the manufacturing process of one embodiment of the thin film magnetic head of the present invention, in which a first magnetic layer 2 and an insulator are formed on a non-magnetic substrate 1 as in the conventional example. Layers 3 are sequentially formed, and a conductive layer 4 having a desired pattern is further formed on the insulating layer 3.
is formed.

In this case, in the present invention, a protrusion 4a is formed at a portion of the patterned conductor layer 4 that straddles the tapered portion 2a of the first magnetic layer 2. That is, as shown in FIGS. 6a and 6b, the protrusion 4 of the conductor layer 4
A is partially removed by side etching, but since a sufficient area margin is provided, the width of the conductor layer 4 does not become narrower and cause wire breakage as in the conventional example. Furthermore, in order to complete the thin film magnetic head of the present invention, a second magnetic layer 7 is formed in a desired pattern on the conductor layer 4 with an insulator layer 5 in between, as in the conventional example, and The first and second magnetic layers 2 and 7 may be brought into contact through windows 6 provided in the body layers 3 and 5 to form a magnetic head core.

In the above embodiments of the present invention, a single-turn coil type thin film magnetic head was explained, but for example, a two-turn coil type thin film magnetic head or a multi-turn coil type as shown in FIG. In the figure, the same members or the same numbers as in the subordinate example are indicated, 4' is the second conductive layer, and 9 is the second conductive layer 4' and the second magnetic layer. This is an insulating layer for electrically insulating from the 7.

Moreover, FIG. 8 shows the thin film magnetic head's sticking when the conductor layers 4 are pulled out in opposite directions (up and down in the drawing). The present invention can be applied by forming a pattern in which a protruding portion 4a is formed at a location spanning the tapered portion 2a of the first magnetic layer 2.

As mentioned above, the present invention includes the first magnetic layer 2 on the conductive layer 4.
Since the pattern is such that the protruding part 4a is provided only at the location where it straddles the taper part 2a, even if the protruding part 4a on the tapered part 2a is side-etched, there is sufficient space in terms of area. Therefore, there is no possibility that the conductor layer 4 will be disconnected or the like, and a remarkable effect can be achieved in preventing deterioration of the characteristics and gait.

Although it is conceivable to set the line width of the conductive layer to be thick as a whole, in that case, there is a drawback that the distance between the lines becomes small and the crosstalk characteristics between channels deteriorate.

On the other hand, since the conductive layer 4 of the present invention is provided with the protruding portions 4a only in a portion thereof, such characteristic deterioration does not occur.

[Brief explanation of the drawing]

FIG. 1 is a top view of essential parts of a conventional thin-film magnetic head, FIG. 2 is a cross-sectional view taken along the line X--X in FIG. , FIG. 4 to FIG. 8 are related to the thin film magnetic head of the present invention, FIG. 4 is a top view of the main part showing the middle of the manufacturing process, FIG. 5 is a YY cross-sectional view of FIG. 4, 6a and 6b are explanatory diagrams for explaining side etching of a conductive layer, FIG. 7 is a cross-sectional view of a two-turn coil type thin film magnetic head, and FIG. 8 is a top view of essential parts for explaining another embodiment. It is. DESCRIPTION OF SYMBOLS 1... Non-magnetic substrate, 2... 1st magnetic layer, 2a.
... Part of napa, 3, 5, 9... Insulator layer, 4...
Conductor layer, 4a... protrusion. Figure 1 Figure 2 Figure 5 Figure 3 Figure 4 Figure 6 Figure 7 Figure 8

Claims (1)

[Claims] 1. In a thin film magnetic head formed by forming first and second magnetic layers, an insulating layer, and a conductive layer on a non-magnetic substrate, the conductive layer has a tapered portion of the first magnetic layer. A thin film magnetic head characterized by having a pattern in which protrusions are provided only in areas where the magnetic head is exposed.