JPS6122865B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a semiconductor device, and particularly to a method for sealing a container containing a semiconductor device, and aims to prevent characteristic fluctuations during the sealing process.

In particular, solid-state imaging devices with a photoconductive film formed on their surfaces;
A further object of the present invention is to prevent characteristic fluctuations during the sealing process of a container containing a solid-state imaging device with an optical filter adhered to the surface.

The conventional sealing of a container containing a semiconductor device, particularly a storage container called a ceramic package, will be explained with reference to FIG. 1st
The figure shows a ceramic package 1 and a semiconductor device 2.
A sealed structure is shown in which the electrodes on the device 2 are fixed with an adhesive 3 and the electrodes on the device 2 and the external leads are connected with a thin metal wire 4.

FIG. 1A shows an example in which a glass lid 5 is bonded with a resin 8, and the metallized layers 7 and 6 formed on a part of the glass lid 5 and the package 1 may be omitted.
Alternatively, a thin soft metal (for example, indium foil) may be inserted between the metallized layers 6 and 7 and sealed under pressure.

FIG. 1B shows an example in which the central part of the metal plate 11 is cut out, a lid is used in which a glass plate 12 is pasted in advance, and the lid is sealed with low melting point solder 13.

In the conventional example described above, the method of sealing only the peripheral part of the lid with resin adhesive is relatively low temperature (e.g.
Although the resin can be cured at temperatures (approximately 100℃), its water and moisture resistance is weak, and although this may not be a problem for general MOS ISI, it becomes a major problem for solid-state image sensors with photoconductive films. Furthermore, this method cannot be used with a solid-state image sensor with an organic mosaic filter attached, as the temperature cannot be raised above 80°C. Further, for the same reason, the low melting point soldering method cannot be used as a sealing method for a container containing a solid-state image sensor with a filter.

The present invention provides a method that completely eliminates the drawbacks of the above-mentioned conventional examples, and FIG. 2 shows a cross-sectional structural diagram of one embodiment in the order of steps. As the ultraviolet curable adhesive, one whose main component is a well-known modified acrylate is used. The adhesive is
10 by irradiating ultraviolet light of 10000μm/cm
Can be cured in ~15 seconds.

FIG. 2A shows a solid-state image sensor 2 in which a filter 24 is adhesively fixed to a predetermined part of a storage container 21 with an adhesive 25.
2 is shown fixed.

Although FIG. 2B shows a state in which the ultraviolet curable resin 27 is filled, it is desirable that the surface of the resin is sufficiently exposed above the solid-state image sensor.

Next, as shown in FIG. 2C, a glass lid 28 is covered and ultraviolet rays 29 are irradiated to harden the entire structure, completing the sealing process. The smaller the gap between the glass lid 28 and the filter 24, the faster the curing process, and preferably 0.5 mm or less.

FIG. 3 shows a case of sealing according to the second embodiment, and is an example in which the ultraviolet curable resin 31 is applied and cured only on the solid-state image sensor and the sealing portion. In this case, when filling the resin 27 in the step of FIG. 2B,
It is sufficient to drop the resin only on the portion indicated by 31 in FIG. At this time, add a little more resin so that when you press the glass lid, it overflows from the adhesive surface.

In this case, everything is manufactured using the same manufacturing process except for the resin coating process shown in FIG. 2B.

According to the manufacturing method of the present invention, since the temperature is not increased, there is no change in the characteristics of the semiconductor device. moreover,
When the manufacturing method of the present invention is used for packaging a semiconductor device including a photodetector or a solid-state image sensor to which an optical filter is bonded, the space between the device and the glass plate that also serves as a lid is filled with ultraviolet curable resin. Therefore, in that case, surface reflection can be prevented and loss of transmitted light can be eliminated. In particular, if a UV-curable resin whose refractive index is close to that of glass is selected, the effect will be very large.

[Brief explanation of the drawing]

Figures 1A and B are diagrams for explaining the conventional sealing method, Figures 2A, B, and C are diagrams for explaining one embodiment of the present invention, and Figure 3 is a diagram for explaining another embodiment of the present invention. It is a figure for explaining an example. 21... Storage container, 22... Solid-state imaging device, 2
3...Device adhesive material, 24...Filter, 2
5... Adhesive, 26... Fine metal wire, 27... Ultraviolet curing resin, 28... Glass lid, 29... Ultraviolet light.

Claims (1)

[Scope of Claims] 1. After adhering and fixing a semiconductor device to a storage container and electrically connecting the electrodes on the device and external leads, at least the device is connected to a glass plate that also serves as a lid of the storage container. A method of manufacturing a semiconductor device, characterized in that an ultraviolet curable resin is interposed between the glass plates, and the resin is cured by irradiating ultraviolet rays through the glass plate. 2. The method of manufacturing a semiconductor device according to claim 1, wherein the semiconductor device is a solid-state image sensor having an optical filter bonded to the surface thereof.