JPS6227932B2 - - Google Patents
Info
- Publication number
- JPS6227932B2 JPS6227932B2 JP12743178A JP12743178A JPS6227932B2 JP S6227932 B2 JPS6227932 B2 JP S6227932B2 JP 12743178 A JP12743178 A JP 12743178A JP 12743178 A JP12743178 A JP 12743178A JP S6227932 B2 JPS6227932 B2 JP S6227932B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- copper
- silver
- bonding
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 23
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 19
- 239000007772 electrode material Substances 0.000 claims description 19
- 229910052709 silver Inorganic materials 0.000 claims description 18
- 239000004332 silver Substances 0.000 claims description 18
- 238000005219 brazing Methods 0.000 claims description 16
- 230000008595 infiltration Effects 0.000 claims description 14
- 238000001764 infiltration Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 11
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000009760 electrical discharge machining Methods 0.000 claims description 8
- 229910052721 tungsten Inorganic materials 0.000 claims description 8
- 239000010937 tungsten Substances 0.000 claims description 8
- 229910052750 molybdenum Inorganic materials 0.000 claims description 7
- 239000011733 molybdenum Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- UYKQQBUWKSHMIM-UHFFFAOYSA-N silver tungsten Chemical compound [Ag][W][W] UYKQQBUWKSHMIM-UHFFFAOYSA-N 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims 1
- 238000003754 machining Methods 0.000 description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 11
- 229910002804 graphite Inorganic materials 0.000 description 11
- 239000010439 graphite Substances 0.000 description 11
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000010891 electric arc Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 239000011812 mixed powder Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000008018 melting Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- ZCUFMDLYAMJYST-UHFFFAOYSA-N thorium dioxide Chemical compound O=[Th]=O ZCUFMDLYAMJYST-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910003452 thorium oxide Inorganic materials 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000760 Hardened steel Inorganic materials 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- OMSFUHVZHUZHAW-UHFFFAOYSA-N [Ag].[Mo] Chemical compound [Ag].[Mo] OMSFUHVZHUZHAW-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 102200082816 rs34868397 Human genes 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- HHIQWSQEUZDONT-UHFFFAOYSA-N tungsten Chemical compound [W].[W].[W] HHIQWSQEUZDONT-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H1/00—Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
- B23H1/04—Electrodes specially adapted therefor or their manufacture
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Description
【発明の詳細な説明】
本発明は放電加工の電極材料に係り、さらに詳
しくは導電層をもつ粉末冶金法によつて焼結・溶
浸して形成する複合電極材料の製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electrode material for electrical discharge machining, and more particularly to a method for manufacturing a composite electrode material having a conductive layer formed by sintering and infiltration using a powder metallurgy method.
放電加工は被加工物と加工電極とを絶縁性の加
工液中に極めて小さいギヤツプで対向させ、短時
間のパルス性アーク放電を繰返すことによつて、
被加工物を加工する方法である。非切削加工であ
るため焼入鋼、ダイヤモンドなどの高硬度、強じ
ん材料でも容易に加工できる、複雑な形状の加工
ができる、加工時に働く力が小さく、熱影響も小
さく、加工精度が高い、自動化しやすく経済的で
あるなどの利点がある一方、加工速度が遅い、電
極消耗がある、被加工物と電極のギヤツプを精密
に制御する必要があるなどの欠点がある。しか
し、今日では次第に改善され広範囲に利用されて
いる。 Electrical discharge machining involves placing the workpiece and machining electrode facing each other in an insulating machining fluid with an extremely small gap, and repeating short-term pulsed arc discharge.
This is a method of processing a workpiece. Since it is a non-cutting process, it can easily process even hard and strong materials such as hardened steel and diamonds. It can process complex shapes. The force applied during machining is small, the thermal effect is small, and the machining accuracy is high. While it has advantages such as being easy to automate and being economical, it has disadvantages such as slow processing speed, electrode wear, and the need to precisely control the gap between the workpiece and the electrode. However, today it has been gradually improved and is widely used.
放電加工では10-7〜10-3sの短いアーク放電に
よつて被加工物に溶融、蒸発が行われ、それによ
り電極に対応した形状が形成されるが、一方電極
側にもこれと似た現象が起り電極の消耗となる。
電極の消耗量は被加工物に較べれば遥かに小さい
が、それも電極材料の材質、放電エネルギの大小
によつて差を生じる。従来はこの電極材料に銅、
アルミニウム、タングステン、モリブデンなどの
純金属、軟鋼、銅合金、焼結合金、グラフアイト
などが用いられているが、それぞれ一長一短があ
る。たとえば銅、アルミニウムなどの電極は導電
率が高く電極の形状にする加工も容易であるが電
極としての消耗が激しく、そのため深穴などでは
寸法の変化を生じたり、途中で電極を取替える必
要を生じたりする。グラフアイトも加工しやすく
消耗も比較的少ないが、じん性に欠けるので、欠
損しやすくやはり電極の取替えを要する場合があ
る。一方銅―タングステン、銀―タングステンな
どの焼結合金は消耗が少ないが、導電率が低いた
めアーク放電初期の喰いつき、なじみが悪いため
加工速度が遅い欠点がある。しかし金型に寸法精
度の高い、深い形状を刻み込む場合には、従来は
銅―タングステンなどの焼結体を用い、これより
所定の形状の電極に機械加工にて仕上げ、該電極
を放電加工機に取り付けるために被加工物に接す
る面と反対面に硬鋼などの一般金属体よりなるシ
ヤンク材を銀ろう付けして使用していた。前記の
ごとく仕上げられた銅―タングステン焼結体より
なる電極材では加工速度が遅いほか、ろう接によ
る接合強度が必ずしも十分でなく、接合面積の広
い場合や接合部に外力のかかる場合には放電加工
中に、ろう材と焼結材とのなじみの不十分さによ
る微小な空隙の存在による局部放電等を生じ、接
合部がはく離脱落するという欠点があつた。 In electrical discharge machining, a short arc discharge of 10 -7 to 10 -3 s melts and evaporates the workpiece, forming a shape that corresponds to the electrode. This phenomenon occurs and the electrode wears out.
The amount of wear of the electrode is much smaller than that of the workpiece, but it also varies depending on the material of the electrode and the magnitude of the discharge energy. Conventionally, this electrode material was copper,
Pure metals such as aluminum, tungsten, and molybdenum, mild steel, copper alloys, sintered alloys, and graphite are used, but each has advantages and disadvantages. For example, electrodes made of copper, aluminum, etc. have high conductivity and are easy to process into the shape of the electrode, but they are subject to rapid wear and tear, resulting in dimensional changes in deep holes, etc., and the need to replace the electrode midway. or Graphite is also easy to process and has relatively little wear and tear, but because it lacks toughness, it is prone to breakage and may require electrode replacement. On the other hand, sintered alloys such as copper-tungsten and silver-tungsten are less abrasive, but have the drawbacks of low conductivity, which causes biting at the beginning of arc discharge, and poor fitting, which slows machining speed. However, when carving a deep shape with high dimensional accuracy into a mold, conventionally a sintered body of copper-tungsten or the like is used, which is machined into an electrode of a predetermined shape, and then the electrode is machined using an electric discharge machine. In order to attach the machine to the workpiece, a shank material made of a general metal such as hard steel was soldered with silver on the surface opposite to the surface in contact with the workpiece. Electrode materials made of copper-tungsten sintered bodies finished as described above have a slow processing speed, and the joint strength by brazing is not necessarily sufficient, and discharge may occur when the joint area is large or when external force is applied to the joint. During machining, there was a drawback in that localized discharges occurred due to the presence of minute voids due to insufficient compatibility between the brazing filler metal and the sintered material, resulting in the bonding part peeling off and falling off.
本発明はこれらの点にかんがみてなされたもの
で、放電加工用電極材料として特に加工開始時の
喰いつきを改善して加工速度を向上させかつ寸法
精度保持の点から電極の消耗が少なく、さらに簡
単な工程によりシヤンク部分をも強固に一体化で
きる電極材料を高融点金属焼結体を主体として形
成する製造方法を提供することを目的とする。本
発明は電極材料の電極面に、良導電層を設けるこ
と、および、溶浸と同時に電極材にシヤンク材を
接合し一体化することを特徴とするものである。
即ち本願発明は、本願特許とほぼ同日の本出願人
の出願である特願昭53−121556号(特開昭55−
48537以下「甲発明」と称す。)の製法に関する発
明である。 The present invention has been made in view of these points, and as an electrode material for electric discharge machining, it particularly improves the biting at the start of machining, increases machining speed, maintains dimensional accuracy, and reduces electrode wear. It is an object of the present invention to provide a manufacturing method for forming an electrode material mainly made of a high melting point metal sintered body, which can firmly integrate even the shank portion through a simple process. The present invention is characterized in that a highly conductive layer is provided on the electrode surface of the electrode material, and that a shank material is joined and integrated with the electrode material at the same time as infiltration.
In other words, the present invention is based on Japanese Patent Application No. 121556/1983 (Japanese Unexamined Patent Application Publication No. 55/1988), which was filed by the present applicant on almost the same day as the patent application.
48537 hereinafter referred to as "A Invention". ) is an invention related to a manufacturing method.
具体的には、甲発明において電極面に銅層又は
銀層を接合するが、この接合としてろう付を利用
工夫したものである。これにより比較的厚い層
(例えば2〜3mm程度)からある程度うすい層ま
で簡便に接合できるのである。 Specifically, in the invention A, a copper layer or a silver layer is bonded to the electrode surface, and brazing is used for this bonding. This makes it possible to easily bond layers ranging from relatively thick layers (for example, about 2 to 3 mm) to relatively thin layers.
本発明は高融点金属として平均粒径3μのタン
グステン又はモリブデン粉末に酸化トリウム
(ThO2)、酸化ジルコニウム(ZrO2)の平均粒径
3μの粉末の1種又は2種を1〜10重量%添加し
てよく混合し、該混合粉体を電極形状に金型を用
いて成形圧1〜4t/cm2にて成形する。成形後水素
雰囲気中にて1000゜〜1300℃にて30分〜3時間焼
結し、タングステン又はモリブデンを主体とした
スケルトン(焼成品)を作る。酸化トリウム、酸
化ジルコニウムの添加は加工速度改良のためであ
る。次に該スケルトンに溶浸材として銅又は銀を
溶浸すると同時にシヤンク材を接合する。このた
め予めシヤンク材に使用する一般金属体を所定の
形状に加工しておき接合面を清浄化し、接合材を
塗布する。接合材としては通常銀を40〜60重量
%、コバルト、ニツケルの1種又は2種を計60〜
40重量%をよく混合して用いる。この混合粉は細
かい方が分散がよく好ましい。なお混合粉量は
0.1〜0.2g/cm2程度でよく、該混合粉はそのまま
の状態で使用してもよく、あるいは水、アルコー
ル等でペースト状にして用いてもよく、又メツシ
ユプレートでもよい。この様に合金成分、粉末の
大きさ及び粉末量を規定することにより接合強度
を向上させることができる。 The present invention adds 1 to 10% by weight of one or both of thorium oxide (ThO 2 ) and zirconium oxide (ZrO 2 ) powders with an average particle size of 3μ to tungsten or molybdenum powder with an average particle size of 3μ as a high melting point metal. The mixed powder is then molded into an electrode shape using a mold at a molding pressure of 1 to 4 t/cm 2 . After forming, it is sintered in a hydrogen atmosphere at 1000° to 1300°C for 30 minutes to 3 hours to create a skeleton (fired product) mainly made of tungsten or molybdenum. The purpose of adding thorium oxide and zirconium oxide is to improve processing speed. Next, the skeleton is infiltrated with copper or silver as an infiltrant, and at the same time a shank material is joined. For this purpose, a general metal body to be used as a shank material is processed into a predetermined shape in advance, the bonding surfaces are cleaned, and a bonding material is applied. The bonding material is usually 40 to 60% by weight of silver and one or both of cobalt and nickel for a total of 60 to 60% by weight.
Mix well and use 40% by weight. The finer the powder mixture is, the better the dispersion becomes. The amount of mixed powder is
The amount may be about 0.1 to 0.2 g/cm 2 , and the mixed powder may be used as it is, or may be made into a paste with water, alcohol, etc., or may be used in a mesh plate. By regulating the alloy components, powder size, and powder amount in this way, the bonding strength can be improved.
前記スケルトンを電極寸法に適応するグラフア
イト容器底部に置き、その上部に接合材を介して
シヤンク材を電極材の形状と一致するごとく積載
し、グラフアイト容器とスケルトン、シヤンク材
との隙間に溶浸材をつめる。溶浸材としては銅又
は銀を用いるが、その形状は粉体でも塊状でもよ
いが、小片にして用いる。溶浸材の量はスケルト
ン中にしみ込ませる所要量と接合材を溶解し合金
層とする量でよいがグラフアイト容器とスケルト
ン、シヤンク材との隙間があるので、これを考え
多少多く秤量添加する。次いで連続水素炉にこの
グラフアイト容器を装入して、溶浸条件として
1300゜〜1000℃で30分〜3時間で炉を通過させ
る。この溶浸により銅又は銀が20〜35重量%含ま
れ、かつスケルトン中に均一に分布するとともに
タングステン又はモリブデンのスケルトン中の空
隙はなくなり、銅又は銀―タングステン又はモリ
ブデン焼結体となるとともに、溶浸材の一部は接
合材を溶解し接合層を形成する。 The skeleton is placed on the bottom of a graphite container that matches the electrode dimensions, and a shank material is placed on top of it via a bonding material so that it matches the shape of the electrode material, and the shank material is melted into the gap between the graphite container, the skeleton, and the shank material. Fill with soaking material. Copper or silver is used as the infiltrant, and the shape may be powder or lump, but it is used in small pieces. The amount of infiltration material may be the required amount to soak into the skeleton and the amount to melt the bonding material to form an alloy layer, but there is a gap between the graphite container, skeleton, and shank material, so take this into consideration and add a slightly larger amount by weight. . Next, this graphite container was charged into a continuous hydrogen furnace, and the infiltration conditions were
Pass through the furnace at 1300° to 1000°C for 30 minutes to 3 hours. Through this infiltration, 20 to 35% by weight of copper or silver is contained and is uniformly distributed in the skeleton, and there are no voids in the tungsten or molybdenum skeleton, resulting in a copper or silver-tungsten or molybdenum sintered body. A portion of the infiltration material dissolves the bonding material and forms a bonding layer.
さらに銅又は銀―タングステン又はモリブデン
焼結体およびシヤンク材外周に付着した溶浸材を
除去したのち、焼結体の被加工物に接する面(以
下電極面という)に純銅板又は純銀板より焼結体
断面形状に切断した板片をろう付けする。該板の
板厚は被加工物に形成する形状にもよるが、通常
0.5〜3mm程度でよい。この場合のろう材として
はタングステンを含む材料については濡れ性の向
上を目的としてJIS Z3261のBAg―3級のニツケ
ルの添加された銀ろう材が適している。しかし、
真空中で使用するときは亜鉛、カドミウムを含有
しているので真空雰囲気中で蒸発し具合が悪いの
でBAg―8級の銀ろう材を使用するのがよい。ろ
う付け後必要な機械加工等を施して放電加工用電
極とする。 Furthermore, after removing the infiltration material adhering to the copper or silver-tungsten or molybdenum sintered body and the outer periphery of the shank material, the surface of the sintered body in contact with the workpiece (hereinafter referred to as the electrode surface) is sintered with a pure copper plate or pure silver plate. Braze the plate pieces cut into a cross-sectional shape. The thickness of the plate depends on the shape to be formed on the workpiece, but it is usually
Approximately 0.5 to 3 mm is sufficient. As the brazing material in this case, for materials containing tungsten, a silver brazing material to which nickel of JIS Z3261 BAg-3 grade is added is suitable for the purpose of improving wettability. but,
When using in a vacuum, it is better to use BAg-8 grade silver brazing filler metal, as it contains zinc and cadmium, which will evaporate in a vacuum atmosphere and cause problems. After brazing, necessary machining is performed to create an electrode for electrical discharge machining.
本発明の製造方法により放電加工用の電極材と
して電極面から、銅層、ろう付け層、銅―タング
ステン又は銅―モリブデン焼結体、接合層、シヤ
ンク材あるいは銀層、ろう付け層、銀―タングス
テン又は銀―モリブデン焼結体、接合層、シヤン
ク材よりなる5層構造複合電極材が得られる。本
発明のごとく被加工物に接する電極面に銅層又は
銀層を設けることにより放電加工の開始時に導電
率の高い層にてアーク放電を行なうことによりス
ムースな放電となり、被加工物を電極に対応する
形状に加工し始め、銅層又は銀層さらにはろう付
け層を消耗したのちは銅又は銀―タングステン又
はモリブデン焼結体が電極として作用するが、こ
の時点では焼結体の形状が被加工面の形状に適応
するようになつており、アーク放電もスムースに
進行するとともに電極の消耗も少なく、精密な寸
法を被加工物上に形成させることができるととも
に、全体として加工速度が増大するのである。又
本発明のごとく接合材を用いシヤンク材を溶浸工
程で一体接合することにより、ろう付け工程を省
略できるほか強度も上昇しシヤンク材より電極材
のはく離脱落もなくなり前記複合体による加工速
度の増大、シヤンク材の一体化により品質、安
全、生産性などの面ですぐれた効果がある。なお
電極材料のシヤンク接合面に、電極面の形成とと
もに銀層又は銅層を設けておけば、シヤンク材を
はんだ接合することができ、作業能率の点で好ま
しい場合がある。 By the manufacturing method of the present invention, electrode materials for electrical discharge machining are prepared from the electrode surface, such as a copper layer, a brazing layer, a copper-tungsten or copper-molybdenum sintered body, a bonding layer, a shank material or a silver layer, a brazing layer, a silver- A five-layer composite electrode material consisting of a tungsten or silver-molybdenum sintered body, a bonding layer, and a shank material is obtained. By providing a copper layer or a silver layer on the electrode surface in contact with the workpiece as in the present invention, arc discharge is performed in the highly conductive layer at the start of electrical discharge machining, resulting in smooth discharge, and the workpiece is connected to the electrode. The copper or silver-tungsten or molybdenum sintered body acts as an electrode after it has been processed into the corresponding shape and the copper or silver layer and also the brazing layer have been consumed, but at this point the shape of the sintered body is not covered. It adapts to the shape of the machined surface, arc discharge progresses smoothly, there is less wear on the electrode, it is possible to form precise dimensions on the workpiece, and the overall machining speed increases. It is. In addition, by integrally joining the shank material using the bonding material in the infiltration process as in the present invention, the brazing process can be omitted, the strength is increased, and the electrode material does not peel off or fall from the shank material, and the processing speed using the composite material can be reduced. By increasing the size and integrating the shank material, there are excellent effects in terms of quality, safety, productivity, etc. Note that if a silver layer or a copper layer is provided on the shank joint surface of the electrode material at the same time as the electrode surface is formed, the shank material can be soldered and joined, which may be preferable in terms of work efficiency.
以下本発明の実施例を述べる。 Examples of the present invention will be described below.
実施例
平均粒径3μのタングステン粉末95重量%に平
均粒径3μの酸化トリウム5重量%を添加してよ
く混合し、直径20mm、高さ20mmの円柱状金型に入
れ成形圧4t/cm2にて成形する。成形後水素雰囲気
中にて1000℃、1時間焼結しタングステンスケル
トンを作る。一方シヤンク材として硬鋼
(S45C)を放電加工機の電極取付部に取付けうる
よう所定の寸法に機械加工し、その電極材との接
合面を脱脂清浄し接合材を塗布する。以下第1図
aの断面図、bの平面図を用いて、この工程を説
明する。接合材としては銀とコバルトとを60:40
の割合で混合した混合粉をアルコールにてペース
ト状とし塗布する(第1図12)。第1図aでグ
ラフアイト容器15の底部中央にタングステンス
ケルトン11を置き、接合材12を介してシヤン
ク材13を積載し、グラフアイト容器15との隙
間にスケルトンへしみ込ませる量と接合材を溶解
し合金となし接合層を形成する量に多少の余剰量
の溶浸材14として銅粉をつめる。次いで連続水
素炉にこのグラフアイト容器15を装入して、溶
浸条件として1200℃、30分で炉を通過させ、溶浸
材をとかしてスケルトン中に均一にしみ込ませる
と同時に接合層を形成する。溶浸後過剰に付着し
た溶浸材を除去すれば、第2図aのごとく下部よ
り銅―タングステン焼結体21、接合層22、シ
ヤンク材23と連続した3層構造複合電極素材が
えられる。次に焼結体21の電極面となる面を清
浄にした後、BAg―3の銀ろう材を介して3mm厚
の銅板を積載し炉に入れ、ろう材の融解による接
合を施せば、第2図bに示すごとく電極面より純
銅層24、銀ろう接合層25、銅―タングステン
焼結体21、接合層22、シヤンク材23の5層
構造複合電極材が得られる。同様に角柱電極材に
ついては第2図cが得られる。銀ろうのしみ出
し、溶浸材の付着、銅板、焼結体、シヤンク材の
ずれなどのある場合には、最終的に機械加工を施
して仕上げる。Example 5% by weight of thorium oxide with an average particle size of 3μ was added to 95% by weight of tungsten powder with an average particle size of 3μ, mixed well, and placed in a cylindrical mold with a diameter of 20mm and a height of 20mm at a molding pressure of 4t/cm 2 Molded at. After molding, it is sintered at 1000℃ for 1 hour in a hydrogen atmosphere to create a tungsten skeleton. On the other hand, hard steel (S45C) is machined as a shank material to a predetermined size so that it can be attached to the electrode attachment part of an electric discharge machine, and the surface to be joined with the electrode material is degreased and cleaned, and a bonding material is applied. This step will be explained below using the cross-sectional view of FIG. 1a and the plan view of FIG. 1b. The bonding material is silver and cobalt in a ratio of 60:40.
The mixed powder mixed in the ratio of 1 is made into a paste with alcohol and applied (Fig. 1, 12). In FIG. 1a, the tungsten skeleton 11 is placed at the center of the bottom of the graphite container 15, the shank material 13 is loaded through the bonding material 12, and the amount of the bonding material that is soaked into the skeleton and the bonding material is dissolved in the gap between the graphite container 15 and the graphite container 15. Copper powder is added as an infiltrant 14 in an amount slightly surplus to the amount required to form the alloy and the bonding layer. Next, this graphite container 15 is placed in a continuous hydrogen furnace and passed through the furnace at 1200°C for 30 minutes as infiltration conditions to melt the infiltrant and uniformly soak it into the skeleton, while at the same time forming a bonding layer. do. After infiltration, if the excessively adhered infiltrant is removed, a three-layer composite electrode material consisting of a copper-tungsten sintered body 21, a bonding layer 22, and a shank material 23 continuous from the bottom as shown in FIG. 2a can be obtained. . Next, after cleaning the surface of the sintered body 21 that will become the electrode surface, a 3 mm thick copper plate is loaded through BAg-3 silver brazing material, placed in a furnace, and bonded by melting the brazing material. As shown in FIG. 2b, a five-layer composite electrode material consisting of a pure copper layer 24, a silver brazing bonding layer 25, a copper-tungsten sintered body 21, a bonding layer 22, and a shank material 23 is obtained from the electrode surface. Similarly, for the prismatic electrode material, Figure 2c is obtained. If there is any seepage of silver solder, adhesion of infiltration material, or misalignment of the copper plate, sintered body, or shank material, final machining is performed to finish the work.
第1図は本発明方法の一実施例の工程を示す
図、第2図は本発明方法の一実施例を示す図であ
る。
11…タングステンスケルトン、12…接合
材、13,23…シヤンク材、14…溶浸材
(銅)、15…グラフアイト容器、21…銅約30%
含有タングステン焼結体、22…接合層、24…
純銅層、25…ろう付け層。
FIG. 1 is a diagram showing steps of an embodiment of the method of the present invention, and FIG. 2 is a diagram showing an embodiment of the method of the present invention. 11... Tungsten skeleton, 12... Bonding material, 13, 23... Shank material, 14... Infiltration material (copper), 15... Graphite container, 21... Approximately 30% copper
Containing tungsten sintered body, 22... bonding layer, 24...
Pure copper layer, 25...brazing layer.
Claims (1)
銅又は銀を溶浸してなる放電加工用電極材料の製
造方法において、溶浸時に銀を40〜60重量%、コ
バルト、ニツケルの1種又は2種を計60〜40重量
%でなる接合材を介し、鉄系金属体を所定面に接
合する工程と、溶浸後電極面に厚さが0.5〜3mm
の銅層又は銀層をろう付けにより形成させる工程
を有することを特徴とする銅又は銀―タングステ
ン又はモリブデン層状複合放電加工用電極材料の
製造方法。1. In a method for producing an electrode material for electrical discharge machining by infiltrating high-melting point metal tungsten or molybdenum with copper or silver, a total of 60% of silver and one or two of cobalt and nickel are added during infiltration. A process of bonding a ferrous metal body to a predetermined surface through a bonding material consisting of ~40% by weight, and a process of bonding the electrode surface to a thickness of 0.5 to 3 mm after infiltration.
1. A method for producing a copper or silver-tungsten or molybdenum layered composite electrode material for electrical discharge machining, comprising the step of forming a copper layer or a silver layer by brazing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12743178A JPS5558928A (en) | 1978-10-18 | 1978-10-18 | Manufacturing method of electrode material for electrical discharge machining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12743178A JPS5558928A (en) | 1978-10-18 | 1978-10-18 | Manufacturing method of electrode material for electrical discharge machining |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5558928A JPS5558928A (en) | 1980-05-02 |
| JPS6227932B2 true JPS6227932B2 (en) | 1987-06-17 |
Family
ID=14959781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12743178A Granted JPS5558928A (en) | 1978-10-18 | 1978-10-18 | Manufacturing method of electrode material for electrical discharge machining |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5558928A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113245548B (en) * | 2021-05-27 | 2021-10-01 | 攀时(上海)高性能材料有限公司 | Infiltration processing technology and silver-tungsten contact material prepared by same |
-
1978
- 1978-10-18 JP JP12743178A patent/JPS5558928A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5558928A (en) | 1980-05-02 |
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