JPS6227933B2 - - Google Patents
Info
- Publication number
- JPS6227933B2 JPS6227933B2 JP12743278A JP12743278A JPS6227933B2 JP S6227933 B2 JPS6227933 B2 JP S6227933B2 JP 12743278 A JP12743278 A JP 12743278A JP 12743278 A JP12743278 A JP 12743278A JP S6227933 B2 JPS6227933 B2 JP S6227933B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- electrode
- bonding
- silver
- tungsten
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 33
- 229910052802 copper Inorganic materials 0.000 claims description 32
- 239000010949 copper Substances 0.000 claims description 32
- 239000007772 electrode material Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 25
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 20
- 229910052709 silver Inorganic materials 0.000 claims description 17
- 239000004332 silver Substances 0.000 claims description 17
- 230000008595 infiltration Effects 0.000 claims description 14
- 238000001764 infiltration Methods 0.000 claims description 14
- 238000003754 machining Methods 0.000 claims description 13
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 239000002131 composite material Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229910052750 molybdenum Inorganic materials 0.000 claims description 7
- 239000011733 molybdenum Substances 0.000 claims description 7
- 229910052721 tungsten Inorganic materials 0.000 claims description 7
- 239000010937 tungsten Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 238000009760 electrical discharge machining Methods 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 229910052742 iron Inorganic materials 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 229910002804 graphite Inorganic materials 0.000 description 10
- 239000010439 graphite Substances 0.000 description 10
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 238000005304 joining Methods 0.000 description 6
- 238000005219 brazing Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- UYKQQBUWKSHMIM-UHFFFAOYSA-N silver tungsten Chemical compound [Ag][W][W] UYKQQBUWKSHMIM-UHFFFAOYSA-N 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 238000010891 electric arc Methods 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 239000011812 mixed powder Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 230000000669 biting effect Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- ZCUFMDLYAMJYST-UHFFFAOYSA-N thorium dioxide Chemical compound O=[Th]=O ZCUFMDLYAMJYST-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 238000004663 powder metallurgy Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910003452 thorium oxide Inorganic materials 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- 229910000760 Hardened steel Inorganic materials 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 102200082816 rs34868397 Human genes 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- HHIQWSQEUZDONT-UHFFFAOYSA-N tungsten Chemical compound [W].[W].[W] HHIQWSQEUZDONT-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H1/00—Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
- B23H1/04—Electrodes specially adapted therefor or their manufacture
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Description
【発明の詳細な説明】
本発明は放電加工の電極材料に係り、さらに詳
しくは導電層をもつ粉末治金法によつて焼結・溶
浸して形成する複合電極材料の製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electrode material for electric discharge machining, and more particularly to a method for manufacturing a composite electrode material having a conductive layer formed by sintering and infiltration using a powder metallurgy method.
放電加工は非切削加工であるため焼入鋼、ダイ
ヤモンドなどの高硬度、強じん材料でも容易に加
工できる、複雑な形状の加工ができる、加工時に
働く力が小さく、熱影響も小さく、加工精度が高
い、自動化しやすく経済的であるなどの利点があ
る一方、加工速度が遅い、電極消耗がある、被加
工物と電極のギヤツプを精密に制御する必要があ
るなどの欠点がある。 Electrical discharge machining is a non-cutting process, so it can easily machine hard and strong materials such as hardened steel and diamond, it can machine complex shapes, the force applied during machining is small, the thermal effect is small, and the machining accuracy is high. While this method has advantages such as high productivity, ease of automation, and economy, it has disadvantages such as slow processing speed, electrode wear, and the need to precisely control the gap between the workpiece and electrode.
放電加工では短いアーク放電によつて被加工物
に溶融、蒸発が行われ、それにより電極に対応し
た形状が形成されるが、一方電極側にもこれと似
た現象が起り電極の消耗となる。電極の消耗量は
被加工物に較べれば遥かに小さいが、それも電極
材料の材質、放電エネルギーの大小によつて差を
生じる。従来はこの電極材料に銅、アルミニウ
ム、タングステン、モリブデンなどの純金属、軟
鋼、銅合金、焼結合金、グラフアイトなどが用い
られているが、それぞれ一長一短がある。たとえ
ば銅、アルミニウムなどの電極は導電率が高く電
極の形状にする加工も容易であるが電極としての
消耗が激しく、深穴などでは寸法の変化を生じた
り、途中で電極を取替える必要を生じたりする。
グラフアイトも加工しやすく消耗も比較的少ない
が、じん性に欠けるので、欠損しやすくやはり電
極の取替えを要する場合がある。一方銅―タング
ステン、銀―タングステンなどの焼結合金は消耗
が少ないが、導電率が低いためアーク放電初期の
喰いつき、なじみが悪いため加工速度が遅い欠点
がある。しかし金型に寸法精度の高い深い形状を
刻み込む場合には、従来は銅―タングステンなど
の焼結体を用い、これより所定の形状の電極に仕
上げ、該電極を放電加工機に取り付けるために被
加工物に接する面と反対面に硬鋼などの一般金属
体よりなるシヤンク材を銀ろう付けして使用して
いた。前記のごとく仕上げられた銅―タングステ
ン焼結体よりなる電極材では加工速度が遅いほ
か、ろう接による接合強度が必ずしも十分でな
く、接合面積の広い場合や接合部に外力のかかる
場合には放電加工中に、ろう材と焼結材とのなじ
みの不十分さによる微小な空隙の存在による局部
放電等を生じ、接合部がはく離脱落するという欠
点があつた。 In electric discharge machining, the workpiece is melted and evaporated by a short arc discharge, forming a shape that corresponds to the electrode, but a similar phenomenon also occurs on the electrode side, causing wear and tear on the electrode. . Although the amount of wear of the electrode is much smaller than that of the workpiece, it also varies depending on the material of the electrode and the magnitude of the discharge energy. Conventionally, pure metals such as copper, aluminum, tungsten, and molybdenum, mild steel, copper alloys, sintered alloys, and graphite have been used as electrode materials, but each has advantages and disadvantages. For example, electrodes made of copper, aluminum, etc. have high conductivity and are easy to process into the shape of the electrode, but they are subject to rapid wear and tear, resulting in dimensional changes in deep holes, etc., and the need to replace the electrode midway through the process. do.
Graphite is also easy to process and has relatively little wear and tear, but it lacks toughness and is prone to breakage, which may require electrode replacement. On the other hand, sintered alloys such as copper-tungsten and silver-tungsten are less abrasive, but have the drawbacks of low conductivity, which causes biting in the early stages of arc discharge, and poor fitting, which slows machining speed. However, when carving a deep shape with high dimensional accuracy into a mold, conventionally a sintered body of copper-tungsten or the like is used, which is then finished into an electrode of a predetermined shape, and then the electrode is mounted on an electric discharge machine. A shank material made of a general metal such as hard steel was soldered with silver on the surface opposite to the surface in contact with the workpiece. Electrode materials made of copper-tungsten sintered bodies finished as described above have a slow processing speed, and the joint strength by brazing is not necessarily sufficient, and discharge may occur when the joint area is large or when external force is applied to the joint. During machining, there was a drawback in that localized discharges occurred due to the presence of minute voids due to insufficient compatibility between the brazing filler metal and the sintered material, resulting in the bonding part peeling off and falling off.
本発明はこれらの点にかんがみてなされたもの
で、放電加工用電極材料として特に加工開始時の
喰いつきを改善して加工速度を向上させ、かつ寸
法精度保持の点から電極の消耗が少なく、さらに
簡単な工程によりシヤンク部分をも強固に一体化
できる電極材料を高融点金属焼結体を主体として
形成する製造方法を提供することを目的とする。 The present invention has been made in view of these points, and as an electrode material for electric discharge machining, it particularly improves the biting at the start of machining to increase machining speed, and from the viewpoint of maintaining dimensional accuracy, there is little wear on the electrode. Another object of the present invention is to provide a manufacturing method for forming an electrode material mainly made of a high melting point metal sintered body, which can firmly integrate even the shank portion through a simple process.
本発明は電極材料の電極面に、機械的結合方法
により良導電層を設けること、および、溶浸と同
時に電極材にシヤンク材を接合し一体化すること
を特徴とするものである。即ち本願発明は、本願
特許とほぼ同日の本出願人の出願である特願昭53
―121556号(特開昭55―48537以下「甲発明」と
称す。)の製法に関する発明である。 The present invention is characterized in that a highly conductive layer is provided on the electrode surface of the electrode material by a mechanical bonding method, and that a shank material is joined and integrated with the electrode material at the same time as infiltration. In other words, the present invention is based on the patent application filed in 1973, which was filed by the present applicant on approximately the same date as the present patent.
-121556 (JP-A-55-48537 hereinafter referred to as the "A Invention") is an invention related to a manufacturing method.
具体的には、甲発明において電極面に銅層又は
銀層を接合するが、この接合として機械的結合を
利用工夫したものである。これにより比較的広い
層(電極の面績が大きいと接合がむずかしい。)
を確実に接合できるのである。なお、本願発明で
はアーク放電初期の喰い付き性改善として、銅、
銀のほかにアルミニウム又はその合金も含めてい
る。これは純銅、純銀ほどではないが、かなり喰
い付き性を改善することがわかつた為付加したも
のである。この為本願発明では、アルミニウム及
びその合金を考慮して層の厚さが0.5〜5mmとな
つているが、甲発明とその本質は変らない。 Specifically, in the invention A, a copper layer or a silver layer is bonded to the electrode surface, and this bonding is devised to utilize mechanical bonding. This results in a relatively wide layer (if the electrode has a large surface area, it will be difficult to bond).
can be reliably joined. In addition, in the present invention, copper,
In addition to silver, it also includes aluminum or its alloys. Although this is not as effective as pure copper or pure silver, it was added because it was found to significantly improve the biting properties. Therefore, in the present invention, the thickness of the layer is set to 0.5 to 5 mm in consideration of aluminum and its alloy, but the essence thereof is not different from that of the A invention.
本発明は高融点金属として平均粒径3μのタン
グステン又はモリブデン粉末に酸化トリウム
(ThO2)、酸化ジルコニウム(ZrO2)の平均粒径
3μの粉末の1種又は2種を1〜10重量%添加し
てよく混合し、該混合粉体を電極形状に金型を用
いて成形圧1〜4t/cm2にて成形する。成形後水素
雰囲気中にて1000゜〜1300℃にて30分〜3時間焼
結し、タングステン又はモリブデンを主体とした
スケルトン(焼成品)を作る。酸化トリウム、酸
化ジルコニウムの添加は加工速度改良のためであ
る。次に該スケルトンに溶浸材として銅又は銀を
溶浸すると同時にシヤンク材を接合する。このた
め予めシヤンク材に使用する一般金属体を所定の
形状に加工しておき接合面を清浄化し、接合材を
塗布する。接合材としては通常銀を40〜60重量
%、コバルト、ニツケルの1種又は2種を計60〜
40重量%をよく混合して用いる。この混合粉は細
かい方が分散がよく好ましい。なお混合粉量は
0.1〜0.2g/cm2程度でよく、該混合粉はそのまま
の状態で使用してもよく、あるいは水、アルコー
ル等でペースト状にして用いてもよく、又メツシ
ユプレートでもよい。この様に合金成分,粉末の
大きさ及び粉末量を規定することにより接合強度
を向上させることができる。 The present invention adds 1 to 10% by weight of one or both of thorium oxide (ThO 2 ) and zirconium oxide (ZrO 2 ) powders with an average particle size of 3 μm to tungsten or molybdenum powder with an average particle size of 3 μm as a high melting point metal. The mixed powder is then molded into an electrode shape using a mold at a molding pressure of 1 to 4 t/cm 2 . After forming, it is sintered in a hydrogen atmosphere at 1000° to 1300°C for 30 minutes to 3 hours to create a skeleton (fired product) mainly made of tungsten or molybdenum. The purpose of adding thorium oxide and zirconium oxide is to improve processing speed. Next, the skeleton is infiltrated with copper or silver as an infiltrant, and at the same time a shank material is joined. For this purpose, a general metal body to be used as a shank material is processed into a predetermined shape in advance, the bonding surfaces are cleaned, and a bonding material is applied. The bonding material is usually 40 to 60% by weight of silver and one or both of cobalt and nickel for a total of 60 to 60% by weight.
Mix well and use 40% by weight. The finer the powder mixture is, the better the dispersion becomes. The amount of mixed powder is
The amount may be about 0.1 to 0.2 g/cm 2 , and the mixed powder may be used as it is, or may be made into a paste with water, alcohol, etc., or may be used in a mesh plate. By regulating the alloy components, powder size, and powder amount in this way, the bonding strength can be improved.
前記スケルトンを電極寸法に適応するグラフア
イト容器底部に置き、その上部に接合材を介して
シヤンク材を電極材の形状と一致するごとく積載
し、グラフアイト容器とスケルトン、シヤンク材
との隙間に溶浸材をつめる。溶浸材としては銅又
は銀を用いるが、その形状は粉体でも塊状でもよ
いが、小片にして用いる。溶浸材の量はスケルト
ン中にしみ込ませる所要量と接合材を溶解し合金
属とする量でよいがグラフアイト容器とスケルト
ン、シヤンク材との隙間があるので、これを考え
多少多く秤量添加する。次いで連続水素炉にこの
グラフアイト容器を装入して、溶浸条件として
1300゜〜1000℃で30分〜3時間で炉を通過させ
る。この溶浸により銅又は銀が20〜35重量%含ま
れ、かつスケルトン中に均一に分布するとともに
タングステン又はモリブデンのスケルトン中の空
隙はなくなり、銅又は銀―タングステン又はモリ
ブデン焼結体となるとともに、溶浸材の一部は接
合材を溶解し接合層を形成する。 The skeleton is placed on the bottom of a graphite container that matches the electrode dimensions, and a shank material is placed on top of it via a bonding material so that it matches the shape of the electrode material, and the shank material is melted into the gap between the graphite container, the skeleton, and the shank material. Fill with soaking material. Copper or silver is used as the infiltrant, and the shape may be powder or lump, but it is used in small pieces. The amount of infiltration material may be the required amount to soak into the skeleton and the amount to melt the bonding material to form a composite metal, but there is a gap between the graphite container, skeleton, and shank material, so take this into consideration and add a slightly larger amount by weight. . Next, this graphite container was charged into a continuous hydrogen furnace, and the infiltration conditions were
Pass through the furnace at 1300° to 1000°C for 30 minutes to 3 hours. Through this infiltration, 20 to 35% by weight of copper or silver is contained and is uniformly distributed in the skeleton, and there are no voids in the tungsten or molybdenum skeleton, resulting in a copper or silver-tungsten or molybdenum sintered body. A portion of the infiltration material dissolves the bonding material and forms a bonding layer.
さらに銅又は銀―タングステン又はモリブデン
焼結材およびシヤンク材外周に付着した溶浸材を
除去したのち、焼結体の被加工物に接する面(以
下電極面という)に導電率の高い銅、銀又はアル
ミニウムおよびその合金の板より焼結体断面形状
に切断した板片を接合する。該板の板厚は被加工
物に形成する形状および接合方法にもよるが、通
常0.5〜5mm程度でよい。接合方法としては第1
図aの断面図、bの平面図に示すごとく、たとえ
ば銅―タングステン焼結体11に接合層12を介
してシヤンク材13を一体化した電極材に導電率
の高い銅板14をビス15止めする方法がある。
ビス15の材質としては銅又は銅合金であること
が望ましい。又接合に当つては焼結体11の電極
面および銅板14の接合面を清浄かつ平滑にして
ビス止めにより隙間の生じないようにする。又第
2図aの断面図、bの平面図に示すように、たと
えば銀―タングステン焼結体21に接合層22を
介してシヤンク材23を一体化した電極材に導電
率の高い銀板24を圧入する方法もある。この場
合には焼結体21の電極面を圧入するつば部のリ
ング寸法に合わせて、予め機械加工にて仕上げる
か又はスケルトン成形体を作るときにこの寸法の
金型を用いて行なう。一方銀板24は板より機械
加工により作つてもよく、又は鋳物、粉末治金に
よつてもよい。又圧入に当つては焼結体の電極面
および銀板の焼結体に接する面を清浄にし、一体
化した電極材に銀板を重ね、電極材の縦軸方向に
圧縮力を加えて圧入する。この場合必要に応じジ
グを用いるとともに、銀板が焼結体に密着し隙間
の生じないようにする。又銀板が軟かく変形を生
じたときは、後加工で電極の形状に補修する。 Furthermore, after removing the infiltration material adhering to the copper or silver-tungsten or molybdenum sintered material and the outer periphery of the shank material, the surface of the sintered body that is in contact with the workpiece (hereinafter referred to as the electrode surface) is coated with highly conductive copper or silver. Alternatively, plate pieces cut into the cross-sectional shape of a sintered body from aluminum or its alloy plates are joined. Although the thickness of the plate depends on the shape formed on the workpiece and the joining method, it is usually about 0.5 to 5 mm. The first joining method is
As shown in the cross-sectional view in Figure a and the plan view in Figure b, a copper plate 14 with high conductivity is fixed with screws 15 to an electrode material in which a shank material 13 is integrated with a copper-tungsten sintered body 11 via a bonding layer 12, for example. There is a way.
The material of the screw 15 is preferably copper or copper alloy. When joining, the electrode surface of the sintered body 11 and the joint surface of the copper plate 14 are kept clean and smooth and screwed to prevent gaps from forming. Further, as shown in the cross-sectional view of FIG. 2a and the plan view of FIG. There is also a method of press-fitting. In this case, the electrode surface of the sintered body 21 is finished by machining in advance according to the ring size of the collar into which the electrode surface is press-fitted, or a mold of this size is used when making the skeleton molded body. On the other hand, the silver plate 24 may be made from a plate by machining, or may be made by casting or powder metallurgy. In addition, when press-fitting, clean the electrode surface of the sintered body and the surface of the silver plate in contact with the sintered body, stack the silver plate on the integrated electrode material, and press-fit by applying compressive force in the longitudinal axis direction of the electrode material. do. In this case, use a jig if necessary, and make sure that the silver plate is in close contact with the sintered body so that there are no gaps. Also, if the silver plate is soft and deformed, it is repaired to the shape of the electrode in post-processing.
焼結体への接合は圧入でなく第3図aの断面
図、bの平面図に示すごときねじによつてもよ
い。たとえば銅―タングステン焼結体31に接合
層32を介してシヤンク材33を一体化した電極
材に導電率の高い銅ブロツクにねじを切るととも
に焼結体の電極面にもねじを切り、ねじ止め35
により接合する。この場合も接合面を清浄にし、
隙間の生じないようにする。又第4図aの断面
図、bの平面図に示すごとく、たとえば銅―タン
グステン焼結体41に接合層42を介してシヤン
ク材43を一体化した電極材に導電率の高い銅板
44をピン45を打ち込んで接合する方法もあ
る。この場合のピン45の材質は打ち込みにより
変形し焼結体と銅板を密着させるとともに導電
率、耐食性を考え銅又は銅合金が好ましい。ピン
の寸法、本数等は電極の形状、銅板の厚さにより
異なるが通常は少くてよい。なお焼結体の電極面
および銅板の接合面を平滑にしかつ清浄にするこ
とは勿論、ピン接合により密着させ隙間のないよ
うにする。このほかにも機械的に接合する方法は
あるが、それは使用目的により使い分けられる。 The sintered body may be joined to the sintered body by screws as shown in the cross-sectional view of FIG. 3a and the plan view of FIG. 3b, instead of press-fitting. For example, in an electrode material in which a shank material 33 is integrated with a copper-tungsten sintered body 31 via a bonding layer 32, a thread is cut into a copper block with high conductivity, and a thread is also cut into the electrode surface of the sintered body and screwed. 35
Join by. In this case too, clean the joint surface and
Avoid creating gaps. Further, as shown in the cross-sectional view of FIG. 4a and the plan view of FIG. There is also a method of joining by driving 45. In this case, the material of the pin 45 is preferably copper or a copper alloy in view of deformation by driving to bring the sintered body and the copper plate into close contact, as well as electrical conductivity and corrosion resistance. The dimensions, number, etc. of the pins vary depending on the shape of the electrode and the thickness of the copper plate, but usually a small number is sufficient. Note that the electrode surface of the sintered body and the bonding surface of the copper plate should of course be made smooth and clean, and should also be closely attached by pin bonding so that there are no gaps. There are other mechanical joining methods, but they can be used depending on the purpose of use.
本発明の製造方法により放電加工用の電極材と
して電極面から、銅層、銅―タングステン又は銅
―モリブデン焼結体、接合層、シヤンク材あるい
は銀層、銀―タングステン又は銅―モリブデン焼
結体、接合層、シヤンク材よりなる4層構造複合
電極材が得られる。本発明のごとく被加工物に接
する電極面に銅層、銀層又はアルミニウム層のご
とき導電率の高い層を設けることにより放電加工
の開始時に導電率の高い層にてアーク放電を行な
うことによりスムースな放電となり、被加工物を
電極に対応する形状に加工し始め、銅層、銀層又
はアルミニウム層を消耗したのちは銅又は銀―タ
ングステン又はモリブデン焼結体が電極として作
用するが、この時点では焼結体の形状が被加工面
の形状に適応するようになつており、アーク放電
もスムースに進行するとともに電極の消耗も少な
く、精密な寸法を被加工物上に形成させることが
でき、全体として加工速度が増大するのである。
本発明のごとく導電率の高い層を機械的に接合す
る方法では、該層の厚さを任意にとれるとともに
焼結体の溶浸材と異なる層をも接合できる利点が
ある。ろう付けなどと異なるのでろう材の選択の
困難さもない。 The manufacturing method of the present invention can be used as an electrode material for electrical discharge machining from the electrode surface, including a copper layer, a copper-tungsten or copper-molybdenum sintered body, a bonding layer, a shank material or a silver layer, and a silver-tungsten or copper-molybdenum sintered body. A four-layer composite electrode material consisting of , a bonding layer, and a shank material is obtained. As in the present invention, by providing a layer with high conductivity such as a copper layer, silver layer or aluminum layer on the electrode surface in contact with the workpiece, arc discharge is performed in the layer with high conductivity at the start of electrical discharge machining, thereby making it smooth. After the copper, silver, or aluminum layer is consumed, the copper or silver-tungsten or molybdenum sintered body acts as the electrode, but at this point In this case, the shape of the sintered body adapts to the shape of the workpiece surface, arc discharge progresses smoothly, there is less wear on the electrode, and precise dimensions can be formed on the workpiece. The overall machining speed increases.
The method of mechanically joining layers with high conductivity as in the present invention has the advantage that the thickness of the layer can be set arbitrarily, and also layers different from the infiltration material of the sintered body can be joined. Since it is different from brazing, there is no difficulty in selecting the brazing material.
又本発明のごとく接合材を用いシヤンク材を溶
浸工程で一体接合することにより、シヤンク材と
電極材とのろう付け工程を省略できるほか強度も
上昇しシヤンク材より電極材のはく離脱落もなく
なり、前記高導電率層を有する複合体による加工
速度の増大とともにシンク材の一体化により品
質、安全、生産性などの面ですぐれた効果があ
る。なお、電極材料のシヤンク接合面に電極面の
形成とともに、銀層又は銅層を設けておけば、シ
ヤンク材をはんだ接合することができ作業能率の
点で好ましい場合がある。 In addition, by integrally joining the shank material in the infiltration process using a bonding material as in the present invention, the brazing process between the shank material and the electrode material can be omitted, the strength is increased, and the electrode material does not peel off or fall from the shank material. In addition to increasing the processing speed due to the composite body having the high conductivity layer, the integration of the sink material has excellent effects in terms of quality, safety, productivity, etc. Note that if a silver layer or a copper layer is provided on the shank joint surface of the electrode material at the same time as forming the electrode surface, the shank material can be soldered and joined, which may be preferable in terms of work efficiency.
以下本発明の実施例を述べる。 Examples of the present invention will be described below.
実施例
平均粒径3μのタングステン粉末95重量%に平
均粒径3μの酸化トリウム5重量%を添加してよ
く混合し、直径20mm、高さ20mmの円柱状金型に入
れ成形圧4t/cm2にて成形する。成形後水素雰囲気
中にて1000℃、1時間焼結しタングステンスケル
トンを作る。一方シヤンク材として硬鋼
(S45C)を放電加工機の電極取付部に取付けしう
るよう所定の寸法に機械加工し、その電極材との
接合面を脱脂清浄し接合材を塗布する。以下第5
図aの断面図、bの平面図を用いて、この工程を
説明する。接合材としては銀とコバルトを60:40
の割合で混合した混合粉をアルコールにてペース
ト状とし塗布する(第5図52)。第5図aでグ
ラフアイト容器55の底部中央にタングステンス
ケルトン51を置き、接合材52を介してシヤン
ク材53を積載し、グラフアイト容器55との隙
間にスケルトンへしみ込ませる量と接合材を溶解
し合金となし接合層を形成する量に多少の余剰量
を見込み溶浸材54として銅粉をつめる。次に連
続水素炉にこのグラフアイト容器55を装入し
て、溶浸条件として1200℃、30分で炉を通過さ
せ、溶浸材をとかしてスケルトン中に均一にしみ
込ませると同時に接合層を形成する。溶浸後過剰
に付着した溶浸材を除去すれば第1図aのごとく
上部に銅―タングステン焼結体11、接合層1
2、シヤンク材13と連続した3層構造複合電極
素材がえられる。次に板厚3mmの銅板より20mm直
径の円板を切断し、その中心に4mm直径のビスを
通す穴をあけるとともに被加工面に接する板面に
ビスの頭部の皿とりを行い、端面、穴あけ部を清
浄にするとともに板面を平らにする。一方複合電
極素材の電極面にビスをとめるためビスの直径に
合致するねじを切り清浄にするとともに電極面を
平らにし清浄にする。次に前記銅板を複合電極素
材の電極面に積載し、ビスを用いねじ止めする。
この製造方法により第1図のごとき銅層14、銅
―タングステン焼結体11、接合層12、シヤン
ク材13よりなる4層構造複合電極材が得られ
る。Example 5% by weight of thorium oxide with an average particle size of 3μ was added to 95% by weight of tungsten powder with an average particle size of 3μ, mixed well, and placed in a cylindrical mold with a diameter of 20mm and a height of 20mm at a molding pressure of 4t/cm 2 Molded at. After molding, it is sintered at 1000℃ for 1 hour in a hydrogen atmosphere to create a tungsten skeleton. On the other hand, hard steel (S45C) is machined as a shank material to a predetermined size so that it can be attached to the electrode attachment part of an electric discharge machine, and the surface to be joined with the electrode material is degreased and cleaned, and a bonding material is applied. 5th below
This step will be explained using the cross-sectional view in Figure a and the plan view in Figure b. 60:40 silver and cobalt as bonding materials
The mixed powder mixed in the ratio of 1 is made into a paste with alcohol and applied (Fig. 5, 52). In FIG. 5a, a tungsten skeleton 51 is placed at the center of the bottom of a graphite container 55, a shank material 53 is loaded through a bonding material 52, and the amount of the bonding material is dissolved and soaked into the skeleton in the gap between it and the graphite container 55. Copper powder is filled in as an infiltrant material 54 with a certain amount surplus to the amount required to form the alloy and the bonding layer. Next, this graphite container 55 is charged into a continuous hydrogen furnace and passed through the furnace at 1200°C for 30 minutes as the infiltration condition to melt the infiltrant and uniformly soak it into the skeleton, and at the same time form a bonding layer. Form. After infiltration, if the excessively adhered infiltrant is removed, a copper-tungsten sintered body 11 and a bonding layer 1 are formed on the upper part as shown in Fig. 1a.
2. A three-layer composite electrode material continuous with the shank material 13 is obtained. Next, cut a 20 mm diameter disk from a 3 mm thick copper plate, make a hole in the center for passing a 4 mm diameter screw, and countersink the head of the screw on the plate surface that is in contact with the workpiece surface. Clean the hole and flatten the board surface. On the other hand, in order to fasten a screw to the electrode surface of the composite electrode material, a screw that matches the diameter of the screw is cut and cleaned, and the electrode surface is flattened and cleaned. Next, the copper plate is placed on the electrode surface of the composite electrode material and screwed using screws.
By this manufacturing method, a four-layer composite electrode material consisting of a copper layer 14, a copper-tungsten sintered body 11, a bonding layer 12, and a shank material 13 as shown in FIG. 1 is obtained.
第1図は本発明方法の一実施例を示す図、第2
図は本発明方法の一実施例を示す図、第3図は本
発明方法の一実施例を示す図、第4図は本発明方
法の一実施例を示す図、第5図は本発明方法の一
実施例の工程を示す図である。
11,21,31,41…銅約30%含有タング
ステン焼結体、12,22,32,42…接合
層、13,23,33,43,53…シヤンク
材、14,24,34,44…純銅層、15…ビ
ス、35…ねじ部、45…ピン、51…タングス
テンスケルトン、52…接合材、54…溶浸材
(銅)、55…グラフアイト容器。
FIG. 1 is a diagram showing an embodiment of the method of the present invention, and FIG.
The figure shows an embodiment of the method of the present invention, FIG. 3 shows an embodiment of the method of the present invention, FIG. 4 shows an embodiment of the method of the present invention, and FIG. 5 shows a method of the present invention. It is a figure which shows the process of one Example. 11,21,31,41...Tungsten sintered body containing about 30% copper, 12,22,32,42...Joining layer, 13,23,33,43,53...Shank material, 14,24,34,44... Pure copper layer, 15... Screw, 35... Threaded portion, 45... Pin, 51... Tungsten skeleton, 52... Bonding material, 54... Infiltration material (copper), 55... Graphite container.
Claims (1)
銅又は銀を溶浸してなる放電加工用電極材料の製
造方法において、溶浸時に銀を40〜60重量%、コ
バルト、ニツケルの1種又は2種を計60〜40重量
%でなる接合材を介し、鉄系金属体を所定面に接
合する工程と、溶浸後電極面に厚さが0.5〜5mm
の銅、銀、アルミニウム又はアルミニウム合金を
機械的結合方法により形成させる工程を有するこ
とを特徴とする銅、銀、アルミニウム又はアルミ
ニウム合金―タングステン又はモリブデン層状複
合放電加工用電極材料の製造方法。1. In a method for producing an electrode material for electrical discharge machining by infiltrating high-melting point metal tungsten or molybdenum with copper or silver, a total of 60% of silver and one or two of cobalt and nickel are added during infiltration. The process of bonding the iron-based metal body to a predetermined surface via a bonding material consisting of ~40% by weight, and the process of bonding the electrode surface to a thickness of 0.5 to 5 mm after infiltration.
1. A method for producing a composite electrode material for electric discharge machining in which a copper, silver, aluminum or aluminum alloy-tungsten or molybdenum layered electrode material is formed by a mechanical bonding method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12743278A JPS5558929A (en) | 1978-10-18 | 1978-10-18 | Manufacturing method of electrode material for electrical discharge machining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12743278A JPS5558929A (en) | 1978-10-18 | 1978-10-18 | Manufacturing method of electrode material for electrical discharge machining |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5558929A JPS5558929A (en) | 1980-05-02 |
| JPS6227933B2 true JPS6227933B2 (en) | 1987-06-17 |
Family
ID=14959803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12743278A Granted JPS5558929A (en) | 1978-10-18 | 1978-10-18 | Manufacturing method of electrode material for electrical discharge machining |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5558929A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4040493B2 (en) * | 2003-02-24 | 2008-01-30 | 株式会社ミツトヨ | Electrode for electrical discharge machining |
| JPWO2005078972A1 (en) * | 2004-02-13 | 2008-01-10 | 株式会社リアルクリエイト | Communication state activation material, communication state activation sheet, and communication state activation device |
-
1978
- 1978-10-18 JP JP12743278A patent/JPS5558929A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5558929A (en) | 1980-05-02 |
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