JPS6118360B2 - - Google Patents
Info
- Publication number
- JPS6118360B2 JPS6118360B2 JP740077A JP740077A JPS6118360B2 JP S6118360 B2 JPS6118360 B2 JP S6118360B2 JP 740077 A JP740077 A JP 740077A JP 740077 A JP740077 A JP 740077A JP S6118360 B2 JPS6118360 B2 JP S6118360B2
- Authority
- JP
- Japan
- Prior art keywords
- metal ring
- glass
- lead terminal
- terminal
- airtight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 18
- 238000007789 sealing Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 3
- 239000008187 granular material Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
【発明の詳細な説明】
この発明は、気密端子の製造方法、詳しくは金
属環とリード端子の組立を粉末ガラス成形時に行
い、封着のための治具への組立てを簡略にした気
密端子の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for manufacturing an airtight terminal, in particular, a method for manufacturing an airtight terminal, in which a metal ring and a lead terminal are assembled during powder glass molding, and assembly into a jig for sealing is simplified. This relates to a manufacturing method.
従来までの代表的な気密端子の製造方法は、造
粒したガラス顆粒を粉末成形し、更に仮焼成を行
つてガラスタブレツト1を得、これと事前に適宜
熱処理を施した金属環4とリード端子5を、封着
用治具2に組込み、高温加熱して気密端子を得て
いた(第1図(a))。 A typical conventional manufacturing method for airtight terminals is to powder-form granulated glass granules, then pre-sinter them to obtain a glass tablet 1, which is then combined with a metal ring 4 and a lead that have been appropriately heat-treated in advance. The terminal 5 was assembled into the sealing jig 2 and heated at a high temperature to obtain an airtight terminal (FIG. 1(a)).
この方法は、ガラス顆粒の成形を単独で行うた
め、成形機構が簡単である反面、成形体のまゝ取
扱うときがあり、成形体に容易に欠けを生じせし
めて歩留低下の一要因をなしていた。又封着する
ために、治具へガラスタブレツト、金属環及びリ
ード端子を組込む作業は、気密端子製造工程にお
いて最も入手を要する部分で、安価な気密端子を
製造するについて大きな障害となつていた。 In this method, the molding mechanism is simple because the glass granules are molded independently, but on the other hand, the molded product is handled as it is, which can easily cause chips to occur in the molded product, which is a factor in reducing yield. was. In addition, the work of assembling the glass tablet, metal ring, and lead terminal into the jig for sealing is the part that requires the most procurement in the airtight terminal manufacturing process, and has been a major obstacle to manufacturing inexpensive airtight terminals. .
又器状をなす金属環を用いた気密端子において
は、ガラスの溶融順序が適当でない場合、第1図
(b)に示すように器状底部に気泡3を封じ込め金属
環とガラスとの接触面積を減じるなどの不具合点
があつた。 In addition, in an airtight terminal using a container-shaped metal ring, if the melting order of the glass is not appropriate,
As shown in (b), there were drawbacks such as the inclusion of air bubbles 3 in the bottom of the vessel, reducing the contact area between the metal ring and the glass.
本発明は、以上のような不具合点を除き、更に
安価な気密端子を提供することを目的としてい
る。 An object of the present invention is to eliminate the above-mentioned disadvantages and provide a more inexpensive airtight terminal.
以下添付図面にもとずいて、この発明の一実施
例を説明する。 An embodiment of the present invention will be described below based on the accompanying drawings.
第2図は、この発明の一実施例を示す。 FIG. 2 shows an embodiment of the invention.
予め成形機のダイ15の中に金属環11、下パ
ンチ12の中にリード端子18が供給さされる。 The metal ring 11 and the lead terminal 18 are supplied into the die 15 of the molding machine and the lower punch 12 in advance.
ガラス顆粒13は、フイーダ14によつて金属
環11の存在するダイ15の穴16に流れ込む
(第2図(a))。 The glass granules 13 flow through the feeder 14 into the hole 16 of the die 15 where the metal ring 11 is present (FIG. 2(a)).
次にリード端子18を一定量下パンチ12より
上昇させ(図示せず)た後、この穴16上にきて
いる上パンチ17が下降して、ダイ15の中のガ
ラス顆粒13を加圧成形する(第2図(b))。 Next, after the lead terminal 18 is raised by a certain amount from the lower punch 12 (not shown), the upper punch 17 located above the hole 16 is lowered, and the glass granules 13 in the die 15 are press-formed. (Figure 2(b)).
成形が完了すると上パンチ17は、リード端子
18を吸着し、ガラス成形体13を介して固定さ
れた金属環11と共に、一定量引上げる。その後
ダイ15に備えられた2枚のカツター10が連動
してリード端子18の下端を両側から挾み切断す
る(第2図(c))。 When the molding is completed, the upper punch 17 attracts the lead terminal 18 and pulls it up by a certain amount together with the metal ring 11 fixed via the glass molded body 13. Thereafter, the two cutters 10 provided on the die 15 work together to pinch and cut the lower end of the lead terminal 18 from both sides (FIG. 2(c)).
上パンチ17は、リード端子18を放ち所定の
位置まで上昇して停止する。ガラス成形体13を
介して固定されたリード端子18と金属環11
は、該状態で封着用治具に組込まれ、高温加熱さ
れる準備を整える。 The upper punch 17 releases the lead terminal 18, rises to a predetermined position, and stops. Lead terminal 18 and metal ring 11 fixed via glass molded body 13
is assembled into a sealing jig in this state and prepared to be heated at a high temperature.
尚本実施例においては、リード端子18は、下
パンチ12の下部より自動的に供給される。 In this embodiment, the lead terminals 18 are automatically supplied from the lower part of the lower punch 12.
又リード端子18と金属環11は、必要により
事前に適宜表面処理を施したものを使用する。 Further, the lead terminal 18 and the metal ring 11 are used which have been subjected to appropriate surface treatment in advance if necessary.
封着処理には温度分布(第3図)に示すような
プログラムの組めるトンネル型無酸化雰囲気炉
(第4図)を用いる。 For the sealing process, a tunnel type non-oxidizing atmosphere furnace (Fig. 4), which can be programmed as shown in the temperature distribution (Fig. 3), is used.
封着治具は、300℃〜400℃の温度域で15分以上
加熱し、ガラス造粒に用いたバインダーを十分に
気化させて後、ベルトコンベアに乗せて封着加熱
帯へ挿入する。 The sealing jig is heated in a temperature range of 300°C to 400°C for 15 minutes or more to sufficiently vaporize the binder used for glass granulation, and then placed on a belt conveyor and inserted into the sealing heating zone.
以上に記載したように、この発明によれば、ガ
ラスタブレツトの焼成工程を省くことができ、更
に入手を最も要した封着治具へのガラスタブレツ
ト・リード端子・金属環の組立を簡略化し、安価
な気密端子を提供することができる。品質上で
は、予めガラス顆粒を金属環の内面に一様に固定
するために、第1図(b)に見られるような、ガラス
タブレツト1が気泡3を封じ込める現象を防ぐこ
とができる。 As described above, according to the present invention, the firing process of the glass tablet can be omitted, and the assembly of the glass tablet, lead terminal, and metal ring into the sealing jig, which is the most necessary to obtain, is simplified. This makes it possible to provide inexpensive airtight terminals. In terms of quality, since the glass granules are uniformly fixed on the inner surface of the metal ring in advance, it is possible to prevent the glass tablet 1 from enclosing the air bubbles 3 as seen in FIG. 1(b).
第1図(a)は従来の代表的な気密端子の封着前の
状態を示す組立断面図、(b)は気泡を封じ込めた気
密端子を示す縦断面図。
第2図(a)(b)(c)は、この発明による一実施例の成
形工程を示す縦断面図、第3図は封着処理のため
の加熱温度と時間のプログラムの一例を示すダイ
ヤグラム図、第4図はトンネル型無酸化雰囲気炉
の一例を示す縦断面図である。
11…金属環、12…下パンチ、13…ガラス
顆粒、14…フイーダ、15…ダイ、16…ダイ
の穴、17…上パンチ、18…リード端子、19
…上パンチの穴、10…カツター。
FIG. 1(a) is an assembled sectional view showing a typical conventional airtight terminal before being sealed, and FIG. 1(b) is a vertical sectional view showing an airtight terminal with bubbles sealed. FIGS. 2(a), (b), and (c) are longitudinal sectional views showing the molding process of an embodiment of the present invention, and FIG. 3 is a diagram showing an example of a heating temperature and time program for sealing treatment. 4 are longitudinal sectional views showing an example of a tunnel type non-oxidizing atmosphere furnace. 11...Metal ring, 12...Lower punch, 13...Glass granules, 14...Feeder, 15...Die, 16...Die hole, 17...Upper punch, 18...Lead terminal, 19
...Upper punch hole, 10...Cutter.
Claims (1)
を、ガラスによつて絶縁封着する気密端子の製造
方法において、金属環穴内にガラス粉末を流し込
み、中心部にリード端子を供給した後、前記ガラ
ス粉末の加圧成形と、前記金属環と前記リード端
子の仮固定を同時に行ない、その後加圧成形して
できたガラス成形体を介して仮固定された前記リ
ード端子と前記金属環を加熱封着することを特徴
とする気密端子の製造方法。 2 前記金属環穴内の一部にテーパーをつけたこ
とを特徴とする特許請求の範囲第1項記載の気密
端子の製造方法。[Claims] 1. A method for manufacturing an airtight terminal in which a metal ring and at least one lead terminal are insulated and sealed with glass, in which glass powder is poured into a hole in the metal ring, and a lead terminal is placed in the center. After supplying, the glass powder is press-molded and the metal ring and the lead terminal are temporarily fixed at the same time, and then the lead terminal and the lead terminal that are temporarily fixed via the glass molded body formed by the pressure-forming are A method for manufacturing an airtight terminal, characterized by heat-sealing a metal ring. 2. The method of manufacturing an airtight terminal according to claim 1, wherein a portion of the metal ring hole is tapered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP740077A JPS5392463A (en) | 1977-01-26 | 1977-01-26 | Method of making sealing terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP740077A JPS5392463A (en) | 1977-01-26 | 1977-01-26 | Method of making sealing terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5392463A JPS5392463A (en) | 1978-08-14 |
| JPS6118360B2 true JPS6118360B2 (en) | 1986-05-12 |
Family
ID=11664831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP740077A Granted JPS5392463A (en) | 1977-01-26 | 1977-01-26 | Method of making sealing terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5392463A (en) |
-
1977
- 1977-01-26 JP JP740077A patent/JPS5392463A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5392463A (en) | 1978-08-14 |
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