JPS6159906B2 - - Google Patents
Info
- Publication number
- JPS6159906B2 JPS6159906B2 JP9093478A JP9093478A JPS6159906B2 JP S6159906 B2 JPS6159906 B2 JP S6159906B2 JP 9093478 A JP9093478 A JP 9093478A JP 9093478 A JP9093478 A JP 9093478A JP S6159906 B2 JPS6159906 B2 JP S6159906B2
- Authority
- JP
- Japan
- Prior art keywords
- formula
- group
- adhesive
- atom
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 239000004962 Polyamide-imide Substances 0.000 claims description 7
- 229920002312 polyamide-imide Polymers 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
- -1 dimethylmethylene group Chemical group 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 125000004434 sulfur atom Chemical group 0.000 claims description 2
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- CJPIDIRJSIUWRJ-UHFFFAOYSA-N benzene-1,2,4-tricarbonyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C(C(Cl)=O)=C1 CJPIDIRJSIUWRJ-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Structure Of Printed Boards (AREA)
Description
本発明は、耐熱性、耐燃性、電気絶縁性、接着
性が優れた新規耐熱性フレキシブル電子部品に関
するものである。
ポリイミドフイルムは優れた耐熱性を有してい
る故に、テープキヤリア用基板などの耐熱性を要
する電子材料として近年脚光をあびているが、銅
箔を接着するのに必要な接着剤として現在用いら
れているエポキシ系接着剤の耐熱性は250℃以下
であり、ポリイミドと同等の400℃の耐熱性を有
するものはなく、ポリイミドの耐熱性が活かしき
れていないのが現状であり、当分野において耐熱
性接着剤の要望は強い。
本発明は、ポリイミドフイルムと銅箔の接着剤
として、芳香核の１、３の位置に結合を有する芳
香族ポリアミドイミドを用いたフレキシブル電子
部品は、優れた耐熱性、耐燃性、電気絶縁性、接
着性を有するという事実にもとづいたものであ
る。
即ち、本発明は、ポリイミドフイルム、接着
剤、銅箔の積層物において、接着剤が下記一般式
、、で表わされる一種以上の芳香族ポリア
ミドイミドである事を特徴とする耐熱性フレキシ
ブル電子部品
〔式中のArは、式
The present invention relates to a new heat-resistant flexible electronic component that has excellent heat resistance, flame resistance, electrical insulation properties, and adhesive properties. Because polyimide film has excellent heat resistance, it has recently been in the spotlight as an electronic material that requires heat resistance, such as for tape carrier substrates, but it is currently used as an adhesive for bonding copper foil. The heat resistance of the epoxy adhesives currently used is 250℃ or less, and there is no adhesive that has the same heat resistance of 400℃ as polyimide.Currently, the heat resistance of polyimide is not fully utilized. There is a strong demand for adhesives. The present invention provides a flexible electronic component using aromatic polyamideimide having bonds at positions 1 and 3 of the aromatic nucleus as an adhesive between polyimide film and copper foil, which has excellent heat resistance, flame resistance, electrical insulation properties, This is based on the fact that it has adhesive properties. That is, the present invention provides a heat-resistant flexible electronic component in which the adhesive is one or more aromatic polyamide-imides represented by the following general formula in a laminate of a polyimide film, an adhesive, and a copper foil. [Ar in the formula is
【式】【formula】
【式】
又は
（ただし、Ｒは水素原子、ハロゲン原子又はアル
キル基（例えばメチル基、エチル基、プロピル基
など）、Ｘは酸素原子、硫黄原子、スルホニル
基、カルボニル基、カルボキシル基、メチレン基
又はジメチルメチレン基であり、これらは互いに
同一であつても異なつていても良い）で表わされ
る二価の残基、Ar′は式[Formula] or (However, R is a hydrogen atom, a halogen atom, or an alkyl group (e.g., methyl group, ethyl group, propyl group, etc.), and X is an oxygen atom, sulfur atom, sulfonyl group, carbonyl group, carboxyl group, methylene group, or dimethylmethylene group. (which may be the same or different), Ar' is a divalent residue of the formula
【式】【formula】
【式】又は[Formula] or
【式】（ただし、ＲとＸとは
前記と同じ意味をもつ）で表わされる二価の残
基、ｎは正の整数である〕
を提供するものである。
本発明に使用される芳香族ポリアミドイミドと
しては、
およびこれらの混合物が好適であり、特に
A divalent residue represented by the formula: (wherein R and X have the same meanings as above, n is a positive integer). The aromatic polyamideimide used in the present invention includes: and mixtures thereof are preferred, especially
【式】が好まし い。 これらの芳香族ポリアミドイミドは、例えば[Formula] is preferable stomach. These aromatic polyamideimides are, for example,
【式】【formula】
【式】【formula】
【式】又は
（式中のＲとＸは前記と同じ意味をもつ）で表わ
される芳香族ジアミンとトリメリツト酸クロライ
ドとを反応させるか、あるいは一般式
又は
（式中のＲとＸは前記と同じ意味をもつ）で表わ
されるビスイミドカルボン酸とジフエニル−３・
3′−ジイソシアネートとを反応させるか、あるい
は一般式OCN−Ar（又はAr′）−NCO（式中のAr
とAr′は前記と同じ意味をもつ）で表わされるジ
イソシアネートと、式
で示されるビスイミドカルボン酸を反応させるこ
とによつて製造することができる。
本発明に用いられる芳香族ポリアミドイミドの
還元粘度は、0.2〜1.5特に0.4〜1.3が好ましい。
還元粘度が0.2以下では、膜の強度も弱く実用特
性が不充分であり、還元粘度が1.5以上では、作
業性が低下する。
本発明の耐熱性フレキシブル電子部品は耐熱
性、耐燃性、電気絶縁性、接着性に優れたもので
ありポリイミドフイルムとしては、デユポン社製
商品名「カプトン」などで代表されるものがあ
り、銅箔としては、電解銅箔、圧延銅箔などがあ
る。
本発明の耐熱性フレキシブル電子部品は優れた
接着性を有しているが、更に接着性を向上する為
にエポキシ樹脂或いはシランカツプリング剤など
を添加しても良い。
次に、本発明をより具体的に説明するために実
施例を述べるが、本発明はこれら実施例に限定さ
れるものではない。
実施例 １〜８
デユポン社製ポリイミドフイルム「カプトン」
（膜厚75μ）と電解銅箔（膜厚35μ）を、表１に
示した芳香族ポリアミドイミド接着剤とＮ−メチ
ルピロリドンを用いて、150℃で30分間熱処理し
て接着した。次いで、400℃で１時間耐熱性テス
トを行い、その後の銅箔の引きはがし強度は表１
に示した通りであり、優れた耐熱性と接着性を有
していた。尚、引きはがし強度はJIS C6481−
1968に準じて測定した。更にJIS C6481−1968に
準じて耐燃性を測定した結果も優れたものであつ
た。[Formula] or (R and X in the formula have the same meanings as above) and trimellitic acid chloride are reacted, or the general formula or Bisimidocarboxylic acid represented by (R and X in the formula have the same meanings as above) and diphenyl-3.
3'-diisocyanate, or with the general formula OCN-Ar (or Ar')-NCO (Ar in the formula
and Ar′ have the same meanings as above) and the diisocyanate represented by the formula It can be produced by reacting a bisimidecarboxylic acid represented by: The aromatic polyamideimide used in the present invention preferably has a reduced viscosity of 0.2 to 1.5, particularly 0.4 to 1.3.
If the reduced viscosity is less than 0.2, the strength of the film will be weak and the practical properties will be insufficient, and if the reduced viscosity is more than 1.5, the workability will be reduced. The heat-resistant flexible electronic component of the present invention has excellent heat resistance, flame resistance, electrical insulation properties, and adhesive properties. Examples of polyimide films include those typified by the product name "Kapton" manufactured by DuPont; Examples of the foil include electrolytic copper foil and rolled copper foil. Although the heat-resistant flexible electronic component of the present invention has excellent adhesive properties, an epoxy resin or a silane coupling agent may be added to further improve the adhesive property. Next, Examples will be described to more specifically explain the present invention, but the present invention is not limited to these Examples. Examples 1 to 8 Polyimide film “Kapton” manufactured by DuPont
(film thickness: 75 μm) and electrolytic copper foil (film thickness: 35 μm) were bonded together by heat treatment at 150° C. for 30 minutes using the aromatic polyamideimide adhesive shown in Table 1 and N-methylpyrrolidone. Next, a heat resistance test was conducted at 400℃ for 1 hour, and the peel strength of the copper foil after that was shown in Table 1.
As shown in , it had excellent heat resistance and adhesive properties. In addition, the peel strength is JIS C6481−
Measured according to 1968. Furthermore, the flame resistance was measured according to JIS C6481-1968 and the results were excellent.
Claims (1)
において、接着剤が下記一般式(1)、(2)、(3)で表わ
される一種以上の芳香族ポリアミドイミドである
ことを特徴とする耐熱性フレキシブル電子部品。 〔式中のArは、式【式】 【式】【式】 又は （ただし、Ｒは水素原子、ハロゲン原子又はアル
キル基、Ｘは酸素原子、硫黄原子、スルホニル
基、カルボニル基、カルボキシル基、メチレン基
又はジメチルメチレン基であり、これらは互いに
同一であつても異なつていても良い）で表わされ
る二価の残基、Ar′は式【式】 【式】又は 【式】（ただし、ＲとＸとは 前記と同じ意味をもつ）で表わされる二価の残
基、ｎは正の整数である〕[Scope of Claims] 1. In the laminate of polyimide film, adhesive, and copper foil, the adhesive is one or more aromatic polyamideimides represented by the following general formulas (1), (2), and (3). A heat-resistant flexible electronic component featuring: [Ar in the formula is the formula [formula] [formula] [formula] or (However, R is a hydrogen atom, a halogen atom, or an alkyl group, and X is an oxygen atom, a sulfur atom, a sulfonyl group, a carbonyl group, a carboxyl group, a methylene group, or a dimethylmethylene group, and these may be the same or different Ar′ is a divalent residue represented by the formula [Formula] [Formula] or [Formula] (where R and X have the same meanings as above). base, n is a positive integer]
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9093478A JPS5518426A (en) | 1978-07-27 | 1978-07-27 | Heat-resistant flexible electronic parts |
| US06/010,290 US4377652A (en) | 1978-02-17 | 1979-02-08 | Polyamide-imide compositions and articles for electrical use prepared therefrom |
| GB08210524A GB2103633B (en) | 1978-04-28 | 1979-02-09 | Polyamide-imide compositions for imparting electrical properties and articles produced using the compositions |
| GB7904632A GB2016487B (en) | 1978-02-17 | 1979-02-09 | Articles for electrical use and compositions useful therefor |
| DE2905857A DE2905857C2 (en) | 1978-02-17 | 1979-02-15 | Polyamide-imide compositions with granular materials and use of such compositions for electrical components, circuit boards and insulating substrates |
| CA321,623A CA1123981A (en) | 1978-02-17 | 1979-02-16 | Soluble aromatic polyamide-imide compositions for electrical use |
| NLAANVRAGE7901256,A NL181739C (en) | 1978-02-17 | 1979-02-16 | COMPOSITION BASED ON AN AROMATIC POLYAMIDE IMIDE. |
| CA000384856A CA1143084A (en) | 1978-02-17 | 1981-08-28 | Soluble aromatic polyamide-imide compositions for electrical use |
| GB08210337A GB2104084B (en) | 1978-04-28 | 1982-04-07 | Polyamide-imide compositions for imparting electrical properties and articles produced using the compositions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9093478A JPS5518426A (en) | 1978-07-27 | 1978-07-27 | Heat-resistant flexible electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5518426A JPS5518426A (en) | 1980-02-08 |
| JPS6159906B2 true JPS6159906B2 (en) | 1986-12-18 |
Family
ID=14012268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9093478A Granted JPS5518426A (en) | 1978-02-17 | 1978-07-27 | Heat-resistant flexible electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5518426A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1198662A (en) * | 1980-09-22 | 1985-12-31 | National Aeronautics And Space Administration | Process for preparing high temperature polyimide film laminates |
| JPS58157190A (en) * | 1982-03-12 | 1983-09-19 | 日立化成工業株式会社 | Method of producing substrate for flexible printed circuit |
| JPS6122937A (en) * | 1984-07-11 | 1986-01-31 | 三井金属鉱業株式会社 | Printed wiring board and manufacture thereof |
| JPS61224485A (en) * | 1985-03-29 | 1986-10-06 | パイオニア株式会社 | Printed circuit board and manufacture thereof |
| JPH07119087B2 (en) * | 1987-09-30 | 1995-12-20 | 日立化成工業株式会社 | Manufacturing method of flexible double-sided metal-clad laminate |
-
1978
- 1978-07-27 JP JP9093478A patent/JPS5518426A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5518426A (en) | 1980-02-08 |
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