JPS6159211B2 - - Google Patents
Info
- Publication number
- JPS6159211B2 JPS6159211B2 JP13643981A JP13643981A JPS6159211B2 JP S6159211 B2 JPS6159211 B2 JP S6159211B2 JP 13643981 A JP13643981 A JP 13643981A JP 13643981 A JP13643981 A JP 13643981A JP S6159211 B2 JPS6159211 B2 JP S6159211B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- runner
- mold
- constriction
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0061—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the material feeding channel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
本発明は、トランスフアー樹脂成形金型に関す
るもので、特に機械的力に対して脆弱なる金属細
線により外部取り出しリードと内部素子を連結す
る構造を有するダイオードの如き樹脂成形型の電
子部品成形の際に、上述の金属細線を損うことな
く樹脂成形を実施できる金型を提供せんとするも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mold for molding a transfer resin, and in particular, a mold for molding a resin such as a diode, which has a structure in which an external lead and an internal element are connected by a thin metal wire that is vulnerable to mechanical force. It is an object of the present invention to provide a mold that can perform resin molding without damaging the above-mentioned thin metal wires when molding electronic components.
上述の如き内部構造を有する代表的樹脂成形型
電子部品の例である樹脂封止型ダイオードを用い
本発明になるトランスフア樹脂成形金型を説明す
る。 The transfer resin molding die according to the present invention will be explained using a resin-sealed diode, which is an example of a typical resin-molded electronic component having the internal structure as described above.
一般に、第１図に示すように、本体がエポキシ
樹脂のような樹脂で封止成形されるダイオードチ
ツプ３は、リードフレームと称される外部引出し
リード１の平面なる部分２に良導電性の金の如き
ロウ材により接着されている。又、ダイオードチ
ツプ３はその表面に例えばアルミニウムの如き良
導電性を有する金属により電極が形成されてお
り、この電極と上述の外部引き出しリードは、金
線のような良導電性の細線４により熱圧着方式等
により連結されている。この状態のものをトラン
スフアー樹脂成形機により成形封止されダイオー
ドが完成される。 Generally, as shown in FIG. 1, a diode chip 3 whose main body is sealed and molded with a resin such as epoxy resin has a flat part 2 of an external lead 1 called a lead frame made of highly conductive gold. It is bonded with a brazing material such as. Further, an electrode is formed on the surface of the diode chip 3 using a metal having good conductivity such as aluminum, and this electrode and the above-mentioned external lead are connected to heat by a thin wire 4 having good conductivity such as a gold wire. They are connected using a crimp method or the like. This state is molded and sealed using a transfer resin molding machine to complete the diode.
第２図に従来の金型を示す。これと同様の上金
型が用意され、上金型および下金型の間に第１図
に示す構造を有するリードフレームがセツトさ
れ、ランナ６、ゲート５を介してキヤビテイ９に
樹脂が注入されて樹脂成形される。しかし、第２
図の金型構造においては、ランナ６の端面に注入
加圧により樹脂が当り戻つてくるバツクストレス
が強く、第１図の金細線４へ影響を与えて金細線
変形の大きな原因となつており、ダイオードの信
頼度を損つている。 Figure 2 shows a conventional mold. An upper mold similar to this is prepared, a lead frame having the structure shown in FIG. 1 is set between the upper mold and the lower mold, and resin is injected into the cavity 9 via the runner 6 and gate 5. It is then molded with resin. However, the second
In the mold structure shown in the figure, the back stress caused by the resin hitting the end face of the runner 6 due to injection pressure and returning is strong, which affects the thin gold wire 4 in FIG. 1 and is a major cause of deformation of the thin gold wire. , impairing the reliability of the diode.
本発明の目的は、係る金細線の変形を起す欠点
を除去できるトランスフア樹脂成形金型の提供に
ある。 An object of the present invention is to provide a transfer resin molding die that can eliminate such defects that cause deformation of the thin gold wire.
本発明による樹脂成形金型は、ランナの端部に
くびれを設け、その先に樹脂溜を設けたもので、
このくびれおよび樹脂溜によつてバツクストレス
は低減され、しかも加圧力が保持される。上記樹
脂溜は、好ましくは、スパイラル状の延長ランナ
として設けられる。 The resin molding mold according to the present invention has a constriction at the end of the runner and a resin reservoir at the end of the constriction.
This constriction and resin reservoir reduce back stress and maintain pressure. The resin reservoir is preferably provided as a spiral extended runner.
以下に第３図を参照しながら本発明に係る封入
成形金型の構成を説明する。 The structure of the encapsulation mold according to the present invention will be explained below with reference to FIG.
本発明の一実施例に係る樹脂成形金型の構成
は、製品を形成するキヤビテイ９とそれに樹脂を
供給する枝通称ゲートと称される部分５とランナ
６から成り立つており、そのゲート末端部を過ぎ
たランナ端部に樹脂溜としてのスパイラル状の過
剰ランナ８が設けられ、且つランナ部６とスパイ
ラル状過剰ランナ部８の接合点にくびれ７を設け
ている。 The structure of the resin molding die according to one embodiment of the present invention is composed of a cavity 9 for forming a product, a branch portion 5 for supplying resin to the cavity, commonly referred to as a gate, and a runner 6, and an end portion of the gate. A spiral excess runner 8 as a resin reservoir is provided at the passed runner end, and a constriction 7 is provided at the junction of the runner portion 6 and the spiral excess runner portion 8.
従つて、本発明の金型を用いれば、成形時のバ
ツクストレスはスパイラル８の長さ及びくびれ７
の幅を適当に設備することにより吸収され、且
つ、加圧力を保持でき、製品内の機械的に脆弱な
細線へ何ら影響を与えることなく樹脂成形が実施
できる。 Therefore, if the mold of the present invention is used, the back stress during molding will depend on the length of the spiral 8 and the constriction 7.
By setting the width appropriately, the pressure can be absorbed and the pressure can be maintained, and resin molding can be carried out without affecting the mechanically fragile thin wires in the product.
第１図は被成形部品（樹脂封止前の中間品）の
平面図、第２図は従来の成形金型を示し、Ａは平
面図、ＢはＡ図のＸ−X′における断面図、第３
図は本発明の一実施例による金型の平面図であ
る。
１……外部引出しリード、２……リードフレー
ム平面部、３……ダイオード素子、４……金細
線、５……ゲート、６……ランナ、７……くび
れ、８……スパイラル状過剰ランナ、９……キヤ
ビテイ。
Fig. 1 is a plan view of the molded part (intermediate product before resin sealing), Fig. 2 shows a conventional molding die, A is a plan view, B is a sectional view taken along line X-X' in Fig. A, Third
The figure is a plan view of a mold according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...External drawer lead, 2...Lead frame plane part, 3...Diode element, 4...Gold wire, 5...Gate, 6...Runner, 7...Constriction, 8...Spiral-shaped excess runner, 9... Cavity.
Claims (1)
し、前記ランナを通して供給された樹脂を前記ゲ
ートを介して前記キヤビテイに注入して前記キヤ
ビテイ内に保持された部品を前記樹脂で封止する
樹脂成形金型において、前記ランナの端部にくび
れをもたせ、その先に樹脂溜を設けたことを特徴
とする樹脂成形金型。1 A resin molding mold that has a runner, a gate, and a cavity inside, and injects resin supplied through the runner into the cavity through the gate to seal the parts held in the cavity with the resin. A resin molding mold according to the invention, characterized in that the end of the runner has a constriction, and a resin reservoir is provided at the end of the constriction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13643981A JPS5838138A (en) | 1981-08-31 | 1981-08-31 | Mold for molding resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13643981A JPS5838138A (en) | 1981-08-31 | 1981-08-31 | Mold for molding resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5838138A JPS5838138A (en) | 1983-03-05 |
| JPS6159211B2 true JPS6159211B2 (en) | 1986-12-15 |
Family
ID=15175145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13643981A Granted JPS5838138A (en) | 1981-08-31 | 1981-08-31 | Mold for molding resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5838138A (en) |
-
1981
- 1981-08-31 JP JP13643981A patent/JPS5838138A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5838138A (en) | 1983-03-05 |
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